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DE3771405D1 - Vollstaendiges waermerohr-modul. - Google Patents

Vollstaendiges waermerohr-modul.

Info

Publication number
DE3771405D1
DE3771405D1 DE8787401180T DE3771405T DE3771405D1 DE 3771405 D1 DE3771405 D1 DE 3771405D1 DE 8787401180 T DE8787401180 T DE 8787401180T DE 3771405 T DE3771405 T DE 3771405T DE 3771405 D1 DE3771405 D1 DE 3771405D1
Authority
DE
Germany
Prior art keywords
heat pipe
pipe module
complete heat
complete
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787401180T
Other languages
English (en)
Inventor
Elric Saaski
Robert J Hannemann
Leslie R Fox
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Digital Equipment Corp
Original Assignee
Digital Equipment Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Digital Equipment Corp filed Critical Digital Equipment Corp
Application granted granted Critical
Publication of DE3771405D1 publication Critical patent/DE3771405D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE8787401180T 1986-05-30 1987-05-26 Vollstaendiges waermerohr-modul. Expired - Fee Related DE3771405D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86950586A 1986-05-30 1986-05-30

Publications (1)

Publication Number Publication Date
DE3771405D1 true DE3771405D1 (de) 1991-08-22

Family

ID=25353667

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787401180T Expired - Fee Related DE3771405D1 (de) 1986-05-30 1987-05-26 Vollstaendiges waermerohr-modul.

Country Status (5)

Country Link
EP (1) EP0251836B1 (de)
JP (1) JPH0727999B2 (de)
CN (1) CN1006834B (de)
CA (1) CA1289130C (de)
DE (1) DE3771405D1 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4995451A (en) * 1989-12-29 1991-02-26 Digital Equipment Corporation Evaporator having etched fiber nucleation sites and method of fabricating same
DE4019091A1 (de) * 1990-06-15 1991-12-19 Battelle Institut E V Waermeableitungseinrichtung fuer halbleiterbauelemente und verfahren zu deren herstellung
US5453641A (en) * 1992-12-16 1995-09-26 Sdl, Inc. Waste heat removal system
DE19626227C2 (de) * 1996-06-29 1998-07-02 Bosch Gmbh Robert Anordnung zur Wärmeableitung bei Chipmodulen auf Mehrschicht-Keramikträgern, insbesondere für Multichipmodule, und Verfahren zu ihrer Herstellung
US5864176A (en) * 1997-04-04 1999-01-26 Unisys Corporation Electro-mechnical subassembly having a greatly reduced thermal resistance between two mating faces by including a film of liquid, that evaporates without leaving any residue, between the faces
US6133631A (en) * 1997-05-30 2000-10-17 Hewlett-Packard Company Semiconductor package lid with internal heat pipe
US6062302A (en) * 1997-09-30 2000-05-16 Lucent Technologies Inc. Composite heat sink
FR2783312A1 (fr) * 1998-09-15 2000-03-17 Matra Marconi Space France Boucle fluide a pompage capillaire
JP2003110076A (ja) * 2001-10-01 2003-04-11 Fujitsu Ltd 熱拡散器および放熱器
KR100460180B1 (ko) * 2002-04-08 2004-12-08 (주)울텍 다공질 실리콘을 이용한 전자 소자 냉각용 히트 파이프
US20040011509A1 (en) 2002-05-15 2004-01-22 Wing Ming Siu Vapor augmented heatsink with multi-wick structure
US6937471B1 (en) * 2002-07-11 2005-08-30 Raytheon Company Method and apparatus for removing heat from a circuit
US7000691B1 (en) 2002-07-11 2006-02-21 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
US6957550B2 (en) 2003-05-19 2005-10-25 Raytheon Company Method and apparatus for extracting non-condensable gases in a cooling system
CN100356555C (zh) * 2004-03-29 2007-12-19 台达电子工业股份有限公司 散热器
US8341965B2 (en) 2004-06-24 2013-01-01 Raytheon Company Method and system for cooling
US7254957B2 (en) 2005-02-15 2007-08-14 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
US20070119572A1 (en) 2005-11-30 2007-05-31 Raytheon Company System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements
US7908874B2 (en) 2006-05-02 2011-03-22 Raytheon Company Method and apparatus for cooling electronics with a coolant at a subambient pressure
US8651172B2 (en) 2007-03-22 2014-02-18 Raytheon Company System and method for separating components of a fluid coolant for cooling a structure
US7921655B2 (en) 2007-09-21 2011-04-12 Raytheon Company Topping cycle for a sub-ambient cooling system
US7934386B2 (en) 2008-02-25 2011-05-03 Raytheon Company System and method for cooling a heat generating structure
US7907409B2 (en) 2008-03-25 2011-03-15 Raytheon Company Systems and methods for cooling a computing component in a computing rack
WO2009137472A1 (en) * 2008-05-05 2009-11-12 Cornell University High performance wick
KR101070842B1 (ko) * 2009-06-11 2011-10-06 주식회사 자온지 방열장치 및 이를 구비한 전자장치
CN104867890A (zh) * 2015-05-07 2015-08-26 上海交通大学 一种用于3d芯片的相变冷却结构
CN105914191B (zh) * 2016-06-20 2018-03-16 深圳市宏钢机械设备有限公司 一种水冷散热的集成电路封装
JP6848417B2 (ja) * 2016-12-19 2021-03-24 日本電気株式会社 冷却装置
JP6920115B2 (ja) * 2017-07-04 2021-08-18 新光電気工業株式会社 ヒートパイプ及びヒートパイプの製造方法
CN108278581B (zh) * 2018-01-28 2019-11-29 陈攀攀 一种led阵列模块的冷却结构

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1435110A (en) * 1973-08-31 1976-05-12 Atomic Energy Authority Uk Microcircuit packages
JPS6116699Y2 (de) * 1980-11-25 1986-05-22
JPS59232448A (ja) * 1983-06-16 1984-12-27 Fujitsu Ltd 液冷容器

Also Published As

Publication number Publication date
JPH0727999B2 (ja) 1995-03-29
EP0251836B1 (de) 1991-07-17
CN1006834B (zh) 1990-02-14
CN87104536A (zh) 1988-05-11
EP0251836A1 (de) 1988-01-07
JPS6354758A (ja) 1988-03-09
CA1289130C (en) 1991-09-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee