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DE3856132D1 - Halbleiterrelais - Google Patents

Halbleiterrelais

Info

Publication number
DE3856132D1
DE3856132D1 DE3856132T DE3856132T DE3856132D1 DE 3856132 D1 DE3856132 D1 DE 3856132D1 DE 3856132 T DE3856132 T DE 3856132T DE 3856132 T DE3856132 T DE 3856132T DE 3856132 D1 DE3856132 D1 DE 3856132D1
Authority
DE
Germany
Prior art keywords
control circuit
radiator
base portion
circuit block
cartridge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3856132T
Other languages
English (en)
Other versions
DE3856132T2 (de
Inventor
Kozo Maenishi
Makoto Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP28984787A external-priority patent/JPH0734513B2/ja
Priority claimed from JP62298200A external-priority patent/JPH0724348B2/ja
Priority claimed from JP62304366A external-priority patent/JPH01144106A/ja
Priority claimed from JP1987182540U external-priority patent/JPH0186176U/ja
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Application granted granted Critical
Publication of DE3856132D1 publication Critical patent/DE3856132D1/de
Publication of DE3856132T2 publication Critical patent/DE3856132T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electronic Switches (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Circuit For Audible Band Transducer (AREA)
  • Relay Circuits (AREA)
  • Inspection Of Paper Currency And Valuable Securities (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE3856132T 1987-11-17 1988-11-17 Halbleiterrelais Expired - Fee Related DE3856132T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP28984787A JPH0734513B2 (ja) 1987-11-17 1987-11-17 固体継電器
JP62298200A JPH0724348B2 (ja) 1987-11-26 1987-11-26 固体継電器
JP62304366A JPH01144106A (ja) 1987-11-30 1987-11-30 電源装置
JP1987182540U JPH0186176U (de) 1987-11-30 1987-11-30

Publications (2)

Publication Number Publication Date
DE3856132D1 true DE3856132D1 (de) 1998-03-12
DE3856132T2 DE3856132T2 (de) 1998-10-08

Family

ID=27475056

Family Applications (2)

Application Number Title Priority Date Filing Date
DE3853462T Expired - Fee Related DE3853462T2 (de) 1987-11-17 1988-11-17 Halbleiterrelais.
DE3856132T Expired - Fee Related DE3856132T2 (de) 1987-11-17 1988-11-17 Halbleiterrelais

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE3853462T Expired - Fee Related DE3853462T2 (de) 1987-11-17 1988-11-17 Halbleiterrelais.

Country Status (3)

Country Link
EP (2) EP0316917B1 (de)
AT (2) ATE163121T1 (de)
DE (2) DE3853462T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19637800C1 (de) * 1996-09-17 1997-09-04 Telefunken Microelectron Kabelverstärker
DE19915836C2 (de) * 1999-04-08 2002-03-07 Dold & Soehne Kg E Modulares Gehäusesystem für den Einbau von Steuerungs- und Leistungselektronik
ES2170017B2 (es) * 1999-11-19 2003-08-01 Behr France Sarl Instalacion de calefaccion electrica, particularmente para un vehiculo automovil.
JP2007165588A (ja) * 2005-12-14 2007-06-28 Omron Corp パワーモジュール構造及びこれを用いたソリッドステートリレー
US8472194B2 (en) * 2010-05-05 2013-06-25 Custom Sensors & Technologies, Inc. Solid state switching device with integral heatsink
DE102010017672B4 (de) * 2010-06-30 2017-04-06 Vossloh-Schwabe Optoelectronic Gmbh & Co. Kg Kühlanordnung mit Kühlkörper und Leuchte für den Außenbereich
US9857397B2 (en) 2016-04-07 2018-01-02 Sensata Technologies, Inc. Modular packaging with elevating screw
JP6119913B2 (ja) * 2016-12-06 2017-04-26 三菱電機株式会社 照明システムおよび照明器具
CN112994413B (zh) * 2021-03-24 2022-12-30 深圳市英威腾电气股份有限公司 自然散热变频器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59158389U (ja) * 1983-04-08 1984-10-24 三菱電機株式会社 制御装置
JPS6042930A (ja) * 1983-08-19 1985-03-07 Mitsubishi Electric Corp ３相ソリツドステ−トリレ−
WO1986002496A1 (en) * 1984-10-16 1986-04-24 Amp Incorporated Electronic key assemblies
JPH077836B2 (ja) * 1986-10-31 1995-01-30 オムロン株式会社 固体継電器
DE8704499U1 (de) * 1987-03-26 1987-08-13 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Elektrische Baueinheit

Also Published As

Publication number Publication date
ATE120608T1 (de) 1995-04-15
EP0631463A2 (de) 1994-12-28
DE3853462D1 (de) 1995-05-04
DE3856132T2 (de) 1998-10-08
EP0631463A3 (de) 1995-04-05
EP0316917A3 (en) 1990-01-17
EP0631463B1 (de) 1998-02-04
EP0316917A2 (de) 1989-05-24
ATE163121T1 (de) 1998-02-15
DE3853462T2 (de) 1995-11-16
EP0316917B1 (de) 1995-03-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee