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DE4118308A1 - Circuit board structure with surface mounted devices - has main and auxiliary boards adhered together via electrically insulating adhesive - Google Patents

Circuit board structure with surface mounted devices - has main and auxiliary boards adhered together via electrically insulating adhesive

Info

Publication number
DE4118308A1
DE4118308A1 DE4118308A DE4118308A DE4118308A1 DE 4118308 A1 DE4118308 A1 DE 4118308A1 DE 4118308 A DE4118308 A DE 4118308A DE 4118308 A DE4118308 A DE 4118308A DE 4118308 A1 DE4118308 A1 DE 4118308A1
Authority
DE
Germany
Prior art keywords
circuit board
circuit
carrier according
electrically insulating
mounted devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE4118308A
Other languages
German (de)
Other versions
DE4118308C2 (en
Inventor
Vlastimil Zlamal
Josef Dipl Ing Freidl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE4118308A priority Critical patent/DE4118308C2/en
Publication of DE4118308A1 publication Critical patent/DE4118308A1/en
Application granted granted Critical
Publication of DE4118308C2 publication Critical patent/DE4118308C2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

The circuit board structure with surface mounted devices has a main board (1) to which the surface mounted devices are attached via a conductive adhesive and an auxiliary board (2) to which the components are attached via soldering. The auxiliary board (2) is mounted on the surface of the main board (1) via an electrically insulating adhesive, with the 2 boards (1,2) electrically coupled via bonding wires (5). Pref. both boards have a ceramics carrier substrate, with the circuit paths and contact pads applied via a thick-film technique. ADVANTAGE - Improved electromagnetic compatibility.

Description

Die Erfindung betrifft einen Schaltungsträger gemäß Oberbe­ griff von Patentanspruch 1.The invention relates to a circuit carrier according to Oberbe handle of claim 1.

Herkömmlich werden elektrische Bauelemente auf Leiterplatten, die als Schaltungsträger dienen, durch Löten elektrisch kon­ taktiert und befestigt. Wegen einer starken thermischen Bela­ stung der Bausteine beim Löten und Problemen beim anschließend notwendigen Reinigen der Leiterplatten, werden derzeit die mei­ sten Bausteine mit Leitkleber kontaktiert. Allerdings werden sehr große und schwere Bausteine auf die Leiterplatte weiter­ hin gelötet, da das Kleben in diesem Fall nicht zuverlässig genug ist.Conventionally, electrical components are used on printed circuit boards, which serve as circuit carriers, electrically con by soldering clocked and fixed. Because of a strong thermal load the blocks during soldering and problems with the subsequent necessary cleaning of the circuit boards, are currently the most most of the blocks contacted with conductive adhesive. However very large and heavy blocks on the circuit board soldered there, since gluing is not reliable in this case is enough.

In dem Dokument EP-A 03 07 766 ist ein Schaltungsträger be­ schrieben, bei dem eine Leiterplatte mit sogenannten SMD-Bau­ steinen (Surface Mounted Devices) bestückt wird. Dabei werden die Anschlüsse der Bausteine unmittelbar an Kontaktflecken in bekannter Weise entweder durch Kleben mit einem elektrisch leitfähigen Kleber (im folgenden Leitkleber genannt) oder durch Löten mit Hilfe von Lotpaste befestigt.In the document EP-A 03 07 766 a circuit carrier is wrote in which a circuit board with so-called SMD construction stones (Surface Mounted Devices). In doing so the connections of the blocks directly to contact pads in known way either by gluing with an electrical conductive adhesive (hereinafter referred to as conductive adhesive) or attached by soldering using solder paste.

Die Klebetechnik und die Löttechnik können nur mit einem ho­ hen Aufwand auf einer Leiterplatte gleichzeitig angewendet werden, weil ansonsten eine gute Kontaktierung der Bausteine mit der Leiterplatte beeinträchtigt werden kann. Wenn zwei Leiterplatten miteinander zu einer elektronischen Schaltung verbunden werden, wobei die Bausteine auf der ersten Leiter­ platte geklebt und die auf der zweiten Leiterplatte gelötet sind, sind lange Verbindungsleitungen zwischen den Leiter­ platten notwendig. Außerdem nimmt eine solche Aufbauweise viel Platz in Anspruch.The adhesive technology and the soldering technology can only be done with a ho hen effort applied to a circuit board at the same time because otherwise good contacting of the building blocks can be affected with the circuit board. If two PCBs together to form an electronic circuit are connected, with the building blocks on the first ladder plate glued and soldered to the second circuit board are long connecting lines between the conductors plates necessary. In addition, such a construction takes takes up a lot of space.

Der im Anspruch 1 angegebenen Erfindung liegt das Problem zu­ grunde, einen einfach aufgebauten Schaltungsträger zu schaf­ fen, der wenig Platz einnimmt.The invention specified in claim 1 addresses the problem reasons to create a simply constructed circuit carrier fen that takes up little space.

Die mit der Erfindung erzielten Vorteile liegen insbesondere darin, daß die Zuleitungen zu den Bausteinen kurz gehalten werden. Dadurch wird die elektromagnetische Verträglichkeit (EMV) der Schaltung vergrößert.The advantages achieved with the invention are in particular in that the leads to the building blocks are kept short will. This will make the electromagnetic compatibility (EMC) of the circuit enlarged.

Eine vorteilhafte Ausgestaltung der Erfindung ist in den Un­ teransprüchen angegeben. Die Weiterbildung nach den Unteran­ sprüchen ermöglicht es, einen Schaltungsträger zu schaffen, durch den zusätzlich Platz eingespart wird, indem eine zweite Leiterplatte über Widerständen und Leiterbahnen an einer er­ sten Leiterplatte befestigt wird. Die beiden Leiterplatten werden elektrisch über Bonddrähte oder mit einem Leitkleber miteinander verbunden.An advantageous embodiment of the invention is in the Un specified claims. Continuing education according to the Unteran sayings makes it possible to create a circuit board which saves additional space by adding a second PCB over resistors and traces on one he Most circuit board is attached. The two circuit boards are made electrically via bond wires or with a conductive adhesive connected with each other.

Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und wird im folgenden näher beschrieben.An embodiment of the invention is in the drawing shown and is described in more detail below.

Es zeigtIt shows

Fig. 1 die Obersicht eines Ausschnitts aus einem schema­ tisch dargestellten Schaltungsträger und Fig. 1 is a top view of a section of a schematically represented circuit board and

Fig. 2 einen Querschnitt gemäß der Linie II-II in Fig. 1. FIG. 2 shows a cross section along the line II-II in FIG. 1.

Ein Schaltungsträger wird im vorliegenden Beispiel bei einem Kraftfahrzeug-Zündsteuergerät verwendet. Er weist eine erste Leiterplatte 1 (Fig. 1 und Fig. 2) und eine zweite Leiter­ platte 2 auf. Die Leiterplatten 1 und 2 werden jeweils mit SMD-Bausteinen 3 bestückt, wie es beispielsweise aus dem Doku­ ment EP-A 03 07 766 bekannt ist. Die Leiterplatten 1 und 2 wei­ sen jeweils eine Trägerschicht, Leiterbahnen, Kontaktflecke 4 und Durchkontaktierungen auf. Nach dem Bestücken sind die An­ schlüsse der Bausteine 3 mit den Kontaktflecken 4 der Leiter­ platten 1 und 2 elektrisch und mechanisch verbunden. A circuit carrier is used in the present example in a motor vehicle ignition control device. It comprises a first printed circuit board 1 (Fig. 1 and Fig. 2) and a second circuit board 2. The circuit boards 1 and 2 are each equipped with SMD modules 3 , as is known for example from the document EP-A 03 07 766. The circuit boards 1 and 2 each have a carrier layer, conductor tracks, contact pads 4 and plated-through holes. After assembly, the connections to the modules 3 with the contact pads 4 of the circuit boards 1 and 2 are electrically and mechanically connected.

In den Figuren sind jeweils nur ein Baustein 3 auf der ersten Leiterplatte 1 und auf der zweiten Leiterplatte 2 gezeichnet, stellvertretend für alle Bausteine einer elektronischen Schal­ tung. Es sind auch jeweils nur drei Kontaktflecken 4 gezeich­ net, auf denen die Bausteine 3 befestigt sind. Die Leiter­ bahnen sind nicht gezeichnet.In the figures, only one module 3 is drawn on the first circuit board 1 and on the second circuit board 2 , representative of all modules of an electronic circuit device. There are also only three contact patches 4 , on which the modules 3 are attached. The conductor tracks are not drawn.

Die Trägerschicht ist aus Keramik oder einem anderen isolieren­ den Material hergestellt. Die Leiterbahnen, Widerstände und die Kontaktflecken 4 sind in Dickschichttechnik auf mindestens einer Oberfläche der Trägerschicht aufgebracht. Die beiden Lei­ terplatten 1 und 2 können mit einer nichtmetallischen Abdeck­ schicht überzogen sein, zum Schutz vor Kurzschlüssen beim Kle­ ben oder Löten der Bausteine 3. Die Kontaktflecken 4 sind al­ lerdings in der Abdeckschicht ausgespart, um die Bausteine 3 zuverlässig zu kontaktieren.The backing layer is made of ceramic or another isolate the material. The conductor tracks, resistors and the contact pads 4 are applied in thick-film technology to at least one surface of the carrier layer. The two Lei terplatten 1 and 2 can be coated with a non-metallic cover layer to protect against short circuits when gluing or soldering the blocks 3rd The contact spots 4 are, however, recessed in the cover layer in order to reliably contact the building blocks 3 .

Alle Bausteine 3 der ersten Leiterplatte 1 sind nur mit Leit­ kleber an den Kontaktflecken 4 befestigt.All blocks 3 of the first circuit board 1 are attached to the contact pads 4 only with conductive adhesive.

Große und schwere Bausteine, beispielsweise ein PROM in einem PLCC-Gehäuse (Plastic Lead Chip Carrier), können nur bedingt geklebt werden. Werden solche Bausteine für die Schaltung be­ nötigt, so werden sie auf der zweiten Leiterplatte 2 mittels Löten befestigt.Large and heavy components, for example a PROM in a PLCC housing (Plastic Lead Chip Carrier), can only be glued to a limited extent. If such components are required for the circuit, they are attached to the second circuit board 2 by means of soldering.

Alle Bausteine 3 der zweiten Leiterplatte 2 sind auf die Kon­ taktflecke 4 gelötet.All components 3 of the second circuit board 2 are soldered to the contact patches 4 .

Das Kleben mit Leitkleber und das Löten der beiden Leiterplat­ ten 1 bzw. 2 findet nach dem Bestücken mit den Bausteinen 3 jeweils getrennt voneinander statt. Somit werden Fehler, die durch gegenseitige Beeinflussung von Kleben und Löten entste­ hen, auf den Leiterplatten 1 und 2 ausgeschlossen.The gluing with conductive glue and the soldering of the two printed circuit boards 1 and 2 takes place separately after the assembly with the building blocks 3 . Errors on the printed circuit boards 1 and 2 resulting from mutual interference between gluing and soldering are thus excluded.

Die zweite Leiterplatte 2 ist an der ersten Leiterplatte 1 mit einem elektrisch isolierenden Kleber oder einem Klebeband befestigt. Eine Klebeschicht ist in der Fig. 2 nicht ge­ zeichnet. Elektrisch sind die beiden Leiterplatten 1 und 2 entweder über Bonddrähte 5 (wie in Fig. 1 und 2 gezeichnet) oder mittels Leitkleber miteinander verbunden. Dabei besteht die elektrische Verbindung zwischen den Kontaktflecken 4 der beiden Leiterplatten 1 und 2. Bei Verwendung von Leitkleber zum Befestigen der zweiten Leiterplatte 2 kann auf den elek­ trisch isolierenden Kleber verzichtet werden.The second circuit board 2 is fastened to the first circuit board 1 with an electrically insulating adhesive or an adhesive tape. An adhesive layer is not shown in FIG. 2. The two printed circuit boards 1 and 2 are electrically connected to one another either via bonding wires 5 (as drawn in FIGS. 1 and 2) or by means of conductive adhesive. There is the electrical connection between the contact pads 4 of the two printed circuit boards 1 and 2 . When using conductive adhesive for attaching the second circuit board 2 , there is no need for the electrically insulating adhesive.

Auf dem Teil der ersten Leiterplatte 1, an dem die zweite Leiterplatte 2 befestigt wird, können Leiterbahnen, Kontakt­ flecken 4 und Durchkontaktierungen beliebig angeordnet sein. Viel Platz wird gespart, wenn die zweite Leiterplatte 2 über Widerstände geklebt wird, sofern diese mittels Dickschicht­ technik auf der ersten Leiterplatte 1 aufgebracht sind.On the part of the first circuit board 1 to which the second circuit board 2 is fastened, conductor tracks, contact spots 4 and plated-through holes can be arranged as desired. A lot of space is saved if the second circuit board 2 is glued over resistors, provided that these are applied to the first circuit board 1 by means of thick-film technology.

Claims (8)

1. Schaltungsträger mit mindestens zwei Leiterplatten (1, 2), die jeweils eine Trägerschicht mit mindestens auf jeweils ei­ ner Oberfläche angeordnete Kontaktflecken (4), an denen SMD-Bau­ steine (3) befestigt sind, aufweisen, dadurch gekennzeichnet,
  • - daß an einer ersten Leiterplatte (1) die Bausteine (3) mit einem Leitkleber befestigt sind,
  • - daß an einer zweiten Leiterplatte (2) die Bausteine (3) durch Löten befestigt sind, und
  • - daß die zweite Leiterplatte (2) auf die erste Leiterplatte (1) geklebt ist.
1. A circuit carrier with at least two printed circuit boards ( 1 , 2 ), each having a carrier layer with at least one contact surface ( 4 ) arranged on each ner surface, to which SMD components ( 3 ) are attached, characterized in that
  • - That on a first circuit board ( 1 ) the blocks ( 3 ) are attached with a conductive adhesive,
  • - That on a second circuit board ( 2 ), the blocks ( 3 ) are attached by soldering, and
  • - That the second circuit board ( 2 ) is glued to the first circuit board ( 1 ).
2. Schaltungsträger nach Anspruch 1, dadurch gekennzeichnet, daß die Trägerschichten der Leiterplatten (1, 2) aus Keramik hergestellt sind.2. Circuit carrier according to claim 1, characterized in that the carrier layers of the printed circuit boards ( 1 , 2 ) are made of ceramic. 3. Schaltungsträger nach Anspruch 2, dadurch gekennzeichnet, daß die Leiterbahnen und die Kontaktflecken (4) mittels Dick­ schichttechnik aufgebracht sind.3. Circuit carrier according to claim 2, characterized in that the conductor tracks and the contact pads ( 4 ) are applied by means of thick layer technology. 4. Schaltungsträger nach Anspruch 3, dadurch gekennzeichnet, daß Widerstände mittels Dickschichttechnik auf der ersten Lei­ terplatte (1) aufgebracht sind.4. Circuit carrier according to claim 3, characterized in that resistors are applied by means of thick-film technology on the first Lei terplatte ( 1 ). 5. Schaltungsträger nach Anspruch 4, dadurch gekennzeichnet, daß die zweite Leiterplatte (2) an der ersten Leiterplatte (1) über den Leiterbahnen und den Widerständen befestigt ist.5. Circuit carrier according to claim 4, characterized in that the second printed circuit board ( 2 ) on the first printed circuit board ( 1 ) is fastened over the conductor tracks and the resistors. 6. Schaltungsträger nach Anspruch 5, dadurch gekennzeichnet, daß die erste Leiterplatte (1) mit der zweiten Leiterplatte (2) elektrisch mittels Bonddrähten (5) verbunden ist. 6. Circuit carrier according to claim 5, characterized in that the first circuit board ( 1 ) with the second circuit board ( 2 ) is electrically connected by means of bonding wires ( 5 ). 7. Schaltungsträger nach Anspruch 6, dadurch gekennzeichnet, daß die zweite Leiterplatte (2) mit einem elektrisch isolie­ renden Kleber oder einem Klebeband an der ersten Leiterplatte (1) befestigt ist.7. A circuit carrier according to claim 6, characterized in that the second circuit board ( 2 ) with an electrically insulating adhesive or an adhesive tape is attached to the first circuit board ( 1 ). 8. Schaltungsträger nach Anspruch 5, dadurch gekennzeichnet, daß die erste Leiterplatte (1) und die zweite Leiterplatte (2) mittels Leitkleber miteinander verbunden sind.8. Circuit carrier according to claim 5, characterized in that the first circuit board ( 1 ) and the second circuit board ( 2 ) are connected to one another by means of conductive adhesive.
DE4118308A 1991-06-04 1991-06-04 Circuit carrier for SMD components Expired - Fee Related DE4118308C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4118308A DE4118308C2 (en) 1991-06-04 1991-06-04 Circuit carrier for SMD components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4118308A DE4118308C2 (en) 1991-06-04 1991-06-04 Circuit carrier for SMD components

Publications (2)

Publication Number Publication Date
DE4118308A1 true DE4118308A1 (en) 1992-12-10
DE4118308C2 DE4118308C2 (en) 1994-12-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE4118308A Expired - Fee Related DE4118308C2 (en) 1991-06-04 1991-06-04 Circuit carrier for SMD components

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DE (1) DE4118308C2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9315985U1 (en) * 1993-10-20 1994-01-05 Reichhardt, Bernd, 99097 Erfurt Memory module
DE19924080A1 (en) * 1999-05-26 2000-12-21 Siemens Ag Base plate with printed circuit board attached to it
EP1355353A3 (en) * 2002-04-15 2006-06-28 Hamilton Sundstrand Corporation Compact circuit carrier package

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10327767A1 (en) * 2003-06-18 2005-01-05 Marconi Communications Gmbh Circuit assembly and manufacturing method therefor
DE102005037460A1 (en) * 2005-08-09 2007-02-15 Robert Bosch Gmbh Arrangement with at least one IC has components with circuit carrier and conductive electrodes with separation of conductive sections on IC and carrier to ensure electromagnetic compatibility

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3522647A1 (en) * 1985-06-25 1987-01-08 Merten Kg Pulsotronic Circuit module motherboard
EP0307766A1 (en) * 1987-09-09 1989-03-22 Siemens Aktiengesellschaft Circuit board to be imprinted with SMD components

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3522647A1 (en) * 1985-06-25 1987-01-08 Merten Kg Pulsotronic Circuit module motherboard
EP0307766A1 (en) * 1987-09-09 1989-03-22 Siemens Aktiengesellschaft Circuit board to be imprinted with SMD components

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
NN: Productronic, H.1/2, 1989, S.66 u. S.68 *
REICHEL, Herbert, FEIL, Michael: "Hybridintegration", Hüthig Verlag, 1986, S. 18 u. 19 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9315985U1 (en) * 1993-10-20 1994-01-05 Reichhardt, Bernd, 99097 Erfurt Memory module
DE19924080A1 (en) * 1999-05-26 2000-12-21 Siemens Ag Base plate with printed circuit board attached to it
EP1355353A3 (en) * 2002-04-15 2006-06-28 Hamilton Sundstrand Corporation Compact circuit carrier package
US7754976B2 (en) 2002-04-15 2010-07-13 Hamilton Sundstrand Corporation Compact circuit carrier package

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Publication number Publication date
DE4118308C2 (en) 1994-12-22

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