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DE60135260D1 - Belichtungsgerät - Google Patents

Belichtungsgerät

Info

Publication number
DE60135260D1
DE60135260D1 DE60135260T DE60135260T DE60135260D1 DE 60135260 D1 DE60135260 D1 DE 60135260D1 DE 60135260 T DE60135260 T DE 60135260T DE 60135260 T DE60135260 T DE 60135260T DE 60135260 D1 DE60135260 D1 DE 60135260D1
Authority
DE
Germany
Prior art keywords
exposure unit
exposure
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60135260T
Other languages
English (en)
Inventor
Kiyoshi Arakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE60135260D1 publication Critical patent/DE60135260D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE60135260T 2000-11-15 2001-11-13 Belichtungsgerät Expired - Fee Related DE60135260D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000348713A JP2002151400A (ja) 2000-11-15 2000-11-15 露光装置、その保守方法並びに同装置を用いた半導体デバイス製造方法及び半導体製造工場

Publications (1)

Publication Number Publication Date
DE60135260D1 true DE60135260D1 (de) 2008-09-18

Family

ID=18822244

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60135260T Expired - Fee Related DE60135260D1 (de) 2000-11-15 2001-11-13 Belichtungsgerät
DE60128879T Expired - Lifetime DE60128879D1 (de) 2000-11-15 2001-11-13 Belichtungsapparat

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60128879T Expired - Lifetime DE60128879D1 (de) 2000-11-15 2001-11-13 Belichtungsapparat

Country Status (6)

Country Link
US (3) US6757048B2 (de)
EP (2) EP1731967B1 (de)
JP (1) JP2002151400A (de)
KR (1) KR100453343B1 (de)
DE (2) DE60135260D1 (de)
TW (1) TWI249781B (de)

Families Citing this family (50)

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WO2001006548A1 (fr) 1999-07-16 2001-01-25 Nikon Corporation Procede et systeme d'exposition
JP2002198277A (ja) * 2000-12-22 2002-07-12 Canon Inc 補正装置、露光装置、デバイス製造方法及びデバイス
TWI222668B (en) * 2001-12-21 2004-10-21 Nikon Corp Gas purging method and exposure system, and device production method
JPWO2003085708A1 (ja) * 2002-04-09 2005-08-18 株式会社ニコン 露光方法及び露光装置、並びにデバイス製造方法
DE10239344A1 (de) * 2002-08-28 2004-03-11 Carl Zeiss Smt Ag Vorrichtung zum Abdichten einer Projektionsbelichtungsanlage
JP2004104050A (ja) * 2002-09-13 2004-04-02 Canon Inc 露光装置
JP3984898B2 (ja) * 2002-09-18 2007-10-03 キヤノン株式会社 露光装置
US7138640B1 (en) * 2002-10-17 2006-11-21 Kla-Tencor Technologies, Corporation Method and apparatus for protecting surfaces of optical components
JP2004186179A (ja) * 2002-11-29 2004-07-02 Canon Inc 露光装置
JP4289906B2 (ja) * 2003-02-28 2009-07-01 キヤノン株式会社 露光装置
SG141416A1 (en) 2003-04-30 2008-04-28 Asml Netherlands Bv Lithographic apparatus,device manufacturing methods, mask and method of characterising a mask and/or pellicle
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP3862678B2 (ja) * 2003-06-27 2006-12-27 キヤノン株式会社 露光装置及びデバイス製造方法
US7316869B2 (en) 2003-08-26 2008-01-08 Intel Corporation Mounting a pellicle to a frame
EP1667210A4 (de) * 2003-09-03 2008-11-05 Nikon Corp Belichtungsvorrichtung und bauelemente-herstellungsverfahren
JP2005159322A (ja) * 2003-10-31 2005-06-16 Nikon Corp 定盤、ステージ装置及び露光装置並びに露光方法
KR100530499B1 (ko) * 2003-12-26 2005-11-22 삼성전자주식회사 노광 방법 및 이를 수행하기 위한 레티클, 레티클어셈블리 및노광 장치
JP4018647B2 (ja) * 2004-02-09 2007-12-05 キヤノン株式会社 投影露光装置およびデバイス製造方法
US20050202252A1 (en) * 2004-03-12 2005-09-15 Alexander Tregub Use of alternative polymer materials for "soft" polymer pellicles
KR100647366B1 (ko) * 2004-06-11 2006-11-23 주식회사 하이닉스반도체 노광시스템
US7030959B2 (en) * 2004-07-23 2006-04-18 Nikon Corporation Extreme ultraviolet reticle protection using gas flow thermophoresis
WO2006078025A1 (ja) * 2005-01-24 2006-07-27 Nikon Corporation 計測方法、計測システム、検査方法、検査システム、露光方法及び露光システム
US7502095B2 (en) * 2005-03-29 2009-03-10 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
US20070085984A1 (en) * 2005-10-18 2007-04-19 Asml Netherlands B.V. Lithographic projection apparatus, device manufacturing method and device manufactured thereby
TWI330762B (en) * 2005-03-29 2010-09-21 Asml Netherlands Bv Seal of a lithographic apparatus, lithographic apparatus, device manufacturing method and data storage medium
KR100739424B1 (ko) * 2005-10-28 2007-07-13 삼성전기주식회사 비활성 기체 주입을 이용한 노광 장치 및 인쇄회로 기판의 제조 방법
DE102005052757B4 (de) * 2005-11-04 2007-07-26 Vistec Semiconductor Systems Gmbh Vorrichtung zur Positionsmessung eines Objekts mit einem Laser-Interferometersystem
KR101284475B1 (ko) * 2005-11-22 2013-07-15 가부시끼가이샤 하이테크 시스템즈 반도체장치의 제조방법
CN2857056Y (zh) * 2005-12-05 2007-01-10 上海多丽影像设备有限公司 一种大lcd微移的数码曝光装置
US7372559B2 (en) * 2005-12-14 2008-05-13 Kla-Tencor Technologies Corp. Systems and methods for inspecting a wafer with increased sensitivity
US7492441B2 (en) * 2005-12-22 2009-02-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method incorporating a pressure shield
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8817226B2 (en) * 2007-02-15 2014-08-26 Asml Holding N.V. Systems and methods for insitu lens cleaning using ozone in immersion lithography
US7969550B2 (en) * 2007-04-19 2011-06-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8749753B2 (en) * 2007-04-27 2014-06-10 Nikon Corporation Movable body apparatus, exposure apparatus and optical system unit, and device manufacturing method
TW200907597A (en) * 2007-06-04 2009-02-16 Nikon Corp Environmental control apparatus, stage apparatus, exposure apparatus and device manufacturing method
US7561250B2 (en) * 2007-06-19 2009-07-14 Asml Netherlands B.V. Lithographic apparatus having parts with a coated film adhered thereto
CA2718426C (en) * 2008-03-14 2017-06-06 Bemis Company, Inc. Ozone applicator and method for polymer oxidation
KR20140108348A (ko) * 2009-08-07 2014-09-05 가부시키가이샤 니콘 이동체 장치, 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
NL2008345A (en) * 2011-03-28 2012-10-01 Asml Holding Nv Lithographic apparatus and device manufacturing method.
US9513568B2 (en) 2012-07-06 2016-12-06 Asml Netherlands B.V. Lithographic apparatus
DE102012219806A1 (de) * 2012-10-30 2014-04-30 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage mit mindestens einem Mittel zur Reduktion des Einflusses von Druckschwankungen
NL2012291A (en) * 2013-02-20 2014-08-21 Asml Netherlands Bv Gas flow optimization in reticle stage environment.
KR102221592B1 (ko) * 2013-12-06 2021-03-02 엘지디스플레이 주식회사 평판표시패널용 노광장치
KR20170117071A (ko) * 2015-02-18 2017-10-20 브이 테크놀로지 씨오. 엘티디 주사 노광 장치
EP3488294B1 (de) 2016-07-21 2022-05-04 ASML Netherlands B.V. Lithografisches verfahren
WO2019115196A1 (en) * 2017-12-14 2019-06-20 Asml Netherlands B.V. Lithographic apparatus with improved patterning performance
CN111801619B (zh) * 2018-01-11 2023-09-29 Asml荷兰有限公司 光刻方法和设备
JP7299755B2 (ja) * 2018-09-10 2023-06-28 キヤノン株式会社 露光装置、および物品の製造方法
EP3620858B1 (de) * 2018-09-10 2023-11-01 Canon Kabushiki Kaisha Belichtungsvorrichtung und verfahren zur herstellung eines artikels

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JP3552363B2 (ja) 1995-09-12 2004-08-11 株式会社ニコン 走査型露光装置
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EP1075017A4 (de) 1998-03-31 2005-04-20 Nikon Corp Optische vorrichtung und damit ausgerüstetes belichtungssystem
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JP2000058447A (ja) 1998-06-05 2000-02-25 Nikon Corp 荷電粒子ビ―ム露光装置及び半導体デバイス製造方法
JP2000179590A (ja) 1998-12-18 2000-06-27 Zexel Corp 電磁クラッチ
JP2000195779A (ja) 1998-12-28 2000-07-14 Nikon Corp 露光装置及びマイクロデバイスの製造方法
EP1098225A3 (de) 1999-11-05 2002-04-10 Asm Lithography B.V. Lithographischer Projektionsapparat mit Spülgassystem und Verfahren unter Verwendung desselben
TW563002B (en) 1999-11-05 2003-11-21 Asml Netherlands Bv Lithographic projection apparatus, method of manufacturing a device using a lithographic projection apparatus, and device manufactured by the method
TW480372B (en) * 1999-11-05 2002-03-21 Asm Lithography Bv Lithographic projection apparatus, method of manufacturing a device using the apparatus, and device manufactured according to the method

Also Published As

Publication number Publication date
EP1207425A3 (de) 2005-06-22
EP1207425A2 (de) 2002-05-22
KR100453343B1 (ko) 2004-10-20
US20040017551A1 (en) 2004-01-29
EP1207425B1 (de) 2007-06-13
DE60128879D1 (de) 2007-07-26
EP1731967B1 (de) 2008-08-06
EP1731967A1 (de) 2006-12-13
US20020057422A1 (en) 2002-05-16
US7034918B2 (en) 2006-04-25
TWI249781B (en) 2006-02-21
KR20020037709A (ko) 2002-05-22
US20050146696A1 (en) 2005-07-07
JP2002151400A (ja) 2002-05-24
US6757048B2 (en) 2004-06-29
US6891593B2 (en) 2005-05-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee