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DE3688034D1 - Vor elektrostatischen entladungen geschuetzte eingangsschaltung. - Google Patents

Vor elektrostatischen entladungen geschuetzte eingangsschaltung.

Info

Publication number
DE3688034D1
DE3688034D1 DE8686902663T DE3688034T DE3688034D1 DE 3688034 D1 DE3688034 D1 DE 3688034D1 DE 8686902663 T DE8686902663 T DE 8686902663T DE 3688034 T DE3688034 T DE 3688034T DE 3688034 D1 DE3688034 D1 DE 3688034D1
Authority
DE
Germany
Prior art keywords
input circuit
electrostatic discharge
circuit protected
protected
electrostatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686902663T
Other languages
English (en)
Other versions
DE3688034T2 (de
Inventor
Horst Leuschner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics lnc USA
Original Assignee
SGS Thomson Microelectronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics Inc filed Critical SGS Thomson Microelectronics Inc
Application granted granted Critical
Publication of DE3688034D1 publication Critical patent/DE3688034D1/de
Publication of DE3688034T2 publication Critical patent/DE3688034T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/32055Deposition of semiconductive layers, e.g. poly - or amorphous silicon layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60Protection against electrostatic charges or discharges, e.g. Faraday shields

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE8686902663T 1985-04-08 1986-04-07 Vor elektrostatischen entladungen geschuetzte eingangsschaltung. Expired - Fee Related DE3688034T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US72086285A 1985-04-08 1985-04-08
PCT/US1986/000697 WO1986006213A1 (en) 1985-04-08 1986-04-07 Electrostatic discharge input protection network

Publications (2)

Publication Number Publication Date
DE3688034D1 true DE3688034D1 (de) 1993-04-22
DE3688034T2 DE3688034T2 (de) 1993-06-24

Family

ID=24895559

Family Applications (2)

Application Number Title Priority Date Filing Date
DE8686902663T Expired - Fee Related DE3688034T2 (de) 1985-04-08 1986-04-07 Vor elektrostatischen entladungen geschuetzte eingangsschaltung.
DE198686902663T Pending DE218685T1 (de) 1985-04-08 1986-04-07 Vor elektrostatischen entladungen geschuetzte eingangsschaltung.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE198686902663T Pending DE218685T1 (de) 1985-04-08 1986-04-07 Vor elektrostatischen entladungen geschuetzte eingangsschaltung.

Country Status (7)

Country Link
US (1) US4724471A (de)
EP (1) EP0218685B1 (de)
JP (1) JPH0732237B2 (de)
KR (1) KR910009931B1 (de)
BR (1) BR8606541A (de)
DE (2) DE3688034T2 (de)
WO (1) WO1986006213A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3714647C2 (de) * 1987-05-02 1993-10-07 Telefunken Microelectron Integrierte Schaltungsanordnung
US4750081A (en) * 1987-10-19 1988-06-07 Unisys Corporation Phantom ESD protection circuit employing E-field crowding
US4882610A (en) * 1987-10-29 1989-11-21 Deutsche Itt Industries Gmbh Protective arrangement for MOS circuits
DE3882892D1 (de) * 1987-10-29 1993-09-09 Itt Ind Gmbh Deutsche Schutzanordnung fuer mos-schaltungen.
EP0397780A4 (en) * 1988-02-02 1991-09-18 Analog Devices, Incorporated Ic with means for reducing esd damage
US5196913A (en) * 1988-07-11 1993-03-23 Samsung Electronics Co., Ltd. Input protection device for improving of delay time on input stage in semi-conductor devices
US4959708A (en) * 1988-08-26 1990-09-25 Delco Electronics Corporation MOS integrated circuit with vertical shield
US5210596A (en) * 1989-06-30 1993-05-11 Texas Instruments Incorporated Thermally optimized interdigitated transistor
US5477078A (en) * 1994-02-18 1995-12-19 Analog Devices, Incorporated Integrated circuit (IC) with a two-terminal diode device to protect metal-oxide-metal capacitors from ESD damage
KR100206870B1 (ko) * 1995-11-28 1999-07-01 구본준 정전 방전 및 래치 업 방지회로
US5773346A (en) * 1995-12-06 1998-06-30 Micron Technology, Inc. Semiconductor processing method of forming a buried contact
US5705841A (en) * 1995-12-22 1998-01-06 Winbond Electronics Corporation Electrostatic discharge protection device for integrated circuits and its method for fabrication
US6777784B1 (en) * 2000-10-17 2004-08-17 National Semiconductor Corporation Bipolar transistor-based electrostatic discharge (ESD) protection structure with a heat sink
US6976238B1 (en) * 2001-06-03 2005-12-13 Cadence Design Systems, Inc. Circular vias and interconnect-line ends
US6801416B2 (en) * 2001-08-23 2004-10-05 Institute Of Microelectronics ESD protection system for high frequency applications
JP3753692B2 (ja) * 2002-12-20 2006-03-08 ローム株式会社 オープンドレイン用mosfet及びこれを用いた半導体集積回路装置
US6927458B2 (en) * 2003-08-08 2005-08-09 Conexant Systems, Inc. Ballasting MOSFETs using staggered and segmented diffusion regions
KR20100135521A (ko) * 2009-06-17 2010-12-27 주식회사 하이닉스반도체 반도체 소자 및 그 제조 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3335340A (en) * 1964-02-24 1967-08-08 Ibm Combined transistor and testing structures and fabrication thereof
US3609470A (en) * 1968-02-19 1971-09-28 Ibm Semiconductor devices with lines and electrodes which contain 2 to 3 percent silicon with the remainder aluminum
US3740835A (en) * 1970-08-31 1973-06-26 Fairchild Camera Instr Co Method of forming semiconductor device contacts
US3777216A (en) * 1972-10-02 1973-12-04 Motorola Inc Avalanche injection input protection circuit
US4291322A (en) * 1979-07-30 1981-09-22 Bell Telephone Laboratories, Incorporated Structure for shallow junction MOS circuits
US4342045A (en) * 1980-04-28 1982-07-27 Advanced Micro Devices, Inc. Input protection device for integrated circuits
JPS57211272A (en) * 1981-06-23 1982-12-25 Toshiba Corp Semiconductor device
JPS583285A (ja) * 1981-06-30 1983-01-10 Fujitsu Ltd 半導体集積回路の保護装置
JPS5994865A (ja) * 1982-11-24 1984-05-31 Toshiba Corp 半導体装置
JPH0618251B2 (ja) * 1983-02-23 1994-03-09 株式会社東芝 半導体装置

Also Published As

Publication number Publication date
KR910009931B1 (ko) 1991-12-05
JPH0732237B2 (ja) 1995-04-10
WO1986006213A1 (en) 1986-10-23
KR880700465A (ko) 1988-03-15
BR8606541A (pt) 1987-08-04
DE3688034T2 (de) 1993-06-24
EP0218685B1 (de) 1993-03-17
US4724471A (en) 1988-02-09
JPS62502504A (ja) 1987-09-24
EP0218685A4 (de) 1988-12-22
DE218685T1 (de) 1988-05-19
EP0218685A1 (de) 1987-04-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee