Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
  • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
  • B23H1/00—Electrical discharge machining, i.e. removing metal with a series of rapidly recurring electrical discharges between an electrode and a workpiece in the presence of a fluid dielectric
  • B23H1/04—Electrodes specially adapted therefor or their manufacture
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
  • B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
  • B24B47/00—Drives or gearings; Equipment therefor
  • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
  • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
  • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
  • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
  • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
  • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
  • B24B53/065—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels having other than straight profiles, e.g. crowned
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
  • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
  • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
  • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
  • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
  • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
  • B25J9/00—Programme-controlled manipulators
  • B25J9/16—Programme controls
  • B25J9/1602—Programme controls characterised by the control system, structure, architecture
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
  • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Automation & Control Theory (AREA)
• Chemical & Material Sciences (AREA)
• Ceramic Engineering (AREA)
• Inorganic Chemistry (AREA)
• Manufacturing & Machinery (AREA)
• Robotics (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Mechanical Treatment Of Semiconductor (AREA)
• Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
• Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
• Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Applications Claiming Priority (2)

Publications (2)

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ID=10856556

Family Applications (2)

Family Applications After (1)

Country Status (7)

Families Citing this family (20)

Family Cites Families (13)

• 1999
  • 1999-07-03 GB GB9915557A patent/GB2351684B/en not_active Expired - Lifetime
• 2000
  • 2000-04-20 DE DE60011822T patent/DE60011822T2/de not_active Expired - Fee Related
  • 2000-04-20 EP EP02015167A patent/EP1260312B1/de not_active Expired - Lifetime
  • 2000-04-20 DE DE60009506T patent/DE60009506T2/de not_active Expired - Fee Related
  • 2000-04-20 WO PCT/GB2000/001562 patent/WO2001002133A2/en active IP Right Grant
  • 2000-04-20 JP JP2001507607A patent/JP2003503225A/ja not_active Withdrawn
  • 2000-04-20 US US10/018,767 patent/US6881130B1/en not_active Expired - Fee Related
  • 2000-04-20 EP EP00920921A patent/EP1200228B1/de not_active Expired - Lifetime
  • 2000-05-16 TW TW089109330A patent/TW448087B/zh active

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