[go: up one dir, main page]

DE60003167D1 - Verfahren zur herstellung einer elektronischen vorrichtung der kontaktlosen karten art - Google Patents

Verfahren zur herstellung einer elektronischen vorrichtung der kontaktlosen karten art

Info

Publication number
DE60003167D1
DE60003167D1 DE60003167T DE60003167T DE60003167D1 DE 60003167 D1 DE60003167 D1 DE 60003167D1 DE 60003167 T DE60003167 T DE 60003167T DE 60003167 T DE60003167 T DE 60003167T DE 60003167 D1 DE60003167 D1 DE 60003167D1
Authority
DE
Germany
Prior art keywords
chip
antenna
electronic device
producing
art
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60003167T
Other languages
English (en)
Other versions
DE60003167T2 (de
Inventor
P Patrice
Michael Zafrany
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus SA filed Critical Gemplus SA
Publication of DE60003167D1 publication Critical patent/DE60003167D1/de
Application granted granted Critical
Publication of DE60003167T2 publication Critical patent/DE60003167T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE60003167T 1999-03-12 2000-03-06 Verfahren zur herstellung einer elektronischen vorrichtung der kontaktlosen karten art Expired - Lifetime DE60003167T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9903102 1999-03-12
FR9903102A FR2790849B1 (fr) 1999-03-12 1999-03-12 Procede de fabrication pour dispositif electronique du type carte sans contact
PCT/FR2000/000555 WO2000055808A1 (fr) 1999-03-12 2000-03-06 Procede de fabrication pour dispositif electronique du type carte sans contact

Publications (2)

Publication Number Publication Date
DE60003167D1 true DE60003167D1 (de) 2003-07-10
DE60003167T2 DE60003167T2 (de) 2004-05-06

Family

ID=9543140

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60003167T Expired - Lifetime DE60003167T2 (de) 1999-03-12 2000-03-06 Verfahren zur herstellung einer elektronischen vorrichtung der kontaktlosen karten art

Country Status (8)

Country Link
US (1) US6677186B1 (de)
EP (1) EP1163637B1 (de)
CN (1) CN1343340A (de)
AT (1) ATE242518T1 (de)
AU (1) AU3172400A (de)
DE (1) DE60003167T2 (de)
FR (1) FR2790849B1 (de)
WO (1) WO2000055808A1 (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2775810B1 (fr) * 1998-03-09 2000-04-28 Gemplus Card Int Procede de fabrication de cartes sans contact
IL127569A0 (en) 1998-09-16 1999-10-28 Comsense Technologies Ltd Interactive toys
US6607136B1 (en) 1998-09-16 2003-08-19 Beepcard Inc. Physical presence digital authentication system
WO2000021020A2 (en) 1998-10-02 2000-04-13 Comsense Technologies, Ltd. Card for interaction with a computer
US6468638B2 (en) 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US8019609B2 (en) 1999-10-04 2011-09-13 Dialware Inc. Sonic/ultrasonic authentication method
AU2002249532A1 (en) * 2001-03-22 2002-10-08 Beepcard Inc. Manufacture of self-powered identification devices
US9219708B2 (en) 2001-03-22 2015-12-22 DialwareInc. Method and system for remotely authenticating identification devices
DE10114355A1 (de) * 2001-03-22 2002-10-17 Intec Holding Gmbh Verfahren zur Herstellung einer kontaktlosen multifunktionalen Chipkarte sowie entsprechend hergestellte Chipkarte
US6606247B2 (en) * 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
KR100910769B1 (ko) * 2002-06-11 2009-08-04 삼성테크윈 주식회사 Ｉｃ 카드 및, 그것의 제조 방법
FR2847365B1 (fr) * 2002-11-15 2005-03-11 Gemplus Card Int Connexion/raccordement simultane par un percage d'adhesif d'encartage
JP2004185208A (ja) * 2002-12-02 2004-07-02 Sony Corp Ｉｃカード
DE10257111B4 (de) * 2002-12-05 2005-12-22 Mühlbauer Ag Chipkarte und Verfahren zur Herstellung einer Chipkarte
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
MY148205A (en) * 2003-05-13 2013-03-15 Nagraid Sa Process for assembling an electronic component on a substrate
JP4479209B2 (ja) * 2003-10-10 2010-06-09 パナソニック株式会社 電子回路装置およびその製造方法並びに電子回路装置の製造装置
US7353598B2 (en) * 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US7551141B1 (en) 2004-11-08 2009-06-23 Alien Technology Corporation RFID strap capacitively coupled and method of making same
US7615479B1 (en) 2004-11-08 2009-11-10 Alien Technology Corporation Assembly comprising functional block deposited therein
US7385284B2 (en) * 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US20060109130A1 (en) * 2004-11-22 2006-05-25 Hattick John B Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7542301B1 (en) 2005-06-22 2009-06-02 Alien Technology Corporation Creating recessed regions in a substrate and assemblies having such recessed regions
EP1900263A4 (de) * 2005-07-04 2011-03-23 Univ Griffith Herstellung elektronischer komponenten in kunststoff
US7456748B2 (en) * 2005-10-20 2008-11-25 National Starch And Chemical Investment Holding Corporation RFID antenna with pre-applied adhesives
EP2001077A1 (de) * 2007-05-21 2008-12-10 Gemplus Verfahren zur Herstellung einer Vorrichtung, die eine Transponderantenne verbunden mit Kontaktbereichen umfasst, und so erhaltene Vorrichtung
EP2034429A1 (de) * 2007-09-05 2009-03-11 Assa Abloy AB Herstellungsverfahren für eine Karte und mit diesem Verfahren hergestellte Karte
DE102007050102A1 (de) * 2007-10-16 2009-04-23 Smartrac Ip B.V. Verfahren zur Herstellung eines Übertragungsmoduls sowie Übertragungsmodul
US20120256004A1 (en) * 2011-04-07 2012-10-11 Redbud Systems, LLC Selectively enabled rfid tag
DE102011115315A1 (de) * 2011-09-29 2013-04-04 Infineon Technologies Ag Chipkarten-Modul für eine Chipkarte
US9122968B2 (en) * 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
CN104412724A (zh) * 2012-07-04 2015-03-11 松下知识产权经营株式会社 电子部件安装构造体、ic卡、cof封装
US10622700B2 (en) * 2016-05-18 2020-04-14 X-Celeprint Limited Antenna with micro-transfer-printed circuit element
FR3058545B1 (fr) * 2016-11-04 2018-10-26 Smart Packaging Solutions Procede de fabrication d'un module electronique pour carte a puce
CN109409486B (zh) * 2018-10-31 2020-01-31 江苏恒宝智能系统技术有限公司 一种智能卡及其加工方法
BR112021017785A2 (pt) * 2019-03-11 2021-11-23 Ellipse World Inc Módulo eletrônico acondicionado e método de manufatura do mesmo

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法
ZA941671B (en) * 1993-03-11 1994-10-12 Csir Attaching an electronic circuit to a substrate.
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US6036099A (en) * 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
US5826328A (en) * 1996-03-25 1998-10-27 International Business Machines Method of making a thin radio frequency transponder
WO1998006063A1 (fr) * 1996-08-02 1998-02-12 Solaic Carte a circuit integre a connexion mixte
FR2756955B1 (fr) * 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
FR2769441A1 (fr) * 1997-10-07 1999-04-09 Philips Electronics Nv Carte electronique sans contact et son procede de fabrication
FR2769389B1 (fr) * 1997-10-07 2000-01-28 Rue Cartes Et Systemes De Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte
FR2778308B1 (fr) * 1998-04-30 2006-05-26 Schlumberger Systems & Service Procede de realisation d'un composant electronique et composant electronique
FR2780551B1 (fr) * 1998-06-29 2001-09-07 Inside Technologies Micromodule electronique integre et procede de fabrication d'un tel micromodule
FR2781298B1 (fr) * 1998-07-20 2003-01-31 St Microelectronics Sa Procede de fabrication d'une carte a puce electronique et carte a puce electronique
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
FR2801707B1 (fr) * 1999-11-29 2002-02-15 A S K Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux

Also Published As

Publication number Publication date
FR2790849A1 (fr) 2000-09-15
EP1163637B1 (de) 2003-06-04
ATE242518T1 (de) 2003-06-15
EP1163637A1 (de) 2001-12-19
CN1343340A (zh) 2002-04-03
US6677186B1 (en) 2004-01-13
AU3172400A (en) 2000-10-04
DE60003167T2 (de) 2004-05-06
WO2000055808A1 (fr) 2000-09-21
FR2790849B1 (fr) 2001-04-27

Similar Documents

Publication Publication Date Title
DE60003167D1 (de) Verfahren zur herstellung einer elektronischen vorrichtung der kontaktlosen karten art
ATE229204T1 (de) Verfahren zur herstellung von kontaktlosen karten
DE60036103D1 (de) Verfahren zur herstellung einer kontaktlosen hybriden chipkarte mit einem antennenträger aus fasermaterial
WO2004015441A3 (en) Radio frequency identificaton device and method
ATE270491T1 (de) Verfahren zum herstellen einer gegen störstrahlung abgeschirmten gedruckten leiterplatte
MXPA06000842A (es) Tarjeta de circuito impreso con componentes empotrados y metodo de fabricacion.
MXPA04002482A (es) Etiqueta de seguridad y procedimiento para fabricar la misma.
TW200732974A (en) Electronic device and fabrication method thereof
TW200731889A (en) Method of fabricating substrate with embedded component therein
DE602006012184D1 (de) Hybrides leitfähiges Beschichtungsverfahren zur elektrischen Brückenverbindung von RFID-Einzelchips mit einer Verbundantenne
ATE207227T1 (de) Chipkarte, verfahren zur herstellung einer chipkarte und halbleiterchip zur verwendung in einer chipkarte
DE60313447D1 (de) Eingebetteter planarer zirkulator und verfahren zu seiner herstellung
ATE532231T1 (de) Hohlleiter in einer leiterplatte
ATE232324T1 (de) Verfahren zur herstellung einer kontaktlosen chipkarte
DE59712063D1 (de) Chipkarte und verfahren zur herstellung einer chipkarte
TW200518647A (en) Printed wiring board and method of manufacturing same
EP0265629A3 (de) Verfahren zur Herstellung von gedruckten Schaltungsplatten mit plattierten Nickel
EP1120824A3 (de) Verfahren zur Herstellung eines IC-Chips mit einer Schutzschicht
CN102983391B (zh) 一种高光通透性天线
TW200518390A (en) Antenna device and method for manufacturing the same
WO2003058677A3 (de) System zur fertigung von elektrischen und integrierten schaltkreisen
WO2002076717A3 (en) Manufacture of self-powered identification devices
ATE250785T1 (de) Laminierherstellungsverfahren einer kontaktlosen karte
WO2009091460A3 (en) Circuit board having an electrodeposited coating on a conductive core within a via and method of making same
ATE274289T1 (de) Leiterplatte sowie verfahren zum herstellen einer solchen leiterplatte und eines schichtverbundmaterials für eine solche leiterplatte

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
R082 Change of representative

Ref document number: 1163637

Country of ref document: EP

Representative=s name: HOFFMANN - EITLE, DE