DE3342923A1 - Mounting system - Google Patents
Mounting systemInfo
- Publication number
- DE3342923A1 DE3342923A1 DE19833342923 DE3342923A DE3342923A1 DE 3342923 A1 DE3342923 A1 DE 3342923A1 DE 19833342923 DE19833342923 DE 19833342923 DE 3342923 A DE3342923 A DE 3342923A DE 3342923 A1 DE3342923 A1 DE 3342923A1
- Authority
- DE
- Germany
- Prior art keywords
- metal oxide
- fastening arrangement
- arrangement according
- heat
- oxide ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 17
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 17
- 239000011224 oxide ceramic Substances 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 claims description 5
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 3
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 2
- 229910052574 oxide ceramic Inorganic materials 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052593 corundum Inorganic materials 0.000 abstract description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 abstract 1
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
BefestigungsanordnungMounting arrangement
Die Erfindung betrifft eine Befestigungsanordnung für wärmeerzeugende Bauelemente elektrischer Geräte, insbesondere für Stromversorgungsgeräte. Derartige Befestigungsanordnungen sind mit Kühlvorrichtungen elekfrischer Geräte verbunden.The invention relates to a fastening arrangement for heat generating Components of electrical devices, in particular for power supply devices. Such Fastening assemblies are associated with cooling devices of electrical appliances.
#rmeerzeugende Bauelemente, beispielsweise Leitungstransistoren oder Dioden, wurden bisher auf metallischen Blöcken befestigt, die als Wärmeleiter dienen (DBP 1201435). Meist wird durch das Verbinden des Bauelements mit dem meallischen Block eine Elektrode an diesen angeschlossen, so daß sich auf einem Metallblock mehrere Bauelemente nur unterbringen lassen, wenn eine elektrische Isolierung der Befestigungsstelle vorgenommen werden kann.# Heat-generating components, for example line transistors or Diodes were previously attached to metallic blocks that serve as heat conductors (DBP 1201435). Usually by connecting the component with the meal Block an electrode attached to this so that it sits on a metal block several components can only be accommodated if the electrical insulation of the Attachment point can be made.
Das Anbringen zusätzlicher elektrischer Isolierungen ist arbeitsaufwendig. Mit Isolierungen versehene Kühlblöcke müssen nach ihrer Bestückung geprüft werden.Applying additional electrical insulation is labor-intensive. Cooling blocks with insulation must be checked after they have been fitted.
Der Erfindung liegt die Aufgabe zugrunde, eine besonders einfach herstellbare Befestigungsanordnung zu schaffen, bei der keine Isolationsprobleme auftreten.The invention is based on the object of a particularly simple to manufacture To create fastening arrangement in which no insulation problems occur.
Diese Aufgabe wird bei einer Befestigungsanordnung der eingangs genannten Art dadurch gelöst, daß in einem Kuhlblock aus elektrisch isolierender Metalloxid-Keramik die Befestigungsstellen zum Anschrauben oder Anklemmen mindestens eines Bauelements vorgesehen sind.In the case of a fastening arrangement, this task becomes the one mentioned at the outset Art solved in that in a cooling block made of electrically insulating metal oxide ceramic the fastening points for screwing or clamping at least one component are provided.
Der Erfindung liegt die Erkenntnis zugrunde, daß sowohl die Wärmeleiteigenschaften als auch der elektrische Widerstand einer Metalloxid-Keramik zur Verwendung als Befestigungsmittel geeignet sind. Besonders hohe Wärmeleitfähigkeit besitzen beispielsweise Aluminium oder Berilliumoxid-Keramik.The invention is based on the knowledge that both the thermal conductivity properties as well as the electrical resistance of a metal oxide ceramic for use as Fasteners are suitable. For example, they have particularly high thermal conductivity Aluminum or beryllium oxide ceramic.
Die Erfindung wird mit weiterens in den Unteransprüchen angegebenen vorteilhaften Ausgestaltungen anhand des in der Zeichnung schematisch dargestellten Ausführungsbeispiels näher erläutert.The invention is further specified in the subclaims advantageous embodiments based on that shown schematically in the drawing Embodiment explained in more detail.
In einem Gerät mit wärmeerzeugenden elektrischen Bauelementen wird eine Leiterplatte 1 mit einem Kühlkörper 2 verbunden, über den die Wärme von Leistungshalbleitern bzw. Dioden abgeführt werden soll.In a device with heat-generating electrical components a circuit board 1 is connected to a heat sink 2, through which the heat from power semiconductors or diodes should be discharged.
Die wärmeerzeugenden Bauelemente 3 und 4 sind mechanisch mit einem quaderförmigen Metalloxid-Keramikblock 5 verbunden. Geeignete Metalloxide sind z.B. Al203und BeO.The heat generating components 3 and 4 are mechanically with a cuboid metal oxide ceramic block 5 connected. Suitable metal oxides are e.g. Al203 and BeO.
Der Metalloxidblock dient gleichzeitig der Befestigung der Leiterplatte 1 mit dem Kühlkörper 2. In einer anderen Ausgestaltungsform kann ein Metalloxidblock gleichzeitig mit den bei einem Kühlkörper vorgesehenen Rippen ausgestaltet sein und den Kühlkörper ersetzen.The metal oxide block also serves to fasten the circuit board 1 with the heat sink 2. In another embodiment, a metal oxide block be designed at the same time as the ribs provided in a heat sink and replace the heat sink.
Das mit dem Metalloxidblock 5 verschraubte Bauelement 3 wird elektrisch mit teilweise dargestellten Leiterbahnen der Leiterplatte 1 verlötet. Es spielt keine Rolle, wenn die Befestigungslasche auch elektrische Funktionen hat.The component 3 screwed to the metal oxide block 5 becomes electrical soldered to the conductor tracks of the circuit board 1, some of which are shown. It's playing does not matter if the fastening strap also has electrical functions.
In einer anderen Ausgestaltung sind die Leiterbahnen selbst auf dem Metalloxidkörper, auf dem das Bauelement 4 verschraubt oder verklemmt ist.In another embodiment, the conductor tracks are themselves on the Metal oxide body on which the component 4 is screwed or clamped.
Aufgrund der Härte des Metalloxidkörpers und unterschiedlicher Wärmeausdehnungskoeffizienten werden elastische Befestigungsmittel vorgesehen, die beispielsweise aus einem Federring bestehen. So können bei der Herstellung des Metalloxidblockes Ausnehmungen mit eingebracht sein, in denen zum Befestigen des jeweiligen Bauelementes eine Mutter elastisch gelagert wird.Due to the hardness of the metal oxide body and different coefficients of thermal expansion elastic fastening means are provided, which for example consist of a spring ring exist. For example, recesses can also be introduced during the production of the metal oxide block be, in which a nut is elastic to attach the respective component is stored.
Liste der Bezugszeichen: 1 Leiterplatte 2 Kühlkörper 3, 4 wärmeerzeugendes Bauelement 5 MetalloxidkörperList of reference symbols: 1 circuit board 2 heat sink 3, 4 heat generating Component 5 metal oxide body
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19833342923 DE3342923A1 (en) | 1983-11-26 | 1983-11-26 | Mounting system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19833342923 DE3342923A1 (en) | 1983-11-26 | 1983-11-26 | Mounting system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3342923A1 true DE3342923A1 (en) | 1985-06-05 |
Family
ID=6215413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19833342923 Withdrawn DE3342923A1 (en) | 1983-11-26 | 1983-11-26 | Mounting system |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE3342923A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5164884A (en) * | 1990-03-29 | 1992-11-17 | Nokia Mobile Phones, Ltd. | Device for cooling a power transistor |
| US5191512A (en) * | 1991-04-17 | 1993-03-02 | Pioneer Electronic Corporation | Heat sink/circuit board assembly |
| EP1253636A1 (en) * | 2000-09-19 | 2002-10-30 | Matsushita Electric Industrial Co., Ltd. | Electronic equipment |
-
1983
- 1983-11-26 DE DE19833342923 patent/DE3342923A1/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5164884A (en) * | 1990-03-29 | 1992-11-17 | Nokia Mobile Phones, Ltd. | Device for cooling a power transistor |
| US5191512A (en) * | 1991-04-17 | 1993-03-02 | Pioneer Electronic Corporation | Heat sink/circuit board assembly |
| EP1253636A1 (en) * | 2000-09-19 | 2002-10-30 | Matsushita Electric Industrial Co., Ltd. | Electronic equipment |
| EP1253636A4 (en) * | 2000-09-19 | 2005-03-02 | Matsushita Electric Ind Co Ltd | ELECTRONIC EQUIPMENT |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8139 | Disposal/non-payment of the annual fee |