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DE4322034A1 - Packaging system for vehicle hybrid IC accelerometer - Google Patents

Packaging system for vehicle hybrid IC accelerometer

Info

Publication number
DE4322034A1
DE4322034A1 DE19934322034 DE4322034A DE4322034A1 DE 4322034 A1 DE4322034 A1 DE 4322034A1 DE 19934322034 DE19934322034 DE 19934322034 DE 4322034 A DE4322034 A DE 4322034A DE 4322034 A1 DE4322034 A1 DE 4322034A1
Authority
DE
Germany
Prior art keywords
sensors
pins
angle
base plate
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19934322034
Other languages
German (de)
Inventor
Dieter Naegele
Manfred Weinacht
Klaus Faerber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Deutsche Aerospace AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Aerospace AG filed Critical Deutsche Aerospace AG
Priority to DE19934322034 priority Critical patent/DE4322034A1/en
Publication of DE4322034A1 publication Critical patent/DE4322034A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0078—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Pressure Sensors (AREA)

Abstract

The packaging system uses a single housing (6) providing multi-pole contacts for a three-dimensional hybrid IC sensor module array with the sensors (4,5) inclined at an angle to a base plate (1). The sensors are mounted on a metal angle or prism support (8) and attached to corresponding contact pins (2) via an automatic bonding process.Pref. the contact pins (2) have bonding pads (9) at an angle of 45 degrees to the surface of the base plate coupled via wires (7) to bonding pads (9) for the sensors.

Description

Die Erfindung betrifft die Kontaktierung und Verkapselung von integrier­ ten Schaltungsmodulen, insbesondere Sensoren, deren Hauptachsen ein Win­ kel zueinander im Raum aufweisen, sogenannte dreidimensionale Hybride.The invention relates to the contacting and encapsulation of integrier circuit modules, in particular sensors, whose main axes are a win have angles to each other in space, so-called three-dimensional hybrids.

Die Sensoren und ihre Signalverarbeitungs- und Auswerteschaltung sind dabei auf einem Chip integriert und in jeweils einem separaten Gehäuse untergebracht, vgl. die deutsche Patentschrift 37 36 294, Fig. 3 bis 5. Solche Sensorsysteme sind nicht nur aufwendig in der Herstellung sondern sie müssen wegen der hohen Anforderungen, insbesondere in Sicherheitssy­ stemen in Fahrzeugen, hohen Ansprüchen an die Zuverlässigkeit genügen.The sensors and their signal processing and evaluation circuit are integrated on a chip and each housed in a separate housing, cf. the German patent 37 36 294, Fig. 3 to 5. Such sensor systems are not only complex to manufacture but they must meet high demands on reliability because of the high demands, especially in safety systems in vehicles.

Die Erfindung baut auf der vorgenannten Patentschrift auf und möchte ei­ nerseits die Zuverlässigkeit solcher Meßwerterfassungs- oder Sensormodu­ le erhöhen, andererseits mit einem geringeren Fertigungsaufwand auskom­ men. Hierzu gehört ein raumsparendes und ein sicheres automatisierbares Kontaktieren und Verpacken.The invention is based on the aforementioned patent specification and would like egg on the other hand, the reliability of such measured value acquisition or sensor modules increase le, on the other hand get along with a lower manufacturing effort men. This includes a space-saving and a safe, automatable one Contact and pack.

Die Lösung der Erfindung ist in Anspruch 1 enthalten. Aus- und Weiter­ bildungen der Erfindung sind weiteren Ansprüchen sowie der Beschreibung und Zeichnung eines Ausführungsbeispiels entnehmbar.The solution of the invention is contained in claim 1. Off and on Formations of the invention are further claims and the description and drawing of an embodiment can be removed.

Die wesentlichsten Vorteile der erfindungsgemäßen Lösung bestehen darin, daß die Sensoren mit ihren Hauptachsen - hier Hauptempfindlichkeitsach­ sen (A1, A2) - in einer gewünschten (Fahrt-)Richtung im Raum eines Fahr­ zeuges als Hybrid-IC′s in einem Gehäuse unterbringbar sind und zugleich mit der Verpackung alle Kontaktierungen, insbesondere durch automati­ sches Bonden, vornehmbar sind. Diese Kontaktierungen werden bei der Er­ findung dadurch besonders erleichtert, daß die Bondflecken der Pins und die Sensormodule parallel zueinander angeordnet sind in dem gewählten Winkel im Raum bzw. 90° hierzu - vgl. die Zeichnung, die zwecks Be­ schreibung eines Ausführungsbeispieles beigefügt ist, ohne daß die Er­ findung hierauf beschränkt ist. The main advantages of the solution according to the invention are that the sensors with their main axes - here main sensitivity sen (A1, A2) - in a desired (driving) direction in the space of a driving stuff as a hybrid IC’s can be accommodated in one housing and at the same time with the packaging all contacts, especially by automati chemical bonding, can be performed. These contacts are made with the Er invention is particularly relieved that the bond spots of the pins and the sensor modules are arranged parallel to each other in the selected one Angle in space or 90 ° to this - cf. the drawing, for the purpose of loading writing an embodiment is attached without the Er finding is limited to this.  

Fig. 1 zeigt einen Querschnitt durch das Gehäuse für die IC-Hybride und Fig. 1 shows a cross section through the housing for the IC hybrids and

Fig. 2 zeigt den um seine 45° geneigte Mittelachse drehbaren Arbeits­ tisch für das Bonden. Fig. 2 shows the rotatable about its 45 ° central axis work table for bonding.

Die Fig. 1 zeigt in Einbaulage zur Fahrtrichtung den prinzipiellen Auf­ bau des gemeinsamen Gehäuses für die IC-Hybride 4, 5, wobei eine Grund­ platte 1, mit Pins 2 durchsetzt ist, insbesondere solche mit Glasdurch­ führungen 10, wie sie in der integrierten Schaltungstechnik und in der Hybridtechnik üblich sind und leicht kontaktierbar sind, insbesondere durch Drahtbonden. Vor dem Einsetzen der Pins 2 in die Grundplatte 1 sind die Pins an ihren in der Zeichnung oberen Enden 3 abgekröpft um ei­ nen vorgebbaren Winkel, im Beispiel 45°, und ergeben so parallele Bond­ flächen zu den Sensoren in Raumrichtung 1 und zu den Sensoren (4, 5) in Richtung von deren Achsen A1 und A2. Hier sind diese im Ausführungsbei­ spiel 90° zueinander ausgerichtet und gegenüber dem Substrat oder der Grundplatte mit 45°. Diese Winkel können bei Bedarf je nach Anwendungs­ fall auch hiervon abweichend gewählt werden. Die Sensoren 4, 5, welche zu den abgekröpften Enden 3 der Pins 2 parallel angeordnet sind, lassen sich bei der Erfindung in einem Arbeitsgang automatisch bonden. Dabei werden dünne Bonddrähte 7 von den IC-Hybriden mit den Sensoren 4, 5 auf ihren IC-Trägern B mit den Enden 3 der Pins 2 durch automatisches Bonden an den Bondflecken 9 verbunden. Fig. 1 shows in the installation position to the direction of travel the basic construction of the common housing for the IC hybrids 4 , 5 , with a base plate 1 , with pins 2 interspersed, especially those with glass bushings 10 , as they are in integrated circuit technology and are common in hybrid technology and are easy to contact, especially by wire bonding. Before inserting the pins 2 into the base plate 1 , the pins are bent at their upper ends 3 in the drawing by a predeterminable angle, in the example 45 °, and thus result in parallel bonding surfaces to the sensors in spatial direction 1 and to the sensors ( 4 , 5 ) in the direction of their axes A1 and A2. Here these are aligned in the exemplary embodiment at 90 ° to one another and at 45 ° with respect to the substrate or the base plate. Depending on the application, these angles can also be selected differently if necessary. The sensors 4 , 5 , which are arranged parallel to the bent ends 3 of the pins 2 , can be bonded automatically in one operation in the invention. In this case, thin bonding wires 7 are connected by the IC hybrids with the sensors 4 , 5 on their IC carriers B to the ends 3 of the pins 2 by automatic bonding on the bonding spots 9 .

