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DE60039745D1 - Vielschichtkondensator - Google Patents

Vielschichtkondensator

Info

Publication number
DE60039745D1
DE60039745D1 DE60039745T DE60039745T DE60039745D1 DE 60039745 D1 DE60039745 D1 DE 60039745D1 DE 60039745 T DE60039745 T DE 60039745T DE 60039745 T DE60039745 T DE 60039745T DE 60039745 D1 DE60039745 D1 DE 60039745D1
Authority
DE
Germany
Prior art keywords
multilayer capacitor
multilayer
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60039745T
Other languages
English (en)
Inventor
Taisuke Ahiko
Takaya Ishigara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Application granted granted Critical
Publication of DE60039745D1 publication Critical patent/DE60039745D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
DE60039745T 1999-12-28 2000-12-28 Vielschichtkondensator Expired - Lifetime DE60039745D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP37482899A JP2001189234A (ja) 1999-12-28 1999-12-28 積層コンデンサ

Publications (1)

Publication Number Publication Date
DE60039745D1 true DE60039745D1 (de) 2008-09-18

Family

ID=18504502

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60039745T Expired - Lifetime DE60039745D1 (de) 1999-12-28 2000-12-28 Vielschichtkondensator

Country Status (5)

Country Link
US (1) US6407907B1 (de)
EP (1) EP1115129B1 (de)
JP (1) JP2001189234A (de)
DE (1) DE60039745D1 (de)
TW (1) TW484150B (de)

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US6757152B2 (en) 2001-09-05 2004-06-29 Avx Corporation Cascade capacitor
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US7573698B2 (en) * 2002-10-03 2009-08-11 Avx Corporation Window via capacitors
US7016175B2 (en) * 2002-10-03 2006-03-21 Avx Corporation Window via capacitor
JP4548571B2 (ja) * 2002-10-08 2010-09-22 日本特殊陶業株式会社 積層コンデンサの製造方法
CN100437850C (zh) * 2002-10-30 2008-11-26 京瓷株式会社 电容器，布线基板，退耦电路以及高频电路
JP2006222442A (ja) * 2002-10-30 2006-08-24 Kyocera Corp コンデンサ、及び配線基板
USD522456S1 (en) * 2002-11-29 2006-06-06 Honda Giken Kogyo Kabushiki Kaisha Capacitor cell
US6891258B1 (en) * 2002-12-06 2005-05-10 Xilinx, Inc. Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit
DE10303738B4 (de) * 2003-01-30 2007-12-27 Infineon Technologies Ag Speicherkondensator und Speicherzellenanordnung
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DE10339156B3 (de) * 2003-08-26 2005-03-17 Epcos Ag Schaltungsanordnung mit mehreren Kapazitäten
DE102004010001A1 (de) * 2004-03-01 2005-09-22 Epcos Ag Elektrisches Bauelement und schaltungsanordnung mit dem Bauelement
JP3901697B2 (ja) 2004-03-19 2007-04-04 Ｔｄｋ株式会社 積層コンデンサ
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JP4426482B2 (ja) * 2005-02-28 2010-03-03 Ｏｋｉセミコンダクタ株式会社 パッケージ基台およびその製造方法、並びにそのパッケージ基台を備えた半導体パッケージ
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DE102005016590A1 (de) * 2005-04-11 2006-10-26 Epcos Ag Elektrisches Mehrschicht-Bauelement und Verfahren zur Herstellung eines Mehrschicht-Bauelements
US7355836B2 (en) * 2005-06-07 2008-04-08 Intel Corporation Array capacitor for decoupling multiple voltage rails
JP4704866B2 (ja) * 2005-09-14 2011-06-22 日本特殊陶業株式会社 配線基板内蔵用コンデンサ及び配線基板
US7932471B2 (en) 2005-08-05 2011-04-26 Ngk Spark Plug Co., Ltd. Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment
JP4757587B2 (ja) * 2005-09-21 2011-08-24 Ｔｄｋ株式会社 積層コンデンサ、及び、その製造方法
US7561407B1 (en) * 2005-11-28 2009-07-14 Altera Corporation Multi-segment capacitor
JP5089880B2 (ja) * 2005-11-30 2012-12-05 日本特殊陶業株式会社 配線基板内蔵用キャパシタ、キャパシタ内蔵配線基板及びその製造方法
JP4643482B2 (ja) * 2006-03-24 2011-03-02 日本特殊陶業株式会社 配線基板
US7426102B2 (en) * 2006-05-01 2008-09-16 Vishay Intertechnology, Inc. High precision capacitor with standoff
JP4760789B2 (ja) * 2006-08-21 2011-08-31 株式会社村田製作所 積層コンデンサ、回路基板及び回路モジュール
USD576943S1 (en) * 2006-10-06 2008-09-16 Nec Tokin Corporation Chip-type solid state electrolytic capacitor
KR100905862B1 (ko) * 2007-02-26 2009-07-02 삼성전기주식회사 집적된 적층형 칩 커패시터 모듈 및 이를 구비하는 집적회로 장치
US8161609B2 (en) * 2008-05-21 2012-04-24 Intel Corporation Methods of fabricating an array capacitor
US20090296310A1 (en) * 2008-06-03 2009-12-03 Azuma Chikara Chip capacitor precursors, packaged semiconductors, and assembly method for converting the precursors to capacitors
US20110007488A1 (en) * 2009-07-07 2011-01-13 Chin-Wei Liu Power supply current circuit structure
JP5158061B2 (ja) * 2009-11-30 2013-03-06 Ｔｄｋ株式会社 薄膜コンデンサ
KR101070095B1 (ko) * 2009-12-10 2011-10-04 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법
JP5432002B2 (ja) * 2010-02-25 2014-03-05 太陽誘電株式会社 コンデンサ及びその製造方法
US8823133B2 (en) 2011-03-29 2014-09-02 Xilinx, Inc. Interposer having an inductor
JP2013021299A (ja) * 2011-06-16 2013-01-31 Murata Mfg Co Ltd 積層セラミック電子部品
JP5784384B2 (ja) * 2011-06-20 2015-09-24 日本特殊陶業株式会社 電子部品の製造方法
US9406738B2 (en) 2011-07-20 2016-08-02 Xilinx, Inc. Inductive structure formed using through silicon vias
US9330823B1 (en) 2011-12-19 2016-05-03 Xilinx, Inc. Integrated circuit structure with inductor in silicon interposer
US9337138B1 (en) 2012-03-09 2016-05-10 Xilinx, Inc. Capacitors within an interposer coupled to supply and ground planes of a substrate
JP2014011419A (ja) * 2012-07-03 2014-01-20 Taiyo Yuden Co Ltd コンデンサ
JP6043548B2 (ja) * 2012-08-31 2016-12-14 太陽誘電株式会社 コンデンサ
CN103515093A (zh) * 2013-07-24 2014-01-15 中国电子科技集团公司第五十五研究所 一种具有内部互连结构的片式电容及其制备方法
KR101508540B1 (ko) * 2013-08-09 2015-04-06 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판
US9807884B2 (en) * 2014-12-22 2017-10-31 Qualcomm Incorporated Substrate comprising embedded elongated capacitor
JP6610072B2 (ja) * 2015-08-07 2019-11-27 株式会社村田製作所 積層コンデンサ、及び、配線基板
KR101872582B1 (ko) * 2016-03-22 2018-06-28 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조 방법
JP2018074069A (ja) * 2016-11-01 2018-05-10 Tdk株式会社 薄膜コンデンサ
KR102427927B1 (ko) * 2017-11-10 2022-08-02 삼성전기주식회사 3단자 적층형 커패시터
JP2019176109A (ja) * 2018-03-29 2019-10-10 太陽誘電株式会社 受動部品及び電子機器
WO2020167955A1 (en) 2019-02-13 2020-08-20 Avx Corporation Multilayer ceramic capacitor including conductive vias
WO2023058497A1 (ja) * 2021-10-06 2023-04-13 株式会社村田製作所 電子部品
WO2024143087A1 (ja) * 2022-12-28 2024-07-04 株式会社村田製作所 積層セラミックコンデンサ

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Also Published As

Publication number Publication date
JP2001189234A (ja) 2001-07-10
TW484150B (en) 2002-04-21
EP1115129B1 (de) 2008-08-06
EP1115129A2 (de) 2001-07-11
US6407907B1 (en) 2002-06-18
EP1115129A3 (de) 2006-06-07

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: AHIKO, TAISUKE, YURI-GUN, AKITA-KEN 018-0402, JP

Inventor name: ISHIGAKI, TAKAYA, TOKYO 103-8272, JP

8364 No opposition during term of opposition