DE1114593B - Process for the manufacture of selenium rectifiers - Google Patents
Process for the manufacture of selenium rectifiersInfo
- Publication number
- DE1114593B DE1114593B DEST13592A DEST013592A DE1114593B DE 1114593 B DE1114593 B DE 1114593B DE ST13592 A DEST13592 A DE ST13592A DE ST013592 A DEST013592 A DE ST013592A DE 1114593 B DE1114593 B DE 1114593B
- Authority
- DE
- Germany
- Prior art keywords
- selenium
- metal
- steaming
- compounds
- metals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052711 selenium Inorganic materials 0.000 title claims description 43
- 239000011669 selenium Substances 0.000 title claims description 43
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 title claims description 40
- 238000000034 method Methods 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 238000010025 steaming Methods 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 10
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 7
- 238000007740 vapor deposition Methods 0.000 claims description 7
- 150000002739 metals Chemical class 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- 150000002367 halogens Chemical class 0.000 claims description 5
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims description 2
- 125000002524 organometallic group Chemical group 0.000 claims description 2
- 150000002736 metal compounds Chemical class 0.000 claims 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 11
- 239000000654 additive Substances 0.000 description 11
- 230000000996 additive effect Effects 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 5
- 239000007789 gas Substances 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 2
- 125000003748 selenium group Chemical group *[Se]* 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- JZUAITAPPPWUSR-UHFFFAOYSA-N bis(selanylidene)iron Chemical compound [Fe](=[Se])=[Se] JZUAITAPPPWUSR-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- -1 selenium Halogen compounds Chemical class 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000006200 vaporizer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/01—Manufacture or treatment
- H10D48/04—Manufacture or treatment of devices having bodies comprising selenium or tellurium in uncombined form
- H10D48/043—Preliminary treatment of the selenium or tellurium, its application to foundation plates or the subsequent treatment of the combination
- H10D48/0431—Application of the selenium or tellurium to the foundation plate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02425—Conductive materials, e.g. metallic silicides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02491—Conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02614—Transformation of metal, e.g. oxidation, nitridation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/01—Manufacture or treatment
- H10D48/04—Manufacture or treatment of devices having bodies comprising selenium or tellurium in uncombined form
- H10D48/042—Preparation of foundation plates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/01—Manufacture or treatment
- H10D48/04—Manufacture or treatment of devices having bodies comprising selenium or tellurium in uncombined form
- H10D48/043—Preliminary treatment of the selenium or tellurium, its application to foundation plates or the subsequent treatment of the combination
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Vapour Deposition (AREA)
Description
DEUTSCHESGERMAN
PATENTAMTPATENT OFFICE
St 13592 Vmc/21gSt 13592 Vmc / 21g
BEKANNTMACHUNG DER ANMELDUNG UNDAUSGABE DER AUSLEGESCHRIFTsNOTICE THE REGISTRATION AND ISSUE OF EDITORIAL
5. OKTOBER 1961OCTOBER 5, 1961
Die Erfindung betrifft ein Verfahren zur Herstellung von Selengleichrichtem durch Aufdampfen des Selens im Vakuum unter Zusatz von Metallen zum halogenhaltigen Selen.The invention relates to a method for producing selenium rectifiers by vapor deposition Selenium in a vacuum with the addition of metals to the halogen-containing selenium.
Es ist bereits bekannt, dem Selen für Selengleichrichter verschiedene Stoffe zuzusetzen, um die Leitfähigkeit des Selens zu beeinflussen, insbesondere um die Leitfähigkeit der Selenschicht zu verbessern. Seit langem werden daher dem Selen Halogene oder Halogenverbindungen zugesetzt. Eine weitere Verbesserung wird erreicht, wenn dem Selen gleichzeitig mit dem Halogen gewisse Metalle in geringer Menge zugesetzt werden. Als Metallzusätze kommen beispielsweise Antimon, Wismut, Zinn, Tellur, Thallium, Cer und Eisen in Frage.It is already known to use selenium for selenium rectifiers to add various substances to influence the conductivity of selenium, in particular to to improve the conductivity of the selenium layer. For a long time, therefore, halogens or selenium Halogen compounds added. A further improvement is achieved when using the selenium at the same time Certain metals are added in small quantities to the halogen. For example, there are metal additives Antimony, bismuth, tin, tellurium, thallium, cerium and iron in question.
Die Zusätze werden dem Selen beispielsweise in einer Menge von 0,01 bis 1 % zugefügt. Diese Metallzusätze bewirken eine erhebliche Verminderung des spezifischen Widerstandes der halogenhaltigen Selenschicht. The additives are added to the selenium, for example, in an amount of 0.01 to 1%. These metal additives cause a considerable reduction in the specific resistance of the halogen-containing selenium layer.
Es besteht nun das Problem, diese Metallzusätze dem Selen in geeigneter Menge beizumischen bzw. in vorteilhafter Weise in der Selenschicht zu verteilen. Beim Aufbringen der Selenschicht durch Aufdampfen im Vakuum können die Zusätze gleichzeitig mit dem Selen in einen getrennten Verdampfer verdampft und damit in die Selenschicht eingebracht werden. Zu einer genauen Dosierung des Zusatzstoffes ist jedoch hierbei ein großer Aufwand erforderlich, da beide oder auch mehrere Verdampfer unabhängig voneinander geregelt werden müssen und infolge der besonderen Verhältnisse im Vakuum mit einer gewissen Anheizzeit und Abkühlzeit der Verdampfer gerechnet werden muß, innerhalb der eine Regelung nicht möglich ist.There is now the problem of adding these metal additives to the selenium in a suitable amount or in to be distributed advantageously in the selenium layer. When applying the selenium layer by vapor deposition In a vacuum, the additives can be evaporated in a separate evaporator and at the same time as the selenium thus introduced into the selenium layer. However, an exact dosage of the additive is required this requires a great deal of effort, since both or several evaporators are independent of one another must be regulated and due to the special conditions in the vacuum with a certain The heating-up and cooling-down times of the evaporator must be taken into account, within which control is not possible is.
Zur Umgehung dieser Schwierigkeiten werden daher bei dem Verfahren nach der Erfindung während des Aufdampfens der Selenschicht eine oder mehrere chemische Verbindungen der zuzusetzenden Metalle in den Bedampfungsraum eingebracht, die bei Zimmertemperatur einen Dampfdruck von mindestens 10~3 Torr haben und sich im Vakuum auf der erwärmten Selenoberfläehe in eine bei Aufdampfbedingungen gasförmige Verbindung und das entsprechende Metall zersetzen.To circumvent these difficulties are therefore incorporated one or more chemical compounds of the to be added metals in the Bedampfungsraum in the method according to the invention during the vapor deposition of the selenium layer having a vapor pressure of at least 10 -3 Torr at room temperature and in a vacuum on the heated Selenoberfläehe decompose into a compound which is gaseous under vapor deposition conditions and the corresponding metal.
Hierfür geeignete Verbindungen sind z. B. die Metallkarbonyle. Diese Verbindungen sind bei Zimmertemperatur und Atmosphärendruck flüssig, beim Arbeitsdruck der Auf dampf anlagen, ungefähr 10~3 Torr, gasförmig und können in einfacher Weise, wie weiter unten beschrieben, in den Bedampfungsraum eingebracht werden. Auf der erwärmten Selenoberfläche Verfahren zur Herstellung von SelengleiehriehternCompounds suitable for this purpose are e.g. B. the metal carbonyls. These compounds are liquid at room temperature and atmospheric pressure, at the working pressure of the steam systems, about 10 -3 Torr, gaseous and can be introduced into the steaming room in a simple manner, as described below. On the heated selenium surface process for the production of selenium gauges
Anmelder:Applicant:
Standard Elektrik Lorenz Aktiengesellschaft, Stuttgart-Zuffenhausen, Hellmuth-Hirth-Str. 42Standard electrical system Lorenz Aktiengesellschaft, Stuttgart-Zuffenhausen, Hellmuth-Hirth-Str. 42
Dr. rer. nat. Hans Lauckner, Weissenburg (Bay.), und Dr. rer, nat. Hermann Karl Josef Strosche,Dr. rer. nat. Hans Lauckner, Weissenburg (Bay.), And Dr. rer, nat. Hermann Karl Josef Strosche,
Nürnberg,
sind als Erfinder genannt wordenNuremberg,
have been named as inventors
werden diese Verbindungen in Kohlenmonoxyd und das entsprechende Metall zersetzt, das in die Selenschicht eingebaut wird. Durch Dosierung der in den Vakuumraum eingebrachten Menge des Zusatzstoffes läßt sich leicht die Menge des Zusatzstoffes in der Selenschicht bemessen. Außerdem treten die zum Einbau in die Selenschicht vorgesehenen Metalle auf diese Weise in einer besonders geeigneten Form auf, was offenbar darauf zurückzuführen ist, daß die durch Zersetzung der Verbindung auf der Selenoberfläche entstehenden Metallteilchen besonders reaktionsfähig sind. Durch geeignete Bemessung der Vakuumpumpe wird dafür gesorgt, daß das durch die Reaktion entstehende Gas in kurzer Zeit abgesaugt wird und daß auch der Partialdruck der eingeführten chemischen Verbindung schnell abnimmt, so daß eine genaue Dosierung des Zusatzstoffes möglich ist. Man kann so während des Aufdampfens des Selens die Menge des zugesetzten Metalls variieren, so daß Selengleichrichter definierter Eigenschaften hergestellt werden können. Zweckmäßig wird der Zusatz von Metall gegen Ende der Bedampfung vermindert oder unterlassen, so daß die zuletzt aufgedampfte Selenschicht einen höheren Widerstand besitzt als die übrige Schicht.these compounds are broken down into carbon monoxide and the corresponding metal that is in the selenium layer is installed. By dosing the amount of additive introduced into the vacuum space the amount of additive in the selenium layer can easily be measured. In addition, the Incorporation in the selenium layer provided metals in this way in a particularly suitable form, which is apparently due to the fact that the decomposition of the compound on the selenium surface the resulting metal particles are particularly reactive. By appropriately dimensioning the Vacuum pump ensures that the gas produced by the reaction is sucked off in a short time and that the partial pressure of the chemical compound introduced also decreases rapidly, so that a exact dosage of the additive is possible. You can thus during the evaporation of the selenium Amount of added metal vary, so that selenium rectifiers of defined properties are produced can be. The addition of metal is expediently reduced or towards the end of the vapor deposition omitted, so that the last deposited selenium layer has a higher resistance than that remaining layer.
An Stelle von Metallcarbonyle können auch metallorganische Verbindungen, z. B. Metallalkyle, verwendet werden.Instead of metal carbonyls, organometallic ones can also be used Connections, e.g. B. metal alkyls can be used.
Zweckmäßigerweise wird die Anordnung dabei so getroffen, daß der Bedampfungsraum, in dem die zu bedampfenden Grundplatten fest oder beweglich überAppropriately, the arrangement is made so that the steaming room in which the to steaming base plates fixed or movable over
109 707/215109 707/215
einem Selenverdampfer angeordnet sind, über ein Nadelventil mit einem geeigneten Gefäß in Verbindung stehen, das einen genügenden Vorrat an dereinzubringenden Verbindung enthält. Während des Aufdampfens der Selenschicht kann durch Öffnen des Nadelventils eine gewünschte Menge der Verbindung in dem Bedampfungsraum eingelassen werden, die sich auf der Oberfläche der Selenschicht zersetzt und das einzubauende Metall zurückläßt. Natürlich muß das Ventil, das den Bedampfungsraum mit dem Vorratsgefäß verbindet, so angeordnet sein, daß die Selenoberfläche gleichmäßig von dem Dampf bestrichen wird. Gegebenenfalls wird es vorteilhaft sein, mehrere Einlaßdüsen anzubringen. Auch muß darauf geachtet werden, daß sich nicht das im Selenverdämpfer befindliche Selen mit dem Zusatzstoff anreichert. Zur Erzielung eines gleichmäßigen Dampfdruckes im Vorratsgefäß wird dieses mit geeigneten Mitteln auf konstanter Temperatur gehalten.a selenium vaporizer, in connection with a suitable vessel via a needle valve stand that contains a sufficient supply of the compound to be introduced. During the Vapor deposition of the selenium layer can create a desired amount of the compound by opening the needle valve be let into the steaming room, which decomposes on the surface of the selenium layer and leaves behind the metal to be installed. Of course, the valve that connects the steaming room with the Storage vessel connects, be arranged so that the selenium surface evenly coated by the steam will. If necessary, it will be advantageous to attach several inlet nozzles. Also must be on it care must be taken that the selenium in the selenium suppressor does not become enriched with the additive. In order to achieve a uniform vapor pressure in the storage vessel, it is filled with suitable Means kept at constant temperature.
Als Zusatzstoff kann z. B. Eisenpentakarbonyl, Fe(CO)5, verwendet werden, das bei Zimmertemperatur einen Dampfdruck von etwa 20 Torr hat. Nach Evakuierung des Bedampfungsraumes wird nun mit Beginn der Selenbedampfung das Nadelventil, das den Vorratsraum mit dem Bedampfungsraum verbindet, so weit geöffnet, daß sich im Bedampfungsraum ein konstanter Druck von 10"3 Torr einstellt. Die zu bedampfenden Grundplatten haben dabei eine Temperatur von etwa 100° C. Der Eisenpentakarbonyldampf zersetzt sich dabei ständig an der frisch kondensierenden Selenoberfläche, und dabei reagiert das entstehende, feinstverteilte Eisen mit dem chlorhaltigen Selen. Solange im Bedampfungsraum Eisenpentakarbonyldampf vorhanden ist, wird in die aufgedampfte Selenschicht Eisen in gleichmäßiger Verteilung, im allgemeinen als Eisenchlorid oder Eisenselenid, eingebaut.As an additive, for. B. iron pentacarbonyl, Fe (CO) 5 , can be used, which has a vapor pressure of about 20 torr at room temperature. After evacuation of the Bedampfungsraumes the needle valve that connects the reservoir with the Bedampfungsraum is now opened so far that is established a constant pressure of 10 "3 Torr in Bedampfungsraum with the beginning of the Selenbedampfung. The have to be vapor-deposited base plates, a temperature of about 100 ° C. The iron pentacarbonyl vapor constantly decomposes on the freshly condensing selenium surface, and the resulting finely divided iron reacts with the chlorine-containing selenium Iron selenide, built-in.
Zweckmäßigerweise wird die Zufuhr an Eisenpentakarbonyl gegen Ende der Bedampfung eingestellt, d. h. nach Erreichung von zwei Dritteln der gewünschten Selenschichtdicke das Nadelventil geschlossen. Nun wird der Rest der Selenschicht bei sinkendem Partialdruck an Karbonyldampf aufgedampft. Die Zufuhr an Karbonyl kann auch kurz vor dem Erreichen der gewünschten Selenschichtdicke abgebrochen und der Rest des Selens erst nach einer kurzen Pause aufgedampft werden, so daß inzwischen der im Bedampfungsraum vorhandene Rest an Karbonyldampf abgepumpt wird. Es kann auch vorteilhaft sein, den Rest des Karbonyldampfes durch Spülen mit einem inerten Gas aus dem Bedampfungsraum zu entfernen. In jedem Fall ist es vorteilhaft, wenn die letzten Mikron der Selenschicht frei von Zusatzmetall sind.The supply of iron pentacarbonyl is expediently stopped towards the end of the steaming process, d. H. after two thirds of the desired selenium layer thickness has been reached, the needle valve is closed. Now the rest of the selenium layer is vaporized on with decreasing partial pressure of carbonyl vapor. The addition of carbonyl can also be carried out shortly before the desired selenium layer thickness is reached canceled and the rest of the selenium can only be evaporated after a short break, so that meanwhile the remaining carbonyl vapor in the steaming room is pumped out. It can also be beneficial the rest of the carbonyl vapor by purging with an inert gas from the steaming room to remove. In any case, it is advantageous if the last micron of the selenium layer is free of Additional metal are.
Zweckmäßig wird zwischen dem Bedampfungsraum und der Pumpe ein Filter, Adsorptions- oder Kondensationsgefäß eingeschaltet, um das bei der Zersetzung entstehende Gas bzw. Reste der nicht zersetzten Verbindung zurückzuhalten.Appropriately, a filter, adsorption or between the steaming space and the pump The condensation vessel is switched on to remove the gas or residues of the non-decomposed gas that is produced during the decomposition Withhold connection.
Die so erhaltenen Platten werden in bekannter Weise mit einer Sperrschicht und einer Deckelektrode versehen und den bekannten Formierungsverfahren unterworfen.The plates obtained in this way are provided in a known manner with a barrier layer and a cover electrode provided and subjected to the known forming process.
Claims (6)
Deutsche Patentschriften Nr. 806 876, 820 318; deutsche Patentanmeldung L 12172 VIIIc/21g (bekanntgemacht am 8.10.1953);
USA.-Patentschrift Nr. 2463 753.Considered publications:
German Patent Nos. 806 876, 820 318; German patent application L 12172 VIIIc / 21g (published October 8, 1953);
U.S. Patent No. 2,463,753.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH355862D CH355862A (en) | 1958-03-29 | 1957-10-03 | Method of manufacturing selenium rectifier plates |
FR1184267D FR1184267A (en) | 1958-03-29 | 1957-10-10 | Selenium rectifier |
BE561534D BE561534A (en) | 1958-03-29 | 1957-10-11 | |
DEST13592A DE1114593B (en) | 1958-03-29 | 1958-03-29 | Process for the manufacture of selenium rectifiers |
FR790489A FR75399E (en) | 1958-03-29 | 1959-03-26 | Selenium rectifier |
FR865645A FR79988E (en) | 1958-03-29 | 1961-06-21 | Selenium rectifier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEST13592A DE1114593B (en) | 1958-03-29 | 1958-03-29 | Process for the manufacture of selenium rectifiers |
Publications (1)
Publication Number | Publication Date |
---|---|
DE1114593B true DE1114593B (en) | 1961-10-05 |
Family
ID=7456091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DEST13592A Pending DE1114593B (en) | 1958-03-29 | 1958-03-29 | Process for the manufacture of selenium rectifiers |
Country Status (3)
Country | Link |
---|---|
BE (1) | BE561534A (en) |
CH (1) | CH355862A (en) |
DE (1) | DE1114593B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2463753A (en) * | 1945-10-01 | 1949-03-08 | Hartford Nat Bank & Trust Co | Process of preparing selenium for the purpose of increasing its conductivity |
DE820318C (en) * | 1948-10-02 | 1951-11-08 | Siemens & Halske A G | Selenium bodies, especially for dry rectifiers, photo elements and light-sensitive resistance cells |
-
1957
- 1957-10-03 CH CH355862D patent/CH355862A/en unknown
- 1957-10-11 BE BE561534D patent/BE561534A/xx unknown
-
1958
- 1958-03-29 DE DEST13592A patent/DE1114593B/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2463753A (en) * | 1945-10-01 | 1949-03-08 | Hartford Nat Bank & Trust Co | Process of preparing selenium for the purpose of increasing its conductivity |
DE806876C (en) * | 1945-10-01 | 1951-06-21 | Philips Nv | Process for the preparation of selenium to which small amounts of substances have been added to increase the conductivity |
DE820318C (en) * | 1948-10-02 | 1951-11-08 | Siemens & Halske A G | Selenium bodies, especially for dry rectifiers, photo elements and light-sensitive resistance cells |
Also Published As
Publication number | Publication date |
---|---|
BE561534A (en) | 1958-04-11 |
CH355862A (en) | 1961-07-31 |
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