DE3882477D1 - Perlenfoermiges zusammengesetztes element. - Google Patents

Perlenfoermiges zusammengesetztes element.

Info

Publication number: DE3882477D1
Authority: DE; Germany
Prior art keywords: pearl; composite element; shaped composite; shaped; composite
Prior art date: 1987-10-08
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE8888309366T

Other languages

English (en)

Other versions

DE3882477T2 (de

Inventor

Yoshinori Sasaki

Sumio Takahashi

Toshihiro Kuroshima

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

TDK Corp

Original Assignee

TDK Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-10-08

Filing date

1988-10-07

Publication date

1993-08-26

1988-10-07 Application filed by TDK Corp filed Critical TDK Corp

1993-08-26 Application granted granted Critical

1993-08-26 Publication of DE3882477D1 publication Critical patent/DE3882477D1/de

1994-02-03 Publication of DE3882477T2 publication Critical patent/DE3882477T2/de

2008-10-08 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Electromagnetism (AREA)
Manufacturing & Machinery (AREA)
Coils Or Transformers For Communication (AREA)
Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

DE88309366T 1987-10-08 1988-10-07 Perlenförmiges zusammengesetztes Element. Expired - Lifetime DE3882477T2 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1987153344U JPH0158909U (de)	1987-10-08	1987-10-08

Publications (2)

Publication Number	Publication Date
DE3882477D1 true DE3882477D1 (de)	1993-08-26
DE3882477T2 DE3882477T2 (de)	1994-02-03

Family

ID=15560420

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE88309366T Expired - Lifetime DE3882477T2 (de)	1987-10-08	1988-10-07	Perlenförmiges zusammengesetztes Element.

Country Status (4)

Country	Link
US (1)	US4845452A (de)
EP (1)	EP0311418B1 (de)
JP (1)	JPH0158909U (de)
DE (1)	DE3882477T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5224878A (en) *	1992-03-31	1993-07-06	Amp Incorporated	Connector filter with integral surge protection
EP0593020B1 (de) *	1992-10-12	1999-02-03	Matsushita Electronics Corporation	Verfahren zur Herstellung eines elektronischen Bauelementes
JPH07201592A (ja) *	1993-12-28	1995-08-04	Murata Mfg Co Ltd	積層型ｌｃ複合部品
US5455552A (en) *	1994-05-03	1995-10-03	Steward, Inc.	Ferrite common mode choke adapted for circuit board mounting
KR0168961B1 (ko) *	1995-06-07	1999-03-20	이형도	포면실장 부품용 라인필터
JP3127792B2 (ja) *	1995-07-19	2001-01-29	株式会社村田製作所	Ｌｃ共振器およびｌｃフィルタ
US6566731B2 (en) *	1999-02-26	2003-05-20	Micron Technology, Inc.	Open pattern inductor
US6240622B1 (en) *	1999-07-09	2001-06-05	Micron Technology, Inc.	Integrated circuit inductors
US6447615B2 (en) *	1999-08-10	2002-09-10	National Starch And Chemical Investment Holding Corporation	Sago fluidity starch and use thereof
JP3301415B2 (ja) *	1999-08-19	2002-07-15	株式会社村田製作所	チップ状電子部品
JP4217438B2 (ja) *	2002-07-26	2009-02-04	Ｆｄｋ株式会社	マイクロコンバータ
US7612641B2 (en) *	2004-09-21	2009-11-03	Pulse Engineering, Inc.	Simplified surface-mount devices and methods
US7495926B2 (en) *	2004-10-05	2009-02-24	Sony Ericsson Mobile Communications Ab	Interface module for electronic devices
CN101341646B (zh) *	2005-10-28	2011-06-08	日立金属株式会社	Dc-dc转换器
WO2008126043A1 (en) *	2007-04-17	2008-10-23	Nxp B.V.	Method for manufacturing an element having electrically conductive members for application in a microelectronic package
US8824165B2 (en)	2008-02-18	2014-09-02	Cyntec Co. Ltd	Electronic package structure
US9001527B2 (en) *	2008-02-18	2015-04-07	Cyntec Co., Ltd.	Electronic package structure
TWI355068B (en) *	2008-02-18	2011-12-21	Cyntec Co Ltd	Electronic package structure
WO2014115434A1 (ja) *	2013-01-22	2014-07-31	株式会社村田製作所	Ｌｃ複合部品
KR101525689B1 (ko) *	2013-11-05	2015-06-03	삼성전기주식회사	적층 세라믹 전자 부품 및 적층 세라믹 전자 부품의 실장 기판
JP6358132B2 (ja) *	2015-03-03	2018-07-18	オムロン株式会社	立体回路構造体
US9673179B1 (en)	2016-07-20	2017-06-06	International Business Machines Corporation	Discrete electronic device embedded in chip module
US20180151291A1 (en) *	2016-11-29	2018-05-31	Qualcomm Incorporated	Inductor with embedded diode
US20180218828A1 (en) *	2017-01-27	2018-08-02	Toyota Motor Engineering & Manufacturing North America, Inc.	Inductor with variable permeability core
JP7231340B2 (ja) *	2018-06-05	2023-03-01	太陽誘電株式会社	セラミック電子部品およびその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS58266Y2 (ja) *	1977-09-30	1983-01-06	株式会社村田製作所	同調装置
US4342069A (en) *	1979-07-02	1982-07-27	Mostek Corporation	Integrated circuit package
US4328530A (en) *	1980-06-30	1982-05-04	International Business Machines Corporation	Multiple layer, ceramic carrier for high switching speed VLSI chips
US4563659A (en) *	1982-07-28	1986-01-07	Murata Manufacturing Co., Ltd.	Noise filter
JPS6041312A (ja) *	1983-08-16	1985-03-05	Tdk Corp	回路素子

1987
- 1987-10-08 JP JP1987153344U patent/JPH0158909U/ja active Pending
1988
- 1988-10-05 US US07/254,324 patent/US4845452A/en not_active Expired - Lifetime
- 1988-10-07 DE DE88309366T patent/DE3882477T2/de not_active Expired - Lifetime
- 1988-10-07 EP EP88309366A patent/EP0311418B1/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
US4845452A (en)	1989-07-04
DE3882477T2 (de)	1994-02-03
JPH0158909U (de)	1989-04-13
EP0311418B1 (de)	1993-07-21
EP0311418A2 (de)	1989-04-12
EP0311418A3 (en)	1990-03-28

Publication	Publication Date	Title
DE3882477D1 (de)	1993-08-26	Perlenfoermiges zusammengesetztes element.
CH682870GA3 (fr)	1993-12-15	Agrotextile composite.
DE68900410D1 (de)	1991-12-12	Zusammengesetztes sorbensmittel.
DE3580617D1 (de)	1991-01-03	Mullit-cordierit-keramikverbundwerkstoff.
DE59004903D1 (de)	1994-04-14	Verbundelement.
DE3676498D1 (de)	1991-02-07	Aufbuegelbarer einlageverbundstoff.
DE3650438D1 (de)	1995-12-21	Keramik-Metall-Verbund.
DE3884310D1 (de)	1993-10-28	Verbundlegierung.
NO864774D0 (no)	1986-11-27	Kompositt benplattform.
DE3852285D1 (de)	1995-01-12	Verbundstoff.
DE3767005D1 (de)	1991-02-07	Montage-element.
DE3866242D1 (de)	1991-12-19	Verbindungselement.
DE3774616D1 (de)	1992-01-02	Verbindungselement.
ATE106911T1 (de)	1994-06-15	Komposit-werkzeuge.
KR880701635A (ko)	1988-11-04	쎄라믹-유리질-금속 합성물
DE3888940D1 (de)	1994-05-11	Verbundstoff.
DE59006445D1 (de)	1994-08-18	Verbindungselement.
DE3874269D1 (de)	1992-10-08	Chromcarbidsinterkoerper.
DE3865633D1 (de)	1991-11-21	Verbindungselement.
NO883025D0 (no)	1988-07-06	Autodesinfiserende avformingsmaterialer.
DE3878574D1 (de)	1993-04-01	Verbindungselemente.
DE3761602D1 (de)	1990-03-08	Steckbaugruppe.
DE3863380D1 (de)	1991-08-01	Verschlusselement.
AT389547B (de)	1989-12-27	Waermedaemm-verbundelement
NO873648D0 (no)	1987-08-28	Komposittartikkel.

Legal Events

Date	Code	Title	Description
1994-08-18	8364	No opposition during term of opposition