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DE3782201D1 - Halbleiterphotosensor und verfahren zu dessen herstellung. - Google Patents

Halbleiterphotosensor und verfahren zu dessen herstellung.

Info

Publication number
DE3782201D1
DE3782201D1 DE8787306304T DE3782201T DE3782201D1 DE 3782201 D1 DE3782201 D1 DE 3782201D1 DE 8787306304 T DE8787306304 T DE 8787306304T DE 3782201 T DE3782201 T DE 3782201T DE 3782201 D1 DE3782201 D1 DE 3782201D1
Authority
DE
Germany
Prior art keywords
production
semiconductor photosensor
photosensor
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787306304T
Other languages
English (en)
Other versions
DE3782201T2 (de
Inventor
Tetsuo Yoshizawa
Akio Mihara
Hiromichi Yamashita
Ichiro Ohnuki
Yasuo Suda
Keiji Ohtaka
Toshiaki Sato
Taichi Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61166895A external-priority patent/JPH0719893B2/ja
Priority claimed from JP61166896A external-priority patent/JPH07112050B2/ja
Priority claimed from JP62006899A external-priority patent/JP2765832B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE3782201D1 publication Critical patent/DE3782201D1/de
Publication of DE3782201T2 publication Critical patent/DE3782201T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
DE8787306304T 1986-07-16 1987-07-16 Halbleiterphotosensor und verfahren zu dessen herstellung. Expired - Fee Related DE3782201T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61166895A JPH0719893B2 (ja) 1986-07-16 1986-07-16 光半導体装置
JP61166896A JPH07112050B2 (ja) 1986-07-16 1986-07-16 光半導体装置
JP62006899A JP2765832B2 (ja) 1987-01-14 1987-01-14 光半導体装置の製造方法

Publications (2)

Publication Number Publication Date
DE3782201D1 true DE3782201D1 (de) 1992-11-19
DE3782201T2 DE3782201T2 (de) 1993-04-15

Family

ID=27277387

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787306304T Expired - Fee Related DE3782201T2 (de) 1986-07-16 1987-07-16 Halbleiterphotosensor und verfahren zu dessen herstellung.

Country Status (3)

Country Link
US (2) US5583076A (de)
EP (1) EP0253664B1 (de)
DE (1) DE3782201T2 (de)

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FR2683390A1 (fr) * 1991-10-30 1993-05-07 Sodern Detecteur d'images a lumiere parasite reduite et application a un senseur de terre.
JP3507251B2 (ja) 1995-09-01 2004-03-15 キヤノン株式会社 光センサｉｃパッケージおよびその組立方法
JPH09148620A (ja) * 1995-09-20 1997-06-06 Sharp Corp 光反射型検出器及びその製造方法
US6611610B1 (en) * 1997-04-02 2003-08-26 Gentex Corporation Vehicle lamp control
JP3173586B2 (ja) * 1998-03-26 2001-06-04 日本電気株式会社 全モールド型固体撮像装置およびその製造方法
AU2170000A (en) * 1998-12-22 2000-07-12 Intel Corporation Clearmold photosensor package having diffractive/refractive optical surfaces
EP1315858B1 (de) * 2000-08-22 2007-02-07 Exxonmobil Chemical Patents Inc. Polypropylenfasern und gewebe
JP2003198897A (ja) * 2001-12-27 2003-07-11 Seiko Epson Corp 光モジュール、回路基板及び電子機器
US6900508B2 (en) * 2002-04-16 2005-05-31 Stmicroelectronics, Inc. Embedded flat film molding
JP3934648B2 (ja) 2002-05-15 2007-06-20 松下電器産業株式会社 光検出器、光ヘッド装置、光情報処理装置および光情報処理方法
JP4145612B2 (ja) * 2002-08-30 2008-09-03 ユーディナデバイス株式会社 光学多層膜及びそれを有する光半導体装置
US20050009239A1 (en) * 2003-07-07 2005-01-13 Wolff Larry Lee Optoelectronic packaging with embedded window
JP2005055327A (ja) * 2003-08-05 2005-03-03 Sony Corp 指紋照合装置
WO2005031879A1 (de) * 2003-09-26 2005-04-07 Siemens Aktiengesellschaft Optisches modul und optisches system
US6943423B2 (en) * 2003-10-01 2005-09-13 Optopac, Inc. Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof
US6864116B1 (en) * 2003-10-01 2005-03-08 Optopac, Inc. Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof
US7122874B2 (en) * 2004-04-12 2006-10-17 Optopac, Inc. Electronic package having a sealing structure on predetermined area, and the method thereof
US6943424B1 (en) 2004-05-06 2005-09-13 Optopac, Inc. Electronic package having a patterned layer on backside of its substrate, and the fabrication thereof
JP2006101479A (ja) * 2004-09-02 2006-04-13 Canon Inc 固体撮像装置及びそれを用いたカメラ
US20060043513A1 (en) * 2004-09-02 2006-03-02 Deok-Hoon Kim Method of making camera module in wafer level
KR100498708B1 (ko) * 2004-11-08 2005-07-01 옵토팩 주식회사 반도체 소자용 전자패키지 및 그 패키징 방법
DE102006014247B4 (de) * 2006-03-28 2019-10-24 Robert Bosch Gmbh Bildaufnahmesystem und Verfahren zu dessen Herstellung
US8084563B2 (en) * 2006-07-07 2011-12-27 Jsr Corporation Cyclic olefin addition copolymer, process for production thereof, and retardation film obtained from the copolymer
JP5276371B2 (ja) * 2008-07-09 2013-08-28 キヤノン株式会社 撮像装置
US10283538B2 (en) 2016-02-17 2019-05-07 Canon Kabshiki Kaisha Imaging device and method of driving imaging device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3622419A (en) * 1969-10-08 1971-11-23 Motorola Inc Method of packaging an optoelectrical device
US4203792A (en) * 1977-11-17 1980-05-20 Bell Telephone Laboratories, Incorporated Method for the fabrication of devices including polymeric materials
JPS572773A (en) * 1980-06-06 1982-01-08 Nippon Telegr & Teleph Corp <Ntt> Recording system for gradation image
JPS58192366A (ja) * 1982-05-07 1983-11-09 Hitachi Ltd 受光素子内蔵集積回路装置
US4641418A (en) * 1982-08-30 1987-02-10 International Rectifier Corporation Molding process for semiconductor devices and lead frame structure therefor
US4504435A (en) * 1982-10-04 1985-03-12 Texas Instruments Incorporated Method for semiconductor device packaging
JPS5995504A (ja) * 1982-11-24 1984-06-01 Canon Inc 合焦位置検出装置
JPH065760B2 (ja) * 1983-02-14 1994-01-19 三洋電機株式会社 感 光 装 置
JPS59148872A (ja) * 1983-02-15 1984-08-25 Rion Co Ltd 熱式風速計
IT1212711B (it) * 1983-03-09 1989-11-30 Ates Componenti Elettron Dispositivo a semiconduttore aforma di scheda piana con contatti elettrici su ambedue le facce eprocedimento per la sua fabbricazione.
JPS6018941A (ja) * 1983-07-12 1985-01-31 Seiko Epson Corp 半導体装置
US4685987A (en) * 1983-09-02 1987-08-11 The Bergquist Company Method of preparing interfacings of heat sinks with electrical devices
US4644384A (en) * 1984-02-02 1987-02-17 National Semiconductor Corporation Apparatus and method for packaging eprom integrated circuits
JPS60257546A (ja) * 1984-06-04 1985-12-19 Mitsubishi Electric Corp 半導体装置及びその製造方法
DE3582031D1 (de) * 1984-12-17 1991-04-11 Sanyo Electric Co Photodetektor.
JPS62244139A (ja) * 1986-04-17 1987-10-24 Citizen Watch Co Ltd 樹脂封止型ピングリツドアレイ及びその製造方法
US4843036A (en) * 1987-06-29 1989-06-27 Eastman Kodak Company Method for encapsulating electronic devices

Also Published As

Publication number Publication date
DE3782201T2 (de) 1993-04-15
US5583076A (en) 1996-12-10
EP0253664A2 (de) 1988-01-20
US5912504A (en) 1999-06-15
EP0253664A3 (en) 1989-02-08
EP0253664B1 (de) 1992-10-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee