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DE3877633D1 - AQUEOUS ACID BATH FOR GALVANIC DEPOSITION OF GLOSSY AND LEVELED COPPER COATINGS. - Google Patents

AQUEOUS ACID BATH FOR GALVANIC DEPOSITION OF GLOSSY AND LEVELED COPPER COATINGS.

Info

Publication number
DE3877633D1
DE3877633D1 DE8888108876T DE3877633T DE3877633D1 DE 3877633 D1 DE3877633 D1 DE 3877633D1 DE 8888108876 T DE8888108876 T DE 8888108876T DE 3877633 T DE3877633 T DE 3877633T DE 3877633 D1 DE3877633 D1 DE 3877633D1
Authority
DE
Germany
Prior art keywords
pref
acid
bath
cpd
alkyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8888108876T
Other languages
German (de)
Inventor
Wolfgang Dahms
Hubert-Matthias Seidenspinner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Priority to DE8888108876T priority Critical patent/DE3877633D1/en
Application granted granted Critical
Publication of DE3877633D1 publication Critical patent/DE3877633D1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Aq. acid bath for bright and level Cu electroplating contains 2-(4'-aminophenyl) -benzothiazonium cpd(s). of formula (I): In (I), R1 = 1-5C alkyl, (substd.) aryl or aralkyl; R2 = H, 1-5C alkyl or 1-5C alkoxy; R3 and R4 independently = 1-5C alkyl; X = an acid gp. The bath contains 0.0005-0.3 (0.002-0.25)g (I)/1. The bath has pH less than 1. It also contains: a) high mol. cpd(s). contg. 0, pref. PVA, CMC, polyethylene glycol, polypropylene glycol, stearic acid poly-glycol ester, oleic acid poliglycol ester etc.; pref. in a concn.of 0.005-20 (0.01-5) g/l; and/or b) an N-free organic thio cpd. with water-solubilising gps., pref. Na 3-mercaptopropane-1-sulphonate, thiophoshoric acid 0-ethyl-bis-(omega-sulphopropyl) ester, di-Na salt etc.; pref. in a concn. of 0.0005-0.2 (0.001-0.3) g/l.
DE8888108876T 1987-06-30 1988-06-03 AQUEOUS ACID BATH FOR GALVANIC DEPOSITION OF GLOSSY AND LEVELED COPPER COATINGS. Expired - Lifetime DE3877633D1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8888108876T DE3877633D1 (en) 1987-06-30 1988-06-03 AQUEOUS ACID BATH FOR GALVANIC DEPOSITION OF GLOSSY AND LEVELED COPPER COATINGS.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19873721985 DE3721985A1 (en) 1987-06-30 1987-06-30 AQUEOUS ACID BATH FOR GALVANIC DEPOSITION OF GLOSSY AND LEVELED COPPER COATINGS
DE8888108876T DE3877633D1 (en) 1987-06-30 1988-06-03 AQUEOUS ACID BATH FOR GALVANIC DEPOSITION OF GLOSSY AND LEVELED COPPER COATINGS.

Publications (1)

Publication Number Publication Date
DE3877633D1 true DE3877633D1 (en) 1993-03-04

Family

ID=6330825

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19873721985 Withdrawn DE3721985A1 (en) 1987-06-30 1987-06-30 AQUEOUS ACID BATH FOR GALVANIC DEPOSITION OF GLOSSY AND LEVELED COPPER COATINGS
DE8888108876T Expired - Lifetime DE3877633D1 (en) 1987-06-30 1988-06-03 AQUEOUS ACID BATH FOR GALVANIC DEPOSITION OF GLOSSY AND LEVELED COPPER COATINGS.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19873721985 Withdrawn DE3721985A1 (en) 1987-06-30 1987-06-30 AQUEOUS ACID BATH FOR GALVANIC DEPOSITION OF GLOSSY AND LEVELED COPPER COATINGS

Country Status (5)

Country Link
EP (1) EP0297306B1 (en)
JP (1) JPH01100292A (en)
AT (1) AT396946B (en)
DE (2) DE3721985A1 (en)
ES (1) ES2045013T3 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
JPH04120692A (en) * 1990-09-11 1992-04-21 Koatsu Gas Kogyo Kk Sensor testing device
DE4032864A1 (en) * 1990-10-13 1992-04-16 Schering Ag ACIDIC BATH FOR THE GALVANIC DEPOSITION OF COPPER COVERS AND METHODS USING THIS COMBINATION
DE4133299A1 (en) * 1991-10-08 1993-04-15 Basf Lacke & Farben CATHODICALLY ADDIBLE ELECTRO DIP VARNISH
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
RU2175999C2 (en) * 1999-03-09 2001-11-20 Калининградский государственный университет Aqueous bright copper plating electrolyte for
DE10000090A1 (en) * 2000-01-04 2001-08-30 Elfo Ag Sachseln Sachseln Electrical connecting element production method has embossed substrate provided with selectively etched conductive galvanic coating
EP1348320A1 (en) * 2001-01-04 2003-10-01 Elmicron AG Method for producing electroconductive structures
US6736954B2 (en) * 2001-10-02 2004-05-18 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
RU2237754C2 (en) * 2002-07-25 2004-10-10 Калининградский государственный университет Electrolyte for bright copper plating
US7153408B1 (en) * 2006-04-13 2006-12-26 Herdman Roderick D Copper electroplating of printing cylinders
EP2568063A1 (en) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Low internal stress copper electroplating method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817272A (en) * 1981-07-20 1983-02-01 Yamatake Honeywell Co Ltd Actuator for control valve
WO1984001393A1 (en) * 1982-09-30 1984-04-12 Learonal Inc Electrolytic copper plating solutions
US4490220A (en) * 1982-09-30 1984-12-25 Learonal, Inc. Electrolytic copper plating solutions

Also Published As

Publication number Publication date
ES2045013T3 (en) 1994-01-16
DE3721985A1 (en) 1989-01-12
EP0297306B1 (en) 1993-01-20
JPH01100292A (en) 1989-04-18
EP0297306A1 (en) 1989-01-04
AT396946B (en) 1993-12-27
ATA166488A (en) 1993-05-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ATOTECH DEUTSCHLAND GMBH, 10553 BERLIN, DE