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DE3776962D1 - Lichtempfindliche harzzusammensetzung und ihre verwendung. - Google Patents

Lichtempfindliche harzzusammensetzung und ihre verwendung.

Info

Publication number
DE3776962D1
DE3776962D1 DE8787106152T DE3776962T DE3776962D1 DE 3776962 D1 DE3776962 D1 DE 3776962D1 DE 8787106152 T DE8787106152 T DE 8787106152T DE 3776962 T DE3776962 T DE 3776962T DE 3776962 D1 DE3776962 D1 DE 3776962D1
Authority
DE
Germany
Prior art keywords
resin composition
light sensitive
sensitive resin
light
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787106152T
Other languages
English (en)
Inventor
Kenji Tazawa
Akihiko Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Application granted granted Critical
Publication of DE3776962D1 publication Critical patent/DE3776962D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/026—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from the reaction products of polyepoxides and unsaturated monocarboxylic acids, their anhydrides, halogenides or esters with low molecular weight
    • C08F299/028—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from the reaction products of polyepoxides and unsaturated monocarboxylic acids, their anhydrides, halogenides or esters with low molecular weight photopolymerisable compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Emergency Medicine (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE8787106152T 1986-04-28 1987-04-28 Lichtempfindliche harzzusammensetzung und ihre verwendung. Expired - Fee Related DE3776962D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61096933A JPH0639518B2 (ja) 1986-04-28 1986-04-28 耐熱性感光性樹脂組成物

Publications (1)

Publication Number Publication Date
DE3776962D1 true DE3776962D1 (de) 1992-04-09

Family

ID=14178140

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787106152T Expired - Fee Related DE3776962D1 (de) 1986-04-28 1987-04-28 Lichtempfindliche harzzusammensetzung und ihre verwendung.

Country Status (4)

Country Link
US (1) US4786579A (de)
EP (1) EP0246467B1 (de)
JP (1) JPH0639518B2 (de)
DE (1) DE3776962D1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07103217B2 (ja) * 1986-05-14 1995-11-08 株式会社日立製作所 樹脂組成物
JPS63258975A (ja) * 1986-12-26 1988-10-26 Toshiba Corp ソルダーレジストインキ組成物
JPS6462375A (en) * 1987-09-02 1989-03-08 Arakawa Chem Ind Liquid photosolder resist ink composition of alkali development type
US5364736A (en) * 1987-12-07 1994-11-15 Morton International, Inc. Photoimageable compositions
GB2213487B (en) * 1987-12-08 1992-01-08 Kansai Paint Co Ltd Method of forming a cured coating film
JP2691348B2 (ja) * 1988-04-03 1997-12-17 日本合成化学工業株式会社 感光性樹脂の製造法および感光性樹脂組成物
JP2691347B2 (ja) * 1988-04-03 1997-12-17 日本合成化学工業株式会社 感光性樹脂の製造方法および感光性樹脂組成物
US5178988A (en) * 1988-09-13 1993-01-12 Amp-Akzo Corporation Photoimageable permanent resist
US5070002A (en) * 1988-09-13 1991-12-03 Amp-Akzo Corporation Photoimageable permanent resist
JPH0436308A (ja) * 1990-05-31 1992-02-06 Somar Corp 紫外線硬化性樹脂組成物
US5229252A (en) * 1989-06-09 1993-07-20 Morton International, Inc. Photoimageable compositions
WO1993011465A1 (en) * 1991-12-06 1993-06-10 Akzo Nobel N.V. Photopolymerizable composition containing interlinked allylic and epoxy polymer networks
JPH05194618A (ja) * 1992-01-23 1993-08-03 Ajinomoto Co Inc 密着性に優れた紫外線硬化型樹脂組成物
KR0126118B1 (ko) * 1992-09-10 1997-12-18 다나카 쇼소 솔더레지스트용 잉크조성물
US5596024A (en) * 1993-06-22 1997-01-21 Three Bond Co., Ltd. Sealing composition for liquid crystal
US5726257A (en) * 1994-08-30 1998-03-10 Sumitomo Chemical Company, Ltd. Esterified resorcinol-carbonyl compound condensates and epoxy resins therewith
JP2002064276A (ja) * 2000-08-22 2002-02-28 Nippon Steel Chem Co Ltd 光又は熱硬化性樹脂組成物及び多層プリント配線基板
CN105807479B (zh) * 2016-05-24 2021-02-19 京东方科技集团股份有限公司 一种显示面板、其制作方法及显示装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5625441B2 (de) * 1972-09-04 1981-06-12
US4025348A (en) * 1974-05-10 1977-05-24 Hitachi Chemical Company, Ltd. Photosensitive resin compositions
US4390615A (en) * 1979-11-05 1983-06-28 Courtney Robert W Coating compositions
CA1197042A (en) * 1980-02-04 1985-11-19 Thomas P. O'hearn Molding compositions
JPS57162713A (en) * 1981-03-31 1982-10-06 Matsushita Electric Works Ltd Epoxy acrylate resin composition
JPS5944321B2 (ja) * 1981-12-25 1984-10-29 横浜ゴム株式会社 繊維強化プラスチツク用樹脂組成物
JPS58199341A (ja) * 1982-05-17 1983-11-19 Tokyo Ohka Kogyo Co Ltd 耐熱性感光性樹脂組成物
US4479983A (en) * 1983-01-07 1984-10-30 International Business Machines Corporation Method and composition for applying coatings on printed circuit boards
DE3479897D1 (en) * 1983-05-30 1989-11-02 Mitsubishi Rayon Co Resin composition
JPS60118710A (ja) * 1983-11-29 1985-06-26 Osaka Soda Co Ltd 風乾性を有するアリル系エポキシポリアクリレ−ト樹脂組成物
JPS60208377A (ja) * 1984-04-02 1985-10-19 Asahi Kagaku Kenkyusho:Kk ソルダ−レジストインキ用樹脂組成物
JPS6159447A (ja) * 1984-08-31 1986-03-26 Sony Corp 感光性樹脂組成物
DE3588111T2 (de) * 1985-06-29 1996-10-31 Asahi Chem Res Lab Kunststoffzusammensetzung für Lötschutztinte

Also Published As

Publication number Publication date
JPS62253613A (ja) 1987-11-05
EP0246467A2 (de) 1987-11-25
US4786579A (en) 1988-11-22
JPH0639518B2 (ja) 1994-05-25
EP0246467B1 (de) 1992-03-04
EP0246467A3 (en) 1988-04-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee