DE543667C - Compensation for copper-beryllium alloys - Google Patents
Compensation for copper-beryllium alloysInfo
- Publication number
- DE543667C DE543667C DEM112912D DEM0112912D DE543667C DE 543667 C DE543667 C DE 543667C DE M112912 D DEM112912 D DE M112912D DE M0112912 D DEM0112912 D DE M0112912D DE 543667 C DE543667 C DE 543667C
- Authority
- DE
- Germany
- Prior art keywords
- copper
- compensation
- beryllium
- beryllium alloys
- alloys
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Heat Treatment Of Articles (AREA)
Description
Vergütung von Kupfer-Beryllium-Legierungen Die Erfindung betrifft die Vergütung von Kupfer-Nickel-Beryllium-Legierungen. Der Hauptzweck der Erfindung ist, ein Material darzustellen, welches solche Eigenschaften besitzt, daß man es für alle Zwecke, zu denen Jetzt Kupfer verwendet wird, benutzen kann, und welches außerdem noch durch entsprechende Wärmebehandlung Härte und Festigkeit erhält, die wesentlich größer sind als bei metallischem Kupfer.Quenching and tempering of copper-beryllium alloys The invention relates to the tempering of copper-nickel-beryllium alloys. The main purpose of the invention is to represent a material which possesses such properties that it can be for all purposes that now copper is used for, and what also receives hardness and strength through appropriate heat treatment, which are much larger than with metallic copper.
Es ist nun gefunden worden, daß diese Legierungen die Eigenschaft der Selbsthärtung besitzen, wenn sie in der Luft oder im Ofen von etwa goo° langsam abgekühlt werden. Die Abkühlung kann auch in der Weise erfolgen, daß die Temperatur von goo° C auf etwa 700° C während etwa i'/, Stunden zurückgeht und darauf die Abkühlung an der Luft erfolgt. Besonders günstig erweisen sich solche Legierungen, bei denen das Verhältnis von Nickel zu Beryllium etwa 13 : i beträgt. Eine Legierung mit 95,71 Kupfer, 4°'o Nikkel und 0,3'/" Beryllium erlangt nach der Vergiitung eine Härte von 86° Brinell, eine Zugfestigkeit von 50,7 kg pro Ouadratmillimeter -und eine Dehnung von 25 % bei 5 cm Meßlänge.It has now been found that these alloys have the property of self-hardening when they are slowly cooled in the air or in a furnace from about goo °. The cooling can also take place in such a way that the temperature falls from goo ° C. to about 700 ° C. for about 1.5 hours and then the cooling takes place in the air. Those alloys in which the ratio of nickel to beryllium is about 13: i have proven to be particularly favorable. An alloy with 95.71 copper, 4 ° nickel and 0.3 ° beryllium attains a hardness of 86 ° Brinell, a tensile strength of 50.7 kg per square millimeter - and an elongation of 25 % at 5 cm measuring length.
Auch der elektrische Widerstand der Legierungen wird durch diese Wärmebehandlung erniedrigt.This heat treatment also increases the electrical resistance of the alloys humiliated.
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US543667XA | 1926-10-20 | 1926-10-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE543667C true DE543667C (en) | 1932-02-08 |
Family
ID=21990542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DEM112912D Expired DE543667C (en) | 1926-10-20 | 1927-10-02 | Compensation for copper-beryllium alloys |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE543667C (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2665667A (en) * | 1950-04-14 | 1954-01-12 | Tolkien Fritz | Rodless slide valve regulating device |
DE1458546B1 (en) * | 1962-12-26 | 1970-04-09 | Nippert Electric Products Comp | Process for the production of composite semiconductor carriers |
-
1927
- 1927-10-02 DE DEM112912D patent/DE543667C/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2665667A (en) * | 1950-04-14 | 1954-01-12 | Tolkien Fritz | Rodless slide valve regulating device |
DE1458546B1 (en) * | 1962-12-26 | 1970-04-09 | Nippert Electric Products Comp | Process for the production of composite semiconductor carriers |
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