DE19642681A1 - Transceiver module for a phase controlled antenna - Google Patents

Abstract

The invention relates to a transmitter and receiver module in which several layers of components, especially a HF layer and a control layer, are arranged on top of each other in a housing. The HF layer, for instance, contains all HF components required for a T/R module and/or HF sub-assemblies (transmission/reception path, amplitude and/or phase final controlling elements) which are required to control a transmitter/receiver radiation element. Preferably, control layer contains all (digitally operating) sub-assemblies (ASICs, EPROMs) which are required for (digital) control and/or setting of one or several transmitter/receiver modules. If necessary, a third layer can be provided, containing components, especially capacitors, required for T/R module voltage and power supply.

Description

The invention is based on a transmit / receive module for a phase-controlled antenna according to the generic term of Pa claim 1.

A phase-controlled antenna essentially consists of a matrix-shaped arrangement of transmit / receive radiators elements that have a (matrix) spacing of approximately λ / 2 ha ben, where λ is the wavelength of the transmitted and / or emp trapped radiation means. Are now between the beams different phase relationships is at least the type (character) of the sen de / reception lobe and the (main) transmission / reception direction adjustable.  

It is appropriate to the circuitry required for this order immediately behind the level of the radiator elements to arrange, because then in particular a distribution network for the send / receive signals are omitted.

It is still useful, at least in the immediate vicinity of the high-frequency part of the transmit / receive modules for the phase and / or amplitudes contained therein control logic required, preferably in di gital working technology is trained to arrange.

It is advantageous to design this circuit arrangement in this way ten that even with a variety of radiator elements, for example a few thousand, the smallest possible number number of cable lines and / or plug-in connections required is, on the one hand, between the transmit / receive modules and on the other hand between their entirety, which are also active ves frontend is called, and an associated central Evaluation and / or control unit.

Such a frontend should be mechanically robust and exceptional which have a low weight, so that it for example can be rotatably arranged on a mast. This is particularly useful for a radar antenna. Should these now for example in centimeters or millimeters Wavelength range are operated, so the beam ler elements have a corresponding distance as well the transmit / receive modules arranged behind it.

The invention has for its object a genus according to the transmit / receive module that has a high Pac different density for electronic components has the kind that is mechanically robust, spatially small how inexpensive to manufacture.  

This problem is solved by the in the characterizing part of claim 1 specified features. Beneficial Refinements and / or further developments are the others Removable claims.

A first advantage of the invention is that a good dissipation of the heat generated is possible, so that in particular a high transmission power for a radiation element ment can be reached.

A second advantage is that all are used Components and / or assemblies, especially in an indu serial production, are well testable.

A third advantage is that a predefinable type Number of transmit / receive modules on a common carrier ger, which can be flooded by a coolant, zei installed in a len or double line and checked can.

A fourth advantage is that one may defective module during maintenance and / or repair work in is interchangeable at low cost.

Further advantages result from the following Be spelling.

The invention is based on execution examples explained in more detail.

These are suitable for a radar transmit / receive antenna in the GHz range. A circuit arrangement known per se for an individual transmit / receive module is assumed. This includes in particular

• - A transmission path that has at least one GHz power ver contains more;
• - a reception path that has at least one low-noise GHz Contains preamplifier;
• - A send / receive switch, for example a Zir kulator for coupling a transmit / receive radiator element to the send and receive path;
• - At least one adjustable amplitude and / or Pha sensor for setting a predefinable broadcast / Reception characteristics of all radiator elements as well for performing an electrically controlled turn kung the transmission / reception lobes;
• - The associated digital circuit logic;
• - The associated line connections as well
• - the associated current / voltage supply.

The detailed structure of the aforementioned electri rule and / or electronic assemblies is in the following not described, since the invention essentially the An order of these modules relates to each other.

In the invention, it is advantageously possible to a predeterminable number of rows next to each other ordered radiator elements belonging to assemblies in one to arrange single electrically conductive (module) housing.

The invention is based on a layered arrangement of the Assemblies within the (module) housing.  

The invention is based on an example forth explained with reference to schematically illustrated Characters. Show it

Fig. 1 shows a cross section through a module containing at play, two transmission / reception modules (T / R modules) for explaining the layer structure;

FIG. 2a, 2b are plan views of different layers, within one module;

Fig. 3 shows a cross section through a carrier, which cher all assemblies of a complete (emitter) line.

Fig. 1 shows a cross section through a module having a length l of about 60 mm and a height h of about 8.5 mm. The module has a bottom BO with a thickness of approximately 0.75 mm and is made of a material, for example aluminum-silicon carbide (AL / SIC), the coefficient of thermal expansion of which is adapted to the electronic components and / or assemblies located thereon is. On the floor BO side walls SW are attached, which also have a thickness of about 0.75 mm and which consist for example of Kovar, titanium or Al / SiC (aluminum / silicon carbide). On the side walls SW is a lid DE, which consists of a material adapted to the side walls and which has a thickness of approximately 0.5 mm. The lid can be connected to the SW side walls, preferably by a welded connection. The side walls SW also have several openings in the area of the floor BO for carrying out connecting lines VL, preferably planar transitions, with which connections to test devices and to other components can be produced. On the floor BO is now a first assembly level, which is also referred to below as high frequency layer or HF layer HFS, for example by soldering and / or gluing, so that a good electrical and thermally conductive connection is produced. The HF layer HFS consists, for example, of a plate-shaped ceramic substrate, for example aluminum oxide, with a thickness of approximately 0.25 mm. Lines, for example in micro-line technology or in coplanar technology, are preferably attached to the substrate, and additional components may be provided, for example by adhesive, soldered and / or bonded connections. Openings are found in the substrate, in which then in particular active semiconductor circuits, for example a monolithically integrated high-frequency circuit MMIC, are arranged, specifically directly on the floor BO, preferably by gluing or soldering. This advantageously brings about good thermal and electrical contacts. The semiconductor circuits can be connected to the lines on the substrate by means of bond connections. Further thermal and / or electrical contacts between the bottom BO and the top (lines) of the substrate can be produced by means of additional openings and / or bores (via holes) in the substrate. These are then filled with conductive materials. This HF layer HFS is preferably connected to the connecting lines VL via bond connections BON. The structure described can be checked and / or compared, for example, by means of an automatic device which is connected to the connecting lines VL.

After such an intermediate test, the HF Layer the second placement level STE, which is also control layer or control level is attached, at for example also by gluing and / or soldering as well as Vias to the RF layer. The second set  level also consists of one in the circuit technology currently common substrate (cross hatched shown), on which, if possible, the complete tax relectronics, as well as the associated connecting lines for the module is attached. The control electronics contains preferably digitally working (control) components and / or (control) modules (EPROM, ASIC) and Lei power modulators for the first assembly below level HFS and the complete module. This second Assembly level STE is advantageously before installation can be checked and / or compared in the module. After this Installation in the module can be advantageous if necessary a further intermediate test will be carried out, preferably as an automatically working test and / or Ab equal device. This second placement level is STE via vias already mentioned and / or via so-called ball-grid-array connections and / or via tape connections connected to the first assembly level speaking of the required electrical circuit.

Above the second placement level STE is a third loading level SPV (shown in dashed lines). This contains all for the chip on a circuit board Power supply and / or power supply to the module Components, in particular capacitors CAP.

The placement levels are, if necessary, by means of spacing holder AB arranged one above the other.

The arrangement described is therefore more advantageous as a mechanical, electrical and thermal Ver bond between the assembly levels achieved, so that very compact, three-dimensional structures with short electrical connections and shields can be reached the.  

FIG. 2 shows top views, with the cover DE removed, of arrangements corresponding to FIG. 1. FIG. 2a shows a top view of the first assembly level HFS. This consists of the HF parts (transmitting / receiving parts) of, for example, two S / E modules arranged next to one another, which are separated from one another by a shielding and / or contacting arrangement AK, for example a ball grid array connection arrangement are. Fig. 2b shows a plan view of the Fig. 2a belonging to the second component level STE, on the underside of which, for example, a shielding and / or contacting arrangement AK corresponding contact arrangement is introduced. The second assembly level STE shown includes all modules that are required to control the underlying first assembly level. It can be seen that an inexpensive and reliable connection between the assembly levels can be established in this way.

Such transmit / receive modules (T / R modules) are advantageous unfortunately too compact and reliable line and / or matrix arrangements can be combined. All are in modules next to each other in a row interconnected. The line is therefore as a whole test and / or adjustable. In addition, such a line can be inexpensive can be replaced quickly, for example during maintenance and / or repair work on a phase controlled antenna that contains a multitude of lines.

Fig. 3 shows a cross section through such a order. This consists, for example, of an electrically and thermally highly conductive carrier TR, which is produced, for example, as a so-called extruded profile made of an aluminum alloy. The carrier TR has, for example, a width br of approximately 100 mm and a height ha of approximately 14 mm. The length (perpendicular to the drawing plane) is selected depending on the number of T / R modules to be arranged side by side. The carrier TR has in its middle loading two side by side cooling channels KK through which a coolant, for example a glycol / water mixture or water, can be passed to dissipate the heat loss of the T / R modules attached above. These are fastened, for example, by screws SR so that good electrical and thermal contacts are created. Transmitter / receiver radiator elements RE are also attached to the carrier TR, preferably one radiator element per module. In the area between the radiator elements RE and the TR modules, further components and / or assemblies are arranged, for example the transmission / reception switches (circulators) required for transmission / reception modules, current / voltage supply parts DC PCB and an HF distribution , which is labeled RF-TRIPLATE. Such components and / or assemblies are preferably verbun by band and / or so-called MOE connections, polymer structures with metal components (BONDING / MOE). On the side of the TR modules facing away from the radiator element RE, further current / voltage supplies (DC PCB) and RF distributions (RF TRIPLATE) are available.

With such an arrangement, one is advantageously closed reliable and inexpensive production of a line possible, with only a small number of costs inexpensive and fault-prone plug connections required is used, especially at the ends of a line to ver binding with other and / or a central unit.

The invention is not limited to the exemplary embodiments described, but analogously to other applicable bar. For example, it is possible, in particular, to replace the side walls SW and the cover DE ( FIG. 1) with a side wall SW and the cover DE ( FIG. 1) with a (plastic) casting compound which is suitable for electronic uses. Furthermore, it is possible to attach further TR modules and the circuit arrangements described on the underside of the carrier TR ( FIG. 3), so that a double row of radiator elements and associated modules is produced. In addition, if necessary, it is possible to arrange further components and / or assemblies, for example the transmission / reception switch (circulator) within the modulator housing BO, SW, DE.

Claims (7)

1. Transmit / receive module for a phase-controlled antenna, at least consisting of

• - A high-frequency circuit, which contains a transmission path, a reception path and phase and / or amplitude control element and
• - A control circuit for controlling the high-frequency circuit, characterized in that
• - That a plate-shaped floor (BO) with a predeterminable size is available from a material with predeterminable elec trical and thermal properties,
• that a first assembly level (HFS), which contains at least a substantial part of the high-frequency circuit, is attached to the floor (BO),
• - That above the first assembly level (HFS), a second assembly level (STE), which contains at least a substantial part of the control circuit required to control the first assembly level (HFS), is brought,
• - That the two assembly levels are connected at predetermined points at least by electrical connections and
• - That both assembly levels in a common elec trically conductive housing (SW, DE), the electrically lei tend to the bottom (BO) is arranged.

2. Transceiver module according to claim 1, characterized records that in the housing (SW, DE) an additional third te assembly level (SPV) is available, at least a substantial part of the voltage / power supply Circuits for the first and second assembly level (HFS, STE) contains. 3. Send / receive module according to one of the preceding An sayings, characterized in that each of the assembly planes (HFS, STE, SPV) from a substrate with be sensitive connecting cables and electrical components elements and / or assemblies. 4. Send / receive module according to one of the preceding An sayings, characterized in that in the substrate of breakthroughs are available on the first assembly level (HFS), active (high-frequency) semiconductors that generate heat  components and / or a heat-generating active (high frequency) semiconductor assembly is (are) such that the semiconductor device and / or the semiconductor device group at least one thermal contact to the floor (BO) to sit. 5. Transmit / receive module according to one of the preceding An sayings, characterized in that the housing (SW, DE) at least from an electrically shielding material stands. 6. Send / receive module according to one of the preceding An sayings, characterized in that the housing (SW, DE) at least partially consists of a casting compound, the Surface contains an electrically shielding material. 7. Send / receive module according to one of the preceding An sayings for use in a line arrangement, a carrier (TR) with at least one coolant channel (KK) is available, on which a predeterminable number of Ge houses, with assembly levels contained therein, at least are attached in a heat-conducting manner.