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DE60119090D1 - Einrichtung zur Montage elektronischer Bauteile - Google Patents

Einrichtung zur Montage elektronischer Bauteile

Info

Publication number
DE60119090D1
DE60119090D1 DE60119090T DE60119090T DE60119090D1 DE 60119090 D1 DE60119090 D1 DE 60119090D1 DE 60119090 T DE60119090 T DE 60119090T DE 60119090 T DE60119090 T DE 60119090T DE 60119090 D1 DE60119090 D1 DE 60119090D1
Authority
DE
Germany
Prior art keywords
electronic components
mounting electronic
mounting
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60119090T
Other languages
English (en)
Other versions
DE60119090T2 (de
Inventor
Takashi Yoshii
Hideaki Fukushima
Akihiro Kawai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Tech Instruments Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Instruments Co Ltd filed Critical Hitachi High Tech Instruments Co Ltd
Publication of DE60119090D1 publication Critical patent/DE60119090D1/de
Application granted granted Critical
Publication of DE60119090T2 publication Critical patent/DE60119090T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE2001619090 2001-07-20 2001-07-20 Einrichtung zur Montage elektronischer Bauteile Expired - Lifetime DE60119090T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20010117537 EP1282350B1 (de) 2001-07-20 2001-07-20 Einrichtung zur Montage elektronischer Bauteile

Publications (2)

Publication Number Publication Date
DE60119090D1 true DE60119090D1 (de) 2006-06-01
DE60119090T2 DE60119090T2 (de) 2006-11-30

Family

ID=8178084

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2001619090 Expired - Lifetime DE60119090T2 (de) 2001-07-20 2001-07-20 Einrichtung zur Montage elektronischer Bauteile

Country Status (2)

Country Link
EP (1) EP1282350B1 (de)
DE (1) DE60119090T2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008045928A1 (de) * 2008-09-04 2010-03-11 Siemens Electronics Assembly Systems Gmbh & Co. Kg Verfahren zum Vermessen und Inspizieren von Objekten mittels eines Bildverarbeitungssystems
AT514599B1 (de) 2013-07-05 2015-02-15 Melecs Ews Gmbh & Co Kg Verfahren zur Bestückung elektronischer Leiterplatten mit optischen Bauelementen
EP3267782B1 (de) * 2015-03-05 2020-11-18 FUJI Corporation Montageverwaltungsvorrichtung

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56118391A (en) * 1980-02-25 1981-09-17 Hitachi Ltd Method and device for inserting electronic part
EP0395002A3 (de) * 1989-04-28 1991-07-10 Sanyo Electric Co., Ltd. Vorrichtung zum Montieren von elektronischen Komponenten
JP2599510B2 (ja) * 1991-03-28 1997-04-09 松下電器産業株式会社 部品装着機
JP3552791B2 (ja) * 1995-06-13 2004-08-11 松下電器産業株式会社 電子部品実装方法及び装置
US6094808A (en) * 1996-02-16 2000-08-01 Matsushita Electric Industrial Co., Ltd. Apparatus for mounting electronic components
JP3728350B2 (ja) * 1996-06-11 2005-12-21 松下電器産業株式会社 部品実装方法及び部品実装装置
EP0895450B1 (de) * 1997-07-28 2005-11-16 Matsushita Electric Industrial Co., Ltd. Bauteilzuführer und Vorrichtung zur Bestückung
CN1190121C (zh) * 1997-08-29 2005-02-16 松下电器产业株式会社 部件安装方法以及部件安装装置
JP4331301B2 (ja) * 1999-02-24 2009-09-16 富士機械製造株式会社 電気部品装着機および電気部品装着方法

Also Published As

Publication number Publication date
EP1282350A1 (de) 2003-02-05
EP1282350B1 (de) 2006-04-26
DE60119090T2 (de) 2006-11-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition