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DE1913679B2 - Waermeleitvorrichtung fuer elektrische baugruppen - Google Patents

Waermeleitvorrichtung fuer elektrische baugruppen

Info

Publication number
DE1913679B2
DE1913679B2 DE19691913679 DE1913679A DE1913679B2 DE 1913679 B2 DE1913679 B2 DE 1913679B2 DE 19691913679 DE19691913679 DE 19691913679 DE 1913679 A DE1913679 A DE 1913679A DE 1913679 B2 DE1913679 B2 DE 1913679B2
Authority
DE
Germany
Prior art keywords
heat conducting
conducting device
electric assemblies
assemblies
electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19691913679
Other languages
English (en)
Other versions
DE1913679A1 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to DE19691913679 priority Critical patent/DE1913679B2/de
Publication of DE1913679A1 publication Critical patent/DE1913679A1/de
Publication of DE1913679B2 publication Critical patent/DE1913679B2/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE19691913679 1969-03-18 1969-03-18 Waermeleitvorrichtung fuer elektrische baugruppen Ceased DE1913679B2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19691913679 DE1913679B2 (de) 1969-03-18 1969-03-18 Waermeleitvorrichtung fuer elektrische baugruppen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691913679 DE1913679B2 (de) 1969-03-18 1969-03-18 Waermeleitvorrichtung fuer elektrische baugruppen

Publications (2)

Publication Number Publication Date
DE1913679A1 DE1913679A1 (de) 1970-09-24
DE1913679B2 true DE1913679B2 (de) 1971-03-25

Family

ID=5728499

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691913679 Ceased DE1913679B2 (de) 1969-03-18 1969-03-18 Waermeleitvorrichtung fuer elektrische baugruppen

Country Status (1)

Country Link
DE (1) DE1913679B2 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2608125A1 (de) * 1976-02-27 1977-09-08 Tekade Felten & Guilleaume Einsatz fuer gestelle der elektrischen uebertragungstechnik
DE3310109A1 (de) * 1983-03-21 1984-09-27 Siemens AG, 1000 Berlin und 8000 München Isolierender abstandshalter fuer leiterplatten
DE9316149U1 (de) * 1993-10-22 1993-12-23 Daimler-Benz Aerospace Aktiengesellschaft, 80995 München Wärmeableithauben für Elektroniksteckkarten in einem kühlbaren Gehäuse

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4029999A (en) * 1975-04-10 1977-06-14 Ibm Corporation Thermally conducting elastomeric device
DE3003373A1 (de) * 1980-01-31 1981-08-06 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Elektrische baueinheit mit einer leiterplatte
JPS58218376A (ja) * 1982-06-14 1983-12-19 Mitsubishi Electric Corp 溶接機の出力制御器
FR2654890B1 (fr) * 1989-11-17 1996-08-02 Matra Sep Imagerie Inf Dispositif de dissipation thermique pour carte de circuits imprimes et procede pour sa fabrication.
FR2669178B1 (fr) * 1990-11-09 1996-07-26 Merlin Gerin Coffre et carte electronique a drain thermique et procede de fabrication d'une telle carte.
DE4339786C5 (de) * 1993-11-18 2004-02-05 Emi-Tec Elektronische Materialien Gmbh Verfahren zur Herstellung einer Anordung zur Wärmeableitung

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2608125A1 (de) * 1976-02-27 1977-09-08 Tekade Felten & Guilleaume Einsatz fuer gestelle der elektrischen uebertragungstechnik
DE3310109A1 (de) * 1983-03-21 1984-09-27 Siemens AG, 1000 Berlin und 8000 München Isolierender abstandshalter fuer leiterplatten
DE9316149U1 (de) * 1993-10-22 1993-12-23 Daimler-Benz Aerospace Aktiengesellschaft, 80995 München Wärmeableithauben für Elektroniksteckkarten in einem kühlbaren Gehäuse

Also Published As

Publication number Publication date
DE1913679A1 (de) 1970-09-24

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Legal Events

Date Code Title Description
BHV Refusal