Ein sehr wesentlicher Vorteil der Erfindung ist es, daß die Grundplatte 1 absolut eben ist, wenigstens auf der dem Gehäuse 6 zugekehrten Seite. Das Gehäuse, insbesondere ein Rechteckgehäuse, umfaßt nicht nur die Sen­ soren 4 und 5 auf ihren zueinander abgewinkelten IC-Trägern 8 sondern umhüllt auch die Pins 2, hier die abgekröpften oder abgeschrägten oder anderweitig in einem Winkel zur Grundplatte 1 angeordneten Enden 3 der Pins 2. Die absolut ebene Oberseite der Grundplatte 1 hat den Vorteil, daß hiermit eine absolut dichte Verbindung von Gehäuse und Grundplatte leicht und automatisch herstellbar ist. Die IC-Träger 8 können einfache Bleche sein, die auf der Grundplatte 1 aufgelötet, aufgeschweißt oder ähnlich fest verbunden werden unter dem gewählten Winkel. A very important advantage of the invention is that the base plate 1 is absolutely flat, at least on the side facing the housing 6 . The housing, in particular a rectangular housing, not only includes the sensors 4 and 5 on their angled IC carriers 8 but also envelops the pins 2 , here the bent or beveled or otherwise arranged at an angle to the base plate 1 ends 3 of the pins 2 . The absolutely flat top of the base plate 1 has the advantage that an absolutely tight connection between the housing and the base plate can be produced easily and automatically. The IC carrier 8 can be simple sheets which are soldered, welded or similarly firmly connected to the base plate 1 at the selected angle.

Ein weiterer Vorteil der Erfindung ist in Fig. 2 ersichtlich, die das automatische Bonden mit Hilfe eines Roboters darstellt.Another advantage of the invention can be seen in FIG. 2, which shows automatic bonding with the aid of a robot.

Dabei ist die Grundplatte 1 mit den IC-Hybriden 4, 5 auf ihren Trägern 8 auf dem Drehtisch 11 aufgespannt. Dieser ist ggf. auch um 45° kippbar. Die in Fig. 2 gezeigte Schräglage des Tisches 11 ist die bevorzugte Ar­ beitsstellung für das Bonden. Hier ist nur senkrechtes Bewegen des Bond­ werkzeuges 12 nötig um mittels Druck und Wärme die Drähte 7 mit den vor­ her parallel zueinander aufgebrachten Bondflecken 9 zu verbinden - wie dargestellt. Das Werkzeug 12 braucht hierbei auch nur um einen vorbe­ stimmten Abstand in der vorbestimmten Richtung (zu 14) bewegt zu werden, obwohl der Roboterkopf 13 auch Schwenken und Horizontalbewegung gestat­ tet.The base plate 1 with the IC hybrids 4 , 5 is clamped on their supports 8 on the turntable 11 . This can also be tilted by 45 ° if necessary. The inclined position of the table 11 shown in FIG. 2 is the preferred working position for the bonding. Here, only vertical movement of the bond tool 12 is necessary in order to connect the wires 7 to the bond spots 9 applied in parallel to one another by means of pressure and heat - as shown. The tool 12 only needs to be moved by a predetermined distance in the predetermined direction (to 14 ), although the robot head 13 also allows pivoting and horizontal movement.

Eine Anwendung der Erfindung ist bei Beschleunigungssensoren gegeben, wie sie in der eingangs genannten deutschen Patentschrift erwähnt ist.One application of the invention is in acceleration sensors, as described in the German patent mentioned at the beginning is mentioned.

Claims (5)

1. System zur Verpackung von integrierten Schaltungen (IC′s), ent­ haltend Sensoren auf Substraten, dadurch gekennzeichnet, daß in einem einzigen Gehäuse (6) mehrpolige Kontaktierungen für dreidimensionale An­ ordnung von IC-Hybridmodulen umfaßt sind auf der Grundplatte (1) mit Sensoren (4, 5) unter einem Winkel auf Trägern (8) zueinander derart, daß diese gemeinsam mit den Kontaktstiften (Pins 2) in einer Ebene durch au­ tomatisches Bonden verbunden sind.1. System for packaging integrated circuits (IC's), ent holding sensors on substrates, characterized in that in a single housing ( 6 ) multi-pole contacts for three-dimensional arrangement of IC hybrid modules are included on the base plate ( 1 ) with Sensors ( 4 , 5 ) at an angle to each other on carriers ( 8 ) such that these are connected together with the contact pins (pins 2 ) in one plane by automatic bonding. 2. System nach Anspruch 1, dadurch gekennzeichnet, daß die Sensor­ module (4, 5) auf einem metallischen Winkel oder Prisma (8) als Träger angeordnet sind.2. System according to claim 1, characterized in that the sensor modules ( 4 , 5 ) on a metallic angle or prism ( 8 ) are arranged as a carrier. 3. Verpackungs- und Kontaktierungsgehäuseanordnung nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß IC-Hybride für die Sensoren (4, 5) und die Kontaktstifte (Pins, 2) an ihren abgedichtet ins Gehäuse (6) ge­ führten Enden (3) parallele Bondflecken (9) aufweisen.3. Packaging and contacting housing arrangement according to claim 1 or 2, characterized in that IC hybrids for the sensors ( 4 , 5 ) and the contact pins (pins, 2 ) at their sealed in the housing ( 6 ) GE led ends ( 3 ) parallel Have bond spots ( 9 ). 4. Anordnung nach Anspruch 3, dadurch gekennzeichnet, daß die Bondflecken (9) unter einem Winkel von 45° zur Oberfläche der Grundplat­ te (1) angeordnet sind.4. Arrangement according to claim 3, characterized in that the bond pads ( 9 ) at an angle of 45 ° to the surface of the Grundplat te ( 1 ) are arranged. 5. Anordnung nach Anspruch 3, dadurch gekennzeichnet, daß die Pins (2) glasierte Durchführungen (10) durch die Grundplatte (1) aufweisen.5. Arrangement according to claim 3, characterized in that the pins ( 2 ) have glazed bushings ( 10 ) through the base plate ( 1 ).
DE19934322034 1992-08-06 1993-07-02 Packaging system for vehicle hybrid IC accelerometer Ceased DE4322034A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19934322034 DE4322034A1 (en) 1992-08-06 1993-07-02 Packaging system for vehicle hybrid IC accelerometer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4226064 1992-08-06
DE19934322034 DE4322034A1 (en) 1992-08-06 1993-07-02 Packaging system for vehicle hybrid IC accelerometer

Publications (1)

Publication Number Publication Date
DE4322034A1 true DE4322034A1 (en) 1994-02-10

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ID=25917278

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19934322034 Ceased DE4322034A1 (en) 1992-08-06 1993-07-02 Packaging system for vehicle hybrid IC accelerometer

Country Status (1)

Country Link
DE (1) DE4322034A1 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0744622A1 (en) * 1995-05-26 1996-11-27 Murata Manufacturing Co., Ltd. Acceleration sensor
EP0769701A1 (en) * 1995-10-17 1997-04-23 ITT Automotive Europe GmbH Device for detecting inclination of a vehicle
EP0777124A1 (en) * 1995-11-30 1997-06-04 Matsushita Electric Works, Ltd. Acceleration sensor
WO1998011442A1 (en) * 1996-09-12 1998-03-19 Temic Telefunken Microelectronic Gmbh Acceleration measurement device
DE19720106A1 (en) * 1997-05-16 1998-11-19 Telefunken Microelectron Device for receiving electrical components
DE19841258C1 (en) * 1998-09-09 2000-03-16 Siemens Ag Automobile air-bag control device
WO2000077526A1 (en) * 1999-06-14 2000-12-21 Honeywell Inc. Wedge mount for integrated circuit sensors
DE10135109A1 (en) * 2001-07-19 2003-02-06 Conti Temic Microelectronic Electronic component group for automobile control device, has directional sensor supported by adjustable holder allowing precise orientation
EP1873552A1 (en) 2006-06-27 2008-01-02 Robert Bosch Gmbh Method and device for determining the vertical or horizontal angle error of an all-round sensor in a motor vehicle
DE19903585B4 (en) * 1998-01-30 2009-08-13 Fuji Electric Co., Ltd., Kawasaki Semiconductor sensor and semiconductor sensor chip and semiconductor sensor housing
DE102008022061A1 (en) * 2008-05-03 2009-11-05 Conti Temic Microelectronic Gmbh Vehicle accident detecting component, has printed circuit board with direction-sensitive sensor and assembly opening in housing, where assembly opening is arranged in printed circuit board at specific angle

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3741036A1 (en) * 1987-12-03 1989-06-15 Fraunhofer Ges Forschung MICROMECHANICAL ACCELERATOR
DE3736294C2 (en) * 1987-10-27 1990-07-19 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De
DE3527818C2 (en) * 1985-08-02 1993-08-05 Technotron Elektrotechnische Geraete Und Komponenten Gmbh, 8450 Amberg, De

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3527818C2 (en) * 1985-08-02 1993-08-05 Technotron Elektrotechnische Geraete Und Komponenten Gmbh, 8450 Amberg, De
DE3736294C2 (en) * 1987-10-27 1990-07-19 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De
DE3741036A1 (en) * 1987-12-03 1989-06-15 Fraunhofer Ges Forschung MICROMECHANICAL ACCELERATOR

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0744622A1 (en) * 1995-05-26 1996-11-27 Murata Manufacturing Co., Ltd. Acceleration sensor
US5801507A (en) * 1995-05-26 1998-09-01 Murata Manufacturing Co., Ltd. Acceleration sensor
EP0769701A1 (en) * 1995-10-17 1997-04-23 ITT Automotive Europe GmbH Device for detecting inclination of a vehicle
DE19538616C2 (en) * 1995-10-17 2003-11-27 Continental Teves Ag & Co Ohg Device for detecting a vehicle inclination and / or a vehicle acceleration
EP0777124A1 (en) * 1995-11-30 1997-06-04 Matsushita Electric Works, Ltd. Acceleration sensor
US6112594A (en) * 1996-09-12 2000-09-05 Temic Telefunken Microelectronic Gmbh Acceleration measurement device
WO1998011442A1 (en) * 1996-09-12 1998-03-19 Temic Telefunken Microelectronic Gmbh Acceleration measurement device
EP0886462A2 (en) * 1997-05-14 1998-12-23 TEMIC TELEFUNKEN microelectronic GmbH Device for housing electrical components
US6195261B1 (en) * 1997-05-14 2001-02-27 Temic Telefunken Microelectronic Gmbh Device for positioning integrated circuit components that require specific spatial orientation
DE19720106A1 (en) * 1997-05-16 1998-11-19 Telefunken Microelectron Device for receiving electrical components
DE19720106C2 (en) * 1997-05-16 2001-03-15 Telefunken Microelectron Device for receiving electrical components
DE19903585B4 (en) * 1998-01-30 2009-08-13 Fuji Electric Co., Ltd., Kawasaki Semiconductor sensor and semiconductor sensor chip and semiconductor sensor housing
DE19841258C1 (en) * 1998-09-09 2000-03-16 Siemens Ag Automobile air-bag control device
WO2000077526A1 (en) * 1999-06-14 2000-12-21 Honeywell Inc. Wedge mount for integrated circuit sensors
DE10135109A1 (en) * 2001-07-19 2003-02-06 Conti Temic Microelectronic Electronic component group for automobile control device, has directional sensor supported by adjustable holder allowing precise orientation
EP1873552A1 (en) 2006-06-27 2008-01-02 Robert Bosch Gmbh Method and device for determining the vertical or horizontal angle error of an all-round sensor in a motor vehicle
DE102008022061A1 (en) * 2008-05-03 2009-11-05 Conti Temic Microelectronic Gmbh Vehicle accident detecting component, has printed circuit board with direction-sensitive sensor and assembly opening in housing, where assembly opening is arranged in printed circuit board at specific angle

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Owner name: TEMIC TELEFUNKEN MICROELECTRONIC GMBH, 74072 HEILB

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