DE19880680T1 - Halbleiterbauelement-Testgerät - Google Patents

Halbleiterbauelement-Testgerät

Info

Publication number: DE19880680T1
Authority: DE; Germany
Prior art keywords: semiconductor device; semiconductor; test; test device; device test
Prior art date: 1997-04-16
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

DE19880680T

Other languages

English (en)

Other versions

DE19880680B4 (de

Inventor

Takeshi Onishi

Katuhiko Suzuki

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Advantest Corp

Original Assignee

Advantest Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1997-04-16

Filing date

1998-04-16

Publication date

1999-05-12

1998-04-16 Application filed by Advantest Corp filed Critical Advantest Corp

1999-05-12 Publication of DE19880680T1 publication Critical patent/DE19880680T1/de

2005-11-03 Application granted granted Critical

2005-11-03 Publication of DE19880680B4 publication Critical patent/DE19880680B4/de

2018-04-17 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station

Landscapes

Engineering & Computer Science (AREA)
General Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Power Engineering (AREA)
Testing Of Individual Semiconductor Devices (AREA)
Tests Of Electronic Circuits (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)

DE19880680T 1997-04-16 1998-04-16 Halbleiterbauelement-Testgerät und Verfahren zur Durchführung von Tests in einem solchen Expired - Fee Related DE19880680B4 (de)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP09909597A JP3344548B2 (ja)	1997-04-16	1997-04-16	Ｉｃ試験装置
JP9/99095		1997-04-16
PCT/JP1998/001750 WO1998047011A1 (fr)	1997-04-16	1998-04-16	Testeur de dispositif a semiconducteur

Publications (2)

Publication Number	Publication Date
DE19880680T1 true DE19880680T1 (de)	1999-05-12
DE19880680B4 DE19880680B4 (de)	2005-11-03

Family

ID=14238326

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE19880680T Expired - Fee Related DE19880680B4 (de)	1997-04-16	1998-04-16	Halbleiterbauelement-Testgerät und Verfahren zur Durchführung von Tests in einem solchen

Country Status (5)

Country	Link
US (1)	US6225798B1 (de)
JP (1)	JP3344548B2 (de)
KR (1)	KR100312837B1 (de)
DE (1)	DE19880680B4 (de)
WO (1)	WO1998047011A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2000338195A (ja) *	1999-05-31	2000-12-08	Ando Electric Co Ltd	集積回路試験方法及び装置
JP3584845B2 (ja) *	2000-03-16	2004-11-04	日立ハイテク電子エンジニアリング株式会社	Ｉｃデバイスの試験装置及び試験方法
KR100382248B1 (ko) *	2000-09-23	2003-05-01	에스티에스반도체통신 주식회사	두 개의 스테이션용 테스터에 한 개의 핸들러를 장착하는반도체 소자의 전기적 검사시스템 및 그 검사방법
SG114493A1 (en) *	2001-07-06	2005-09-28	Jie Wu	A test handling apparatus and method
JP2004257980A (ja) *	2003-02-27	2004-09-16	Mire Kk	半導体素子テスト用ハンドラ
JP2005181222A (ja) *	2003-12-22	2005-07-07	Renesas Technology Corp	半導体装置の製造方法
US7508191B2 (en) *	2004-01-29	2009-03-24	Howard Roberts	Pin electronics implemented system and method for reduced index time
US7619432B2 (en) *	2004-01-29	2009-11-17	Howard Roberts	Tandem handler system and method for reduced index time
US7183785B2 (en) *	2004-01-29	2007-02-27	Howard Roberts	Test system and method for reduced index time
KR100640590B1 (ko) *	2004-10-21	2006-11-01	삼성전자주식회사	핸들러 원격 제어가 가능한 반도체 소자의 검사 시스템 및그 작동방법
US7408339B2 (en)	2005-10-17	2008-08-05	Samsung Electronics Co., Ltd.	Test system of semiconductor device having a handler remote control and method of operating the same
US7528617B2 (en) *	2006-03-07	2009-05-05	Testmetrix, Inc.	Apparatus having a member to receive a tray(s) that holds semiconductor devices for testing
US8334764B1 (en) *	2008-12-17	2012-12-18	Utac Thai Limited	Method and apparatus to prevent double semiconductor units in test socket
US9753081B2 (en) *	2010-02-05	2017-09-05	Celerint, Llc	Muxing interface platform for multiplexed handlers to reduce index time system and method
US9349679B2 (en)	2010-08-31	2016-05-24	Utac Thai Limited	Singulation method for semiconductor package with plating on side of connectors
MY181423A (en)	2011-03-01	2020-12-21	Celerint Llc	Method and system for utilizing stand-alone controller in multiplexed handler test cell for indexless tandem semiconductor test
US9817062B2 (en) *	2011-05-19	2017-11-14	Celerint, Llc.	Parallel concurrent test system and method
MY168794A (en) *	2011-05-19	2018-12-04	Celerint Llc	Parallel concurrent test system and method
KR102467416B1 (ko) *	2020-12-24	2022-11-16	주식회사 엑시콘	이종의 피검사 디바이스를 테스트하는 테스트 시스템

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4423815A (en) *	1981-08-10	1984-01-03	Contrel Corporation	Component sorting apparatus
DE3340183A1 (de)	1983-11-07	1985-05-15	Ekkehard Ing.(Grad.) 8011 Zorneding Ueberreiter	Vorrichtung zum weiterleiten von bauteilen, insbesondere von integrierten chips, von einem eingangsmagazin zu einem ausgangsmagazin
JPH071301B2 (ja)	1988-01-08	1995-01-11	新明和工業株式会社	電子部品の搬送装置
JPH02147973A (ja)	1988-11-30	1990-06-06	Tokyo Electron Ltd	半導体検査装置
JPH034181A (ja)	1989-06-01	1991-01-10	Mitsubishi Electric Corp	半導体試験装置
DE4126920A1 (de)	1990-08-17	1992-03-19	Csir Corporate Building Scient	Pruefautomat fuer elektronische bauelemente
US5227717A (en) *	1991-12-03	1993-07-13	Sym-Tek Systems, Inc.	Contact assembly for automatic test handler
US5307011A (en) *	1991-12-04	1994-04-26	Advantest Corporation	Loader and unloader for test handler
US5313156A (en) *	1991-12-04	1994-05-17	Advantest Corporation	Apparatus for automatic handling
US5319353A (en)	1992-10-14	1994-06-07	Advantest Corporation	Alarm display system for automatic test handler
JP2962129B2 (ja) *	1993-12-29	1999-10-12	日本電気株式会社	半導体試験装置
JP3067005B2 (ja)	1994-06-30	2000-07-17	株式会社アドバンテスト	テストトレイ用位置決めストッパ
JP3412114B2 (ja) *	1995-07-26	2003-06-03	株式会社アドバンテスト	Ｉｃ試験装置

1997
- 1997-04-16 JP JP09909597A patent/JP3344548B2/ja not_active Expired - Fee Related
1998
- 1998-04-16 KR KR1019980709526A patent/KR100312837B1/ko not_active IP Right Cessation
- 1998-04-16 US US09/202,467 patent/US6225798B1/en not_active Expired - Lifetime
- 1998-04-16 WO PCT/JP1998/001750 patent/WO1998047011A1/ja active IP Right Grant
- 1998-04-16 DE DE19880680T patent/DE19880680B4/de not_active Expired - Fee Related

Also Published As

Publication number	Publication date
US6225798B1 (en)	2001-05-01
DE19880680B4 (de)	2005-11-03
KR20000015966A (ko)	2000-03-25
JP3344548B2 (ja)	2002-11-11
JPH10288645A (ja)	1998-10-27
KR100312837B1 (ko)	2001-12-12
WO1998047011A1 (fr)	1998-10-22

Publication	Publication Date	Title
DE19680786T1 (de)	1997-10-02	Halbleiterbauelement-Testgerät
DE19823069B8 (de)	2007-06-06	Halbleiterbauelement
DE69637769D1 (de)	2009-01-15	Halbleitervorrichtung
DE69738008D1 (de)	2007-09-27	Halbleiterbauelement
DE69739242D1 (de)	2009-03-19	Halbleitervorrichtung
DE69806578D1 (de)	2002-08-22	Waferhaltevorrichtung
DE69727373D1 (de)	2004-03-04	Halbleitervorrichtung
DK1029240T3 (da)	2004-10-11	Måleapparat
DE69637698D1 (de)	2008-11-13	Halbleitervorrichtung
DE19980453T1 (de)	2000-03-30	Halbleiterbauelement-Testgerät
DE69637809D1 (de)	2009-02-26	Halbleiteranordnung
DE69942813D1 (de)	2010-11-11	Halbleitervorrichtung
DE59607521D1 (de)	2001-09-27	Halbleiter-Bauelement-Konfiguration
DE59508581D1 (de)	2000-08-24	Halbleiterbauelement
DE19880680T1 (de)	1999-05-12	Halbleiterbauelement-Testgerät
DE19782246T1 (de)	2000-01-05	IC-Testgerät
DE69737320D1 (de)	2007-03-22	Halbleitervorrichtung
DE69522789D1 (de)	2001-10-25	Halbleitervorrichtung
DE69829091D1 (de)	2005-03-31	Messungsgerät
DE69501381D1 (de)	1998-02-12	Halbleitergerät
DE69513207D1 (de)	1999-12-16	Halbleitervorrichtung
DE69927476D1 (de)	2005-11-03	Halbleiteranordnung
DE19681689T1 (de)	1998-11-05	Gesichertes Halbleiterbauelement
DE69941921D1 (de)	2010-03-04	Halbleitervorrichtung
DE69728850D1 (de)	2004-06-03	Halbleiteranordnung

Legal Events

Date	Code	Title
1999-05-12	OP8	Request for examination as to paragraph 44 patent law
2000-06-08	8607	Notification of search results after publication
2006-05-04	8364	No opposition during term of opposition
2011-02-17	8339	Ceased/non-payment of the annual fee