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DE60027021D1 - Verkapselung für oled-bauelemente - Google Patents

Verkapselung für oled-bauelemente

Info

Publication number
DE60027021D1
DE60027021D1 DE60027021T DE60027021T DE60027021D1 DE 60027021 D1 DE60027021 D1 DE 60027021D1 DE 60027021 T DE60027021 T DE 60027021T DE 60027021 T DE60027021 T DE 60027021T DE 60027021 D1 DE60027021 D1 DE 60027021D1
Authority
DE
Germany
Prior art keywords
capsulation
oled components
oled
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60027021T
Other languages
English (en)
Other versions
DE60027021T2 (de
Inventor
Ewald Karl Michael Guenther
Mark Dai Joong Auch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Institute of Materials Research and Engineering
Original Assignee
Osram Opto Semiconductors GmbH
Institute of Materials Research and Engineering
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH, Institute of Materials Research and Engineering filed Critical Osram Opto Semiconductors GmbH
Publication of DE60027021D1 publication Critical patent/DE60027021D1/de
Application granted granted Critical
Publication of DE60027021T2 publication Critical patent/DE60027021T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8428Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8723Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
DE60027021T 2000-09-06 2000-09-06 Verkapselung für oled-bauelemente Expired - Lifetime DE60027021T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2000/000133 WO2002021557A1 (en) 2000-09-06 2000-09-06 Encapsulation for oled devices

Publications (2)

Publication Number Publication Date
DE60027021D1 true DE60027021D1 (de) 2006-05-18
DE60027021T2 DE60027021T2 (de) 2006-08-24

Family

ID=20428857

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60027021T Expired - Lifetime DE60027021T2 (de) 2000-09-06 2000-09-06 Verkapselung für oled-bauelemente

Country Status (8)

Country Link
US (1) US7255823B1 (de)
EP (1) EP1320862B1 (de)
JP (1) JP4608182B2 (de)
CN (1) CN1292499C (de)
AU (1) AU2000274682A1 (de)
DE (1) DE60027021T2 (de)
TW (1) TW533611B (de)
WO (1) WO2002021557A1 (de)

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US20100330748A1 (en) 1999-10-25 2010-12-30 Xi Chu Method of encapsulating an environmentally sensitive device
US8344360B2 (en) 1999-12-17 2013-01-01 Osram Opto Semiconductor Gmbh Organic electronic devices with an encapsulation
TWI222839B (en) * 1999-12-17 2004-10-21 Osram Opto Semiconductors Gmbh Method for encapsulation of electronic devices
US7394153B2 (en) 1999-12-17 2008-07-01 Osram Opto Semiconductors Gmbh Encapsulation of electronic devices
US6933537B2 (en) 2001-09-28 2005-08-23 Osram Opto Semiconductors Gmbh Sealing for OLED devices
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US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US7221093B2 (en) 2002-06-10 2007-05-22 Institute Of Materials Research And Engineering Patterning of electrodes in OLED devices
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JP2004303733A (ja) 2003-03-31 2004-10-28 Osram Opto Semiconductors Gmbh 構成素子、とりわけ有機発光ダイオードを備える表示装置
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US7510913B2 (en) 2003-04-11 2009-03-31 Vitex Systems, Inc. Method of making an encapsulated plasma sensitive device
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US6998776B2 (en) 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
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JP4624309B2 (ja) * 2006-01-24 2011-02-02 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
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JP4633674B2 (ja) 2006-01-26 2011-02-16 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100671647B1 (ko) * 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기전계발광 표시 장치
KR100732808B1 (ko) * 2006-01-26 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치의 제조방법
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US8448468B2 (en) 2008-06-11 2013-05-28 Corning Incorporated Mask and method for sealing a glass envelope
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Also Published As

Publication number Publication date
AU2000274682A1 (en) 2002-03-22
EP1320862B1 (de) 2006-03-29
WO2002021557A1 (en) 2002-03-14
CN1292499C (zh) 2006-12-27
JP4608182B2 (ja) 2011-01-05
DE60027021T2 (de) 2006-08-24
JP2004508679A (ja) 2004-03-18
EP1320862A1 (de) 2003-06-25
TW533611B (en) 2003-05-21
US7255823B1 (en) 2007-08-14
CN1454390A (zh) 2003-11-05

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