DE2326861C2 - - Google Patents

Description

The invention relates to a method for producing a Circuitry made of micro modules according to the generic terms of Claims 1 and 2. Such methods are known from the DE-OS 21 11 396 and 21 23 308 known.

The field of application of the invention is therefore the field of microelectronics.  

From DE-OS 21 11 396 is a method for manufacturing a circuit made of micro modules known in the contact pieces for the connections of the micro modules accordingly the later arrangement of the micro building blocks on a substrate be attached, the contact pieces via connection circuits of insulated mounted on the substrate Wires are connected together and the wires attached stripped and contacted with the contact pieces will.

As is apparent from FIGS . 1b to 1h of this DE-OS 21 11 396, individual wire pieces are attached to the substrate in this method, the ends of which are then connected with corresponding contact pieces. This procedure does not allow to test the continuity of current through all conductor parts by applying a voltage to only two ends of this wiring and thus to determine whether the connecting wires are broken or whether there is a short circuit in the wiring.

From DE-OS 21 23 308 is an electronic connection module and its manufacturing process known, in which Micro modules on with guide grooves for connecting wires having housings made of insulating material attached and the terminals of the micro modules with the the ends of the connecting wires emerging from the guide grooves be electrically connected.

It should be noted that this method does not connect micro-modules to one another, but rather only makes connections between individual connection terminals of one micro-module. As can be seen in particular from FIG. 14 of DE-OS 21 23 308, the individual micro modules are connected to one another via printed circuits 86 a on a carrier 86 .

The establishment of the connection circuits between the individual micro-components and also, as already mentioned above, making connections between individuals Clamping a micro module does not allow the Current passage through these respective connecting lines easy to test.

In addition, this publication does not indicate dimension took provision in which in a single operation Contact pieces at the locations of all connecting wires the same be produced in time on which these connecting wires contacted later with the connection terminals of the micro modules should be.

The object underlying the invention is the generic method for producing a circuit to develop from micro modules such that the Current continuity through the connection circuit in the simplest Way can be tested and that the procedure at gerin system equipment and manufacturing aids means can be carried out.

This object is alternatively according to claims 1 or 2 solved.

Particularly preferred embodiments are in the subclaims characterized variants of the method according to the invention.

The method according to the invention for producing a scarf microcomponents have numerous advantages, only the most important of which are highlighted below should be:

• Simplicity of the manufacturing equipment required;
• Possibility of easy modification of the connections;
• large permissible packing density for the connections;
• unlimited number of superimposed layers;
• any physical or mechanical discontinuity between two circuit to be connected put;
• great freedom in the choice of routes for the connection lines with the possibility of their mutual Contact;  
• electrical verifiability through simple resistance Measurement;
• Programmability of connection execution;
• Possibility of installing integrated circuits with their active side up and sticking on their base on the support pad;
• great reliability of the solder connections.

For the further explanation of the invention will now referred to the drawing in which some preferred Illustrated embodiments of the invention are; thereby shows in the drawing

Fig. 1 position an obtainable according to the first embodiment of the method according to the invention in a perspective Dar connection substrate and in various stages of its manufacture,

Fig. 2 is a verwend bares in the context of the second embodiment of the inventive method insulative housing in a perspective view,

Fig. 3 shows a schematic representation of the end of the wiring of the Verbindugsschaltung in the second embodiment variant of the method according OF INVENTION dung,

Fig. 4 is a variant embodiment for the formation of the contact pieces,

Fig. 5 is a greatly enlarged detailed view of the grooves incorporated in the insulating housing for demonstrating the anchoring of the stripped wire to the conductive contact pieces, and

Fig. 6 is a schematic representation of the feed head for the insulated wire.

In Fig. 1 a first embodiment is shown, wherein the same time the essential stages of its preparation are illustrated (Fig. 1a, 1b and 1c). In the illustration in Fig. 1a, conductive contact pieces 62 are applied to a substrate 60 at the points which are to interact electrically with the connections of the micro-modules. In a second process phase ( FIG. 1b), the connection circuit is produced by applying an uninterrupted insulated wire 64 to the contact pieces to be connected later. The connection circuit can also be formed by superimposing several such circuits (subcircuits). The connection circuit is then checked by applying a voltage to ensure that the wire 64 is uninterrupted. The insulated wire 64 is then stripped at the level of each of the contact pieces 62 and soldered to one another; in a last step, the unnecessary sections of the wire 64 are then cut off ( FIG. 1c).

Then the connections of the micro modules are placed on the different contact pieces 62 and soldered to one another.

Fig. 2 shows a perspective view of an insulating housing 2 with grooves 4 , which allow the establishment of connections between the uninterrupted insulated wire and the connections of a micro module that can be used in this insulating housing 2 .

Another variant in which these insulating housings 2 are used is shown in FIGS . 3a and 3b. In these Figu ren three insulating housings 10, 12 and 14 are shown, which are provided for receiving three interconnected electronic micro-modules. The connection circuit is produced by a continuous, insulated wire 16 , which binds the grooves 4 of the various insulating housings 10, 12 and 14 together according to the desired connection plan. In this variant, too, the connection circuit can be formed by superimposing several subcircuits.

The further process steps do not differ from the first variant.

The connection of the wire to the insulating housing 2 can be seen in Fig. 5. In this case, 5a a cross section is shown in Figure by an insulating housing 2, are incorporated in the grooves 4. the insulating housing 2 is coated at least in the interior of the grooves 4 with a thin metal layer 20 , which can be obtained by chemical copper plating for example; the Ver connecting wire is freed from its insulation after the interruption test in the area of the grooves 4 , so that its metal soul 22 is exposed. This stripping of the wire can be done for example by thermal evaporation or by chemical action of a solvent. After inserting the insulated wire into the grooves 4 , they are connected by electro-lytic copper-plating to the metal core 22 of the wire, as is illustrated in FIG. 5b. In the closing operation, the individual metallic contact pieces 24 are then isolated from one another by polishing or by chemical treatment of the top of the insulating housing 2 ( FIG. 5c).

Of course, you can also form the contact pieces by a little inside the insulating housing 2 in the form of fingers into it. This embodiment variant is illustrated in FIG. 4. In Fig. 4, an insulating housing 2 is Darge, which for example receives four connections 101, 102, 103 and 104 , which end at four corresponding fingers 111, 112, 113 and 114 . In this case, the connections are not removed in the central parts of the insulating housing at the height of their side walls as in the embodiment according to FIG. 3b. Of course, the two variants can of FIG. 3 and 4 also combine with each other.

The further process steps were already in the first Process variant described.

In Fig. 6, an insulating support pad 30 is ersicht Lich, on which a feed head 34 presses the insulating connecting wire 36 . The feed head contains a capillary tube 38 through which the insulated wire 36 passes, and a heating coil 40 which is intended for heating the insulation of the wire 36 until it softens; the capillary tube 38 ends in a curved portion 42 which is intended to be shaped for the wire 36 regardless of the direction of its leakage; The feed head 34 is in turn mounted on a support, not shown in the drawing, which allows the exertion of a certain pressure on the wire 36 .

In a special embodiment, the feed head 34 is fixed and the support base 30 is fixedly connected to a table 44 which is movable in its plane, the movement of which can be controlled by an automatically programmable device. With this procedure, the connecting wires 36 can be attached very close to one another, and crossovers of these connecting wires can also be achieved, wherein they can be glued to one another at the points of intersection by thermal softening of their insulating sleeves at the corresponding points. An example of such an intersection between two connecting wires is illustrated in FIG. 6, where a connecting wire 36 runs over a previously brought up connecting wire 46 . In this way, a high packing density for the connections can be achieved without having to take special precautions to avoid short-circuits between the individual connecting wires.

Instead of connecting wires with thermally softenable Insulation can also be used with a wire Cover are covered by the action of a ge convert your own chemical bath into an adhesive state leaves.

Finally, it should be noted that the carrier pad 30 shown in FIG. 6 does not necessarily have to be electrically insulating, but that the electrical insulation can also be ensured by the insulated wire. It can even be of advantage in the counterpart to produce the carrier pad 30 from electrically conductive material and then carry it over to the task of a ground connection for the entire circuit. A metallic version of the carrier pad 30 offers, for example, the additional advantage that it can bring about a particularly effective dissipation of the heat arising in the microcomponents.

Claims (6)

1. A method of manufacturing a circuit from micro bricks, in which

• - Contact pieces for the connections of the micro building blocks are attached to a substrate in accordance with the later arrangement of the micro building blocks,
• the contact pieces are connected to one another via connecting circuits made of insulated wires fastened to the substrate,
• - The wires on the contact pieces are stripped and contacted with them and
• - the connections of the micro modules are electrically connected to the contact pieces,

characterized in that

• at least one connection circuit made of an uninterrupted wire is passed over corresponding contact pieces and attached to the substrate,
• the connection circuit is checked electrically by checking that all sub-circuits are free of interruption as long as they still consist of an uninterrupted wire,
• - Wire sections not required for the final connection circuit are cut off.

2. Method for producing a circuit from micro-stones, in which

• - Micro modules are plugged onto housings with guide grooves for connecting wires as insulating material,
• - The connecting terminals of the micro building blocks are electrically connected to the ends of the connecting wires emerging from the guide grooves,
• the housings are attached to a substrate,
• - At least one connection circuit from an uninterrupted insulated wire leads over the substrate and through guide grooves via corresponding housings and is fastened thereon,
• - The insulated wire at the points where an electrical connection is to be realized, abiso liert, and
• - wire sections not required for the final connection circuit are cut off,

characterized in that before separating the wire sections

• - The contact pieces required for the electrical connections are produced by electrolytic deposition at the stripped points of the connecting wire, a suitable potential being applied to the continuous wire, and wherein
• - The connection circuit is checked electrically that all sub-circuits are checked for freedom of interruption, as long as they still consist of an uninterrupted wire.

3. The method according to claim 2, characterized,  that the contact pieces inside the insulating housing protrude from the inside of the insulation unused wire sections located in the housing while leaving those formed by the contact pieces Fingers on the inner edge of the side walls of the insulating housing be removed. 4. The method according to claim 2, characterized, that a wire to make the connection circuit with thermal or chemical adhesive insulation is used.