DE3433854A1 - Electrical-engineering layered component - Google Patents

Abstract

An insulated metal substrate with an organic layered electric circuit made of conductive foil material can be used for a large variety of cost-effective applications for power distribution boards. The layered component comprises an aluminium substrate on which a three-layered insulating material for connecting the electric circuit made of conductive foil with the metal substrate underneath it is arranged. The multi-layered insulating material comprises two layers of a thermosetting pressure-sensitive adhesive film, between which a very puncture-resistant insulating layer is disposed which is formed either by a polyimide film or a polyetherimide film. The multi-layered insulating material is first, while supplying heat, made to adhere to the metal substrate, and the conductive foil material, in the form of a continuous web or a punched circuit, is applied to the multi-layered insulating material in a coating press prior to arranging the module. The metal foil material is coated onto the metal substrate underneath it, the edges of the foil material remaining electrically insulated with respect to the metal substrate, and a continuous path of conductive metal foil material is etched so as to form the electric circuit from the conductive foil. Prior to application to the metal substrate, holes may be punched into the multi-layered insulating material, so that the conductive foil covering the holes is ... with the ... Original abstract incomplete.

Description

Electrotechnical layer component

The invention relates to an electrotechnical layer component for electrical insulation and retention of an electrically conductive metal layer on the surface of a metal substrate.

Such an electrical layer component can be used for the distribution of electrical Find energy in power supplies for electrical devices.

There is a need for easily manufactured, inexpensive power distribution panels, that can be used with electrical equipment. Known components instructed Metal substrate with an organic coating on it, with a conductive paste was applied to the organic coating by screen printing. These well-known However, components did not make it possible to use an electrical distribution board to create that has high efficiency, is fire retardant, no limitation regarding the substrate thickness or the type of metal used as the substrate has, can use different conductor metals, the possibility of several conductive ones Layers results in a construction with irregular surfaces electromagnetic and radio frequency shielding results in a construction which is bendable after initial manufacture.

US Pat. No. 3,940,534 discloses an electrically conductive metal layer known, which is coated on a substrate made of glass fabric, which is between two outer substrate layers made of polyester material is arranged. The usage a metal foil to form thin-film resistors attached to an insulating Glass or ceramic substrate is known from US Pat. No. 4,306,217.

The invention is based on the task of creating an electrical layer component of the type mentioned to create in the. one made of metal foil conductive circuit connected to an insulated metal substrate and opposite this is isolated. Furthermore, a method for producing such an electrotechnical Layered component are created.

This task is carried out by the characterizing part of the patent claim 1 or 6 specified features solved.

Advantageous configurations and developments of the development result from the subclaims.

According to the invention, a layer component with an insulated metal substrate is provided created that is an organic layered electrical circuit made of conductive Has foil material that mechanically with the underlying metal substrate connected and isolated from it. The construction has according to a Design an aluminum-metal substrate on which a three-length insulating material arranged for fastening the electrical circuit made of conductive foil material is.

The multilayer insulating material comprises two layers of a thermosetting one Acrylic dry adhesive, between which there is a very paint-resistant or puncture-resistant An insulating layer is laminated, which is either a polyimide film or a Polyetherimide film is made. The multilayer insulation material is first under Wärtnezueuhr adhered to the metal substrate, whereupon the metal foil on the multilayer Insulating material is applied before this sub-assembly is put into a coating press is introduced. The conductive foil can be die cut to form an electrical circuit to form before application to the multilayer insulating material, or the metal foil can be etched after coating to form this electrical circuit. The metal foil is layered on the underlying metal substrate in such a way that that this foil material remains isolated from the underlying metal substrate. When a continuous sheet of conductive metal foil is coated onto the substrate the foil material is etched to form an electrical circuit from this to work out conductive foil. Before applying the multilayer insulating material Openings or holes can be punched into the insulating material on the substrate so that the conductive film layered on it, bridging the holes, can be connected to the underlying metal substrate by spot welding.

After coating and etching, insulating protective coatings can be used can be applied to the front and back of the construction.

The electrotechnical layer component according to the invention enables Creation of a benefit distribution plate with high performance and fire retardant properties. This power distribution plate can be in a variety be built up by forms. Various types of conductor metals can be used for the metal foil and any metal can be used for the substrate. If a metal substrate is used, this can be done after or during manufacture be bent, and planar, curved, or irregular surfaces can be provided will. There is no restriction on the strength of the substrate and the strength of the substrate resulting configuration gives electromagnetic and radio frequency shielding properties, except for the case where aluminum substrates are used.

In addition to the advantages mentioned above, the organic layered electrical distribution structure can be formed very easily in such a way that multiple layers of the conductive sheet material are formed, wherein it is possible to create substrates with conductive layers on both sides, and wherein said conductive layers are interconnected via openings in the substrate can be.

The invention is illustrated below with reference to in the drawing Embodiments explained in more detail.

The drawing shows: FIG. 1 a flowchart showing the individual Shows manufacturing step e of the electrotechnical layer component, Fig. 2 shows an exploded view of an embodiment of the layer component, wherein the metal substrate, a three-layer insulating material and a conductive C. # s foil material are shown prior to the formation of the laminate, Fig. 3 is a view of the subassembly post-coating construction (with the conductive sheet material prior to Formation of the laminated body was punched), with connecting strips serving for electroplating were attached by spot welding, Fig. 4 the subassembly after application a protective coating prior to the electroplating step, Fig. 5 the organic layered one electrical distributor construction after electroplating and removal of the Connection strips, with insulating cover layers on the front and back sides of the metal substrate were applied.

As from the flowchart shown in Fig. 1 and the exploded View according to Fig. 1 can be seen, the embodiment of the organic layered electrical distribution structure generally designated by the reference number 11, which designates the electrical layer component. The laminate member 11 includes Metal substrate 12, which can be any metal suitable for use when building a Power distribution plate is desired. An example consists of an aluminum substrate with a thickness of 1.27 mm, with a variety of holes 15 is formed in the substrate for reasons which will be explained in more detail will. It will be understood that any metal substrate for the one described herein Layered component can be used and that cleaning and preparation process should be used in the manufacturing process that is specific to the particular metal substrate are suitable.

The metal substrate 12 can be formed by an aluminum substrate, which is initially cleaned in a degreasing step to remove excess fat and removing oil from the surface of the substrate (step 1 of Figure 1). Any Chemical such as acetone or any other well-known degreaser, can be used. In step 1, the aluminum substrate 12 is left for several minutes dipped in a heated alkaline cleaning solution or it can be used for several Minutes to be immersed in a cleaning acid solution at a higher temperature was brought. The purpose of immersing the substrate 12 in the solution is therein, any remaining contaminants from the surface of the substrate 12 to remove. An alkaline detergent such as the agent "Allied-Kelite Chemidize 740" or an acid cleaner such as "Allied-Kelite Isoprep 161 does can be used, as well as other well-known ones acidic and alkaline cleaning agents. After being immersed in the cleaning solution the substrate 12 is rinsed with water. Next is the aluminum substrate 12th immersed in a sodium dichromate-sulfuric acid solution for 10 to 15 minutes and then dried in an oven at 60 OC. The sodium dichromate etchant yields a controlled and porous layer of aluminum oxide on the surface of the aluminum substrate 12, resulting in improved adhesive and cohesive properties for it organic electrolyte coating material to be applied to 7 #. Eventually becomes a Silane solution applied to the surface of the substrate and dried in air. The silane contributes to a further increase in the adhesive strength of the organic Material to be connected to the aluminum substrate 12. A silane coupling agent such as 1, Union Carbide A-1100 (gamma-aminopropyltriethroxysilane) "can can be used in this final substrate cleaning process after step 1.

The conductive foil material 14 (see Fig. 2) can be any foil material that can conduct a current in a high power application or that can can conduct electrical current for the specific desired application. With this one Embodiment described is an aluminum foil with a film material Thickness of 0.15 mm used, which was cleaned before use when assembling should be. The conductive foil 14, in this embodiment an aluminum foil, is obtained in step A of Figure 1 by using two of the methods of purification the aluminum substrate cleaned, d.

H. the foil is cleaned with acetone for degreasing and then either immersed in an alkaline cleaning solution or in an acidic cleaning solution, as described above, followed by a water rinse follows.

The multilayer insulating material 20 according to FIG. 2 consists of an acrylic dry adhesive film, which only flows under heat and pressure, as well as from a layer of material that is very puncture and puncture resistant and there is an insulating layer between the overlying conductive sheet material 14 and the underlying metal substrate 12 forms. A multilayer suitable for the embodiment described here The insulation material is a three-layer, coated construction, the two layers of an acrylic thermosetting adhesive, between which a layer of a Polyimide film or a polyetherimide film is laminated. The thermosetting Acrylic adhesive in the form of a dry adhesive film is indicated in FIG. 2 by the reference number 21 designated. There is a common acrylic dry adhesive film as the inner layer 22 is a polyimide film made by E. 1. duPont de Nemours Corporation, Wilmington, Delaware, or it is sold under the trademark "Ilapton" For example, a polyetherimide film available from General Electric Corporation under the trademark "Ultem". Both materials for the intermediate layer 22 result in a very puncture-resistant layer which is used for insulation the metal foil 14 is suitable for the metal substrate 12. The three-layer Insulating material 2Q is available from Sheldahl Company of Northfield, Minnesota at under the designation Sheldahl MEC-111 "and includes either or both Sides of "Eapton" film coated with an adhesive. With this MKO-111 material are typically 0.025mm acrylic material on both sides of one Polyimide film piled up with a thickness of 0.025 mm. The MKCF material was already available as a Cover layer is used on polyimide circuits and was also used as a bonding layer or used as core material for multilayer circuits. This material has however, to be particularly useful in a layered component of the type described here Art highlighted in which an insulated metal substrate has an overlying metal foil circuit carries to form a supply distribution plate. The three-layer insulation material 20 is particularly advantageous because the acrylic dry-glue film makes it easy to the circuit with the supply of heat to the underlying metal substrate under only local application of heat, while still maintaining a high adhesive capacity (6 to 8 lb / inch), gives good chemical / solvent resistance, and only a minimal amount of resin being squeezed out during coating will. Because of its puncture resistance, the inner layer 22 prevents the either a polyimide or a polyetherimide that the overlying Circuit pushing through the acrylic adhesive.

According to step 2 of FIG. 1, the insulating layer 20 is exposed to heat adhered to the metal substrate 12. Before sticking by applying heat Ground holes 23 are formed in the insulating layer 20 so that the overlying Metal foil 14 after coating by spot welding with the underlying Metal substrate can be connected to form a ground connection 17, or with a metal foil strip on the other side of the substrate 12 are connected can he is accessible with the aid of an opening 15. The insulating material 20 and the metal substrate 12 are then placed in a coating press, which was heated to 54 to 65 0C and with a pressure of about 6.9 bar is working. It is necessary to attach the insulating material before the coating process, about the inclusion of air bubbles between the adhesive 21 and the substrate 12 to prevent.

As indicated by step 3 of FIG. 1, the Metal foil 14 is next applied to the surface of the material 20, the adhered to the underlying aluminum substrate 12 with the addition of heat became. The metal foil can be with the help of a tape or with the help of other devices held in place by the metal foil temporarily during the coating process adhere, and this metal foil can be applied to the material 20 either in the form of a continuous sheet of metal foil or as a punched circuit pattern (option 1 according to Fig. 1) are applied. When the circuit pattern by punching the foil 14 is fabricated prior to application to the insulating material 20, the metal foil circuit pattern applied to the insulating material 20 prior to the coating step 4. But when a continuous metal foil web is applied to the insulating material 20 in step 3 option II of FIG. 1 is carried out, in which the metal foil is etched to produce the electrical circuit pattern 26. The coating step 4 includes the introduction of the metal substrate 12 that is adhered thereto Insulating material 20 and the overlying conductive metal foil 14 or the Metal foil circuit pattern 26 in a coating press for about 1 hour at about 182 ° C and one Pressure from 10.3 to 34.5 bar ~ with 27s6 bar achieving excellent results became. After coating step 4 according to FIG. 1, the organic layered Option II construction etched if circuit pattern 26 fails Stamping the metal foil was formed (option 1) as this is from the design 16 according to FIG. 3 can be seen.

The circuit pattern 26 is formed from the foil 14 by conventional photoetching techniques (Option II) established. Different patterns are formed on the partial construction, and it is not necessary to explain all the details of this process, because such procedures are well known to those skilled in the art. Such special Circuit patterns or a variety of such patterns are generally photographed and reduced to the desired size. The film 14 is sensitive to light Masking medium coated and exposed with the photographic circuit pattern The light-sensitive masking medium only remains on the one that is not to be removed Foil material, which is a negative process in which the exposed material remains after etching. The sub-assembly is then exposed to an acid etch bath, which only removes the minimal amount of film that needs to be removed. In order to This leaves large areas of the aluminum foil that are not part of the circuit pattern can be used, but effective from the chemically etched circuit pattern are isolated. Alternatively, a positive method can be used in which only the circuit foil material stays behind and everyone else Parts of the film are removed after exposure to create a circuit as shown in FIG. After etching in ferric chloride solutions will be the layered component dried in an oven at around 135 oC.

In step 5 according to FIG. 1, the metal foil sections are spot welded carried out which cover or bridge the openings 23 in the insulating material 20.

The openings 23 according to FIGS. 2 and 3 allow the overlying Metal foil 14 of circuit pattern 26, a contact with the underlying Metal substrate, and these contact areas are spot welded to a firm mechanical and electrical connection between the film section and the metal substrate.

Be in the manufacture of an electrical power distribution panel it is desirable that selected terminals of the circuit pattern be coated with gold, solder, or other material are coated, so that there is a connection that is not only has an improved electrical conductivity, but also compared to a Oxidation is resistant. In Fig. 3 there are a number of such connections 2S placed in front These connections can be electroplated with the help of conventional electroplating processes be, for example by a dip galvanization or an electrolytic Electroplating In order to carry out electrolytic electroplating, it is necessary to To attach connections or electroplating connection strips in such a way that an electrical Current corresponding parts of the circuit pattern during the electroplating process fed it is still necessary to provide a protective cover, to cover areas that should not be electroplated. the Connections are made in that narrow aluminum strips 52 with selected Areas of the circuit pattern 26 are spot welded so that contacts for supplying an electrical current to the connections 28 result. The galvanizing connection strips As a result, 32 form short-circuit contacts for supplying a current to the entire Circuit or to selected parts of the circuit during the electroplating step. Selected portions of the circuit 26 bridge or cover openings 23 and they are spot welded or bonded to the underlying metal substrate 12, to achieve a ground connection 17. By attaching a lead to the substrate 12 is an electrical current through the ground connections 17 during the electroplating step 7 applied to selected sections. Fig. 3 shows the subassembly 16 with it attached connecting strip 32.

A protective coating or masking must be applied to the areas that should not be electroplated. After attaching the electroplating connector strips 32 is a protective coating made of a Lötlac. screen printed onto the conductive Circuit 26 (step 6) applied, such screen printing process in the Technique are well known. As shown by the subassembly 18 according to FIG is, the solder varnish mask 34 is screen printed onto the circuit pattern 26 and the organic adhesive 21 applied, wherein the electroplating connector strips 32 and the connections 28 protected by the emulsion of the screen and not coated will. A suitable material for the protective cover is the material that is under the name 'IMacDermid Macu Maskt'-Lötlack Nr. 9446 is sold and that applied to the front of the subassembly 18 by screen printing and 1 Cure at approximately 65 GC for one hour. This special solder varnish mask flows well between the sections of circuit pattern 26 and provides an effective one Coating during the electrolytic electroplating process after step 7.

