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DE19904834A1 - Mechanism for detaching, separating, and storing thin, fragile disc-shaped substrates for solar cells etc. manufacture - Google Patents

Mechanism for detaching, separating, and storing thin, fragile disc-shaped substrates for solar cells etc. manufacture

Info

Publication number
DE19904834A1
DE19904834A1 DE19904834A DE19904834A DE19904834A1 DE 19904834 A1 DE19904834 A1 DE 19904834A1 DE 19904834 A DE19904834 A DE 19904834A DE 19904834 A DE19904834 A DE 19904834A DE 19904834 A1 DE19904834 A1 DE 19904834A1
Authority
DE
Germany
Prior art keywords
detaching
substrates
separating
liquid
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19904834A
Other languages
German (de)
Inventor
Guenter Ernst
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ACR Automation in Cleanroom GmbH
Original Assignee
ACR Automation in Cleanroom GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ACR Automation in Cleanroom GmbH filed Critical ACR Automation in Cleanroom GmbH
Priority to DE19904834A priority Critical patent/DE19904834A1/en
Publication of DE19904834A1 publication Critical patent/DE19904834A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The mechanism detaches, separates, and stores the thin, fragile substrates from a sawing block in a liquid stream, such that the block is held in a liquid container for detaching the substrates. In the process the top substrate of the block can be brought to the surface by a lifting gear. An inclined, groove-shaped member discharges the liquid, continuously supplied to the container, thus washing the substrates into a cassette. The liquid stream is amplified by nozzles in inlet and bottom of the groove-shaped member.

Description

Bei der Herstellung von Substraten, wie sie beispielsweise für Solarzellen eingesetzt werden, verwendet man Siliziumblöcke oder -säulen, die in dünne Scheiben zersägt werden. Dazu wird der Block oder die Säule auf eine Basisplatte aufgeklebt. Nach dem Sägen haftet die Scheibe an einer Seite nur noch über die Klebestelle auf der Basisplatte. Nachdem der Block vollständig in Scheiben zerteilt ist entsteht ein kammartiges Gebilde, von dem die sehr bruchempfindlichen Scheiben nach dem heutigen Stand der Technik an der Klebestelle von Hand abgebrochen werden. Da die Scheiben nur ca. 0,3 mm dick sind und der Sägespalt auch nicht größer ist, werden bei diesem Ablösevorgang viele Scheiben beschädigt oder zerbrochen.In the manufacture of substrates, such as those used for solar cells silicon blocks or columns are used, which are sawn into thin slices become. To do this, the block or column is glued to a base plate. To When sawing, the pane sticks to one side only via the glue point on the Base plate. After the block is completely divided into slices, a comb-like structure, of which the very fragile discs after current state of the art can be broken off by hand at the glue point. There the discs are only approx. 0.3 mm thick and the saw gap is not larger, many disks are damaged or broken during this detachment process.

Die Erfindung betrifft eine Vorrichtung, mit der dünne, bruchempfindliche scheibenförmige Substrate automatisch und beschädigungsfrei aus einem Sägeblock von der Klebestelle abgelöst, vereinzelt und in eine Kassette eingelagert werden.The invention relates to a device with the thin, fragile disc-shaped substrates automatically and without damage from one Saw block detached from the gluing point, isolated and stored in a cassette become.

Erfindungsgemäß wird diese Aufgabe dadurch gelöst, daß vom Sägeblock (1), der in der Flüssigkeit (5) steht und mit dem Hubwerk (9) nachgeführt werden kann, mit einem Werkzeug (3) an der Flüssigkeitsoberfläche ein Substrat (2) nach dem anderen abgelöst wird und durch die Flüssigkeitsströmung (5.2) über ein rinnenförmiges Wehr (7) in eine Kassette (10) gespült werden kann.According to the invention, this object is achieved in that from the saw block ( 1 ), which is in the liquid ( 5 ) and can be adjusted with the lifting mechanism ( 9 ), one substrate ( 2 ) after the other with one tool ( 3 ) on the liquid surface is detached and can be flushed into a cassette ( 10 ) by the liquid flow ( 5.2 ) via a channel-shaped weir ( 7 ).

Weitere Einzelheiten der Erfindung sind dem Ausführungsbeispiel zu entnehmen, welches nachstehend in der Figur beschrieben wird.Further details of the invention can be found in the exemplary embodiment, which is described below in the figure.

Fig. 1: Längsschnitt durch die Vorrichtung:
Um den Sägeblock (1), der in dem mit Flüssigkeit (5) gefüllten Becken (4) steht mit dem jeweils obersten Substrat (2) an die Flüssigkeitsoberfläche (5.1) nachzuführen, wird der Sägeblock über den Kragarm (9.1) an dem Hubwerk (9) befestigt. Sobald das oberste Substrat (2) mit dem Werkzeug (3), das sowohl als Meißel aber auch als Laser- oder als Wasserstrahlschneidegerät, Ritz- und Schnittwerkzeug ausgebildet sein kann, abgelöst ist, wird es von der Flüssigkeitsströmung (5.2), die durch seitlich am Sägeblock (1) angebrachte Düsen verstärkt werden kann, erfaßt und über das rinnenförmige Wehr (7) in die Kassette (10) gespült. Die Kassette besitzt links und rechts Führungsschlitze, in denen die einzelnen Substrate aufgenommen werden. Mit dem Hubwerk (8) kann im Takt der Vorrichtung von unten nach oben die nächste Aufnahmeposition bereitgestellt werden. Der Flüssigkeitsstrom (5.2) wird durch die zugeführte Menge am Stutzen (4.1) gesteuert. An den Flüssigkeitsbehälter (4) schließt sich an der Wandung (4.2) eine Auffangwanne (6) an, die den Flüssigkeitsstrom (5.2, 5.3, 5.4) auffängt und am Stutzen (6.1) wieder abführt. Das Ablösen und Transportieren der Substrate im Flüssigkeitsstrom erlaubt eine äußerst behutsame Behandlung ohne Beschädigungsgefahr im Gegensatz zum Abbrechen von Hand, bei der eine Biegebeanspruchung des Substrats nicht zu vermeiden ist und beim Eindringen in den Sägespalt auch schon das nächste Substrat beschädigt werden kann. Fig. 1: longitudinal section of the device:
In order to guide the saw block ( 1 ), which is in the basin ( 4 ) filled with liquid ( 5 ), with the uppermost substrate ( 2 ) to the liquid surface ( 5.1 ), the saw block is attached to the lifting mechanism via the cantilever arm ( 9.1 ) ( 9 ) attached. As soon as the uppermost substrate ( 2 ) with the tool ( 3 ), which can be designed both as a chisel but also as a laser or as a water jet cutting device, scribing and cutting tool, is detached, it is removed from the liquid flow ( 5.2 ) by the side nozzles attached to the saw block ( 1 ) can be reinforced, detected and flushed into the cassette ( 10 ) via the channel-shaped weir ( 7 ). The cassette has guide slots on the left and right, in which the individual substrates are received. The lifting device ( 8 ) can be used to provide the next pick-up position from bottom to top in time with the device. The liquid flow ( 5.2 ) is controlled by the amount supplied to the nozzle ( 4.1 ). A collection trough ( 6 ) connects to the liquid container ( 4 ) on the wall ( 4.2 ) and collects the liquid flow ( 5.2 , 5.3 , 5.4 ) and discharges it again at the nozzle ( 6.1 ). Detaching and transporting the substrates in the liquid flow enables extremely careful handling without the risk of damage, in contrast to breaking them off by hand, in which bending stress on the substrate cannot be avoided and the next substrate can also be damaged if it penetrates the sawing gap.

Claims (5)

1. Vorrichtung zum Ablösen, Vereinzeln und Einlagern von dünnen, bruchempfindlichen scheibenförmigen Substraten von einem Sägeblock dadurch gekennzeichnet, daß das Ablösen, Vereinzeln und Einlagern in einem Flüssigkeitsstrom geschieht.1. Device for detaching, separating and storing thin, fragile, disc-shaped substrates from a saw block, characterized in that the detaching, separating and storing takes place in a liquid stream. 2. Vorrichtung nach Anspruch 1 dadurch gekennzeichnet, daß der Sägeblock zum Ablösen der Substrate in einen Flüssigkeitsbehälter gestellt wird.2. Device according to claim 1, characterized in that the saw block is placed in a liquid container to detach the substrates. 3. Vorrichtung nach den Ansprüchen 1 und 2 dadurch gekennzeichnet, daß das jeweils oberste Substrat des Sägeblocks mit Hilfe eines Hubwerks an die Oberfläche nachgeführt werden kann.3. Device according to claims 1 and 2, characterized in that the the uppermost substrate of the saw block with the aid of a lifting mechanism Surface can be tracked. 4. Vorrichtung nach den Ansprüchen 1 bis 3 dadurch gekennzeichet, daß ein geneigtes rinnenförmiges Wehr die dem Behälter stetig zugeführte Flüssigkeit abführt und damit die Substrate in eine Kassette spült.4. Device according to claims 1 to 3, characterized in that a inclined weir-shaped weir, the liquid that is constantly supplied to the container dissipates and thus rinses the substrates in a cassette. 5. Vorrichtung nach den Ansprüchen 1 bis 4 dadurch gekennzeichnet, daß der Flüssigkeitsstrom durch Düsen am Wehreinlauf und am Boden des Wehres verstärkt wird.5. Device according to claims 1 to 4, characterized in that the Liquid flow through nozzles at the weir inlet and at the bottom of the weir is reinforced.
DE19904834A 1999-02-07 1999-02-07 Mechanism for detaching, separating, and storing thin, fragile disc-shaped substrates for solar cells etc. manufacture Withdrawn DE19904834A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19904834A DE19904834A1 (en) 1999-02-07 1999-02-07 Mechanism for detaching, separating, and storing thin, fragile disc-shaped substrates for solar cells etc. manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19904834A DE19904834A1 (en) 1999-02-07 1999-02-07 Mechanism for detaching, separating, and storing thin, fragile disc-shaped substrates for solar cells etc. manufacture

Publications (1)

Publication Number Publication Date
DE19904834A1 true DE19904834A1 (en) 2000-08-10

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DE19904834A Withdrawn DE19904834A1 (en) 1999-02-07 1999-02-07 Mechanism for detaching, separating, and storing thin, fragile disc-shaped substrates for solar cells etc. manufacture

Country Status (1)

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DE (1) DE19904834A1 (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004060040B3 (en) * 2004-12-14 2006-06-14 Richter, Uwe, Dr. Device for separating and sorting of disc-form substrates has first module for separating of disc-form substrates from stack, and second module for measurement and evaluation of thickness and shape of uppermost substrate
DE102005016518B3 (en) * 2005-04-08 2006-11-02 Rena Sondermaschinen Gmbh Substrate replacing and separating device for e.g. wafers, has gripping and transfer mechanism that has gripping components for holding substrates chiseled from substrate block on carrier system, and tilting mechanism for held substrates
WO2006125559A1 (en) * 2005-05-21 2006-11-30 Aci-Ecotec Gmbh & Co. Kg Device for the separation of substrates from a stack
DE102005028112A1 (en) * 2005-06-13 2006-12-21 Schmid Technology Systems Gmbh Method for positioning and maintaining the position of substrates, in particular of thin silicon wafers after wire sawing for their separation
DE102005016519B3 (en) * 2005-04-08 2007-03-01 Rena Sondermaschinen Gmbh Device for individualizing separating and transporting break sensitive disc substrates arranged in a holder has movable splitter and carrier and a transporter for separated substrates
WO2008003502A1 (en) * 2006-07-06 2008-01-10 Rena Sondermaschinen Gmbh Apparatus and method for separating and transporting substrates
DE102006059809A1 (en) * 2006-12-15 2008-06-19 Rena Sondermaschinen Gmbh Device for separating and transporting of disc-shaped substrates, has support unit arranged inside fluid, in which individual substrates stand sequentially one behind other in form of substrate pile in feed direction
EP1935599A1 (en) * 2006-12-15 2008-06-25 Rena Sondermaschinen GmbH Device and method for the separation and the transport of substrates
EP1990293A1 (en) 2007-05-04 2008-11-12 Rena Sondermaschinen GmbH Device and method for singulating
DE102007021512A1 (en) 2007-05-04 2008-11-13 Rena Sondermaschinen Gmbh Device for collecting flat objects in perpendicularly standing positioning and for fixing and conveying objects in a defined distance to each other, has two belts arranged parallel to each other
DE102008060012A1 (en) * 2008-11-24 2010-05-27 Gebr. Schmid Gmbh & Co. Method for turning a sawn wafer block and device therefor
WO2011054510A3 (en) * 2009-11-04 2011-10-13 Solar Semi Engineering Limited Wafer processing
EP2428987A1 (en) 2010-09-13 2012-03-14 RENA GmbH Device and method for separating and transporting substrates
WO2014012879A1 (en) * 2012-07-20 2014-01-23 Xenon Automatisierungstechnik Gmbh Device for separating wafers
EP2388809A4 (en) * 2009-01-13 2014-07-09 Watanabe M & Co Ltd PLATELET SEPARATION APPARATUS, PLATELET SEPARATION / TRANSFER APPARATUS, PLATELET SEPARATION METHOD, PLATELET SEPARATION / TRANSFER METHOD, AND SOLAR CELL PLATELET SEPARATION / TRANSFER METHOD

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3403826A1 (en) * 1984-02-03 1985-08-08 Siemens AG, 1000 Berlin und 8000 München Process for producing semiconductor wafers
US4844047A (en) * 1986-11-28 1989-07-04 Wacker Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Process for sawing crystal rods or blocks into thin wafers
DE19748055A1 (en) * 1997-05-29 1998-12-03 Samsung Electronics Co Ltd Apparatus for cutting out platelets
EP0762483B1 (en) * 1995-09-06 1999-01-07 Nippei Toyama Corporation Wafer processing system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3403826A1 (en) * 1984-02-03 1985-08-08 Siemens AG, 1000 Berlin und 8000 München Process for producing semiconductor wafers
US4844047A (en) * 1986-11-28 1989-07-04 Wacker Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Process for sawing crystal rods or blocks into thin wafers
EP0762483B1 (en) * 1995-09-06 1999-01-07 Nippei Toyama Corporation Wafer processing system
DE19748055A1 (en) * 1997-05-29 1998-12-03 Samsung Electronics Co Ltd Apparatus for cutting out platelets

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
10- 32178 A. *
JP Patent Abstracts of Japan: 04-146621 A. *

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004060040B3 (en) * 2004-12-14 2006-06-14 Richter, Uwe, Dr. Device for separating and sorting of disc-form substrates has first module for separating of disc-form substrates from stack, and second module for measurement and evaluation of thickness and shape of uppermost substrate
DE102005016518B3 (en) * 2005-04-08 2006-11-02 Rena Sondermaschinen Gmbh Substrate replacing and separating device for e.g. wafers, has gripping and transfer mechanism that has gripping components for holding substrates chiseled from substrate block on carrier system, and tilting mechanism for held substrates
DE102005016519B3 (en) * 2005-04-08 2007-03-01 Rena Sondermaschinen Gmbh Device for individualizing separating and transporting break sensitive disc substrates arranged in a holder has movable splitter and carrier and a transporter for separated substrates
WO2006125559A1 (en) * 2005-05-21 2006-11-30 Aci-Ecotec Gmbh & Co. Kg Device for the separation of substrates from a stack
DE102005023618B3 (en) * 2005-05-21 2006-12-07 Aci-Ecotec Gmbh & Co.Kg Device for separating silicon wafers from a stack
DE202006020613U1 (en) 2005-06-13 2009-03-05 Schmid Technology Systems Gmbh Device for positioning and maintaining thin substrates on the cut substrate block
DE102005028112A1 (en) * 2005-06-13 2006-12-21 Schmid Technology Systems Gmbh Method for positioning and maintaining the position of substrates, in particular of thin silicon wafers after wire sawing for their separation
US7766001B2 (en) 2005-06-13 2010-08-03 Schmid Technology Systems Gmbh Device and method for positioning and blocking thin substrates on a cut substrate block
EP2127838A1 (en) 2005-06-13 2009-12-02 Schmid Technology Systems GmbH Device for positioning and blocking thin substrates on a cut substrate block
WO2008003502A1 (en) * 2006-07-06 2008-01-10 Rena Sondermaschinen Gmbh Apparatus and method for separating and transporting substrates
CN101356047B (en) * 2006-07-06 2011-11-09 Rena有限责任公司 Apparatus and method for separating and transporting substrates
DE102006059809B4 (en) * 2006-12-15 2008-08-21 Rena Sondermaschinen Gmbh Device and method for separating and transporting substrates
EP1935599A1 (en) * 2006-12-15 2008-06-25 Rena Sondermaschinen GmbH Device and method for the separation and the transport of substrates
DE102006059809A1 (en) * 2006-12-15 2008-06-19 Rena Sondermaschinen Gmbh Device for separating and transporting of disc-shaped substrates, has support unit arranged inside fluid, in which individual substrates stand sequentially one behind other in form of substrate pile in feed direction
EP1990293A1 (en) 2007-05-04 2008-11-12 Rena Sondermaschinen GmbH Device and method for singulating
DE102007021512A1 (en) 2007-05-04 2008-11-13 Rena Sondermaschinen Gmbh Device for collecting flat objects in perpendicularly standing positioning and for fixing and conveying objects in a defined distance to each other, has two belts arranged parallel to each other
WO2010058009A3 (en) * 2008-11-24 2011-04-21 Gebr. Schmid Gmbh & Co. Method for rotating a sawed wafer block and device therefor
DE102008060012A1 (en) * 2008-11-24 2010-05-27 Gebr. Schmid Gmbh & Co. Method for turning a sawn wafer block and device therefor
EP2388809A4 (en) * 2009-01-13 2014-07-09 Watanabe M & Co Ltd PLATELET SEPARATION APPARATUS, PLATELET SEPARATION / TRANSFER APPARATUS, PLATELET SEPARATION METHOD, PLATELET SEPARATION / TRANSFER METHOD, AND SOLAR CELL PLATELET SEPARATION / TRANSFER METHOD
US8863957B2 (en) 2009-01-13 2014-10-21 Kabushiki Kaisha Watanabe Shoko Wafer separation apparatus, wafer separation and transfer apparatus, wafer separation method, wafer separation and transfer method, and solar cell wafer separation and transfer method
WO2011054510A3 (en) * 2009-11-04 2011-10-13 Solar Semi Engineering Limited Wafer processing
EP2428987A1 (en) 2010-09-13 2012-03-14 RENA GmbH Device and method for separating and transporting substrates
DE102010045098A1 (en) 2010-09-13 2012-03-15 Rena Gmbh Device and method for separating and transporting substrates
WO2014012879A1 (en) * 2012-07-20 2014-01-23 Xenon Automatisierungstechnik Gmbh Device for separating wafers

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