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DE60032438D1 - Verbessertes Verfahren zum Einbetten von passiven Bauteilen - Google Patents

Verbessertes Verfahren zum Einbetten von passiven Bauteilen

Info

Publication number
DE60032438D1
DE60032438D1 DE60032438T DE60032438T DE60032438D1 DE 60032438 D1 DE60032438 D1 DE 60032438D1 DE 60032438 T DE60032438 T DE 60032438T DE 60032438 T DE60032438 T DE 60032438T DE 60032438 D1 DE60032438 D1 DE 60032438D1
Authority
DE
Germany
Prior art keywords
improved process
passive components
embedding passive
embedding
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60032438T
Other languages
English (en)
Other versions
DE60032438T2 (de
Inventor
John James Felten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE60032438D1 publication Critical patent/DE60032438D1/de
Application granted granted Critical
Publication of DE60032438T2 publication Critical patent/DE60032438T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE60032438T 1999-10-15 2000-07-10 Verbessertes Verfahren zum Einbetten von passiven Bauteilen Expired - Lifetime DE60032438T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/419,681 US6317023B1 (en) 1999-10-15 1999-10-15 Method to embed passive components
US419681 1999-10-15

Publications (2)

Publication Number Publication Date
DE60032438D1 true DE60032438D1 (de) 2007-02-01
DE60032438T2 DE60032438T2 (de) 2007-10-04

Family

ID=23663295

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60032438T Expired - Lifetime DE60032438T2 (de) 1999-10-15 2000-07-10 Verbessertes Verfahren zum Einbetten von passiven Bauteilen

Country Status (6)

Country Link
US (2) US6317023B1 (de)
EP (1) EP1093327B1 (de)
JP (1) JP3556164B2 (de)
KR (1) KR100377309B1 (de)
DE (1) DE60032438T2 (de)
TW (1) TWI240602B (de)

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JP2001513697A (ja) 1997-02-24 2001-09-04 スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー エアロゾル法及び装置、粒子製品、並びに該粒子製品から製造される電子装置
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US6696906B1 (en) * 2001-05-30 2004-02-24 Hewlett-Packard Development Company, L.P. Low dielectric loss signal line having a conductive trace supported by filaments
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JP4515477B2 (ja) * 2001-06-05 2010-07-28 大日本印刷株式会社 受動素子を備えた配線板の製造方法
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US7524528B2 (en) 2001-10-05 2009-04-28 Cabot Corporation Precursor compositions and methods for the deposition of passive electrical components on a substrate
US7629017B2 (en) 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US7083850B2 (en) * 2001-10-18 2006-08-01 Honeywell International Inc. Electrically conductive thermal interface
US7732002B2 (en) 2001-10-19 2010-06-08 Cabot Corporation Method for the fabrication of conductive electronic features
US7553512B2 (en) 2001-11-02 2009-06-30 Cabot Corporation Method for fabricating an inorganic resistor
US6860000B2 (en) * 2002-02-15 2005-03-01 E.I. Du Pont De Nemours And Company Method to embed thick film components
US20050063135A1 (en) * 2003-09-18 2005-03-24 Borland William J. High tolerance embedded capacitors
US20040108134A1 (en) * 2002-10-11 2004-06-10 Borland William J. Printed wiring boards having low inductance embedded capacitors and methods of making same
US20040099999A1 (en) * 2002-10-11 2004-05-27 Borland William J. Co-fired capacitor and method for forming ceramic capacitors for use in printed wiring boards
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WO2004056160A1 (en) * 2002-12-13 2004-07-01 E.I. Du Pont De Nemours And Company Printed wiring boards having low inductance embedded capacitors and methods of making same
US20040231885A1 (en) * 2003-03-07 2004-11-25 Borland William J. Printed wiring boards having capacitors and methods of making thereof
US7274100B2 (en) * 2003-06-23 2007-09-25 International Rectifier Corporation Battery protection circuit with integrated passive components
JP4047243B2 (ja) * 2003-08-07 2008-02-13 株式会社日立製作所 有機・無機酸化物混合体薄膜、それを用いた受動素子内蔵電子基板及び有機・無機酸化物混合体薄膜の製造方法
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EP1578179A3 (de) 2004-03-16 2006-05-03 E.I. du Pont de Nemours and Company Dickfilmdielektrikum und leitfähige Zusammensetzungen
US7688569B2 (en) * 2004-03-16 2010-03-30 E. I. Du Pont De Nemours And Company Thick-film dielectric and conductive compositions
US20050204864A1 (en) * 2004-03-16 2005-09-22 Borland William J Thick-film dielectric and conductive compositions
US20050208706A1 (en) * 2004-03-17 2005-09-22 Blazek Roy J Method of creating multi-layered monolithic circuit structure containing integral buried and trimmed components
US20070019789A1 (en) * 2004-03-29 2007-01-25 Jmar Research, Inc. Systems and methods for achieving a required spot says for nanoscale surface analysis using soft x-rays
US7100277B2 (en) * 2004-07-01 2006-09-05 E. I. Du Pont De Nemours And Company Methods of forming printed circuit boards having embedded thick film capacitors
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US7342804B2 (en) * 2004-08-09 2008-03-11 Cts Corporation Ball grid array resistor capacitor network
US20060120015A1 (en) * 2004-12-02 2006-06-08 Borland William J Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards
US20060141225A1 (en) * 2004-12-28 2006-06-29 Borland William J Oxygen doped firing of barium titanate on copper foil
EP1833286A1 (de) * 2004-12-28 2007-09-12 Ngk Spark Plug Co., Ltd Leiterplatte und leiterplattenherstellungsverfahren
US20060189113A1 (en) 2005-01-14 2006-08-24 Cabot Corporation Metal nanoparticle compositions
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US8334464B2 (en) 2005-01-14 2012-12-18 Cabot Corporation Optimized multi-layer printing of electronics and displays
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US7533361B2 (en) 2005-01-14 2009-05-12 Cabot Corporation System and process for manufacturing custom electronics by combining traditional electronics with printable electronics
US7741189B2 (en) * 2005-06-20 2010-06-22 E.I. Du Pont De Nemours And Company Electrodes, inner layers, capacitors, electronic devices and methods of making thereof
US20060282999A1 (en) * 2005-06-20 2006-12-21 Diptarka Majumdar Electrodes, inner layers, capacitors and printed wiring boards and methods of making thereof - part II
US7456459B2 (en) * 2005-10-21 2008-11-25 Georgia Tech Research Corporation Design of low inductance embedded capacitor layer connections
US7504706B2 (en) * 2005-10-21 2009-03-17 E. I. Du Pont De Nemours Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof
US7705423B2 (en) 2005-10-21 2010-04-27 Georgia Tech Research Corporation Device having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuitry of an integrated circuit
US7531416B2 (en) * 2005-12-21 2009-05-12 E. I. Du Pont De Nemours And Company Thick film capacitors on ceramic interconnect substrates
US20070210426A1 (en) * 2006-03-07 2007-09-13 Gerber Mark A Gold-bumped interposer for vertically integrated semiconductor system
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JP2010512663A (ja) * 2006-12-12 2010-04-22 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 複合有機封入剤
EP2102268A2 (de) * 2006-12-12 2009-09-23 E.I. Du Pont De Nemours And Company Kristalline verkapselungsmittel
US20080160173A1 (en) * 2006-12-27 2008-07-03 Nokia Corporation Component Moulding Process
CN101467501B (zh) * 2007-02-06 2011-07-20 揖斐电株式会社 印制电路板及该印制电路板的制造方法
US8357753B2 (en) 2007-07-18 2013-01-22 Cda Processing Limited Liability Company Screen-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazoles
US8270145B2 (en) 2007-12-04 2012-09-18 Cda Processing Limited Liability Company Screen-printable encapsulants based on soluble polybenzoxazoles
EP3167458B1 (de) * 2014-07-11 2020-04-29 E. I. du Pont de Nemours and Company Fliessfähige zusammensetzungen mit niedrigtemperaturhärtung zur herstellung thermisch leitender bahnen in elektronischen anwendungen und verfahren im zusammenhang damit
TWI600354B (zh) * 2014-09-03 2017-09-21 光頡科技股份有限公司 具高彎折力之微電阻結構及其製造方法
WO2017188446A1 (ja) * 2016-04-28 2017-11-02 シャープ株式会社 導電性ペースト、電極接続構造、及び、電極接続構造の製造方法
TWI713424B (zh) * 2018-10-15 2020-12-11 鼎展電子股份有限公司 銅箔電阻與具有該銅箔電阻的電路板結構
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Also Published As

Publication number Publication date
JP3556164B2 (ja) 2004-08-18
KR100377309B1 (ko) 2003-03-26
EP1093327A3 (de) 2003-12-10
TWI240602B (en) 2005-09-21
EP1093327A2 (de) 2001-04-18
EP1093327B1 (de) 2006-12-20
US20020028284A1 (en) 2002-03-07
US6317023B1 (en) 2001-11-13
DE60032438T2 (de) 2007-10-04
KR20010070138A (ko) 2001-07-25
JP2001160672A (ja) 2001-06-12

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