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DE1076824B - Flaechengleichrichter mit einem Halbleiterelement, welches mit der einen Oberflaeche an einer Traegerplatte und mit der anderen Oberflaeche an einem starren Bolzen befestigt ist - Google Patents

Flaechengleichrichter mit einem Halbleiterelement, welches mit der einen Oberflaeche an einer Traegerplatte und mit der anderen Oberflaeche an einem starren Bolzen befestigt ist

Info

Publication number
DE1076824B
DE1076824B DES59117A DES0059117A DE1076824B DE 1076824 B DE1076824 B DE 1076824B DE S59117 A DES59117 A DE S59117A DE S0059117 A DES0059117 A DE S0059117A DE 1076824 B DE1076824 B DE 1076824B
Authority
DE
Germany
Prior art keywords
bolt
rectifier
rigid
contact
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DES59117A
Other languages
German (de)
English (en)
Inventor
Heinz Martin
Friedrich Scherbaum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL239393D priority Critical patent/NL239393A/xx
Priority to IT609174D priority patent/IT609174A/it
Priority to IT602174D priority patent/IT602174A/it
Priority to DENDAT1071234D priority patent/DE1071234B/de
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DES59117A priority patent/DE1076824B/de
Priority to GB2473858A priority patent/GB878100A/en
Publication of DE1076824B publication Critical patent/DE1076824B/de
Priority to NL6600089A priority patent/NL6600089A/xx
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B1/00—Film strip handling
    • G03B1/18—Moving film strip by means which act on the film between the ends thereof
    • G03B1/20—Acting means
    • G03B1/32—Friction grippers or rollers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K13/00—Conveying record carriers from one station to another, e.g. from stack to punching mechanism
    • G06K13/18—Conveying record carriers from one station to another, e.g. from stack to punching mechanism the record carrier being longitudinally extended, e.g. punched tape
    • G06K13/26—Winding-up or unwinding of record carriers; Driving of record carriers
    • G06K13/30—Winding-up or unwinding of record carriers; Driving of record carriers intermittently
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L13/00—Details of the apparatus or circuits covered by groups H04L15/00 or H04L17/00
    • H04L13/02—Details not particular to receiver or transmitter
    • H04L13/06—Tape or page guiding or feeding devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Resistance Heating (AREA)
  • Thermistors And Varistors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DES59117A 1957-07-31 1958-07-23 Flaechengleichrichter mit einem Halbleiterelement, welches mit der einen Oberflaeche an einer Traegerplatte und mit der anderen Oberflaeche an einem starren Bolzen befestigt ist Pending DE1076824B (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL239393D NL239393A (is) 1957-07-31
IT609174D IT609174A (is) 1957-07-31
IT602174D IT602174A (is) 1957-07-31
DENDAT1071234D DE1071234B (is) 1957-07-31
DES59117A DE1076824B (de) 1957-07-31 1958-07-23 Flaechengleichrichter mit einem Halbleiterelement, welches mit der einen Oberflaeche an einer Traegerplatte und mit der anderen Oberflaeche an einem starren Bolzen befestigt ist
GB2473858A GB878100A (en) 1957-07-31 1958-07-31 Improvements in or relating to semi-conductor rectifiers of the p-n junction type
NL6600089A NL6600089A (is) 1957-07-31 1966-01-05

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES0054550 1957-07-31
DES59117A DE1076824B (de) 1957-07-31 1958-07-23 Flaechengleichrichter mit einem Halbleiterelement, welches mit der einen Oberflaeche an einer Traegerplatte und mit der anderen Oberflaeche an einem starren Bolzen befestigt ist

Publications (1)

Publication Number Publication Date
DE1076824B true DE1076824B (de) 1960-03-03

Family

ID=25995414

Family Applications (2)

Application Number Title Priority Date Filing Date
DENDAT1071234D Pending DE1071234B (is) 1957-07-31
DES59117A Pending DE1076824B (de) 1957-07-31 1958-07-23 Flaechengleichrichter mit einem Halbleiterelement, welches mit der einen Oberflaeche an einer Traegerplatte und mit der anderen Oberflaeche an einem starren Bolzen befestigt ist

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DENDAT1071234D Pending DE1071234B (is) 1957-07-31

Country Status (4)

Country Link
DE (2) DE1076824B (is)
GB (1) GB878100A (is)
IT (2) IT602174A (is)
NL (2) NL6600089A (is)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3213336A (en) * 1959-08-03 1965-10-19 Int Electronic Res Corp Transistor heat dissipators
FR2348710A1 (fr) * 1976-04-21 1977-11-18 Leer Koninklijke Emballage Recipient muni d'un canal de sortie et d'un joint a utilisation unique
FR2376392A2 (fr) * 1977-01-04 1978-07-28 Lemer & Cie Dispositif de refroidissement pour paroi metallique

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58169943A (ja) * 1982-03-29 1983-10-06 Fujitsu Ltd 半導体装置
DE102011081687A1 (de) * 2011-08-26 2013-02-28 Robert Bosch Gmbh Halbleiterbauelement mit einem Kühlkörper

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2751528A (en) * 1954-12-01 1956-06-19 Gen Electric Rectifier cell mounting

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2751528A (en) * 1954-12-01 1956-06-19 Gen Electric Rectifier cell mounting

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3213336A (en) * 1959-08-03 1965-10-19 Int Electronic Res Corp Transistor heat dissipators
FR2348710A1 (fr) * 1976-04-21 1977-11-18 Leer Koninklijke Emballage Recipient muni d'un canal de sortie et d'un joint a utilisation unique
FR2376392A2 (fr) * 1977-01-04 1978-07-28 Lemer & Cie Dispositif de refroidissement pour paroi metallique

Also Published As

Publication number Publication date
IT609174A (is)
GB878100A (en) 1961-09-27
NL239393A (is)
IT602174A (is)
DE1071234B (is)
NL6600089A (is) 1966-03-25

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