DE3688034D1 - Vor elektrostatischen entladungen geschuetzte eingangsschaltung. - Google Patents
Vor elektrostatischen entladungen geschuetzte eingangsschaltung.Info
- Publication number
- DE3688034D1 DE3688034D1 DE8686902663T DE3688034T DE3688034D1 DE 3688034 D1 DE3688034 D1 DE 3688034D1 DE 8686902663 T DE8686902663 T DE 8686902663T DE 3688034 T DE3688034 T DE 3688034T DE 3688034 D1 DE3688034 D1 DE 3688034D1
- Authority
- DE
- Germany
- Prior art keywords
- input circuit
- electrostatic discharge
- circuit protected
- protected
- electrostatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32055—Deposition of semiconductive layers, e.g. poly - or amorphous silicon layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US72086285A | 1985-04-08 | 1985-04-08 | |
PCT/US1986/000697 WO1986006213A1 (en) | 1985-04-08 | 1986-04-07 | Electrostatic discharge input protection network |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3688034D1 true DE3688034D1 (de) | 1993-04-22 |
DE3688034T2 DE3688034T2 (de) | 1993-06-24 |
Family
ID=24895559
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686902663T Expired - Fee Related DE3688034T2 (de) | 1985-04-08 | 1986-04-07 | Vor elektrostatischen entladungen geschuetzte eingangsschaltung. |
DE198686902663T Pending DE218685T1 (de) | 1985-04-08 | 1986-04-07 | Vor elektrostatischen entladungen geschuetzte eingangsschaltung. |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE198686902663T Pending DE218685T1 (de) | 1985-04-08 | 1986-04-07 | Vor elektrostatischen entladungen geschuetzte eingangsschaltung. |
Country Status (7)
Country | Link |
---|---|
US (1) | US4724471A (de) |
EP (1) | EP0218685B1 (de) |
JP (1) | JPH0732237B2 (de) |
KR (1) | KR910009931B1 (de) |
BR (1) | BR8606541A (de) |
DE (2) | DE3688034T2 (de) |
WO (1) | WO1986006213A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3714647C2 (de) * | 1987-05-02 | 1993-10-07 | Telefunken Microelectron | Integrierte Schaltungsanordnung |
US4750081A (en) * | 1987-10-19 | 1988-06-07 | Unisys Corporation | Phantom ESD protection circuit employing E-field crowding |
US4882610A (en) * | 1987-10-29 | 1989-11-21 | Deutsche Itt Industries Gmbh | Protective arrangement for MOS circuits |
DE3882892D1 (de) * | 1987-10-29 | 1993-09-09 | Itt Ind Gmbh Deutsche | Schutzanordnung fuer mos-schaltungen. |
EP0397780A4 (en) * | 1988-02-02 | 1991-09-18 | Analog Devices, Incorporated | Ic with means for reducing esd damage |
US5196913A (en) * | 1988-07-11 | 1993-03-23 | Samsung Electronics Co., Ltd. | Input protection device for improving of delay time on input stage in semi-conductor devices |
US4959708A (en) * | 1988-08-26 | 1990-09-25 | Delco Electronics Corporation | MOS integrated circuit with vertical shield |
US5210596A (en) * | 1989-06-30 | 1993-05-11 | Texas Instruments Incorporated | Thermally optimized interdigitated transistor |
US5477078A (en) * | 1994-02-18 | 1995-12-19 | Analog Devices, Incorporated | Integrated circuit (IC) with a two-terminal diode device to protect metal-oxide-metal capacitors from ESD damage |
KR100206870B1 (ko) * | 1995-11-28 | 1999-07-01 | 구본준 | 정전 방전 및 래치 업 방지회로 |
US5773346A (en) * | 1995-12-06 | 1998-06-30 | Micron Technology, Inc. | Semiconductor processing method of forming a buried contact |
US5705841A (en) * | 1995-12-22 | 1998-01-06 | Winbond Electronics Corporation | Electrostatic discharge protection device for integrated circuits and its method for fabrication |
US6777784B1 (en) * | 2000-10-17 | 2004-08-17 | National Semiconductor Corporation | Bipolar transistor-based electrostatic discharge (ESD) protection structure with a heat sink |
US6976238B1 (en) * | 2001-06-03 | 2005-12-13 | Cadence Design Systems, Inc. | Circular vias and interconnect-line ends |
US6801416B2 (en) * | 2001-08-23 | 2004-10-05 | Institute Of Microelectronics | ESD protection system for high frequency applications |
JP3753692B2 (ja) * | 2002-12-20 | 2006-03-08 | ローム株式会社 | オープンドレイン用mosfet及びこれを用いた半導体集積回路装置 |
US6927458B2 (en) * | 2003-08-08 | 2005-08-09 | Conexant Systems, Inc. | Ballasting MOSFETs using staggered and segmented diffusion regions |
KR20100135521A (ko) * | 2009-06-17 | 2010-12-27 | 주식회사 하이닉스반도체 | 반도체 소자 및 그 제조 방법 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3335340A (en) * | 1964-02-24 | 1967-08-08 | Ibm | Combined transistor and testing structures and fabrication thereof |
US3609470A (en) * | 1968-02-19 | 1971-09-28 | Ibm | Semiconductor devices with lines and electrodes which contain 2 to 3 percent silicon with the remainder aluminum |
US3740835A (en) * | 1970-08-31 | 1973-06-26 | Fairchild Camera Instr Co | Method of forming semiconductor device contacts |
US3777216A (en) * | 1972-10-02 | 1973-12-04 | Motorola Inc | Avalanche injection input protection circuit |
US4291322A (en) * | 1979-07-30 | 1981-09-22 | Bell Telephone Laboratories, Incorporated | Structure for shallow junction MOS circuits |
US4342045A (en) * | 1980-04-28 | 1982-07-27 | Advanced Micro Devices, Inc. | Input protection device for integrated circuits |
JPS57211272A (en) * | 1981-06-23 | 1982-12-25 | Toshiba Corp | Semiconductor device |
JPS583285A (ja) * | 1981-06-30 | 1983-01-10 | Fujitsu Ltd | 半導体集積回路の保護装置 |
JPS5994865A (ja) * | 1982-11-24 | 1984-05-31 | Toshiba Corp | 半導体装置 |
JPH0618251B2 (ja) * | 1983-02-23 | 1994-03-09 | 株式会社東芝 | 半導体装置 |
-
1986
- 1986-04-07 BR BR8606541A patent/BR8606541A/pt unknown
- 1986-04-07 DE DE8686902663T patent/DE3688034T2/de not_active Expired - Fee Related
- 1986-04-07 KR KR1019860700875A patent/KR910009931B1/ko not_active IP Right Cessation
- 1986-04-07 EP EP86902663A patent/EP0218685B1/de not_active Expired - Lifetime
- 1986-04-07 DE DE198686902663T patent/DE218685T1/de active Pending
- 1986-04-07 JP JP61502032A patent/JPH0732237B2/ja not_active Expired - Lifetime
- 1986-04-07 WO PCT/US1986/000697 patent/WO1986006213A1/en active IP Right Grant
- 1986-12-29 US US06/948,472 patent/US4724471A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR910009931B1 (ko) | 1991-12-05 |
JPH0732237B2 (ja) | 1995-04-10 |
WO1986006213A1 (en) | 1986-10-23 |
KR880700465A (ko) | 1988-03-15 |
BR8606541A (pt) | 1987-08-04 |
DE3688034T2 (de) | 1993-06-24 |
EP0218685B1 (de) | 1993-03-17 |
US4724471A (en) | 1988-02-09 |
JPS62502504A (ja) | 1987-09-24 |
EP0218685A4 (de) | 1988-12-22 |
DE218685T1 (de) | 1988-05-19 |
EP0218685A1 (de) | 1987-04-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |