DE19737244A1 - Device and method for regulating the phase position of high-frequency electrodes in plasma processes - Google Patents
Device and method for regulating the phase position of high-frequency electrodes in plasma processesInfo
- Publication number
- DE19737244A1 DE19737244A1 DE1997137244 DE19737244A DE19737244A1 DE 19737244 A1 DE19737244 A1 DE 19737244A1 DE 1997137244 DE1997137244 DE 1997137244 DE 19737244 A DE19737244 A DE 19737244A DE 19737244 A1 DE19737244 A1 DE 19737244A1
- Authority
- DE
- Germany
- Prior art keywords
- arrangement
- indicates
- frequency
- phase position
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32155—Frequency modulation
- H01J37/32165—Plural frequencies
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
Abstract
Description
Plasmaprozesse im Vakuum (Niederdruck-Gasentladungen) finden weite Anwen dungsgebiete in der Oberflächentechnik, zum Beispiel bei der Herstellung dünner Schichten durch Kathodenzerstaubung (Spullern). Häufig werden hierbei zur Anre gung der Gasentladung elektromagnetische Wechselfelder verwendet. Eine typi sche Arbeitsfrequenz ist die Industriefrequenz von 13,56 MHz.Plasma processes in vacuum (low pressure gas discharges) are widely used areas of application in surface technology, for example in the manufacture of thin Layers by sputtering. Often, gas discharge used alternating electromagnetic fields. A typi Working frequency is the industrial frequency of 13.56 MHz.
Häufig werden hierbei Anordnungen verwendet, bei denen mehrere Kathoden gleichzeitig in Betrieb sind (simultan-Sputtern). Weiterhin ist es ein gebräuchliches Konzept, zur Verbesserung der Schichthaftung und der Schichteigenschaften auch die Substrate während des Beschichtungsvorganges mit einer Hochfrequenzlei stung zu beaufschlagen (Bias). In vielen Fällen werden hierzu mehrere Hochfre quenzgeneratoren gleichzeitig betrieben.Arrangements are often used in which several cathodes are operating simultaneously (simultaneous sputtering). Furthermore, it is a common one Concept to improve the layer adhesion and the layer properties too the substrates during the coating process with a high-frequency lead to act on (bias). In many cases, several Hochfre sequence generators operated simultaneously.
Um Instabilitäten durch Oszillationen der Differenzfrequenzen zu vermeiden, wer den in solchen Anlagen die Hochfrequenzgeneratoren meist phasenstarr gekoppelt (common exciter). Für die Einstellung der Phasenlage wird jedoch zumeist keine Einheit vorgesehen oder nur ein manuell einzustellender Phasenschieber einge baut. Es ist bekannt, daß die Phasenlage einen gravierenden Einfluß auf den Pro zeß mit seinen elektrischen Parametern, der Stabilität und der Neigung zu Über schlägen (Arcing) hat.To avoid instabilities due to oscillations of the difference frequencies, who the high-frequency generators in such systems are usually phase-locked (common exciter). For the adjustment of the phase position, however, usually none Unit provided or only a manually adjustable phase shifter inserted builds. It is known that the phase position has a serious influence on the Pro zeß with its electrical parameters, stability and tendency to over has arcing.
Die Vorgehensweise zur Optimierung ist mit den manuellen Einheiten jedoch nicht zufriedenstellend, da hier der Phasenverlauf der Strecke nicht kontrolliert werden kann. Zum Beispiel erzeugen die häufig verwendeten automatischen Anpassungs netzwerke (Matchboxen) Phasenverschiebungen, die sich beim Abstimmen verän dern. Jede Einstellung am Phasenschieber ruft einen Abstimmvorgang und damit eine neue Phasenverschiebung hervor, deren Ergebnis der Bediener nicht kennt. Eine vernünftige Einstellstrategie ist somit nicht gegebenHowever, the procedure for optimization is not with the manual units satisfactory, since the phase progression of the route is not checked here can. For example, the commonly used automatic adjustment generate networks (matchboxes) phase shifts that change when voting other. Each setting on the phase shifter calls a tuning process and thus a new phase shift emerges, the result of which the operator does not know. There is therefore no reasonable adjustment strategy
Erfindungsgemäß wird die vorteilhafte Verfahrensweise beschrieben, die Phasenla ge direkt an den Elektroden zu erfassen und automatisch auf einen von der Anla gensteuerung aus einstellbaren Sollwert zu regeln. Hierzu werden an den Elektro den kapazitive Spannungsteiler vorgesehen, die den zeitlichen Verlauf der Span nungen aufnehmen. Einer dieser Spannungsverläufe wird zur Referenz für die (dif ferentielle) Phasenregelung erklärt.According to the invention the advantageous procedure is described, the phase LA ge directly on the electrodes and automatically on one of the system control from the adjustable setpoint. To do this, look at the electro the capacitive voltage divider provided that the time course of the span recordings. One of these voltage profiles becomes the reference for the (dif optional) phase regulation explained.
Eine elektronische Einheit mißt die Phasenverschiebung der anderen Elektrodensi gnale relativ zur Referenz. Diese Verschiebung wird mit dem Sollwert verglichen. Hieraus wird das Treibersignal gebildet, welches als Ansteuerung für die so gere gelte Elektrode verwendet wird. Hiermit ist es möglich, von einem anderen Signal geber aus, z. B. von der Anlagensteuerung aus, einen Sollwert für die Phasenlage vorzugeben, dessen Einhaltung durch die erfindungsgemäße Anordnung sicherge stellt wird. Damit ist die Reproduzierbarkeit an den relevanten Stellen, den Elektro den, gewährleistet.An electronic unit measures the phase shift of the other electrode sensors gnale relative to the reference. This shift is compared to the setpoint. From this, the driver signal is formed, which is used as a control for the so gelte electrode is used. With this it is possible from another signal donor, e.g. B. from the system control, a setpoint for the phase position to specify compliance with the arrangement according to the invention is posed. This means reproducibility at the relevant points, the electrical system guaranteed.
Dies ermöglicht einen reproduzierbaren Betrieb und erschließt neue Optimierungs möglichkeiten für die Prozesse. So können physikalisch offensichtlich relevante Einstellungen (in Phase, Gegenphase, 90° etc.) im Hinblick auf ihre Prozeßauswir kungen untersucht werden. Andere Parameter können über die Phasenlage gere gelt werden. So kann zum Beispiel eine DC-Biasspannung bei konstanten Leistun gen über die Phasenlage geregelt werden.This enables reproducible operation and opens up new optimization possibilities for the processes. So physically obviously relevant Settings (in phase, counter phase, 90 ° etc.) with regard to their process effects be examined. Other parameters can be adjusted via the phase position be valid. For example, a DC bias voltage with constant power be regulated via the phase position.
Zur Optimierung der Prozeßstabilität wird es möglich, Datenbasen anzulegen und wissensbasierte Regelsysteme einzusetzen.To optimize the process stability it is possible to create databases and to use knowledge-based control systems.
Claims (18)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1997137244 DE19737244A1 (en) | 1997-08-27 | 1997-08-27 | Device and method for regulating the phase position of high-frequency electrodes in plasma processes |
PCT/EP1998/005308 WO1999010912A1 (en) | 1997-08-27 | 1998-08-20 | Method and system for supplying several electrodes for plasma processes with alternating voltages of predefined phase position |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1997137244 DE19737244A1 (en) | 1997-08-27 | 1997-08-27 | Device and method for regulating the phase position of high-frequency electrodes in plasma processes |
Publications (1)
Publication Number | Publication Date |
---|---|
DE19737244A1 true DE19737244A1 (en) | 1999-03-04 |
Family
ID=7840274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1997137244 Withdrawn DE19737244A1 (en) | 1997-08-27 | 1997-08-27 | Device and method for regulating the phase position of high-frequency electrodes in plasma processes |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE19737244A1 (en) |
WO (1) | WO1999010912A1 (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0155496B1 (en) * | 1984-03-02 | 1991-01-02 | The Perkin-Elmer Corporation | Plasma emission source |
US5345145A (en) * | 1992-03-31 | 1994-09-06 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for generating highly dense uniform plasma in a high frequency electric field |
US5467883A (en) * | 1992-12-14 | 1995-11-21 | At&T Corp. | Active neural network control of wafer attributes in a plasma etch process |
US5474648A (en) * | 1994-07-29 | 1995-12-12 | Lsi Logic Corporation | Uniform and repeatable plasma processing |
DE19521387A1 (en) * | 1995-06-13 | 1996-12-19 | Leybold Ag | Matching or adaptor network tuning method e.g. for HF plasma generation |
EP0774886A1 (en) * | 1995-11-15 | 1997-05-21 | Applied Materials, Inc. | Method and apparatus for generating a plasma |
US5643364A (en) * | 1994-11-30 | 1997-07-01 | Applied Materials, Inc. | Plasma chamber with fixed RF matching |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4584079A (en) * | 1983-10-11 | 1986-04-22 | Honeywell Inc. | Step shape tailoring by phase angle variation RF bias sputtering |
JPH0747820B2 (en) * | 1989-09-22 | 1995-05-24 | 株式会社日立製作所 | Film forming equipment |
US5228939A (en) * | 1991-12-30 | 1993-07-20 | Cheng Chu | Single wafer plasma etching system |
US5824606A (en) * | 1996-03-29 | 1998-10-20 | Lam Research Corporation | Methods and apparatuses for controlling phase difference in plasma processing systems |
-
1997
- 1997-08-27 DE DE1997137244 patent/DE19737244A1/en not_active Withdrawn
-
1998
- 1998-08-20 WO PCT/EP1998/005308 patent/WO1999010912A1/en unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0155496B1 (en) * | 1984-03-02 | 1991-01-02 | The Perkin-Elmer Corporation | Plasma emission source |
US5345145A (en) * | 1992-03-31 | 1994-09-06 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for generating highly dense uniform plasma in a high frequency electric field |
US5467883A (en) * | 1992-12-14 | 1995-11-21 | At&T Corp. | Active neural network control of wafer attributes in a plasma etch process |
US5474648A (en) * | 1994-07-29 | 1995-12-12 | Lsi Logic Corporation | Uniform and repeatable plasma processing |
US5643364A (en) * | 1994-11-30 | 1997-07-01 | Applied Materials, Inc. | Plasma chamber with fixed RF matching |
DE19521387A1 (en) * | 1995-06-13 | 1996-12-19 | Leybold Ag | Matching or adaptor network tuning method e.g. for HF plasma generation |
EP0774886A1 (en) * | 1995-11-15 | 1997-05-21 | Applied Materials, Inc. | Method and apparatus for generating a plasma |
Also Published As
Publication number | Publication date |
---|---|
WO1999010912A1 (en) | 1999-03-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
8139 | Disposal/non-payment of the annual fee |