DE60132127D1 - Harzformmaschine - Google Patents
HarzformmaschineInfo
- Publication number
- DE60132127D1 DE60132127D1 DE60132127T DE60132127T DE60132127D1 DE 60132127 D1 DE60132127 D1 DE 60132127D1 DE 60132127 T DE60132127 T DE 60132127T DE 60132127 T DE60132127 T DE 60132127T DE 60132127 D1 DE60132127 D1 DE 60132127D1
- Authority
- DE
- Germany
- Prior art keywords
- molding machine
- resin molding
- resin
- machine
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 title 1
- 239000011347 resin Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/34—Moulds or cores; Details thereof or accessories therefor movable, e.g. to or from the moulding station
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0084—General arrangement or lay-out of plants
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
- B29C33/428—For altering indicia, e.g. data, numbers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
- B29C45/1468—Plants therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/18—Feeding the material into the injection moulding apparatus, i.e. feeding the non-plastified material into the injection unit
- B29C45/1808—Feeding measured doses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
- B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000120997A JP4347991B2 (ja) | 2000-04-21 | 2000-04-21 | 樹脂封止装置 |
JP2000121017A JP4327985B2 (ja) | 2000-04-21 | 2000-04-21 | 樹脂封止装置 |
JP2000122911A JP4327988B2 (ja) | 2000-04-24 | 2000-04-24 | 樹脂タブレット送り装置及び樹脂封止装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60132127D1 true DE60132127D1 (de) | 2008-02-14 |
Family
ID=27343164
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60132127T Expired - Lifetime DE60132127D1 (de) | 2000-04-21 | 2001-04-19 | Harzformmaschine |
DE60144161T Expired - Lifetime DE60144161D1 (de) | 2000-04-21 | 2001-04-19 | Harzformmaschine |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60144161T Expired - Lifetime DE60144161D1 (de) | 2000-04-21 | 2001-04-19 | Harzformmaschine |
Country Status (7)
Country | Link |
---|---|
US (1) | US6814556B2 (de) |
EP (2) | EP1147870B1 (de) |
KR (1) | KR100427519B1 (de) |
CN (2) | CN1199776C (de) |
DE (2) | DE60132127D1 (de) |
SG (1) | SG89391A1 (de) |
TW (1) | TW509615B (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3609824B1 (ja) * | 2003-10-30 | 2005-01-12 | 第一精工株式会社 | 樹脂封止成形装置 |
US7241414B2 (en) * | 2004-06-25 | 2007-07-10 | Asm Technology Singapore Pte Ltd. | Method and apparatus for molding a semiconductor device |
US20070176326A1 (en) * | 2006-02-01 | 2007-08-02 | Fa-Shen Chen | Method for filling polymer blanks into molds and an apparatus thereof |
JP2007251094A (ja) * | 2006-03-20 | 2007-09-27 | Towa Corp | 半導体チップの樹脂封止成形装置 |
KR101446268B1 (ko) * | 2008-07-28 | 2014-10-02 | 한미반도체 주식회사 | 오토몰드장치 및 오토몰드용 클리닝장치 |
KR20120046633A (ko) * | 2010-11-02 | 2012-05-10 | 삼성전자주식회사 | 반도체 패키지 몰딩 시스템 및 몰딩 방법 |
TWI585908B (zh) * | 2010-11-25 | 2017-06-01 | 山田尖端科技股份有限公司 | 樹脂模塑裝置與樹脂模塑方法 |
JP5342576B2 (ja) * | 2011-02-18 | 2013-11-13 | 株式会社日本製鋼所 | 旋回可能な下ユニットを備えた転写フィルム送り装置 |
JP5866398B2 (ja) * | 2013-05-15 | 2016-02-17 | 東芝機械株式会社 | 成形システム及び成形品の製造方法 |
CN105818337B (zh) * | 2016-04-29 | 2018-09-28 | 浙江品创知识产权服务有限公司 | 一种新型蓄电池外壳注塑模具 |
JP6212609B1 (ja) * | 2016-08-19 | 2017-10-11 | Towa株式会社 | 樹脂成形装置及び樹脂成形品製造方法 |
CN107521052B (zh) * | 2017-08-23 | 2023-10-03 | 歌尔科技有限公司 | 去静电分腔机构及小型注塑件取出方法 |
CN110497577A (zh) * | 2019-08-21 | 2019-11-26 | 苏州旭芯翔智能设备有限公司 | 一种半导体元器件封装自动化注塑系统及其工作方法 |
JP7175869B2 (ja) * | 2019-10-03 | 2022-11-21 | Towa株式会社 | 樹脂成形装置および樹脂成形方法 |
JP7475232B2 (ja) * | 2020-07-22 | 2024-04-26 | 株式会社ディスコ | 保護部材形成装置 |
JP7135186B1 (ja) * | 2021-09-15 | 2022-09-12 | Towa株式会社 | 樹脂供給装置、樹脂成形システム、及び、樹脂成形品の製造方法 |
JP2024044401A (ja) * | 2022-09-21 | 2024-04-02 | Towa株式会社 | 樹脂供給装置、樹脂成形装置、及び樹脂成形品の製造方法 |
CN117549483B (zh) * | 2023-10-20 | 2024-04-05 | 广东百赞智能装备有限公司 | 一种侧射立压式注塑机 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3797103A (en) * | 1970-05-04 | 1974-03-19 | Gen Electric | Machine and process for semiconductor device assembly |
JPH01186638A (ja) * | 1988-01-14 | 1989-07-26 | Seiei Kosan Kk | 自動モールディング装置 |
JPH0618219B2 (ja) * | 1988-09-27 | 1994-03-09 | 株式会社東芝 | 半導体装置の樹脂封止用樹脂タブレット供給装置 |
JPH03262620A (ja) * | 1990-03-14 | 1991-11-22 | Japan Steel Works Ltd:The | 射出成形設備における製品搬送制御装置及びその方法 |
JP2744324B2 (ja) | 1990-04-03 | 1998-04-28 | アピックヤマダ株式会社 | 樹脂タブレットの整列方法および整列装置 |
JPH05138681A (ja) | 1991-11-18 | 1993-06-08 | Fujitsu Miyagi Electron:Kk | 振動式パーツフイーダ及び樹脂成形装置 |
JPH06166049A (ja) | 1992-12-01 | 1994-06-14 | Apic Yamada Kk | 樹脂タブレットの供給装置 |
WO1993020996A1 (fr) * | 1992-04-13 | 1993-10-28 | Apic Yamada Corporation | Procede et appareil de moulage par transfert |
JP2555517B2 (ja) * | 1992-09-16 | 1996-11-20 | 禧夫 盛合 | 埋設構造物の形状測定方法および装置 |
JP3286817B2 (ja) | 1993-01-28 | 2002-05-27 | 松下電器産業株式会社 | 多室型空気調和装置 |
TW257745B (de) * | 1993-07-22 | 1995-09-21 | Towa Kk | |
US6007316A (en) * | 1993-07-22 | 1999-12-28 | Towa Corporation | Apparatus for molding resin to seal electronic parts |
JP2932136B2 (ja) * | 1993-07-22 | 1999-08-09 | トーワ株式会社 | 電子部品の樹脂封止成形方法及び装置 |
NL9401930A (nl) * | 1994-11-18 | 1996-07-01 | Fico Bv | Modulaire omhulinrichting. |
EP0759349B1 (de) * | 1995-08-23 | 2002-06-05 | Apic Yamada Corporation | Automatische Formmaschine mit Trennfolie |
NL1003366C2 (nl) * | 1996-06-18 | 1997-12-19 | Fico Bv | Inrichting en werkwijze voor het omhullen van produkten. |
JP2820125B2 (ja) | 1996-07-04 | 1998-11-05 | 日本電気株式会社 | タブレット供給装置 |
TW410194B (en) * | 1996-08-20 | 2000-11-01 | Apic Yamada Kk | Resin molding machine |
JP3642637B2 (ja) | 1996-08-20 | 2005-04-27 | アピックヤマダ株式会社 | 樹脂モールド装置 |
JP3776174B2 (ja) * | 1996-09-12 | 2006-05-17 | アピックヤマダ株式会社 | 半導体部品の搬送装置 |
JP3809233B2 (ja) * | 1996-10-15 | 2006-08-16 | アピックヤマダ株式会社 | リリースフィルムを用いる樹脂モールド装置 |
PT1475209E (pt) * | 1997-01-29 | 2007-01-31 | Jes Tougaard Gram | Molde para o fabrico de um objecto montado |
US5925384A (en) * | 1997-04-25 | 1999-07-20 | Micron Technology, Inc. | Manual pellet loader for Boschman automolds |
JP3017470B2 (ja) * | 1997-07-11 | 2000-03-06 | アピックヤマダ株式会社 | 樹脂モールド方法及び樹脂モールド装置 |
JP2000049175A (ja) * | 1998-07-31 | 2000-02-18 | Tsukuba Seiko Kk | 半導体の封止成形方法及び装置 |
-
2001
- 2001-04-17 TW TW090109113A patent/TW509615B/zh not_active IP Right Cessation
- 2001-04-19 DE DE60132127T patent/DE60132127D1/de not_active Expired - Lifetime
- 2001-04-19 DE DE60144161T patent/DE60144161D1/de not_active Expired - Lifetime
- 2001-04-19 EP EP01303591A patent/EP1147870B1/de not_active Expired - Lifetime
- 2001-04-19 EP EP04029271A patent/EP1514662B1/de not_active Expired - Lifetime
- 2001-04-20 CN CNB011214287A patent/CN1199776C/zh not_active Expired - Lifetime
- 2001-04-20 KR KR10-2001-0021377A patent/KR100427519B1/ko not_active Expired - Lifetime
- 2001-04-20 SG SG200102217A patent/SG89391A1/en unknown
- 2001-04-20 CN CNB2004100956825A patent/CN100363166C/zh not_active Expired - Lifetime
- 2001-04-20 US US09/838,240 patent/US6814556B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR100427519B1 (ko) | 2004-04-27 |
KR20010098773A (ko) | 2001-11-08 |
CN1335222A (zh) | 2002-02-13 |
EP1147870B1 (de) | 2008-01-02 |
TW509615B (en) | 2002-11-11 |
EP1514662A1 (de) | 2005-03-16 |
US20010033876A1 (en) | 2001-10-25 |
DE60144161D1 (de) | 2011-04-14 |
EP1147870A2 (de) | 2001-10-24 |
CN1644347A (zh) | 2005-07-27 |
SG89391A1 (en) | 2002-06-18 |
US6814556B2 (en) | 2004-11-09 |
CN100363166C (zh) | 2008-01-23 |
EP1147870A3 (de) | 2002-12-04 |
CN1199776C (zh) | 2005-05-04 |
EP1514662B1 (de) | 2011-03-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |