[go: up one dir, main page]

DE60121070D1 - grinding tool - Google Patents

grinding tool

Info

Publication number
DE60121070D1
DE60121070D1 DE60121070T DE60121070T DE60121070D1 DE 60121070 D1 DE60121070 D1 DE 60121070D1 DE 60121070 T DE60121070 T DE 60121070T DE 60121070 T DE60121070 T DE 60121070T DE 60121070 D1 DE60121070 D1 DE 60121070D1
Authority
DE
Germany
Prior art keywords
abrasive
grain
binder phase
layer
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60121070T
Other languages
German (de)
Other versions
DE60121070T2 (en
Inventor
Tsutomu Takahashi
Naoki Shimomae
Tetsuji Yamashita
Hanako Hata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Application granted granted Critical
Publication of DE60121070D1 publication Critical patent/DE60121070D1/en
Publication of DE60121070T2 publication Critical patent/DE60121070T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

An abrasive tool (420) with metal binder phase has plural protruded parts formed in base metal (422), and has abrasive grain layer (424) with small abrasive-grain-layer parts (428) set at an interval mutually and ultra abrasive grains (14,414) are adhered at these protruded parts by metal binder phase. A single ultra abrasive grain is adhered at each of said small abrasive-grain-layer parts by the metal binder phase. <IMAGE>
DE60121070T 2000-02-07 2001-01-30 grinding tool Expired - Fee Related DE60121070T2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000029614 2000-02-07
JP2000029614A JP2001219376A (en) 2000-02-07 2000-02-07 Electrodeposition grinding wheel

Publications (2)

Publication Number Publication Date
DE60121070D1 true DE60121070D1 (en) 2006-08-10
DE60121070T2 DE60121070T2 (en) 2007-06-06

Family

ID=18554846

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60121070T Expired - Fee Related DE60121070T2 (en) 2000-02-07 2001-01-30 grinding tool

Country Status (6)

Country Link
EP (2) EP1122030B1 (en)
JP (1) JP2001219376A (en)
KR (1) KR100749385B1 (en)
AT (1) ATE331591T1 (en)
DE (1) DE60121070T2 (en)
HK (1) HK1039296A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6669745B2 (en) 2001-02-21 2003-12-30 3M Innovative Properties Company Abrasive article with optimally oriented abrasive particles and method of making the same
TWI238753B (en) * 2002-12-19 2005-09-01 Miyanaga Kk Diamond disk for grinding
JP2005015868A (en) * 2003-06-27 2005-01-20 Yuichiro Niizaki Metallic clay material, and bristle material, shank, disk-shaped grindstone and burr-removing holder formed of the metallic clay material
US20060276111A1 (en) * 2005-06-02 2006-12-07 Applied Materials, Inc. Conditioning element for electrochemical mechanical processing
JP4896114B2 (en) * 2008-11-20 2012-03-14 株式会社ノリタケカンパニーリミテド Electrodeposition tool manufacturing method
KR101250471B1 (en) 2011-03-18 2013-04-24 (주)인성다이아몬드 The grinding disk and its method
CN103552002A (en) * 2013-11-08 2014-02-05 谢泽 Polishing wheel based on fiber adhesive rope coated abrasive tool
CN103551999A (en) * 2013-11-08 2014-02-05 谢泽 Method for producing coated abrasive tool on the basis of fiber ropes
CN106457523A (en) * 2014-06-17 2017-02-22 阪东化学株式会社 Polishing pad and method for producing polishing pad
EP3319757B1 (en) 2015-07-08 2020-09-02 3M Innovative Properties Company Systems and methods for making abrasive articles
JP7315332B2 (en) 2019-01-31 2023-07-26 株式会社荏原製作所 Surface height measurement method using dummy disk and dummy disk

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06114743A (en) * 1992-04-30 1994-04-26 Osaka Diamond Ind Co Ltd Electrodeposition grinding wheel
JP3020434B2 (en) * 1995-07-07 2000-03-15 旭ダイヤモンド工業株式会社 Electroplated wheel and manufacturing method thereof
JP2896657B2 (en) * 1996-06-28 1999-05-31 旭ダイヤモンド工業株式会社 Dresser and manufacturing method thereof
JPH1177535A (en) * 1997-09-09 1999-03-23 Asahi Diamond Ind Co Ltd Conditioner and method of manufacturing the same
US6004196A (en) * 1998-02-27 1999-12-21 Micron Technology, Inc. Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates
JP3295888B2 (en) * 1998-04-22 2002-06-24 株式会社藤森技術研究所 Polishing dresser for polishing machine of chemical machine polisher

Also Published As

Publication number Publication date
DE60121070T2 (en) 2007-06-06
KR20010078363A (en) 2001-08-20
HK1039296A1 (en) 2002-04-19
EP1500469A1 (en) 2005-01-26
EP1122030B1 (en) 2006-06-28
ATE331591T1 (en) 2006-07-15
KR100749385B1 (en) 2007-08-14
EP1122030A2 (en) 2001-08-08
JP2001219376A (en) 2001-08-14
EP1122030A3 (en) 2003-12-10

Similar Documents

Publication Publication Date Title
DE60121070D1 (en) grinding tool
MY122784A (en) Abrasive article suitable for modifying a semiconductor wafer
EP2263832A3 (en) Abrasive article with optimally oriented abrasive particles
AU2001294082A1 (en) Polycrystalline abrasive grit
ATE260166T1 (en) GRINDING TOOL
ATE441502T1 (en) DIAMOND PLATE
GB2421508B (en) Porous abrasive segments and tools incorporating the same
PT1027189E (en) LOW TEMPERATURE LIGHTING FOR ABRASIVE TOOLS
UY34152A (en) ? SUBSTITUTED OXAZOLIDINONES AND ITS USE ?.
MY129229A (en) Spray drying methods of making agglomerate abrasive grains and abrasive articles
AU2001270037A1 (en) Oscillating fixed abrasive cmp system and methods for implementing the same
MY134523A (en) Grinding wheel
DE602005009149D1 (en) ENGINE COMPONENT AND MANUFACTURING METHOD THEREFOR
AU2003275655A1 (en) Polishing slurry and polished substrate
AU2003211822A1 (en) Method for manufacturing silicon carbide sintered compact jig and silicon carbide sintered compact jig manufactured by the method
DE60113920D1 (en) Hand belt sander
AU2003221723A1 (en) Precision portable flange grinder
TW200620527A (en) Wafer chuck
FR2808521B1 (en) IMPROVED ABRASIVE GRAINS
USD488623S1 (en) Felt
DE60229489D1 (en) Grains with diamond tip
USD493828S1 (en) Information card
USD501219S1 (en) Information card
FI20020607A0 (en) Carrier grinding
USD498593S1 (en) Felt

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee