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DE4026722A1 - Making soldered connection between component and PCB - locating discs on terminal pins to improve contact with soldering pads of flexible board - Google Patents

Making soldered connection between component and PCB - locating discs on terminal pins to improve contact with soldering pads of flexible board

Info

Publication number
DE4026722A1
DE4026722A1 DE4026722A DE4026722A DE4026722A1 DE 4026722 A1 DE4026722 A1 DE 4026722A1 DE 4026722 A DE4026722 A DE 4026722A DE 4026722 A DE4026722 A DE 4026722A DE 4026722 A1 DE4026722 A1 DE 4026722A1
Authority
DE
Germany
Prior art keywords
solder
contact pin
soldering
circuit board
eye
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4026722A
Other languages
German (de)
Inventor
Heinz Ing Grad Siegel
Volker Dipl Ing Schurr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE4026722A priority Critical patent/DE4026722A1/en
Priority to PCT/DE1991/000570 priority patent/WO1992003903A1/en
Priority to CS912533A priority patent/CS253391A3/en
Publication of DE4026722A1 publication Critical patent/DE4026722A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60T—VEHICLE BRAKE CONTROL SYSTEMS OR PARTS THEREOF; BRAKE CONTROL SYSTEMS OR PARTS THEREOF, IN GENERAL; ARRANGEMENT OF BRAKING ELEMENTS ON VEHICLES IN GENERAL; PORTABLE DEVICES FOR PREVENTING UNWANTED MOVEMENT OF VEHICLES; VEHICLE MODIFICATIONS TO FACILITATE COOLING OF BRAKES
    • B60T8/00—Arrangements for adjusting wheel-braking force to meet varying vehicular or ground-surface conditions, e.g. limiting or varying distribution of braking force
    • B60T8/32—Arrangements for adjusting wheel-braking force to meet varying vehicular or ground-surface conditions, e.g. limiting or varying distribution of braking force responsive to a speed condition, e.g. acceleration or deceleration
    • B60T8/34—Arrangements for adjusting wheel-braking force to meet varying vehicular or ground-surface conditions, e.g. limiting or varying distribution of braking force responsive to a speed condition, e.g. acceleration or deceleration having a fluid pressure regulator responsive to a speed condition
    • B60T8/36—Arrangements for adjusting wheel-braking force to meet varying vehicular or ground-surface conditions, e.g. limiting or varying distribution of braking force responsive to a speed condition, e.g. acceleration or deceleration having a fluid pressure regulator responsive to a speed condition including a pilot valve responding to an electromagnetic force
    • B60T8/3615—Electromagnetic valves specially adapted for anti-lock brake and traction control systems
    • B60T8/3675—Electromagnetic valves specially adapted for anti-lock brake and traction control systems integrated in modulator units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fluid Mechanics (AREA)
  • Transportation (AREA)
  • Metallurgy (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Magnetically Actuated Valves (AREA)
  • Multi-Conductor Connections (AREA)
  • Regulating Braking Force (AREA)

Abstract

A flexible circuit board (15) has conductor tracks formed between foils. The tracks have formed eye pads that provide the location for the pins (13) of mounted components. For a vehicle braking system the magnetic valves (12) used have pairs of connecting pins. - Soldered connections are made using discs (25) which are a press-fit onto the pins. These provide an increased area for forming the soldered joint (31).

Description

Stand der TechnikState of the art

Die Erfindung geht aus von einem Verfahren zum Herstellen einer Löt­ verbindung nach der Gattung des Patentanspruchs 1. Die Erfindung betrifft außerdem ein Gerät mit derartig hergestellten Lötver­ bindungen gemäß dem Oberbegriff des Patentanspruchs 2.The invention is based on a method for producing a solder connection according to the preamble of claim 1. The invention also relates to a device with solder solder produced in this way Binding according to the preamble of claim 2.

Durch die DE-OS 38 36 405 ist ein Ventilblock für eine hydraulische Bremsanlage bekannt. Der Ventilblock ist mit einer elastischen Kunststoffspritzgußplatine mit im Heißprägeverfahren aufgebrachten Kupferleiterbahnen zur Kontaktierung von aus Magnetventilspulen herausragenden Spulendrähten ausgestattet. Die Spulendrähte sind durch lochgestanzte Spulendrahtlötstellen der Platine geführt und mit dieser durch Schwallbadlötung verbunden.DE-OS 38 36 405 is a valve block for a hydraulic Brake system known. The valve block is elastic Plastic injection molded board with hot stamping Copper conductor tracks for contacting from solenoid valve coils outstanding coil wires. The coil wires are passed through hole punched coil wire solder joints on the board and connected to this by wave soldering.

Aus Gründen kostengünstiger Fertigung wird angestrebt, Einzelteile mit möglichst großen Toleranzen zu fertigen und zu Baugruppen oder Geräten zu fügen. Schwierigkeiten ergeben sich jedoch, wenn erheb­ liche Lagetoleranzen aufweisende Kontaktstifte elektrischer Bauteile mit den Lötaugen flexibler Leiterplatten kombiniert werden sollen, weil diese von den Kontaktstiften ausgeübte Kräfte nicht aufnehmen können. Außerdem ist das Lot nicht in der Lage, mehrere Millimeter breite Spalte zwischen Kontaktstift und Lötauge zu überbrücken. For reasons of cost-effective production, individual parts are sought to manufacture with the greatest possible tolerances and to assemblies or Devices. However, difficulties arise when significant Contact pins of electrical components with positional tolerances to be combined with the solder pads of flexible circuit boards, because these do not absorb the forces exerted by the contact pins can. In addition, the solder is not capable of several millimeters to bridge wide gaps between the contact pin and the pad.  

Darüber hinaus nimmt die Festigkeit einer Lötverbindung mit zuneh­ mender Spaltbreite ab.In addition, the strength of a solder joint increases gap width.

Vorteile der ErfindungAdvantages of the invention

Das erfindungsgemäße Verfahren mit den kennzeichnenden Verfahren­ schritten des Patentanspruchs 1 hat demgegenüber den Vorteil, daß eine einfach erzeugbare Lotverbindung ausreichender Festigkeit mit geringem Aufwand herstellbar ist, weil die Scheibe als Mittler zwischen dem Kontaktstift und dem Lötauge dient. Das Lot kann daher den Kontaktstift, das Lötauge und den von diesem eingeschlossenen Scheibenbereich unterbrechungsfrei benetzen, die relativ kleinen Spalte zwischen dem Kontaktstift und der Scheibe einerseits sowie dem Lötauge und der Scheibe andererseits füllen und eine belastbare, elektrische sichere Bindung erzeugen.The method according to the invention with the characterizing method steps of claim 1 has the advantage that an easily generated solder joint with sufficient strength can be produced with little effort because the disc acts as a mediator between the contact pin and the pad. The solder can therefore the contact pin, the pad and the one enclosed by it Wet the pane area without interruption, the relatively small ones Gaps between the contact pin and the washer on the one hand as well fill the pad and the disc on the other hand and a resilient, create an electrical secure connection.

Das erfindungsgemäße Gerät mit den kennzeichnenden Merkmalen des Anspruchs 2 ist insofern vorteilhaft, weil es kostengünstig mit relativ großen Toleranzen gefertigt werden kann, die bei der Kontaktierung der elektrischen Bauteile mit der Leiterplatte durch die an der Lötverbindung beteiligten Scheiben aber überbrückt sind.The device according to the invention with the characterizing features of Claim 2 is advantageous in that it is inexpensive with relatively large tolerances that can be manufactured in the Contacting of the electrical components with the circuit board the washers involved in the soldered connection are bridged.

Mit der im Anspruch 3 angegebenen Maßnahmen ist es auf einfache Weise möglich, die Scheibe auf dem Kontaktstift zu positionieren und gegen Verlieren zu sichern, was die Handhabung des Geräts bei der Montage der Leiterplatte und beim Lötvorgang erleichtert.With the measures specified in claim 3, it is simple Way possible to position the washer on the contact pin and secure against losing what the handling of the device at the Assembly of the circuit board and during the soldering process easier.

Zeichnungdrawing

Ausführungsbeispiele der Erfindung sind in der Zeichnung vereinfacht dargestellt und in der nachfolgenden Beschreibung näher erläutert. Es zeigenEmbodiments of the invention are simplified in the drawing shown and explained in more detail in the following description. Show it

Fig. 1 eine Draufsicht auf ein Gerät mit Magnetventilen, deren Kontaktstifte durch eine Lötverbindung mit einer flexiblen Leiterplatte kontaktiert sind, Fig. 2 einen Schnitt entlang dem Linienzug II-II in Fig. 1 durch das Gerät, Fig. 3 als Detail III aus Fig. 1 eine Ansicht auf ein Lötauge der Leiterplatte vor dem Lötvorgang in anderem Maßstab, Fig. 4 als Detail IV aus Fig. 2 einen Schnitt durch eine Lötverbindung mit einer ebenen, auf den Kontaktstift aufgepreßten Scheibe zum Stützen des Lötauges als ersten Ausführungsbeispiel in anderem Maßstab und Fig. 5 ebenfalls als Detail entsprechend Fig. 4 eine am Kontaktstift verstemmte Scheibe als zweites Ausführungsbeispiel in anderem Maßstab. Fig. 1 is a plan view of a device with solenoid valves, whose contact pins are contacted by a solder connection to a flexible circuit board, Fig. 2 shows a section along the trace II-II in FIG. 1 by the device, Fig. 3 as detail III of Figure . 1 is a view of a pad of the circuit board prior to soldering in a different scale, Fig. 4 a detail IV from FIG. 2 is a section through a solder connection with a planar pressed onto the contact pin disk for supporting the solder pad as the first embodiment on a different scale and FIG. 5 likewise as a detail corresponding to FIG. 4, a washer caulked on the contact pin as a second exemplary embodiment on a different scale.

Beschreibung der AusführungsbeispieleDescription of the embodiments

Bei dem in den Fig. 1 und 2 teilweise dargestellten Gerät 10 handelt es sich um ein Hydroaggregat für Fahrzeugbremsanlagen mit Blockierschutzeinrichtung. Das Gerät 10 weist ein mehrteiliges Gehäuse 11 auf, in dem Magnetventile 12 aufgenommen sind. Die Magnetventile 12 sind mit je zwei parallel angeordneten Kontakt­ stiften 13 versehen, die aus Isolierhülsen 14 austreten. Die Magnet­ ventile 12 sowie weitere, nicht dargestellte elektrische Bauteile sind mit einer flexiblen Leiterplatte 15 kontaktiert.The device 10 partially shown in FIGS . 1 and 2 is a hydraulic unit for vehicle brake systems with an anti-lock device. The device 10 has a multi-part housing 11 , in which the solenoid valves 12 are accommodated. The solenoid valves 12 are each provided with two contact pins 13 arranged in parallel, which emerge from insulating sleeves 14 . The solenoid valves 12 and other electrical components, not shown, are contacted with a flexible circuit board 15 .

Die flexible Leiterplatte 15 ist aus zwei miteinander verbundenen Folien 18 und 19 gebildet, zwischen denen Leiterbahnen 20 aus Kupferfolie eingebettet sind (Fig. 3). Die (untere) Isolierfolie 18 und die (obere) Deckfolie 19 bestehen aus einem hochwärmebeständigen Kunststoff. Im Bereich der Kontaktstifte 13 sind die Leiterbahnen 20 zu einem ringförmigen Lötauge 21 ausgebildet. Während sich die Isolierfolie 18 unterhalb des Lötauges 22 erstreckt, gibt die Deck­ folie 19 die Leiterbahn 20 im Bereich des Lötauges 21 frei. Das Löt­ auge 21 hat einen kreisförmigen Durchbruch 22, welcher frei von Folie ist.The flexible printed circuit board 15 is formed from two interconnected foils 18 and 19 , between which conductor tracks 20 made of copper foil are embedded ( FIG. 3). The (lower) insulating film 18 and the (upper) cover film 19 consist of a highly heat-resistant plastic. In the area of the contact pins 13 , the conductor tracks 20 are formed into an annular solder pad 21 . While the insulating film 18 extends below the pad 22 , the cover film 19 releases the conductor 20 in the area of the pad 21 . The solder eye 21 has a circular opening 22 which is free of foil.

Auf die aus verzinntem Messing mit quadratischem Querschnitt mit etwa 0,6 mm Kantenlänge bestehenden Kontaktstifte 13 der Magnet­ ventile 12 ist je eine ebenfalls aus verzinntem Messing bestehende Scheibe 25 aufgesteckt. Die ringförmige Scheibe 25 hat einen Außen­ durchmesser, welcher das Lötauge 21 überragt. Die Scheiben 25 sind mit den Kontaktstiften 13 fest verbunden und stützen sich an den Isolier­ hülsen 14 ab, so daß die der Leiterbahn 20 zugewandte Stirnseiten 26 der Scheiben 25 aller Magnetventil 12 vorzugsweise in einer Ebene verlaufen.On the existing of tinned brass with a square cross section with about 0.6 mm edge length contact pins 13 of the solenoid valves 12 is also a disc 25 also made of tinned brass. The annular disc 25 has an outer diameter which protrudes above the pad 21 . The disks 25 are firmly connected to the contact pins 13 and are supported on the insulating sleeves 14 , so that the end faces 26 of the disks 25 of all the solenoid valves 12 facing the conductor track 20 preferably run in one plane.

Die Verbindung der Scheibe 25 mit dem Kontaktstift 13 kann auf unterschiedliche Weise erzeugt werden: Beim in Fig. 4 dargestellten ersten Ausführungsbeispiel hat die Scheibe 25 einen mittigen Durchbruch 27 mit einem Durchmesser, welcher kleiner ist als die Diagonale des Kontaktstift-Querschnitts. Die Scheibe 25 ist daher durch Preßsitz mit dem Kontaktstift 13 verbunden.The connection of the disk 25 to the contact pin 13 can be produced in different ways: In the first exemplary embodiment shown in FIG. 4, the disk 25 has a central opening 27 with a diameter which is smaller than the diagonal of the contact pin cross section. The disc 25 is therefore connected to the contact pin 13 by a press fit.

Beim in Fig. 5 dargestellten zweiten Ausführungsbeispiel besitzt die Scheibe 25 einen zu einem düsenförmigen Durchzug 28 ausgebil­ deten Durchbruch 27. Der Durchzug 28 ist gegen das freie Ende des Kontaktstifts 13 gerichtet und nach dem Aufstecken der Scheibe 25 auf den Kontaktstift mit diesem verstemmt, so daß ebenfalls ein Preßsitz erzielt ist.In the second exemplary embodiment shown in FIG. 5, the disk 25 has an opening 27 which is configured to form a nozzle-shaped passage 28 . The passage 28 is directed against the free end of the contact pin 13 and caulked to the contact pin after the disk 25 has been fitted, so that an interference fit is also achieved.

Der kreisförmige Durchbruch 22 des Lötauges 21 hat einen dem Mehr­ fachen der Diagonale des Kontaktstift-Querschnitts entsprechenden Innendurchmesser von etwa 3 mm. In Fig. 3 nimmt der Kontaktstift 13 eine zentrische Lage zum Durchbruch 22 des Lötauges 21 ein. Diese idealisierte Darstellung verdeutlicht den Fall der toleranzfreien Zuordnung von Kontaktstift 13 zum Lötauge 21 der Leiterbahn 20. Unter den Bedingungen der Praxis treten jedoch erhebliche Lage­ toleranzen zwischen dem Kontaktstift 13 und dem Lötauge 21 auf. Diese Toleranzen können jedoch aufgenommen werden, weil der Kontakt­ stift 13 eine beliebige Lage innerhalb des Durchbruchs 22 des Löt­ auges 21 einnehmen kann. Auch wenn der Kontaktstift 13 am Rande des Durchbruchs 22 positioniert ist, bleibt dessen lichte Öffnung stets von der Scheibe 25 unterlegt. The circular opening 22 of the pad 21 has a multiple of the diagonal of the contact pin cross-section corresponding inner diameter of about 3 mm. In Fig. 3, the contact pin 13 takes a central position to the opening 22 of the pad 21 . This idealized illustration illustrates the case of the tolerance-free assignment of contact pin 13 to the solder pad 21 of the conductor track 20 . Under the conditions of practice, however, considerable position tolerances occur between the contact pin 13 and the pad 21 . However, these tolerances can be included because the contact pin 13 can take any position within the opening 22 of the soldering eye 21 . Even if the contact pin 13 is positioned on the edge of the opening 22 , its clear opening always remains underlaid by the disk 25 .

Die Kontaktstifte 13 der Magnetventile 12 sind mit der flexiblen Leiterplatte 15 durch eine Lötverbindung 31 kontaktiert. Hierzu wird vorzugsweise mit Kolbenlötung Lot auf das entsprechende Lötauge 21 aufgebracht und eine den Kontaktstift 13, das Lötauge und den inner­ halb des Lötauges liegenden Bereich der Scheibe 25 erfassende Benetzung mit Lot erzeugt. Wie die den Querschnitt der Lötverbindung 31 zeigende Darstellung nach den Fig. 4 und 5 deutlich macht, sind das Lötauge 21 und der Kontaktstift 13 durch eine auch den innerhalb des Lötauges liegenden Bereich der Scheibe 25 erfassende Bindung mit erkaltetem Lot 32 kontaktiert. Aufgrund der Mittler­ funktion der Scheibe 25 vermag also das Lot 32 mehrere Millimeter breite Spalte zwischen dem Lötauge 21 und dem Kontaktstift 13 zu überbrücken.The contact pins 13 of the solenoid valves 12 are contacted with the flexible printed circuit board 15 by a solder connection 31 . For this purpose, solder is preferably applied to the corresponding soldering eye 21 with piston soldering, and a wetting with solder which detects the contact pin 13 , the soldering eye and the region of the disk 25 lying inside the soldering eye is generated. How does the cross section of the solder joint 31 facing representation according to FIGS. 4 and 5 significantly, the pad 21 and the contact pin are in contact 13 by also located inside of the land area of the disc 25 detected bond to have cooled down lot 32. Due to the mediator function of the disk 25 , the solder 32 is able to bridge gaps between the soldering eye 21 and the contact pin 13 that are several millimeters wide.

Claims (3)

1. Verfahren zum Herstellen einer Lötverbindung (31) zwischen einem Kontaktstift (13) eines elektrischen Bauteils (Magnetventil 12) und einem Lötauge (21) einer flexiblen Leiterplatte (15), wobei das Lötauge (21) den Kontaktstift (13) mit relativ großem Spiel um­ greift, gekennzeichnet durch die Verfahrensschritte:
  • - auf den Kontaktstift (13) wird eine Scheibe (25) aufgesteckt,
  • - das Lotauge (21) der Leiterplatte (15) wird an der Scheibe (25) abgestützt,
  • - es wird eine den Kontaktstift (13), das Lötauge (21) und den in­ nerhalb des Lotauges (21) liegenden Bereich der Scheibe (25) erfassende Benetzung mit Lot (32) erzeugt.
1. A method for producing a solder connection ( 31 ) between a contact pin ( 13 ) of an electrical component (solenoid valve 12 ) and a soldering eye ( 21 ) of a flexible printed circuit board ( 15 ), the soldering eye ( 21 ) of the contact pin ( 13 ) having a relatively large size Game around, characterized by the procedural steps:
  • - A disc ( 25 ) is placed on the contact pin ( 13 ),
  • - The solder eye ( 21 ) of the circuit board ( 15 ) is supported on the disc ( 25 ),
  • - A contact pin ( 13 ), the soldering eye ( 21 ) and the area of the disk ( 25 ) which lies within the soldering eye ( 21 ) are detected and wetted with solder ( 32 ).
2. Gerät (10) mit nach dem Verfahren nach Anspruch 1 hergestellten Lötverbindungen (31), mit elektrischen Bauteilen, wie Magnetventilen (12) oder dergleichen, welche mit einer flexiblen Leiterplatte (15) kontaktiert sind, wobei Kontaktstifte (13) der Bauteile (12) mit relativ großem Spiel durch Lötaugen (21) der Leiterplatte (15) greifen und durch Lot (32) miteinander verbunden sind, dadurch gekennzeichnet, daß die Lötaugen (21) der Leiterplatte (15) an auf die Kontaktstifte (13) aufgesteckten Scheiben (25) abgestützt und durch eine das jeweilige Lötauge (21) mit dem Kontaktstift (13) sowie den innerhalb des Lötauges (21) liegenden Bereich der Scheibe (25) erfassende Bindung mit Lot (32) kontaktiert sind.2. Device ( 10 ) with solder connections ( 31 ) produced by the method according to claim 1, with electrical components, such as solenoid valves ( 12 ) or the like, which are contacted with a flexible printed circuit board ( 15 ), contact pins ( 13 ) of the components ( 12 ) grasp with a relatively large amount of play through soldering eyes ( 21 ) of the printed circuit board ( 15 ) and are connected to one another by solder ( 32 ), characterized in that the soldering eyes ( 21 ) of the printed circuit board ( 15 ) are attached to disks attached to the contact pins ( 13 ) ( 25 ) are supported and are contacted with solder ( 32 ) by a bond that detects the respective soldering eye ( 21 ) with the contact pin ( 13 ) and the area of the disk ( 25 ) lying within the soldering eye ( 21 ). 3. Gerät (10) nach Anspruch 2, dadurch gekennzeichnet, daß die Scheibe (25) auf den Kontaktstift (13) aufgepreßt oder mit diesem verstemmt ist.3. Device ( 10 ) according to claim 2, characterized in that the disc ( 25 ) is pressed onto the contact pin ( 13 ) or caulked with it.
DE4026722A 1990-08-24 1990-08-24 Making soldered connection between component and PCB - locating discs on terminal pins to improve contact with soldering pads of flexible board Withdrawn DE4026722A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE4026722A DE4026722A1 (en) 1990-08-24 1990-08-24 Making soldered connection between component and PCB - locating discs on terminal pins to improve contact with soldering pads of flexible board
PCT/DE1991/000570 WO1992003903A1 (en) 1990-08-24 1991-07-11 Method of producing a soldered joint, and equipment with such joints
CS912533A CS253391A3 (en) 1990-08-24 1991-08-15 Process for producing soldered joint and apparatus comprising such soldered joints

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4026722A DE4026722A1 (en) 1990-08-24 1990-08-24 Making soldered connection between component and PCB - locating discs on terminal pins to improve contact with soldering pads of flexible board

Publications (1)

Publication Number Publication Date
DE4026722A1 true DE4026722A1 (en) 1992-02-27

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Application Number Title Priority Date Filing Date
DE4026722A Withdrawn DE4026722A1 (en) 1990-08-24 1990-08-24 Making soldered connection between component and PCB - locating discs on terminal pins to improve contact with soldering pads of flexible board

Country Status (3)

Country Link
CS (1) CS253391A3 (en)
DE (1) DE4026722A1 (en)
WO (1) WO1992003903A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992022996A1 (en) * 1991-06-08 1992-12-23 Robert Bosch Gmbh Electrical device with at least one contact pin and conductor track sheet
US5193270A (en) * 1990-12-22 1993-03-16 Robert Bosch Gmbh Method for joining a conductor track foil to an electrical component

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2154958C3 (en) * 1971-11-05 1976-01-08 Norddeutsche Mende Rundfunk Kg, 2800 Bremen Safety soldering point in high-voltage conductor tracks in printed circuits
JPS60137491U (en) * 1984-02-23 1985-09-11 梅田工業株式会社 Fixing structure for difficult-to-braze parts

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5193270A (en) * 1990-12-22 1993-03-16 Robert Bosch Gmbh Method for joining a conductor track foil to an electrical component
WO1992022996A1 (en) * 1991-06-08 1992-12-23 Robert Bosch Gmbh Electrical device with at least one contact pin and conductor track sheet

Also Published As

Publication number Publication date
WO1992003903A1 (en) 1992-03-05
CS253391A3 (en) 1992-03-18

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