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DE58907402D1 - Verfahren zur Metallisierung. - Google Patents

Verfahren zur Metallisierung.

Info

Publication number
DE58907402D1
DE58907402D1 DE89121600T DE58907402T DE58907402D1 DE 58907402 D1 DE58907402 D1 DE 58907402D1 DE 89121600 T DE89121600 T DE 89121600T DE 58907402 T DE58907402 T DE 58907402T DE 58907402 D1 DE58907402 D1 DE 58907402D1
Authority
DE
Germany
Prior art keywords
metallization process
metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE89121600T
Other languages
English (en)
Inventor
Hilmar Dr Esrom
Ulrich Dr Kogelschatz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heraeus Noblelight GmbH
Original Assignee
Heraeus Noblelight GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Noblelight GmbH filed Critical Heraeus Noblelight GmbH
Application granted granted Critical
Publication of DE58907402D1 publication Critical patent/DE58907402D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Catalysts (AREA)
  • Chemically Coating (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE89121600T 1988-11-29 1989-11-23 Verfahren zur Metallisierung. Expired - Fee Related DE58907402D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3840199A DE3840199C2 (de) 1988-11-29 1988-11-29 Verfahren zur Strukturierung von bei der stromlosen Metallisierung katalytisch aktiven Metallschichten mittels UV-Strahlung

Publications (1)

Publication Number Publication Date
DE58907402D1 true DE58907402D1 (de) 1994-05-11

Family

ID=6368086

Family Applications (2)

Application Number Title Priority Date Filing Date
DE3840199A Expired - Fee Related DE3840199C2 (de) 1988-11-29 1988-11-29 Verfahren zur Strukturierung von bei der stromlosen Metallisierung katalytisch aktiven Metallschichten mittels UV-Strahlung
DE89121600T Expired - Fee Related DE58907402D1 (de) 1988-11-29 1989-11-23 Verfahren zur Metallisierung.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE3840199A Expired - Fee Related DE3840199C2 (de) 1988-11-29 1988-11-29 Verfahren zur Strukturierung von bei der stromlosen Metallisierung katalytisch aktiven Metallschichten mittels UV-Strahlung

Country Status (3)

Country Link
EP (1) EP0374505B1 (de)
JP (1) JPH03122287A (de)
DE (2) DE3840199C2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4035080A1 (de) * 1990-11-05 1992-05-07 Abb Patent Gmbh Verfahren und einrichtung zur herstellung von partiellen metallischen schichten
JP3259310B2 (ja) 1992-02-25 2002-02-25 株式会社デンソー めっき方法及びこのめっき方法により得られる筒状コイル
JP3153682B2 (ja) * 1993-08-26 2001-04-09 松下電工株式会社 回路板の製造方法
US6602653B1 (en) 2000-08-25 2003-08-05 Micron Technology, Inc. Conductive material patterning methods
US6451685B1 (en) 2001-02-05 2002-09-17 Micron Technology, Inc. Method for multilevel copper interconnects for ultra large scale integration
KR101507769B1 (ko) 2013-10-10 2015-04-07 경기대학교 산학협력단 산화물 환원 방법 및 이를 이용하는 산화물 환원 장치
CN110091069B (zh) * 2019-04-09 2021-09-24 大族激光科技产业集团股份有限公司 激光退镀方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993491A (en) * 1973-12-07 1976-11-23 Surface Technology, Inc. Electroless plating
US4241105A (en) * 1979-12-17 1980-12-23 Western Electric Company, Inc. Method of plating the surface of a substrate
DE3008434A1 (de) * 1980-03-03 1981-09-17 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren zur selektiven chemischen und/oder galvanischen abscheidung von metallueberzuegen, insbesondere zur herstellung von gedruckten schaltungen
US4304849A (en) * 1980-05-16 1981-12-08 Western Electric Co., Inc. Methods of depositing metallic copper on substrates
US4410569A (en) * 1980-06-13 1983-10-18 Minnesota Mining And Manufacturing Company Palladium (II) bis(hexafluoroacetylacetonate), adducts derived therefrom and uses thereof
DE3337856A1 (de) * 1983-10-18 1985-04-25 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substraten fuer die stromlose metallisierung
EP0167326B1 (de) * 1984-06-29 1989-11-15 Hitachi Chemical Co., Ltd. Verfahren zur Sensibilisierung von Oberflächen für eine stromlose Metallisierung und Lösung zur Durchführung desselben
EP0349882B1 (de) * 1988-07-02 1994-03-16 Heraeus Noblelight GmbH Verfahren zur Herstellung von metallischen Schichten

Also Published As

Publication number Publication date
EP0374505A3 (en) 1990-07-04
EP0374505B1 (de) 1994-04-06
EP0374505A2 (de) 1990-06-27
JPH03122287A (ja) 1991-05-24
DE3840199A1 (de) 1990-05-31
DE3840199C2 (de) 1994-12-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee