DE60108043D1 - Non-destructive inspection procedure - Google Patents

Non-destructive inspection procedure

Info

Publication number: DE60108043D1
Authority: DE; Germany
Prior art keywords: destructive inspection; inspection procedure; procedure; destructive; inspection
Prior art date: 2000-10-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE60108043T

Other languages

German (de)

Other versions

DE60108043T2 (en

Inventor

Kiyoshi Nikawa

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NEC Electronics Corp

Original Assignee

NEC Electronics Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-10-26

Filing date

2001-10-24

Publication date

2005-02-03

2001-03-21 Priority claimed from JP2001081310A external-priority patent/JP2002313859A/en

2001-10-24 Application filed by NEC Electronics Corp filed Critical NEC Electronics Corp

2005-02-03 Publication of DE60108043D1 publication Critical patent/DE60108043D1/en

2005-12-08 Application granted granted Critical

2005-12-08 Publication of DE60108043T2 publication Critical patent/DE60108043T2/en

2021-10-25 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Electromagnetism (AREA)
Computer Vision & Pattern Recognition (AREA)
Health & Medical Sciences (AREA)
Toxicology (AREA)
General Engineering & Computer Science (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Power Engineering (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)
Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
Tests Of Electronic Circuits (AREA)

DE60108043T 2000-10-26 2001-10-24 Non-destructive inspection procedure Expired - Fee Related DE60108043T2 (en)

Applications Claiming Priority (6)

Application Number	Priority Date	Filing Date	Title
JP2000326820		2000-10-26
JP2000326820		2000-10-26
JP2001033928		2001-02-09
JP2001033928		2001-02-09
JP2001081310		2001-03-21
JP2001081310A JP2002313859A (en)	2001-02-09	2001-03-21	Nondestructive inspection method and device and semiconductor chip

Publications (2)

Publication Number	Publication Date
DE60108043D1 true DE60108043D1 (en)	2005-02-03
DE60108043T2 DE60108043T2 (en)	2005-12-08

Family

ID=27345031

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60108043T Expired - Fee Related DE60108043T2 (en)	2000-10-26	2001-10-24	Non-destructive inspection procedure

Country Status (6)

Country	Link
US (1)	US6593156B2 (en)
EP (1)	EP1202069B1 (en)
KR (1)	KR100402044B1 (en)
CN (1)	CN1194396C (en)
DE (1)	DE60108043T2 (en)
TW (1)	TW528874B (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4429593B2 (en) *	2002-11-22	2010-03-10	パナソニック株式会社	Semiconductor device layout verification method
JP4334927B2 (en) *	2003-06-27	2009-09-30	キヤノン株式会社	Inspection method and inspection apparatus for semiconductor laser diode chip
JP2005134196A (en) *	2003-10-29	2005-05-26	Nec Electronics Corp	Non-destructive analysis method and non-destructive analysis device
JP2007127590A (en) *	2005-11-07	2007-05-24	Nec Electronics Corp	Method and system for inspecting semiconductor device
JP2009008626A (en) *	2007-06-29	2009-01-15	Nec Electronics Corp	Failure analysis method and failure analysis device
CN101382502B (en) *	2007-09-07	2011-07-27	鸿富锦精密工业（深圳）有限公司	Surface blot detecting system and detecting method thereof
US20090147255A1 (en) *	2007-12-07	2009-06-11	Erington Kent B	Method for testing a semiconductor device and a semiconductor device testing system
KR101109302B1 (en) *	2009-12-02	2012-01-31	삼성전기주식회사	Defect inspection device of circuit pattern and inspection method
JP2012043953A (en) *	2010-08-18	2012-03-01	Renesas Electronics Corp	Electronic component and manufacturing method of electronic component
DE102013217094B4 (en) *	2013-08-28	2021-11-04	Robert Bosch Gmbh	Micromechanical component and corresponding test method for a micromechanical component
US9523729B2 (en) *	2013-09-13	2016-12-20	Infineon Technologies Ag	Apparatus and method for testing electric conductors
CN103698681A (en) *	2013-12-19	2014-04-02	江苏瑞新科技股份有限公司	Novel non-contact test device for P-type semiconductor and N-type semiconductor
TW201704766A (en)	2015-03-19	2017-02-01	帝喜科技股份有限公司	Particle beam heating to identify defects
US9995677B2 (en)	2016-09-06	2018-06-12	Sensors Unlimited, Inc.	Silicon article inspection systems and methods
US10739397B2 (en)	2017-05-10	2020-08-11	International Business Machines Corporation	Accelerated wafer testing using non-destructive and localized stress
US10514363B2 (en) *	2018-02-23	2019-12-24	The Boeing Company	Laser ultrasound scanning for visualizing damage or irregularities
KR102362879B1 (en)	2018-07-04	2022-02-11	주식회사 엘지에너지솔루션	Method and apparatus for testing internal short of secondary battery and secondary battery used for the method
TWI712317B (en) *	2019-02-22	2020-12-01	興城科技股份有限公司	Open/short tester for inspecting glass substrate and inspecting method thereof
US11548161B2 (en)	2020-05-14	2023-01-10	The Boeing Company	Methods of performing a plurality of operations within a region of a part utilizing an end effector of a robot and robots that perform the methods
TWI741791B (en) *	2020-09-16	2021-10-01	南亞科技股份有限公司	Wafer inspection method and system
US11639914B2 (en)	2020-12-16	2023-05-02	The Boeing Company	Non-destructive test systems with infrared thermography assemblies and ultrasonic test assemblies, and associated methods

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR2565354B3 (en) *	1984-05-30	1986-10-24	Eurotechnique Sa	METHOD AND DEVICE FOR TESTING INTEGRATED CIRCUITS ON WAFERS
JPS6489442A (en) *	1987-09-30	1989-04-03	Toshiba Corp	Measuring method of semiconductor device
US5334540A (en) *	1991-11-14	1994-08-02	Mitsubishi Denki Kabushiki Kaisha	OBIC observation method and apparatus therefor
JP2970194B2 (en) *	1992-04-02	1999-11-02	日本電気株式会社	Semiconductor integrated circuit
JPH0645418A (en) *	1992-07-21	1994-02-18	Mitsubishi Denki Eng Kk	Semiconductor testing system, semiconductor testing method, method of forming wiring pattern of semiconductor integrated circuit, and semiconductor integrated circuit
US5422498A (en) *	1993-04-13	1995-06-06	Nec Corporation	Apparatus for diagnosing interconnections of semiconductor integrated circuits
JPH0714898A (en) *	1993-06-23	1995-01-17	Mitsubishi Electric Corp	Equipment and method for testing and analyzing semiconductor wafer
JP2718370B2 (en) *	1994-07-29	1998-02-25	日本電気株式会社	Wiring short point detection method and wiring short point detection device
US5708371A (en) *	1995-03-16	1998-01-13	Mitsubishi Denki Kabushiki Kaisha	Scanning photoinduced current analyzer capable of detecting photoinduced current in nonbiased specimen
JPH10135413A (en)	1996-10-31	1998-05-22	Matsushita Electric Works Ltd	Semiconductor device and method of evaluating it
US6346821B1 (en) *	1998-03-27	2002-02-12	Infineon Technologies Ag	Method for nondestructive measurement of minority carrier diffusion length and minority carrier lifetime in semiconductor devices
DE69940335D1 (en) *	1998-09-28	2009-03-12	Nec Electronics Corp	Apparatus and method for non-destructive testing of a semiconductor device

2001
- 2001-10-19 TW TW090125938A patent/TW528874B/en not_active IP Right Cessation
- 2001-10-22 US US09/982,863 patent/US6593156B2/en not_active Expired - Fee Related
- 2001-10-24 DE DE60108043T patent/DE60108043T2/en not_active Expired - Fee Related
- 2001-10-24 EP EP01125239A patent/EP1202069B1/en not_active Expired - Lifetime
- 2001-10-25 KR KR10-2001-0065917A patent/KR100402044B1/en not_active IP Right Cessation
- 2001-10-26 CN CNB011368403A patent/CN1194396C/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
TW528874B (en)	2003-04-21
EP1202069B1 (en)	2004-12-29
US20020052055A1 (en)	2002-05-02
KR20020032383A (en)	2002-05-03
EP1202069A3 (en)	2003-04-23
US6593156B2 (en)	2003-07-15
CN1194396C (en)	2005-03-23
CN1351263A (en)	2002-05-29
DE60108043T2 (en)	2005-12-08
KR100402044B1 (en)	2003-10-17
EP1202069A2 (en)	2002-05-02

Publication	Publication Date	Title
DE60108043D1 (en)	2005-02-03	Non-destructive inspection procedure
DE10196075T1 (en)	2003-08-07	Container inspection device
DE60142001D1 (en)	2010-06-17	Battery seal inspection procedure
NO20032447L (en)	2003-07-24	Ultrasonic testing system
NO20030539D0 (en)	2003-02-03	Non-invasive pipe inspection system
DE60030208T8 (en)	2007-11-22	Wafer inspection device
DE50015294D1 (en)	2008-09-18	microtome
DE60236426D1 (en)	2010-07-01	CONTACT PROBE
DE60024924D1 (en)	2006-01-26	A defect inspection
DE10193433T1 (en)	2002-10-31	Mask inspection device
NO20024511D0 (en)	2002-09-20	Pipeline spigot unit for non-destructive inspection
EP1460434A4 (en)	2008-12-03	CONTACT PROBE
DE50204020D1 (en)	2005-09-29	MICROTOME
FI20002029L (en)	2002-03-15	JTAG test system
DE19981380D2 (en)	2001-11-22	Ultrasonic test facility
ATE460658T1 (en)	2010-03-15	TEST STRIP MEASUREMENT PROCEDURE
EP1312916A4 (en)	2008-01-23	Non-destructive inspection device
DE60132196D1 (en)	2008-02-14	TEST SIGNAL
FI20000292A0 (en)	2000-02-11	Test Arrangement and Test Method
DE69901030D1 (en)	2002-04-18	IMAGING DEVICE INSPECTION
DE50013086D1 (en)	2006-08-10	inspection device
DE69919457D1 (en)	2004-09-23	probe
DE10197150T1 (en)	2003-12-04	LSI Tester
DE10196444T1 (en)	2003-10-02	Tester
DE60021770D1 (en)	2005-09-08	PROBE

Legal Events

Date	Code	Title	Description
2006-01-26	8364	No opposition during term of opposition
2010-08-19	8339	Ceased/non-payment of the annual fee