DE112017007068T8 - Halbleitervorrichtung - Google Patents
Halbleitervorrichtung Download PDFInfo
- Publication number
- DE112017007068T8 DE112017007068T8 DE112017007068.6T DE112017007068T DE112017007068T8 DE 112017007068 T8 DE112017007068 T8 DE 112017007068T8 DE 112017007068 T DE112017007068 T DE 112017007068T DE 112017007068 T8 DE112017007068 T8 DE 112017007068T8
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/10—Measuring sum, difference or ratio
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/668—Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/669—Vertical DMOS [VDMOS] FETs having voltage-sensing or current-sensing structures, e.g. emulator sections or overcurrent sensing cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
- H10D62/152—Source regions of DMOS transistors
- H10D62/155—Shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
- H10D62/156—Drain regions of DMOS transistors
- H10D62/157—Impurity concentrations or distributions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/393—Body regions of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/252—Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/512—Disposition of the gate electrodes, e.g. buried gates
- H10D64/513—Disposition of the gate electrodes, e.g. buried gates within recesses in the substrate, e.g. trench gates, groove gates or buried gates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/165—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
- G01R19/16504—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values characterised by the components employed
- G01R19/16519—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values characterised by the components employed using FET's
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/256—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are recessed in semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017025929A JP6693438B2 (ja) | 2017-02-15 | 2017-02-15 | 半導体装置 |
JP2017-025929 | 2017-02-15 | ||
PCT/JP2017/045324 WO2018150713A1 (ja) | 2017-02-15 | 2017-12-18 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE112017007068T5 DE112017007068T5 (de) | 2019-10-31 |
DE112017007068T8 true DE112017007068T8 (de) | 2019-12-19 |
Family
ID=63169271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE112017007068.6T Expired - Fee Related DE112017007068T8 (de) | 2017-02-15 | 2017-12-18 | Halbleitervorrichtung |
Country Status (5)
Country | Link |
---|---|
US (1) | US20190341483A1 (de) |
JP (1) | JP6693438B2 (de) |
CN (1) | CN110291643A (de) |
DE (1) | DE112017007068T8 (de) |
WO (1) | WO2018150713A1 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11063146B2 (en) | 2019-01-10 | 2021-07-13 | Texas Instruments Incorporated | Back-to-back power field-effect transistors with associated current sensors |
JP7092044B2 (ja) | 2019-01-16 | 2022-06-28 | 株式会社デンソー | 半導体装置 |
DE102020107747B4 (de) | 2019-03-22 | 2023-07-20 | Infineon Technologies Ag | Transistoranordnung mit einem lasttransistor und einemerfassungstransistor und elektronische schaltung mit dieser |
WO2020208738A1 (ja) * | 2019-04-10 | 2020-10-15 | 三菱電機株式会社 | 半導体装置 |
JP7363079B2 (ja) * | 2019-04-15 | 2023-10-18 | 富士電機株式会社 | 半導体装置 |
US11004970B2 (en) | 2019-05-20 | 2021-05-11 | Nxp Usa, Inc. | Mirror device structure for power MOSFET and method of manufacture |
JP7099404B2 (ja) * | 2019-05-27 | 2022-07-12 | 株式会社デンソー | 負荷駆動装置 |
JP7310343B2 (ja) * | 2019-06-14 | 2023-07-19 | 富士電機株式会社 | 半導体装置 |
JP7425943B2 (ja) * | 2019-12-12 | 2024-02-01 | 株式会社デンソー | 炭化珪素半導体装置 |
US12068408B2 (en) * | 2020-07-15 | 2024-08-20 | Semiconductor Components Industries, Llc | High electron mobility transistor |
US11410990B1 (en) * | 2020-08-25 | 2022-08-09 | Semiq Incorporated | Silicon carbide MOSFET with optional asymmetric gate clamp |
JP7571560B2 (ja) | 2021-01-15 | 2024-10-23 | 株式会社デンソー | 半導体装置 |
EP4181212A1 (de) * | 2021-11-11 | 2023-05-17 | Infineon Technologies Dresden GmbH & Co . KG | Halbleiterbauelement |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3515298B2 (ja) * | 1995-12-07 | 2004-04-05 | 株式会社東芝 | 半導体装置 |
JP3450650B2 (ja) * | 1997-06-24 | 2003-09-29 | 株式会社東芝 | 半導体装置 |
JP2008235788A (ja) * | 2007-03-23 | 2008-10-02 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置 |
JP4748149B2 (ja) * | 2007-12-24 | 2011-08-17 | 株式会社デンソー | 半導体装置 |
CN102522427B (zh) * | 2008-01-29 | 2014-07-30 | 富士电机株式会社 | 半导体装置 |
JP5447504B2 (ja) * | 2009-03-24 | 2014-03-19 | トヨタ自動車株式会社 | 半導体装置 |
DE112009004805B4 (de) * | 2009-05-28 | 2019-03-28 | Toyota Jidosha Kabushiki Kaisha | Halbleitervorrichtung |
WO2014013618A1 (ja) * | 2012-07-20 | 2014-01-23 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
JP5758365B2 (ja) * | 2012-09-21 | 2015-08-05 | 株式会社東芝 | 電力用半導体素子 |
US10355127B2 (en) * | 2015-07-02 | 2019-07-16 | Mitsubishi Electric Corporation | Semiconductor device |
-
2017
- 2017-02-15 JP JP2017025929A patent/JP6693438B2/ja active Active
- 2017-12-18 DE DE112017007068.6T patent/DE112017007068T8/de not_active Expired - Fee Related
- 2017-12-18 WO PCT/JP2017/045324 patent/WO2018150713A1/ja active Application Filing
- 2017-12-18 CN CN201780086349.3A patent/CN110291643A/zh active Pending
-
2019
- 2019-07-16 US US16/513,047 patent/US20190341483A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2018150713A1 (ja) | 2018-08-23 |
US20190341483A1 (en) | 2019-11-07 |
JP6693438B2 (ja) | 2020-05-13 |
JP2018133433A (ja) | 2018-08-23 |
DE112017007068T5 (de) | 2019-10-31 |
CN110291643A (zh) | 2019-09-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed | ||
R083 | Amendment of/additions to inventor(s) | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |