DE29706016U1 - Electronic device, in particular chip card with riveted connection - Google Patents
Electronic device, in particular chip card with riveted connectionInfo
- Publication number
- DE29706016U1 DE29706016U1 DE29706016U DE29706016U DE29706016U1 DE 29706016 U1 DE29706016 U1 DE 29706016U1 DE 29706016 U DE29706016 U DE 29706016U DE 29706016 U DE29706016 U DE 29706016U DE 29706016 U1 DE29706016 U1 DE 29706016U1
- Authority
- DE
- Germany
- Prior art keywords
- electronic device
- rivet
- rivets
- another
- chip card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/06—Riveted connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
Elektronisches Gerät, insbesondere Chipkarte mit NietverbindunqElectronic device, in particular chip card with rivet connection
Die Erfindung betrifft ein elektronisches Gerät, insbesondere eine Chipkarte gemäß dem Oberbegriff des Anspruches 1 sowie ein Verfahren zum mechanischen und elektrischen Verbinden von Mikromodulen gemäß Anspruch 7.The invention relates to an electronic device, in particular a chip card according to the preamble of claim 1, and a method for mechanically and electrically connecting micromodules according to claim 7.
Bei kontaktlosen Chipkarten, daß heißt bei Chipkarten, bei denen ein induktives Verfahren zur Übertragung von Energie und Daten angewandt wird, ist neben dem Mikromodul, das ein oder mehrere Halbleiterschaltkreise und passive Komponenten beinhaltet, eine Spule erforderlich, die als Sende- und Empfangsantenne zum Übertragen von elektrischer Energie sowie Information dient. Bei den bisher bekannten kontaktlosen Chipkarten wird das Mikromodul mit der Antennenfolie über eine Lot-, Schweiß- oder leitfähige Klebeverbindung elektrisch mit dem Mikromodul mit den Halbleiterschaltkreisen verbunden. In der Praxis hat sich herausgestellt, daß diese Verbindungsstellen bei Biegebelastungen Schwachstellen darstellen und zu Systemausfällen führen.For contactless chip cards, i.e. chip cards that use an inductive method to transmit energy and data, in addition to the micromodule, which contains one or more semiconductor circuits and passive components, a coil is required that serves as a transmitting and receiving antenna for transmitting electrical energy and information. For the contactless chip cards known to date, the micromodule with the antenna foil is electrically connected to the micromodule with the semiconductor circuits using a solder, weld or conductive adhesive connection. In practice, it has been found that these connection points represent weak points under bending stress and lead to system failures.
Es ist daher Aufgabe der vorliegenden Erfindung ein elektronisches Gerät mit wenigstens zwei Mikromodulen anzugeben, die elektrisch miteinander verbunden sind, und deren elektrische Kontaktstelle bei Biegebelastungen zuverlässig und dauerhaft ist. Weiterhin ist es Aufgabe ein verbessertes Verfahren zur elektrischen Verbindung von Mikromodulen anzugeben.It is therefore an object of the present invention to provide an electronic device with at least two micromodules that are electrically connected to one another and whose electrical contact point is reliable and durable under bending loads. It is also an object to provide an improved method for electrically connecting micromodules .
Die Lösung dieser Aufgabe erfolgt in vorrichtungstechnischer Hinsicht gemäß den Merkmalen des Anspruchs 1 und in verfahrenstechnischer Hinsicht gemäß den Merkmalen des Anspruchs 7 .This object is achieved in terms of device technology according to the features of claim 1 and in terms of process technology according to the features of claim 7.
Seile -1 -Ropes -1 -
[File:ANM\SC7133A1.DOC] Ansprühe, l Kontaktlose Chipkarte mit Nietverbindung Telbus Gmbh, Allershausen[File:ANM\SC7133A1.DOC] Spray, l Contactless chip card with rivet connection Telbus Gmbh, Allershausen
Es wird ein elektronisches Gerät und insbesondere eine Chipkarte bereitgestellt, bei dem zwei elektronische Mikromodule, die jeweils auf einem flexiblen Trägersubstrat angeordnete elektronische Bauteile enthalten, an Kontaktstellen mittels Nietverbindungen verbunden sind. Hierbei ist es wichtig, daß die Niet bzw. Nietverbindung aus einem elektrisch leitendem Material besteht und damit sowohl eine elektrische als auch eine mechanische Verbindung der Mikromodule bereitstellt. Es hat sich herausgestellt, daß die Nietverbindung bei mechanischen Belastungen, wie insbesondere Biegebelastungen der Chipkarte, wegen ihres elastischen Verhaltens an den Kontaktstellen durch Reibungseffekte an den Verbindungspunkten einer möglichen Korrosion entgegenwirkt und für niedrige Übergangswiderstände zwischen den zu verbindenen elektrischen Leitern sorgt.An electronic device and in particular a chip card is provided in which two electronic micromodules, each containing electronic components arranged on a flexible carrier substrate, are connected at contact points by means of riveted connections. It is important that the rivet or riveted connection is made of an electrically conductive material and thus provides both an electrical and a mechanical connection of the micromodules. It has been found that the riveted connection counteracts possible corrosion due to friction effects at the connection points due to its elastic behavior at the contact points and ensures low contact resistance between the electrical conductors to be connected.
Die Unteransprüche beziehen sich auf vorteilhafte Ausgestaltungen der Erfindung.
20The subclaims relate to advantageous embodiments of the invention.
20
Gemäß einer solchen vorteilhaften Ausgestaltung der Erfindung sind die Nieten Hohlnieten, die an den Enden
umgebogen werden und somit eine optimale Verbindung bereitstellen.
25According to such an advantageous embodiment of the invention, the rivets are hollow rivets which are bent at the ends and thus provide an optimal connection.
25
Durch die vorteilhafte Ausgestaltung der Erfindung nach Anspruch 4 wird gewährleistet, daß die maximal zulässige Bauhöhe von Chipkarten nicht überschritten wird. Außerdem wird dadurch der die mechanische Verbindung zwischen Niet und Trägersubstrat und damit die mechanische Verbindung zwischen den beiden Trägersubstraten verbessert.The advantageous embodiment of the invention according to claim 4 ensures that the maximum permissible height of chip cards is not exceeded. In addition, the mechanical connection between the rivet and the carrier substrate and thus the mechanical connection between the two carrier substrates is improved.
Durch das erfindungsgemäße Verfahren lassen sich zwei oder mehr Mikromodule, daß heißt flächige Trägersubstrate, sowohl elektrisch als auch mechanisch miteinander verbinden. Hierbei können die Nietaufnahmelöcher vor oder nachThe method according to the invention enables two or more micromodules, i.e. flat carrier substrates, to be connected to one another both electrically and mechanically. The rivet receiving holes can be made before or after
[File-.ANM\SC7133A1.DOC] Ansprüche, I[File-.ANM\SC7133A1.DOC] Claims, I
• · Kontaktlose Chipkarte mit Nietverbindung • · Contactless chip card with rivet connection
Telbus Gmbh, AllershausenTelbus GmbH, Allershausen
IS!IS!
dem aufeinander Positionieren der zu vernietenden Substrate erstellt werden.by positioning the substrates to be riveted together.
Weitere Einzelheiten, Merkmale und Vorteile der Erfindung ergeben sich aus der nachfolgenden Beschreibung anhand der Zeichnung.Further details, features and advantages of the invention will become apparent from the following description with reference to the drawing.
Es zeigt:It shows:
Fig. 1 eine schematische Darstellung eines ersten Trägersubstrats bzw. Mikromoduls einer elektronischen Chipkarte mit den Halbleiterschaltkreisen;Fig. 1 is a schematic representation of a first carrier substrate or micromodule of an electronic chip card with the semiconductor circuits;
Fig. 2 eine schematische Darstellung eines zweiten Trägersubstrats bzw. Mikromoduls in Form einer Antennenfolie für eine kontaktlose Chipkarte; undFig. 2 a schematic representation of a second carrier substrate or micromodule in the form of an antenna foil for a contactless chip card; and
Fig. 3 eine Schnittdarstellung der durch eine Nietverbindung miteinander verbundenen beiden Trägersubstrate nach Fig. 1 und 2.Fig. 3 is a sectional view of the two carrier substrates connected to one another by a rivet joint according to Fig. 1 and 2.
Fig. 1 zeigt ein erstes flexibles Trägersubstrat 2 mit wenigstens einem Halbleiterschaltkreis und sonstigen elektronischen Bauteilen 4, die über nicht näher dargestellte elektrische Leiterbahnen mit zwei ersten elektronischen Kontaktstellen 6 verbunden sind. Fig. 2 zeigt schematisch ein zweites Trägersubstrat 8 mit einer Antennenwicklung 10 und zwei zweiten elektrischen Kontaktstellen 12. Die ersten und zweiten Kontaktstellen 6 und 12 sind so geometrisch auf dem jeweiligen Trägersubstrat 2 bzw. 8 angeordnet, daß sie bei passender Zuordnung der beiden Trägersubstrate 2 und 8 entsprechend der strichlierten Linie 13 in Fig. 2 paarweise aufeinander liegen. Die beiden Substrate 2 und 8 werden in dieser Lage fixiert und die beiden aufeinanderliegenden Kontaktstellen 6 und 12 werden mit Nietaufnahmelöchern 14 mittels Bohrung versehen.Fig. 1 shows a first flexible carrier substrate 2 with at least one semiconductor circuit and other electronic components 4, which are connected to two first electronic contact points 6 via electrical conductor tracks (not shown in detail). Fig. 2 shows a schematic of a second carrier substrate 8 with an antenna winding 10 and two second electrical contact points 12. The first and second contact points 6 and 12 are arranged geometrically on the respective carrier substrate 2 and 8 in such a way that, when the two carrier substrates 2 and 8 are correctly assigned, they lie on top of one another in pairs according to the dashed line 13 in Fig. 2. The two substrates 2 and 8 are fixed in this position and the two contact points 6 and 12 lying on top of one another are provided with rivet receiving holes 14 by means of drilling.
[File:ANM\SC7133A1.DOC] Ansprüche, J 9<f.$<t.9T J Kontaktlose Chipkarte mit Nietverbindung* * Telbus Gmbh, Allershausen[File:ANM\SC7133A1.DOC] Claims, J 9<f.$<t.9T J Contactless chip card with rivet connection* * Telbus Gmbh, Allershausen
Wie in Fig. 3 dargestellt ist, wird in diese Nietaufnahmelöcher 14 eine Hohlniet 16 aus einem elektrisch leitenden Material, insbesondere aus Metall, eingesetzt und die beiden Enden der Hohlniet 16 werden aufgeweitet und in die jeweilige Trägersubstratoberfläche eingedrückt, so daß das obere Ende der Niet 16 mit der Oberseite des jeweiligen Trägersubstrats 2 bzw. 8 fluchtet. Hierbei zeigt Fig. 3 den Zustand in dem die Hohlniet 16 aufgeweitet, jedoch noch nicht in die Substrate 2 und 8 eingedrückt ist. Durch die Nietverbindung 16 werden die Kontaktstellen 6 und 12 aufeinandergedrückt. Aufgrund der Aufweitung der Enden der Niet 16 wirkt diese elektrische und mechanische Nietverbindung bei Biegebelastungen wie eine Feder und gewährleistet so einen dauerhaften und zuverlässigen elektrischen Kontakt zwischen den Kontaktstellen 6 und 12.As shown in Fig. 3, a hollow rivet 16 made of an electrically conductive material, in particular metal, is inserted into these rivet receiving holes 14 and the two ends of the hollow rivet 16 are expanded and pressed into the respective carrier substrate surface so that the upper end of the rivet 16 is aligned with the top of the respective carrier substrate 2 or 8. Fig. 3 shows the state in which the hollow rivet 16 is expanded but not yet pressed into the substrates 2 and 8. The contact points 6 and 12 are pressed together by the rivet connection 16. Due to the expansion of the ends of the rivet 16, this electrical and mechanical rivet connection acts like a spring under bending loads and thus ensures permanent and reliable electrical contact between the contact points 6 and 12.
Für die erfindungsgemäße Nietverbindung sind Hohlnieten besonders geeignet, da sich deren Enden auf einfache Weise z. B. durch einen konisch geformten Stachel aufweiten lassen ohne daß dies zu großen Stauchungen der Niet im Bereich der Kontaktstellen 6, 12 führen würde. Wenn die Substrate während des Vernietens genügend stark zusammengepreßt werden, lassen sich auch Vollnieten verwenden.Hollow rivets are particularly suitable for the rivet connection according to the invention, since their ends can be easily widened, for example by means of a conically shaped spike, without this leading to major compression of the rivet in the area of the contact points 6, 12. If the substrates are pressed together sufficiently strongly during riveting, solid rivets can also be used.
[File:ANM\SC7133A1.DOC] Ansprüojie, j(ÄiCSh9> j · ···· · "···[File:ANM\SC7133A1.DOC] Claims, j(ÄiCSh9> j · ···· · "···
Kontaktlose Chipkarte mit Nietverbindung·" · *·** · ··Contactless chip card with rivet connection·" · *·** · ··
Telbus Gmbh, AllershausenTelbus GmbH, Allershausen
2 erstes flexibles Trägersubstrat2 first flexible carrier substrate
4 Halbleiterschaltkreise, elektronische Bauteile4 Semiconductor circuits, electronic components
6 ersten elektrische Kontaktstellen6 first electrical contact points
8 zweites Trägersubstrat8 second carrier substrate
10 Antennenwicklung10 Antenna winding
12 zweite elektrische Kontaktstellen12 second electrical contact points
13 strichliert Linie, Lage der Trägersubstrate 2 und aufeinander13 dashed line, position of the carrier substrates 2 and
14 Nietaufnahmelöcher 16 Niet14 rivet holes 16 rivet
Claims (1)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE29706016U DE29706016U1 (en) | 1997-04-04 | 1997-04-04 | Electronic device, in particular chip card with riveted connection |
| AU74292/98A AU7429298A (en) | 1997-04-04 | 1998-04-03 | Chip card with a riveted joint |
| PCT/EP1998/001974 WO1998045804A1 (en) | 1997-04-04 | 1998-04-03 | Chip card with a riveted joint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE29706016U DE29706016U1 (en) | 1997-04-04 | 1997-04-04 | Electronic device, in particular chip card with riveted connection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE29706016U1 true DE29706016U1 (en) | 1998-08-06 |
Family
ID=8038465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE29706016U Expired - Lifetime DE29706016U1 (en) | 1997-04-04 | 1997-04-04 | Electronic device, in particular chip card with riveted connection |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU7429298A (en) |
| DE (1) | DE29706016U1 (en) |
| WO (1) | WO1998045804A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10146870A1 (en) * | 2001-09-24 | 2003-04-24 | Orga Kartensysteme Gmbh | Chip card, e.g. a bank card, comprises a chip module on a carrier element, with a chip and conductors with contact surfaces, and a functional element |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1265213A (en) * | 1997-07-28 | 2000-08-30 | 卡尔－海因茨·文迪施 | Chip module, module and method for manufacturing the module, and chip card |
| DE10114355A1 (en) * | 2001-03-22 | 2002-10-17 | Intec Holding Gmbh | Process for the production of a contactless multifunctional chip card as well as the chip card produced accordingly |
| DE102019129719A1 (en) * | 2019-11-05 | 2021-05-06 | Automotive Lighting Reutlingen Gmbh | Electrically conductive connection of printed circuit boards |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2706467A1 (en) * | 1977-02-16 | 1978-08-17 | Hartmann & Braun Ag | Connecting tag for joining circuit boards at various angles - has central upward fold and two downwards bent solder legs at ends |
| GB2014368A (en) * | 1978-02-11 | 1979-08-22 | Nkf Groep Bv | Flexible printed-circuit board |
| EP0117809A1 (en) * | 1983-02-28 | 1984-09-05 | Compagnie D'informatique Militaire Spatiale Et Aeronautique | Electrical connection device for the connection of two printed circuit cards and a method of connecting two printed circuit cards with the aid of this device |
| GB2219443A (en) * | 1988-04-08 | 1989-12-06 | Pennwalt Piezo Film | Forming mechanical and electrical connections of films to printed circuit boards |
| DE3624852C2 (en) * | 1986-01-10 | 1993-01-28 | Orga-Druck Gmbh, 6072 Dreieich, De | |
| DE4416697A1 (en) * | 1994-05-11 | 1995-11-16 | Giesecke & Devrient Gmbh | Data carrier with integrated circuit |
| JPH08128424A (en) * | 1994-10-31 | 1996-05-21 | Fujitsu Denso Ltd | Rivet for attaching printed board |
| JPH08213068A (en) * | 1995-02-09 | 1996-08-20 | Fujikura Ltd | Connecting method of flexible printed circuit board and tape electric wire |
| DE19644796A1 (en) * | 1995-10-30 | 1997-05-07 | Whitaker Corp | Electrical connector assembly |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2716281B1 (en) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Method of manufacturing a contactless card. |
| DE4440721A1 (en) * | 1994-11-15 | 1996-05-23 | Datacolor Druck Und Fullservic | Carrier element for integrated circuit components in e.g. cheque and credit cards |
| US6095424A (en) * | 1995-08-01 | 2000-08-01 | Austria Card Plasikkarten Und Ausweissysteme Gesellschaft M.B.H. | Card-shaped data carrier for contactless uses, having a component and having a transmission device for the contactless uses, and method of manufacturing such card-shaped data carriers, as well as a module therefor |
| WO1998006063A1 (en) * | 1996-08-02 | 1998-02-12 | Solaic | Integrated circuit card with two connection modes |
-
1997
- 1997-04-04 DE DE29706016U patent/DE29706016U1/en not_active Expired - Lifetime
-
1998
- 1998-04-03 AU AU74292/98A patent/AU7429298A/en not_active Abandoned
- 1998-04-03 WO PCT/EP1998/001974 patent/WO1998045804A1/en active Application Filing
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2706467A1 (en) * | 1977-02-16 | 1978-08-17 | Hartmann & Braun Ag | Connecting tag for joining circuit boards at various angles - has central upward fold and two downwards bent solder legs at ends |
| GB2014368A (en) * | 1978-02-11 | 1979-08-22 | Nkf Groep Bv | Flexible printed-circuit board |
| EP0117809A1 (en) * | 1983-02-28 | 1984-09-05 | Compagnie D'informatique Militaire Spatiale Et Aeronautique | Electrical connection device for the connection of two printed circuit cards and a method of connecting two printed circuit cards with the aid of this device |
| DE3624852C2 (en) * | 1986-01-10 | 1993-01-28 | Orga-Druck Gmbh, 6072 Dreieich, De | |
| GB2219443A (en) * | 1988-04-08 | 1989-12-06 | Pennwalt Piezo Film | Forming mechanical and electrical connections of films to printed circuit boards |
| DE4416697A1 (en) * | 1994-05-11 | 1995-11-16 | Giesecke & Devrient Gmbh | Data carrier with integrated circuit |
| JPH08128424A (en) * | 1994-10-31 | 1996-05-21 | Fujitsu Denso Ltd | Rivet for attaching printed board |
| JPH08213068A (en) * | 1995-02-09 | 1996-08-20 | Fujikura Ltd | Connecting method of flexible printed circuit board and tape electric wire |
| DE19644796A1 (en) * | 1995-10-30 | 1997-05-07 | Whitaker Corp | Electrical connector assembly |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10146870A1 (en) * | 2001-09-24 | 2003-04-24 | Orga Kartensysteme Gmbh | Chip card, e.g. a bank card, comprises a chip module on a carrier element, with a chip and conductors with contact surfaces, and a functional element |
| DE10146870B4 (en) * | 2001-09-24 | 2013-03-28 | Morpho Cards Gmbh | Chip card and method for producing an electrical connection between components of such a chip card |
Also Published As
| Publication number | Publication date |
|---|---|
| WO1998045804A1 (en) | 1998-10-15 |
| AU7429298A (en) | 1998-10-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R163 | Identified publications notified | ||
| R207 | Utility model specification |
Effective date: 19980917 |
|
| R156 | Lapse of ip right after 3 years |
Effective date: 20010201 |