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DE4438449A1 - Direct contacting method for component to carrier - Google Patents

Direct contacting method for component to carrier

Info

Publication number
DE4438449A1
DE4438449A1 DE4438449A DE4438449A DE4438449A1 DE 4438449 A1 DE4438449 A1 DE 4438449A1 DE 4438449 A DE4438449 A DE 4438449A DE 4438449 A DE4438449 A DE 4438449A DE 4438449 A1 DE4438449 A1 DE 4438449A1
Authority
DE
Germany
Prior art keywords
component
notches
edges
carrier
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4438449A
Other languages
German (de)
Inventor
Heiner Heeren
Jens Weis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SICAN F&E GMBH (SIBET), 30419 HANNOVER, DE
Original Assignee
Sibet Sican Forschungs Un GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sibet Sican Forschungs Un GmbH filed Critical Sibet Sican Forschungs Un GmbH
Priority to DE4438449A priority Critical patent/DE4438449A1/en
Publication of DE4438449A1 publication Critical patent/DE4438449A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

The directly contactable electronic component (1) has indentations. Contact sites are arranged in the indentations. In one embodiment the indentations are at the edges of the component. The component has perpendicular holes at the sites which are to be contacted and the edges are cut away. In the method of producing the component the component is indented and conductive contact areas are produced. the contact faces are in the indentations. The surfaces of the holes produced at the contact sites are metallised.

Description

Die Erfindung betrifft ein Verfahren zur direkten Kontaktierung elektronischer Bauelemente mit einem Träger und direkt kontaktierbare Bauelemente hierzu. Das Verfahren verzichtet auf herkömmliche aufwendige Kontaktierungsverfahren, wie J-Lead, Gull-Wing und BGA. Statt dessen sind die Kontaktflächen in Einkerbungen am Seitenrand der Bauelemente angeordnet. Die Einkerbungen sind derart ausgeprägt, daß das Lötmittel zwischen Träger und Einkerbung fließt und eine elektrische und mechanische Verbindung bewirkt.The invention relates to a method for direct contacting electronic Components with a carrier and directly contactable components for this. The method dispenses with conventional, complex contacting methods, like J-Lead, Gull-Wing and BGA. Instead, the contact areas are in Notches are arranged on the side edge of the components. The notches are so pronounced that the solder flows between the carrier and the notch and causes an electrical and mechanical connection.

Kontaktierungverfahren finden insbesondere bei Multichip-Modulen, bestehend aus einem Substrat und integrierten Schaltungsanordnungen, Arrays genannt, Anwendung. Die Module werden auf einem Träger, z. B. Leiterplatte, befestigt und kontaktiert. Verschiedene Arrays werden auf dem Träger zu Funktionsgruppen zusammengesetzt und geeignet miteinander verbunden. Der Träger dient hierbei sowohl zur mechanischen Befestigung der Arrays, als auch zur elektrischen Verbindung der Arrays durch Leitungsbahnen und Pins.Contacting methods are used in particular for multichip modules a substrate and integrated circuit arrangements, called arrays, Application. The modules are on a carrier, e.g. B. PCB, attached and contacted. Different arrays become functional groups on the carrier assembled and suitably connected. The carrier serves here both for mechanical fastening of the arrays and for electrical Connection of the arrays by conductor tracks and pins.

Bisher werden integrierte elektronische Bauelemente mit Hilfe von Lötkontakten SIL, Lötkontakten DIL, J-Leads, Gull Wings oder über sogenannten Ball Grid Arrays (BGA) kontaktiert. Diese Verfahren beinhalten mehrere Verfahrensschritte.So far, integrated electronic components have been made using solder contacts SIL, solder contacts DIL, J-Leads, Gull Wings or via so-called ball grid Arrays (BGA) contacted. These procedures involve several process steps.

Dazu gehören:This includes:

  • - Justage der Pins- Adjustment of the pins
  • - Aufpressen der Pins mit speziell hierfür vorgesehenen Werkzeugen- Pressing on the pins using specially designed tools
  • - Verlöten der Pins mit zusätzlichem Fluxen.- Solder the pins with additional fluxing.

Die herkömmlichen Kontaktierungsverfahren erfordern eine definierte Trägergeometrie, u. a. eine rechteckige Bauform und eine definierte Dicke des Träger in sehr engen Toleranzen.The conventional contacting methods require a defined one Beam geometry, u. a. a rectangular shape and a defined thickness of the Beams in very tight tolerances.

Im Falle einer Kontaktierung durch BGA erfolgt ein Aufkleben der Balls an den dafür vorgesehenen Stellen. Dies geschieht ebenfalls in mehreren Verfahrensschritten. In the event of contact by BGA, the balls are stuck to the designated places. This also happens in several Procedural steps.  

Diese zur Zeit eingesetzten Kontaktierungsverfahren beinhalten alle mehrere Verfahrensschritte mit einem hohen Prozeßaufwand und sind ein entscheidender Kostenfaktor beim Aufbau des Substrates.These contacting methods currently used all include several Process steps with a high process expenditure and are a decisive one Cost factor when building the substrate.

Aufgabe der Erfindung war es, eine zuverlässige und einfache Kontaktierung anzugeben, die eine hohe Zahl Kontaktstellen und eine einfache Qualitätskontrolle ermöglicht. Die Kontaktierung sollte nicht an die Form des Trägers gebunden sein. Außerdem sollte das Bauelement reparaturfreundlich montiert sein und eine einfache Testmöglichkeit gewährleisten.The object of the invention was to provide reliable and simple contacting specify a high number of contact points and a simple Quality control enables. The contact should not conform to the shape of the Be bound by the wearer. In addition, the component should be easy to repair be installed and ensure easy testing.

Die Aufgabe wird durch ein elektronisches Bauelement nach Anspruch 1, das Verfahren zur Herstellung des Bauelements nach Anspruch 5 und das Verfahren zur Kontaktierung nach Anspruch 10 oder 11 gelöst.The object is achieved by an electronic component according to claim 1 A method for producing the component according to claim 5 and the method for contacting according to claim 10 or 11 solved.

Erfindungsgemäß wird das Bauelement eingekerbt, wobei in den Einkerbungen Kontaktflächen angeordnet sind. Anschließend wird das eingekerbte Bauelement und der Träger miteinander verbunden.According to the invention, the component is notched, with in the notches Contact areas are arranged. Then the notched component and the carrier connected together.

Erfindungsgemäß kann dies durch Löten erfolgen, derart, daß die Lötstellen in den Einkerbungen befindlich sind. Ein anderes Kontaktverfahren ist mittels Kleben möglich, derart, daß ein flüssiger Klebstoff in die Einkerbungen eingebracht wird und der Klebstoff aushärtet. Der Klebstoff muß im ausgehärteten Zustand leiten sein.According to the invention, this can be done by soldering such that the solder joints in the notches are located. Another method of contact is by gluing possible, such that a liquid adhesive is introduced into the notches and the adhesive hardens. The adhesive must conduct in the hardened state his.

Die Einkerbungen können durch Anbringen von Bohrungen an den Kontaktstellen, anschließendes Metallisieren der Kontaktstellen und Schneidens des Bauelements derart, daß die Bohrungen an den Kanten teilweise freiliegen.The notches can be made by drilling the holes Contact points, then metallizing the contact points and cutting of the component in such a way that the holes are partially exposed at the edges.

Der Schnittvorgang kann mittels Fräsens, Laserschneidens oder Anschleifens erfolgen.The cutting process can be done by milling, laser cutting or grinding respectively.

Erfindungsgemäß ist das Bauelement direkt mit dem Träger kontaktierbar, indem es Einkerbungen aufweist und Kontakte in den Einkerbungen befindlich sind. Die Einkerbungen können sich an den Kanten des Bauelements befinden, so daß beim Lötprozeß das Lot, bzw. beim Klebeprozeß der Klebstoff aufgrund der Kapillarkräfte in die Einkerbungen fließt und an den Kerbwänden aufsteigt.According to the invention, the component can be contacted directly with the carrier, by having notches and contacts in the notches are. The notches can be on the edges of the component, so that the solder during the soldering process or the adhesive during the adhesive process the capillary forces flow into the notches and rise on the notch walls.

Die Fließkräfte können durch eine geometrische Form der Einkerbungen nach Anspruch 4, wie in Fig. 4 skizziert, vergrößert werden, indem das Bauelement an den zu kontaktierenden Stellen mit Bohrungen versehen, die Kanten angeschnitten und die Einkerbungen zusätzlich eingefräst werden. The flow forces can be increased by a geometrical shape of the notches according to claim 4, as outlined in FIG. 4, by providing the component with holes at the points to be contacted, cutting the edges and additionally milling the notches.

Das Kontaktierungsverfahren besitzt den Vorteil, daß keine anfälligen Verdrahtungs- und positionierbare Löteinrichtungen notwendig sind. Vielmehr kann der Lötprozeß im kostengünstigen und zuverlässigen Reflow- oder Schwall- Lötverfahren durchgeführt werden.The contacting method has the advantage that none are susceptible Wiring and positionable soldering devices are necessary. Much more can the soldering process be carried out in a cost-effective and reliable reflow or surge Soldering processes are carried out.

Die seitliche Anordnung der Lötstellen und der geringe Materialaufwand ermöglichen eine gute optische Inspektion des Lötprozesses. Die Lötstellen sind gut zugänglich, so daß Baugruppen durch die Erfindung leichter reparierbar und besser getestet werden können. Durch eine freie Wahl der Geometrie können mehr Kontakte als heutzutage möglich an das Bauelement angebracht werden. Durch dieses Verfahren ist es möglich eine freie Wahl der Größe der Kontaktpads des Trägers zu wählen. Dadurch können verschieden große Kontaktierungen in einem beliebigem Raster auf einem Träger vereinigt werden.The lateral arrangement of the solder joints and the low cost of materials enable a good optical inspection of the soldering process. The solder joints are easily accessible, so that assemblies are easier to repair and can be tested better. With a free choice of geometry more contacts than possible today are attached to the component. With this method it is possible to freely choose the size of the contact pads to choose the wearer. This allows contacting of different sizes in any grid on a support.

Das Kontaktierungsverfahren bietet die Möglichkeit, Verfahrensschritte einzusparen und somit die Attraktivität der MCM-Technologie im Low-Cost- Bereich zu erhöhen.The contacting procedure offers the possibility of procedural steps save and thus the attractiveness of MCM technology in low-cost Increase area.

Die Erfindung wird anhand der Zeichnungen erläutert. Es zeigen:The invention is explained with reference to the drawings. Show it:

Fig. 1 dreidimensionale Ansicht des integrierten Bauelements, Fig. 1 three-dimensional view of the integrated device,

Fig. 2 Draufsicht auf Bauelement 1 und Träger 2 mit der erfindungsgemäßen Kontaktierung, Fig. 2 plan view of component 1 and the support 2 with the inventive contacting,

Fig. 3 Seitenansicht des Bauelements 1 und Trägers 2 mit der erfindungsgemäßen Kontaktierung, Fig. 3 side view of the device 1 and the carrier 2 with the inventive contacting,

Fig. 4 Beispiel einer Geometrieform der Einkerbungen eines Bauelements 1. FIG. 4, a geometry shape of the notches of a component 1.

In Fig. 1 ist ein Bauelement skizziert, das an den Seiten erfindungsgemäße Einkerbungen aufweist. In jeder Einkerbung des Bauelements 1 sind, wie die Draufsicht in Fig. 2 zeigt, Kontakte angeordnet, indem dort Leiterbahnen 2 enden. Das Bauelement wird so auf den Träger 3 gelegt, daß die entsprechenden Leiterbahnen des Trägers 4 und des Bauelementes 2 übereinander angeordnet sind. Bei einem Lötprozeß fließt das Lot 5 aufgrund der Kapillarkräfte in die Einkerbung und sorgt für eine elektrische Verbindung mit der, durch den Anschnitt freigelegten Kontaktfläche des Bauelements. Neben der elektrischen Verbindung bewirkt die Lötstelle eine mechanische Befestigung des Bauelements mit dem Träger.In Fig. 1 a component is outlined which has notches according to the invention on the sides. As the plan view in FIG. 2 shows, contacts are arranged in each notch of the component 1 , in that conductor tracks 2 end there. The component is placed on the carrier 3 such that the corresponding conductor tracks of the carrier 4 and the component 2 are arranged one above the other. In a soldering process, the solder 5 flows into the indentation due to the capillary forces and provides an electrical connection to the contact surface of the component which is exposed by the gate. In addition to the electrical connection, the soldering point effects a mechanical fastening of the component to the carrier.

Das Lot weist aufgrund der Kapillarkräfte, wie in der Seitenansicht in Fig. 3 skizziert, einen nach innen abgerundeten Verlauf auf, so daß die Lötstelle nicht übermäßig dick ist. Due to the capillary forces, as sketched in the side view in FIG. 3, the solder has a curve which is rounded inwards, so that the solder joint is not excessively thick.

Das Bauelement wird hergestellt, indem an den zu kontaktierenden Stellen Bohrungen angebracht werden. Die Bohrungen werden, z. B. durch Metallisierung, elektrisch leitend gemacht. Anschließend werden die Kanten angeschnitten, wobei der Anschnitt sowohl an der Außen-, als auch an der Innenkante erfolgen kann. Das Anschneiden führt zum Freilegen der Kontaktflächen in den aufgetrennten Bohrungen. Die Einkerbungen können zusätzlich noch eingefräst werden, so daß sich die geometrische Form und die Oberfläche vergrößert.The component is manufactured by at the points to be contacted Holes are made. The holes are, for. B. by Metallization, made electrically conductive. Then the edges cut, the cut on both the outer, as well as on the Inner edge can be done. The cutting leads to the exposure of the Contact areas in the separated holes. The notches can additionally be milled, so that the geometric shape and the Surface enlarged.

Claims (11)

1. Direkt kontaktierbares elektronisches Bauelement, dadurch gekennzeichnet, daß es Einkerbungen aufweist und Kontaktstellen in den Einkerbungen befindlich sind.1. Directly contactable electronic component, characterized in that it has notches and contact points are located in the notches. 2. Bauelement nach Anspruch 2, dadurch gekennzeichnet, daß die Einkerbungen an den Kanten angeordnet sind.2. Component according to claim 2, characterized in that the Notches are arranged on the edges. 3. Bauelement nach Anspruch 2, dadurch gekennzeichnet, daß das Bauelement an den zu kontaktierenden Stellen mit senkrechten Bohrungen versehen ist und die Kanten angeschnitten sind.3. Component according to claim 2, characterized in that the Component at the points to be contacted with vertical holes is provided and the edges are cut. 4. Bauelement nach Anspruch 1 oder 2 oder 3, dadurch gekennzeichnet, daß die Einkerbungen eingefräst sind.4. The component according to claim 1 or 2 or 3, characterized in that the notches are milled. 5. Verfahren zur Herstellung direkt kontaktierbarer elektronischer Bauelemente, dadurch gekennzeichnet, daß das Bauelement eingekerbt wird und leitende Kontaktflächen hergestellt werden, wobei die Kontaktflächen in den Einkerbungen angeordnet sind.5. Process for the production of directly contactable electronic components, characterized in that the component is scored and conductive Contact surfaces are produced, the contact surfaces in the Notches are arranged. 6. Verfahren nach Anspruch 5, dadurch gekennzeichnet, daß das Bauelement an den zu kontaktierenden Stellen mit Bohrungen versehen, die Kontaktflächen in den Bohrlöchern metallisiert und die Kanten angeschnitten werden.6. The method according to claim 5, characterized in that the component drill holes at the points to be contacted, which Metallized contact surfaces in the drill holes and cut the edges will. 7. Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß die Kanten mittels Fräsens angeschnitten werden.7. The method according to claim 6, characterized in that the edges be cut by milling. 8. Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß die Kanten mittels Laserschneidens angeschnitten werden.8. The method according to claim 6, characterized in that the edges can be cut by laser cutting. 9. Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß die Kanten mittels Anschleifens angeschnitten werden. 9. The method according to claim 6, characterized in that the edges be cut by grinding.   10. Verfahren zur Kontaktierung direkt kontaktierbarer elektronischer Bauelemente, dadurch gekennzeichnet, daß das Bauelement und der Träger durch Löten miteinander verbunden werden und die Lötstellen in den Einkerbungen befindlich sind.10. Method for contacting directly contactable electronic Components, characterized in that the component and the carrier be connected to each other by soldering and the solder joints in the Notches are located. 11. Verfahren zur Kontaktierung direkt kontaktierbarer elektronischer Bauelemente, dadurch gekennzeichnet, daß das Bauelement und der Träger durch Kleben miteinander verbunden werden und die Klebestellen in den Einkerbungen befindlich sind.11. Method for contacting directly contactable electronic Components, characterized in that the component and the carrier be connected to each other by gluing and the gluing points in the Notches are located.
DE4438449A 1994-10-28 1994-10-28 Direct contacting method for component to carrier Withdrawn DE4438449A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4438449A DE4438449A1 (en) 1994-10-28 1994-10-28 Direct contacting method for component to carrier

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Application Number Priority Date Filing Date Title
DE4438449A DE4438449A1 (en) 1994-10-28 1994-10-28 Direct contacting method for component to carrier

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DE4438449A1 true DE4438449A1 (en) 1996-07-04

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
EP0867939A2 (en) * 1997-03-26 1998-09-30 Matsushita Electronics Corporation Wiring substrate for semiconductor device with externally wired leads
DE10054081A1 (en) * 2000-10-31 2002-05-08 Heraeus Gmbh W C Process for producing a metal support frame, metal support frame and its use
WO2021211577A1 (en) * 2020-04-15 2021-10-21 Nokia Solutions And Networks Oy Board edge electrical contact structures

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0867939A2 (en) * 1997-03-26 1998-09-30 Matsushita Electronics Corporation Wiring substrate for semiconductor device with externally wired leads
EP0867939A3 (en) * 1997-03-26 1999-08-18 Matsushita Electronics Corporation Wiring substrate for semiconductor device with externally wired leads
US6040621A (en) * 1997-03-26 2000-03-21 Matsushita Electronics Corporation Semiconductor device and wiring body
DE10054081A1 (en) * 2000-10-31 2002-05-08 Heraeus Gmbh W C Process for producing a metal support frame, metal support frame and its use
WO2021211577A1 (en) * 2020-04-15 2021-10-21 Nokia Solutions And Networks Oy Board edge electrical contact structures
US20230232533A1 (en) * 2020-04-15 2023-07-20 Nokia Solutions And Networks Oy Board edge electrical contact structures
US12250770B2 (en) * 2020-04-15 2025-03-11 Nokia Solutions And Networks Oy Board edge electrical contact structures

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