[go: up one dir, main page]

DE3873197D1 - Leitungsmetallisierung von substraten mittels entwicklungsmittel. - Google Patents

Leitungsmetallisierung von substraten mittels entwicklungsmittel.

Info

Publication number
DE3873197D1
DE3873197D1 DE8888201342T DE3873197T DE3873197D1 DE 3873197 D1 DE3873197 D1 DE 3873197D1 DE 8888201342 T DE8888201342 T DE 8888201342T DE 3873197 T DE3873197 T DE 3873197T DE 3873197 D1 DE3873197 D1 DE 3873197D1
Authority
DE
Germany
Prior art keywords
substrates
development agents
line metalization
metalization
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8888201342T
Other languages
English (en)
Inventor
William John E Parr
Ronald Eric Hutton
Paul Yuet Yee Moy
Dieter Frank
David A Strawser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akzo NV
Original Assignee
Akzo NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo NV filed Critical Akzo NV
Application granted granted Critical
Publication of DE3873197D1 publication Critical patent/DE3873197D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/082—Coating starting from inorganic powder by application of heat or pressure and heat without intermediate formation of a liquid in the layer
    • C23C24/085—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/082—Coating starting from inorganic powder by application of heat or pressure and heat without intermediate formation of a liquid in the layer
    • C23C24/085—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • C23C24/087—Coating with metal alloys or metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/18—After-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Powder Metallurgy (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
DE8888201342T 1987-06-30 1988-06-29 Leitungsmetallisierung von substraten mittels entwicklungsmittel. Expired - Lifetime DE3873197D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US6859387A 1987-06-30 1987-06-30
US07/204,068 US4997674A (en) 1987-06-30 1988-06-08 Conductive metallization of substrates via developing agents

Publications (1)

Publication Number Publication Date
DE3873197D1 true DE3873197D1 (de) 1992-09-03

Family

ID=26749134

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888201342T Expired - Lifetime DE3873197D1 (de) 1987-06-30 1988-06-29 Leitungsmetallisierung von substraten mittels entwicklungsmittel.

Country Status (5)

Country Link
US (1) US4997674A (de)
EP (1) EP0297677B1 (de)
JP (1) JPH01139773A (de)
CA (1) CA1308311C (de)
DE (1) DE3873197D1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4961879A (en) * 1988-06-08 1990-10-09 Akzo America Inc. Conductive metal-filled substrates via developing agents
US5252255A (en) * 1988-06-08 1993-10-12 Akzo America Inc. Conductive metal-filled substrates via developing agents
US5064469A (en) * 1989-10-03 1991-11-12 Akzo N.V. Preparation of oxidation resistant metal powder
US5175024A (en) * 1989-10-03 1992-12-29 Akzo N.V. Processes for preparation of oxidation resistant metal powders
IL98660A (en) * 1991-06-28 1996-10-16 Orbotech Ltd Method of printing an image on a substrate particularly useful for producing printed circuit boards
FR2682486B1 (fr) * 1991-10-15 1993-11-12 Commissariat A Energie Atomique Miroir dielectrique interferentiel et procede de fabrication d'un tel miroir.
US5378508A (en) * 1992-04-01 1995-01-03 Akzo Nobel N.V. Laser direct writing
US6230963B1 (en) * 1997-01-28 2001-05-15 Eric L. Hertz Method and apparatus using colored foils for placing conductive preforms
DE19859735B4 (de) * 1998-12-23 2006-04-27 Erbslöh Ag Verfahren zur partiellen oder vollständigen Beschichtung der Oberflächen von Bauteilen aus Aluminium und seinen Legierungen mit Lot, Fluß- und Bindemittel zur Hartverlötung
AT409612B (de) * 1999-01-21 2002-09-25 Boehler Bleche Gmbh Plattenförmiges presswerkzeug und verfahren zu dessen herstellung
US6569517B1 (en) 2000-11-17 2003-05-27 3M Innovative Properties Company Color tailorable pigmented optical bodies with surface metalization
US6588099B2 (en) * 2001-01-22 2003-07-08 Sankyo Kasei Kabushiki Kaisha Process for manufacturing molded circuit board
US6591496B2 (en) * 2001-08-28 2003-07-15 3M Innovative Properties Company Method for making embedded electrical traces
JP5064379B2 (ja) * 2005-04-20 2012-10-31 フィブロ−テック，インコーポレイテッド 銅粉末の生成方法、金属粉末の生成方法及びニッケル粉末の生成方法
DE102006025121A1 (de) * 2006-05-30 2007-12-06 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Darstellung von Mikro- und Nanoporen-Massenanordnungen durch Selbstorganisation von Nanopartikeln und Sublimationstechnik
CN116120773A (zh) * 2023-03-23 2023-05-16 中国南方电网有限责任公司超高压输电公司柳州局 防腐导电材料及其制备方法、接地网防腐导电胶泥

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3596842A (en) * 1969-03-05 1971-08-03 Superior Tea And Coffee Co Machine for separating a granular substance from a container of paper or the like
US4232060A (en) * 1979-01-22 1980-11-04 Richardson Chemical Company Method of preparing substrate surface for electroless plating and products produced thereby
US4064074A (en) * 1975-07-08 1977-12-20 Delphic Research Laboratories, Inc. Methods for the manufacture and use of electrically conductive compositions and devices
US4305847A (en) * 1979-07-26 1981-12-15 Acheson Industries, Inc. Copper coating composition for shielding electronic equipment and the like
US4382981A (en) * 1979-07-26 1983-05-10 Acheson Industries, Inc. Method for shielding electronic equipment by coating with copper containing composition
GB2085340B (en) * 1980-10-14 1985-03-27 Standard Telephones Cables Ltd Solderable paint
US4508640A (en) * 1981-11-24 1985-04-02 Showa Denko Kabushiki Kaisha Electromagnetic wave-shielding materials
FR2518126B1 (fr) * 1981-12-14 1986-01-17 Rhone Poulenc Spec Chim Procede de metallisation d'articles electriquement isolants en matiere plastique et les articles intermediaires et finis obtenus selon ce procede
US4499152A (en) * 1982-08-09 1985-02-12 General Electric Company Metal-clad laminate construction
FR2554303B1 (fr) * 1983-10-28 1986-04-18 Rhone Poulenc Rech Substrats metallisables pour circuits imprimes et leur procede de preparation
JPS60253207A (ja) * 1984-05-30 1985-12-13 株式会社東芝 コンデンサの製造方法
DE3564636D1 (en) * 1984-07-31 1988-09-29 Mitsubishi Petrochemical Co Copper-type conductive coating composition
JPS61111335A (ja) * 1984-11-05 1986-05-29 Dainippon Toryo Co Ltd プラスチツク成形方法
US4663240A (en) * 1984-11-06 1987-05-05 Enthone, Incorporated RFI shielded plastic articles and process for making same
US4614837A (en) * 1985-04-03 1986-09-30 Allied Corporation Method for placing electrically conductive paths on a substrate
GB8511905D0 (en) * 1985-05-10 1985-06-19 Akzo Nv Metallizing polymeric materials
FR2586133B1 (fr) * 1985-08-06 1987-12-18 Protavic Compositions conductrices de l'electricite contenant du nickel
DE3669611D1 (de) * 1985-11-04 1990-04-19 Gen Electric Verbesserung der leitfaehigkeit von metallische fuellstoffe enthaltenden kunststoffen.
EP0239901B1 (de) * 1986-03-31 1992-11-11 Tatsuta Electric Wire & Cable Co., Ltd Leitfähige Kupferpastenzusammensetzung
US4786570A (en) * 1987-04-21 1988-11-22 Xerox Corporation Layered, flexible electrophotographic imaging member having hole blocking and adhesive layers

Also Published As

Publication number Publication date
CA1308311C (en) 1992-10-06
JPH01139773A (ja) 1989-06-01
EP0297677B1 (de) 1992-07-29
US4997674A (en) 1991-03-05
EP0297677A1 (de) 1989-01-04

Similar Documents

Publication Publication Date Title
DE3887947D1 (de) Messanordnung von entfernungen.
NO882161D0 (no) Viskositetsmodifiserende midler.
DE69020796D1 (de) Direkt-Elektroplattieren von Durchgangslöchern.
DE3761314D1 (de) Elektroplattierzelle.
DE3872647D1 (de) Korrosionshemmung.
DE3873197D1 (de) Leitungsmetallisierung von substraten mittels entwicklungsmittel.
FI875020A7 (fi) Terapeuttiset aineet.
FI884533L (fi) Underlag foer jordfri odling med kontrollerad vattenhalt i tjockleksriktningen.
FI880917A0 (fi) Luftstyrningsdysa foer torkpartiet i en snabbgaoende pappersmaskin.
FI880065A0 (fi) Foerfarande foer konferensfoerbindningar i datamaskinstyrda digitala telefonfoermedlingsanordningar.
DE3781751D1 (de) Ueberzugsmittel.
FI880697A0 (fi) Manoeverdon foer elektriskt block.
FI880077L (fi) Foerbaettring i en diskmoduls mellanstycken.
ATE112172T1 (de) Targetformer von antitumor-methyltrithioagenzien.
NO893375D0 (no) Nye antiarytmiske midler i.
FI885079L (fi) Speciellt med klorhexadin kompatibel kiseloxid foer anvaendning i tandkraemskompositioner.
FI884869L (fi) I samband med blodprovtagning anvaendbart plaoster.
DE3853473D1 (de) Magnetische brückenanordnungen.
FI883867A7 (fi) 2-pyrimidinyyli-1 -piperatsiinijohdannaisten käyttö.
FI880853A0 (fi) Tappningsraenna foer sodasmaelta i en sodapanna.
FI880291A0 (fi) Varpvaevd enkeltrikao med lugg.
FI874134A7 (fi) Plattbelaeggning.
ATE78881T1 (de) Leitungsmetallisierung von substraten mittels entwicklungsmittel.
NO874112D0 (no) Bobleplate.
ATE92755T1 (de) Phenol-thioether als inhibitoren von 5lipoxygenase.

Legal Events

Date Code Title Description
8332 No legal effect for de