Next, the subassembly 18 is covered with electroplating tape provided over the back of the metal substrate 12 and onto the electroplating connector strips 32 is applied. This electroplating protection tape prevents electrolytic Electroplating of the back of the substrate as well as the connecting strips that are used to Supplying a current to the circuit pattern 26 can be used. The sub-assembly is then in step 7 by means of some conventional selective electroplating process Well-named kind of electroplated so that they don't get through the solder mask or the The areas covered by electroplating protection tape are given a metallic coating preparatory steps and electroplating (steps 6 and 7) are in well known in the art so that they have not been described in great detail. To applying a gold or solder coating to selected terminals 28, the Subassembly 18 dried in an oven.

Steps 8 and 9 of Fig. 1 show that the next steps in the removal of the connecting strips 32: and the application of an insulating Protective coating exist. The subassembly now includes the metal substrate 12 with the multilayer insulating material 20 and 20 connected therewith through # es # liichten the circuit pattern 26, one on the front surface over most of the circuit pattern 26 attached solder lacquer mask and with a galvanic coating provided connections 28. In step 9, an insulating coating 40 (FIG. 5) is screen printed onto the Applied front surface of the sub-assembly, with a galvanic coating provided connections 28 are covered with respect to the insulating cover, so that they remain available for use as connectors.

Any common translation material used in electronic equipment can be used here, such as the material PO-401, which has a two-component epoxy coating used throughout the electronics industry. One or more coating processes result in an insulating coating and improve the external appearance. The ones not covered Connector strip areas are covered by the cover 40. Any rough points can be sanded off and provided with the coating. The coating 40 is dried at 150 oC for about 1 hour.

Finally, an insulating coating is applied to the back of the metal substrate 12 applied. Again, any one used in the electronics industry can Coating materials are used, with the special coatings that are used for special Applications used will depend on the metal used for the substrate. For an aluminum substrate 12, an acrylic enamel material can be used in Screen printing process applied to the back of the substrate and cured at 150 ° C. for about 1 hour will.

Finally, the power distribution plate 38 (Fig.

5) completed in that the three-layer insulating material 20 is cut out of the openings 15 which are arranged in the metal substrate 12 are. It should also be understood that the protective coatings applied to the Front and back sides of the plate 38 are applied prior to electroplating the selected connections 28 can be applied. Various electrical components and assemblies can be attached to plate 38 by having their terminals or punches can be inserted through the holes 15.

The layered electrical distribution structure made of organic material of the type described above results in an isolated metal substrate which has a number of advantages. The construction results in a distributor plate with high performance, with a fire retardant construction, with electromagnetic and high frequency shielding properties (with the exception of aluminum substrates) bending to any shape, be it flat, curved or irregular surfaces can be used, and results in a maximum recommended operating temperature of 150 00, connections using solder pads or pressure connections are possible. Additionally this electrical distribution structure has no restrictions on the metal used for the substrate or in terms of the thickness of the substrate on. Several conductive layers can be achieved by adding another three-layer insulating layer placed on the surface of the plate and another sheet of metal foil or a circuit pattern on this insulating layer be piled up. In addition to aluminum foil, various other conductor metals can be used can be used and the construction can be made to a size that up to 0.836 tn. The organic coatedv electrical described above Distributor construction eliminated #: Disadvantages oe.- nnter distributor circuits, because not only is it very inexpensive, but also an almost unlimited number of uses and forms.

Claims (1)

Electroteclmisches layer component Patent claims: 1. Electrotechnical Layer component for electrical insulation and retention of an electrically conductive one A layer of metal on the surface of a metal substrate, which is not shown n -z e i c h n e t that the layer component (il) is a metal substrate (12), which is electrically conductive metal layer in the form of an electrical circuit made of conductive foil material (14) and a multi-layer insulating material (20) comprising the film material (14) with the surface of the metal substrate (12) connects that the multilayer insulating material (20) comprises two layers (21) of a thermosetting acrylic dry adhesive, between which a layer (22) of very puncture-resistant material is arranged is made of polyimide material or polyetherimide material, and that the multilayer insulating material (20) the conductive foil material (14) with the surface of the metal substrate (12) and thus the electrical circuit on the metal substrate for the formation of the electrotechnical layer component holds and opposite isolated from the substrate. 2. Layer component according to claim 1, d a d u r c h g e k e n n z e i c h n e t that openings (23) are formed in the multilayer insulating material (20) are, and that the conductive film (14) covers the openings (23) and with the surface of the metal substrate (12) is connected. 3. Layer component according to claim 1 or 2, g e -k e n n z e i c h n e t includes metal plating on selected portions of the conductive sheet material (14). 4. Layer component according to one of the preceding claims, g e k e n n z e i n e t d u r c h an electrically insulating cover on the top of the layer component. 5. Layer component according to one of the preceding claims, g e k e n n z e i h n e t d u r c h an insulating coating on the free surfaces of the Metal substrate (12). 6. A method for producing an insulated metal substrate, g e DO NOT NOTE: (1) Clean a metal substrate and an electrically conductive sheet material which electrical Forms conductor parts that are connected to the metal substrate under insulation should, fS placing a three-layer insulating material on a surface of the Metal substrate, the three-layer insulating material having two layers of a thermosetting Acrylic adhesive and an intermediate layer of material comprised of polyimide film or polyetherimide film, (3) # l # arrange the electrical conductor parts forming electrically conductive film material over the three-layer insulating material, and (4) applying heat and pressure to that structure to layer the conductive foil material and the insulating material on the metal substrate9 so that the electrical conductor parts through the three-layer insulating material with the metal substrate are connected, the T # @ iter parts are effectively isolated so that electrical contact with the underlying metal substrate is prevented ao method according to claim 6, that in the three-layer insulating material openings are formed in such a way, ¢ S-ß the overlying conductive foil material with the underlying metal substrate can be connected. 8. The method according to claim 6 or 7, d a d u r c h e k e n n z e I do not want electrically conductive material to strip on selected sections the electrical circuit are placed that a masking material over the entire conductive foil material with the exception of the strips and selected parts of the electric Circuit is applied and that the layer component is electroplated, to metal plating the selected parts of the electrical circuit generate conductive foil material that is not covered by the masking material are. 9. The method according to any one of claims 6 to 8, d a -d u r c h g e it does not indicate that there is an insulating coating on the other surfaces of the isolated metal substrate is applied. 10. The method according to claim 6, d a d u r c h g e -k e n n z e i c That is, the electrical conductor parts that are layered on the substrate are chemically etched to form an electrical circuit that connects to the Metal substrate Connected, but isolated from it. 11. The method according to any one of claims 6 to 10, d a -d u r c h g I do not know that that Metal substrate and the sheet material consist of aluminum; 2o method according to claim 6, d U d u r ch g e -k e n n z e i C h n e t 9 that the conductive sheet material is punched in such a way that the electrical conductor parts form an electrical circuit pattern. 13. Electrical layered component construction for electrical insulation and holding an electrically conductive metallic layer on the surface a metal substrate underneath, which is indicated e t 9 that the layer component construction is an aluminum substrate (12), one electrical conductive metallic layer (14) forming an electrical circuit made of aluminum foil forms all of the surface of the underlying aluminum substrate to adhere to brought and insulated from this M and a multilayer insulating material To: L includes attaching the aluminum foil to the surface of the aluminum substrate, that the multilayer insulating material (20) two layers (21) of an acrylic dry adhesive film comprises, between which a layer of a material is arranged that of Polymid-Matexial or polyetherimide material, and that the multilayer insulating material the Aluminum foil connects to the surface of the aluminum substrate, being the metallic Layer is held on the aluminum substrate and isolated from this.