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DE19627858A1 - Complex power electronic module e.g. for converters of variable speed drives - Google Patents

Complex power electronic module e.g. for converters of variable speed drives

Info

Publication number
DE19627858A1
DE19627858A1 DE1996127858 DE19627858A DE19627858A1 DE 19627858 A1 DE19627858 A1 DE 19627858A1 DE 1996127858 DE1996127858 DE 1996127858 DE 19627858 A DE19627858 A DE 19627858A DE 19627858 A1 DE19627858 A1 DE 19627858A1
Authority
DE
Germany
Prior art keywords
substrate
complex power
frame
circuit board
power component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE1996127858
Other languages
German (de)
Inventor
Andreas Liebsch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EUROTEC GES fur ENERGIESPARTE
Original Assignee
EUROTEC GES fur ENERGIESPARTE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUROTEC GES fur ENERGIESPARTE filed Critical EUROTEC GES fur ENERGIESPARTE
Priority to DE1996127858 priority Critical patent/DE19627858A1/en
Publication of DE19627858A1 publication Critical patent/DE19627858A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

A solid state switching module has a printed circuit substrate 12 on to which a number of single power chips 20 are located. conductor tracks are formed in strips along both edges 18 and these are connected to the chips by bond wires 22. Contact pins 16 for external connection are located along the edges of a housing of insulating material. A heat sink may be placed against the underside of the substrate.

Description

Die Erfindung betrifft ein komplexes Leistungsbauele­ ment. Leistungsbauelemente bestehen zur Zeit meist aus Halbleiterbauelementen, die auf einem Keramiksubstrat oder dergleichen in gelöteter Technik angeordnet werden. Eine Mehrzahl dieser Halbleiter-"Chips" werden mit einer Logik und mit entsprechenden Stiften nach außen verbun­ den.The invention relates to a complex power module ment. Power components usually consist of Semiconductor devices based on a ceramic substrate or the like can be arranged in soldered technology. A majority of these semiconductor "chips" are made with a Logic and connected to the outside with appropriate pins the.

Leistungsmodule werden dabei hauptsächlich in Umrichtern zur Steuerung von drehzahlveränderbaren Antrieben und zur Anpassung unterschiedlichster Spannungsformen einge­ setzt. Dies macht eine sehr vielfältige Auslegung der Module für ihre jeweiligen Anwendungsfälle nötig. Den­ noch verbleibt man bei einer normierten, vorbekannten Gehäusegröße.Power modules are mainly used in converters for controlling variable-speed drives and to adapt a wide variety of voltage types  puts. This makes a very diverse interpretation of the Modules required for their respective applications. Den one still remains with a standardized, known one Case size.

Allerdings sollen die Anschlüsse der Leistungsmodule bei unterschiedlicher Bestückung dem jeweiligen Anwendungs­ fall gerecht werden. Auch gleichartig bestückte Module können unterschiedliche Anforderungen an die Anschlüsse mit sich bringen. Mit bisherigen normierten Gehäusen, die aus einfachen Kunststoffrahmen ggf. auch einem ein­ fachen Deckel bestehen, ist dies nicht möglich. Die Kunststoffrahmen geben feste Orte für die Stifte vor, die zudem häufig fest in die Deckel eingespritzt waren. Die Stifte wurden nach Anfügen des Rahmens sodann an entsprechenden Orten auf dem Substrat aufgelötet, was das Substrat belastete. Auch wird durch den bisherigen Aufbau eine feste Anzahl an Stiften vorgegeben, zu der keiner mehr hinzugefügt werden kann und von der nur schwer einer entfernt werden kann.However, the connections of the power modules should be included different equipment for the respective application case. Modules equipped in the same way can have different connection requirements entail. With previous standardized housings, the one made of simple plastic frames if necessary fold lid, this is not possible. The Plastic frames provide fixed locations for the pens which were also often injected firmly into the lid. The pens were then attached to the frame corresponding places on the substrate soldered what strained the substrate. Also through the previous one Set up a fixed number of pens to which no more can be added and only one difficult to remove one.

Das Substrat dient dabei als Träger für die Leistungs­ bauelemente und zur Abführung der Verlustleistung. Soll dabei wie jetzt in zunehmendem Maße gewünscht, eine hö­ here Verlustleistung abgeführt werden, wird sich dies durch aufwendigeres Material und daher erhöhte Kosten für das Substrat erheblich bemerkbar machen.The substrate serves as a carrier for the performance components and to dissipate the power loss. Should thereby, as now increasingly desired, a height Power dissipation will be dissipated here, this will through more expensive material and therefore increased costs make it noticeably noticeable to the substrate.

Der Erfindung liegt daher die Aufgabe zugrunde, die An­ schlüsse bei einem Leistungsbauelement variabel positio­ nieren zu können und verschiedene Steckerbilder bei ei­ nem normierten Rahmen zu ermöglichen.The invention is therefore based on the object conclusions for a power component variable position kidney and different plug images at egg to enable a standardized framework.

Erfindungsgemäß wird diese Aufgabe durch die im Hauptan­ spruch aufgeführten Merkmale gelöst. Die Unteransprüche geben vorteilhafte Ausführungsformen der Erfindung wie­ der.According to the invention, this task is performed by the main one characteristics listed solved. The subclaims  give advantageous embodiments of the invention such of the.

Insbesondere ist durch die Vorsehung eines gesonderten Leiterplattenstreifens möglich, daß die Anschlüsse je nach Anwendungszweck variabel in Bezug auf die Rahmenab­ messungen positioniert werden können. Es sind verschie­ dene Anschlußtypen für ein Leistungsmodul möglich.In particular, the provision of a separate PCB strip possible that the connections each depending on the application, with respect to the frame measurements can be positioned. They are different possible connection types for a power module.

Durch die Einführung einer weiteren Ebene, die die Sub­ stratebene gegebenenfalls überlappt, ist zudem eine Platzeinsparung ergeben, die den Einsatz der normierten Gehäuse auch für größere Substrate möglich macht. Die damit erreichte höhere integrationsdichte senkt die Ko­ sten und ermöglicht einen einfacheren Fertigungsprozeß.By introducing another level that the Sub strat level may overlap, is also a Space savings result from the use of the standardized Housing also possible for larger substrates. The the higher integration density thus achieved lowers the knockout and enables a simpler manufacturing process.

Nicht zuletzt ist das Material der zusätzlichen Leiter­ plattenstreifen nicht thermisch belastet, so daß auf die üblichen Leiterplattenmaterialien zurückgegriffen werden kann, was wiederum Kostenvorteile bringt. Die Halterung der Stifte erfolgt bevorzugt durch eine Abdeckung, die durch vergossenes Material oder durch einen Deckel rea­ liert werden kann.Last but not least, the material is the additional ladder plate strips not thermally stressed, so that on the usual circuit board materials can be used can, which in turn brings cost advantages. The bracket the pins are preferably made by a cover that through potted material or through a lid rea can be lated.

Durch die Vorsehung zweier entlang der Längserstreckung der Substratplatte sich erstreckender Leiterplatten­ streifen werden die zur Verbindung des Leiterplatten­ streifens mit den Anschlußstiften vorgesehenen Bonddräh­ te möglichst kurz ausgelegt sein. Die Anschlüsse auf der Leiterplatte können geklebt, gelötet oder geschweißt werden. Es können auch bereits bestückte Leiterplatten­ streifen in den Kunststoffrahmen eingeklebt werden.By the provision of two along the length of the substrate plate extending printed circuit boards strips to connect the circuit boards strip provided with the connecting pins te should be as short as possible. The connections on the Printed circuit boards can be glued, soldered or welded will. It can also use printed circuit boards strips can be glued into the plastic frame.

Statt der Verwendung der in den Rahmen eingespritzten Stifte aus dem Stand der Technik können auch an einen Leiterplattenstreifen angesetzte Stifte als vormontier­ tes Teil verwendet werden.Instead of using the injected into the frame Prior art pens can also be attached to one  PCB strips attached pins as pre-assembled used part.

Durch die Möglichkeit, die Logikbausteine oder ggf. auch nur logische Verdrahtungen auf diese Leiterplattenstrei­ fen aufzubringen, ist eine Möglichkeit geschaffen, die komplexen Leistungsbauelemente in einfacher Weise an die jeweiligen Anwendungszwecke anzupassen, ohne daß neuar­ tige Substratgeometrien nötig sind. Das Aufbringen eines Weichvergusses auf den Halbleiter anstelle eines Deckels ist ebenso möglich. Allerdings kann auch nach wie vor ein Deckel oder ein Hartverguß als mechanischer Schutz vorgesehen werden.The possibility of the logic modules or possibly also only logical wiring on this circuit board streak is an opportunity created that complex power components in a simple way to the to adapt to any application without new term substrate geometries are necessary. Applying one Soft potting on the semiconductor instead of a lid is also possible. However, still can a lid or a hard casting as mechanical protection be provided.

Durch die Vorsehung einer Aufnahme für einen Leiterplat­ tenstreifen in den Kunststoffrahmen einer weiteren Ebene wird zudem eine zusätzliche Kante in dem Rahmen geschaf­ fen, die die Festigkeit des Rahmens erhöht, so daß, falls gleichbleibende Festigkeit gewünscht ist, insge­ samt der Rahmen mit weniger Material ausgeführt werden kann.By providing a receptacle for a printed circuit board strips in the plastic frame of another level an additional edge is also created in the frame fen, which increases the strength of the frame so that, if constant strength is desired, in total including the frame with less material can.

Weitere Merkmale und Vorteile der Erfindung ergeben sich aus nachfolgender Beschreibung eines bevorzugten Ausfüh­ rungsbeispiels anhand der beigefügten Zeichnung.Further features and advantages of the invention result from the following description of a preferred embodiment Example using the attached drawing.

Dabei zeigt:It shows:

Fig. 1 ein komplexes Leistungsbauelement in Drauf­ sicht von oben mit zwei schraffiert darge­ stellten Leiterplatten an seinen Längsseiten, Fig. 1 a complex power device in plan view from above with two hatched Darge presented circuit boards on its longitudinal sides,

Fig. 2 eine Ansicht des Leistungsbauelementes von der Seite, in der die sich rechtwinklig von dem Rahmen nach oben erstreckenden Stifte zu er­ kennen sind, Fig. 2 is a view of the power device from the side, in which are to know at right angles from the frame upwardly extending pins to it,

Fig. 3 einen teilweisen Querschnitt durch ein Lei­ stungsbauelement nach Fig. 1 oder 2, bei der das Substrat und die Anordnung des Leiterplat­ tenstreifens in einer weiteren Ebene zu erken­ nen ist, Fig. 3 is a partial cross section through a Lei stungsbauelement of FIG. 1 or 2, wherein the substrate and the arrangement of the printed tenstreifens is in another plane to erken NEN,

Fig. 4 ein weiteres komplexes Leistungsbauelement ähnlich der Fig. 1, Fig. 4 shows a further complex power device similar to FIG. 1,

Fig. 5 eine Draufsicht auf die Steckerkonfiguration der Fig. 4, und Fig. 5 is a plan view of the connector configuration of Fig. 4, and

Fig. 6 eine Ansicht des Leistungsbauelementes der Fig. 4 und 5 von der Seite. Fig. 6 is a view of the power device of FIGS. 4 and 5 from the side.

In der Fig. 1 ist ein Leistungsbauelement mit einem Kunststoffrahmen 10 dargestellt, bei dem die einzelnen Leistungsbauelemente 20 mit Bonddrähten 22 untereinander und auch mit entsprechenden Anschlußflächen 24 auf den (schraffiert dargestellten) Leiterplattenstreifen 18 verbunden sind. Auf diesen Anschlußflächen 24 finden sich auch die aufgelöteten Anschlußstifte 16, die nur in ihrem Querschnitt dargestellt sind. An den Schmalseiten des Rahmens 10 sind die Verschraubungsösen für die Lei­ stungsmodule zur Befestigung in Schaltschränken o. ä. zu erkennen. Um die einzelnen Chips 20 herum sind auf dem Substrat 12 Leiterflächen vorgesehen, die teilweise mit­ einander verbunden und teilweise gegeneinander isoliert sind. In FIG. 1, a power device is shown with a plastic frame 10, in which the individual power devices 20 with bonding wires 22 with each other and also with corresponding pads 24 on the (hatched) circuit board strips 18 are connected. The soldered connection pins 16 , which are only shown in their cross section, are also found on these connection surfaces 24 . On the narrow sides of the frame 10 , the screw eyelets for the Lei stungsmodule for attachment in control cabinets or the like can be seen. Around the individual chips 20 , conductor surfaces are provided on the substrate 12 , some of which are connected to one another and some of which are insulated from one another.

In der Fig. 2 ist in seitlicher Ansicht auf das in der Fig. 1 dargestellte Modul zu erkennen, wie sich durch die Vertikalerstreckung der Kontaktstifte 16 eine be­ stimmte Steckerkonfiguration ergibt. Diese kann nun er­ findungsgemäß durch einfaches Austauschen eines Leiter­ plattenstreifens 18 an den jeweils gewünschten Zweck an­ gepaßt werden. Ein mechanischer Eingriff in bereits auf­ gelötete Stifte ist nicht mehr nötig.In Fig. 2 can be seen in a side view of the module shown in Fig. 1, as a result of the vertical extension of the contact pins 16, a certain connector configuration be. This can he according to the invention by simply replacing a printed circuit board strip 18 to the desired purpose. A mechanical intervention in pins already soldered is no longer necessary.

In der Fig. 3 ist anhand eines Querschnittes durch ein Leistungsbauelement, bei dem der Kunststoffrahmen 10 im rechten Teil geschnitten dargestellt wurde, zu erkennen, wie auf dem Substrat 12 ein Leistungshalbleiter 20 auf­ gesetzt ist, der mit Bonddrähten 22 mit der Leiterplatte 18 verbunden ist, auf der ein Anschlußstift 16 befestigt ist.In FIG. 3 it can be seen from a cross section through a power component, in which the plastic frame 10 has been shown in section on the right, how a power semiconductor 20 is placed on the substrate 12 , which is connected to the printed circuit board 18 with bonding wires 22 , on which a pin 16 is attached.

Der Leiterplattenstreifen 18 befindet sich dabei gegen­ über dem Substrat 12 in einer anderen höheren Ebene und überlappt dieses.The circuit board strip 18 is located opposite the substrate 12 in another higher plane and overlaps this.

Unter dem Substrat 12 befinden sich üblicher- und vor­ teilhafterweise Kühlflächen (nicht dargestellt), die mit dem Substrat 12 zusammenwirken, um die Wärme der Lei­ stungsbauelemente abzuführen. Es kann aber denkbar sein, die Kühlung von oben zu bewirken und den oder die Lei­ terplattenstreifen 18 unter dem Substrat 12 überlappen zu lassen.Under the substrate 12 are usually - and before geous cooling surfaces (not shown) which cooperate with the substrate 12 to dissipate the heat of the power components. However, it may be conceivable to effect cooling from above and to allow the circuit board strip (s) 18 to overlap under the substrate 12 .

Claims (5)

1. Komplexes Leistungsbauelement mit einem Rahmen (10) und wenigstens einem Substrat (12) auf dem eine Lei­ stungselektronik positioniert ist, wobei der Rahmen (10) eine Vielzahl sich nach außen erstreckender Kon­ taktstifte (16) besitzt, gekennzeichnet durch wenigstens einen Leiterplattenstreifen (18), der am Rahmen (10) benachbart dem Substrat (12) vorgesehen ist, der mit dem Substrat (12) und den darauf befindli­ chen Elementen über Bonddrähte (22) verbunden ist, und auf dem die Kontaktstifte (16) angesetzt sind.1. Complex power component with a frame ( 10 ) and at least one substrate ( 12 ) on which Lei stungselektronik is positioned, the frame ( 10 ) having a plurality of outwardly extending con tact pins ( 16 ), characterized by at least one circuit board strip ( 18 ), which is provided on the frame ( 10 ) adjacent to the substrate ( 12 ), which is connected to the substrate ( 12 ) and the elements thereon via bonding wires ( 22 ), and on which the contact pins ( 16 ) are attached. 2. Komplexes Leistungsbauelement nach Anspruch 1, da­ durch gekennzeichnet, daß der wenigstens eine Leiter­ plattenstreifen (18) in einer zweiten Ebene gegenüber dem Substrat (12) angeordnet ist.2. Complex power component according to claim 1, characterized in that the at least one circuit board strip ( 18 ) is arranged in a second plane relative to the substrate ( 12 ). 3. Komplexes Leistungsbauelement nach einem der voran­ gehenden Ansprüche, dadurch gekennzeichnet, daß sich zwei Leiterplattenstreifen (18) beidseitig entlang der Längsseiten parallel zu dem Substrat (12) erstrecken. 3. Complex power component according to one of the preceding claims, characterized in that two circuit board strips ( 18 ) extend on both sides along the long sides parallel to the substrate ( 12 ). 4. Komplexes Leistungsbauelement nach einem der voran­ gehenden Ansprüche, dadurch gekennzeichnet, daß logi­ sche Bauelemente, die nicht Leistungsbauelemente sind, auf dem/den Leiterplattenstreifen (18) angeordnet sind.4. Complex power component according to one of the preceding claims, characterized in that logical components, which are not power components, are arranged on the / the circuit board strip ( 18 ). 5. Komplexes Leistungsbauelement nach einem der voran­ gehenden Ansprüche, dadurch gekennzeichnet, daß die Kontaktstifte (16) durch eine über dem/den Leiterplat­ tenstreifen (18) vergossene Abdeckung (14) an dem Rah­ men (10) gehaltert sind.5. Complex power component according to one of the preceding claims, characterized in that the contact pins ( 16 ) by a strip over the / the printed circuit boards ( 18 ) cast cover ( 14 ) on the frame men ( 10 ) are held.
DE1996127858 1996-07-11 1996-07-11 Complex power electronic module e.g. for converters of variable speed drives Withdrawn DE19627858A1 (en)

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Publication number Priority date Publication date Assignee Title
DE19951865A1 (en) * 1998-12-22 2000-08-03 Mannesmann Vdo Ag Circuit board e.g. for vehicle indicator instrument, has light source mounted on bearer in form of bridge attached to circuit board by fixing arrangement in form of clip fixing or hinge made in one piece with instrument housing
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DE10024377A1 (en) * 2000-05-17 2001-11-29 Eupec Gmbh & Co Kg Housing device and contact element to be used therein
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DE10024377B4 (en) * 2000-05-17 2006-08-17 Infineon Technologies Ag Housing device and contact element to be used therein

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