DE1055922B - Use of alloys of copper, manganese and cobalt as hard solder for difficult-to-solder materials - Google Patents

Description

GERMAN

There is a whole range of requirements for the suitability of an alloy as a solder for joining metallic materials decisive of properties that the solder should combine in an optimal way. This includes in particular the flow behavior and the wetting capacity of the molten solder, its working temperature and its strength properties at increased Temperatures. After all, the alloy itself must be easy to process in order to be able to use it in a suitable form, be able to produce as wire or sheet metal.

In the case of solders for difficult-to-solder materials, e.g. B. Chrome-nickel steels, high-temperature alloys, stellite and other cemented carbides, it has so far proven impossible to add the multitude of solder to the solder at the same time completely satisfying the requirements. There is one a whole range of steel and hard metal grades, but usable results when using them generally only with a more or less extensive renunciation of one or the other per se desirable function of the solder alloy can be achieved. In order to remedy these disadvantages, one has to use The solder alloys introduced numerous other metallic components, with such additives approximately should bring about an improvement of the flow behavior and the wetting. Sometimes it was with the additions also aims to lower the working temperature, which, however, also reduces it the high temperature strength was associated in most cases. The composition of the known solders for Steels and hard metals shows that the way outlined above is often too complicated a structure Multi-material alloys has arrived. For example, attempts have been made as solder for rust-resistant steels and hard metals copper or copper-nickel alloys with additions of manganese, iron or chromium To use silver without using these alloys, their working temperatures at about 1050 to 1100 ° C and above, consistently satisfactory results could be achieved. By adding Zinc could be used in alloys of the named. Kind of while the working temperature is lowered at the same time however, the heat resistance and fatigue strength were impaired as a result. Another group of solders with relatively low working temperatures and low heat resistance is on the Based on silver-copper-zinc; their flow behavior, their wettability and their strength were tried to improve by adding up to 25% manganese and nickel.

The solders with working temperatures of about HOO ⁰ C have sufficient heat resistance in many cases, but due to the high working temperature, the workpieces to be soldered become too exhausted. Use of alloys

made of copper, manganese and cobalt

as hard solder for materials that are difficult to solder

Applicant:
German gold and silver separator

formerly Roessler,
Frankfurt / M.,. Weißfrauensir. 9

Dr. Ewald Wagner, Pforzheim,
has been named as the inventor

² .

annealed, and it comes to coarse grain formation with all its disadvantages. Also bothers at the high Strong oxidation and scaling starting at the working temperature.

s5 occurs in solders with a high copper content, as well as with pure copper, another disadvantage becomes apparent: the elongation decreases at temperatures between 400 and 600 ° C (heat embrittlement) and only increases again at higher temperatures.

In the low flowing solder with working doors temperature between about 600 and 85O ⁰ C, has an adverse effect sometimes the reduced at temperatures of 200 to 300 ° C strength. The wetting power of the low-flowing solders also leaves something to be desired in many cases.

The copper-manganese-cobalt three-component system is already in place known. So are already plumb bobs z. B. the following composition has been proposed:

1. Cobalt not more than 15%

Manganese in 1.5 to 2.5 times

Amount of co
Copper balance to 100%

2. Cobalt 15%

Manganese 25%

Copper 60%

3. Cobalt 4%

Manganese 10%

Copper 86%

Such solders are used with advantage, but surface wetting is in some cases and the heat resistance is insufficient.

It has now been found that a slight addition of palladium to the three-component system copper-manganese

909 507/322

Claims (2)

Cobalt not only wets surfaces for several of the elements chromium, nickel, iron, silicon, which contain chromium, tungsten or molybdenum, cium, silver, gold, titanium and vanadium. The but also a particularly favorable influence on the amount of these additional elements is supposed to exert together with the heat resistance. The amount of palladium palladium should be 1 to less than 5%, with 1 to less than 5% contributing, with the proviso that the respective cobalt content of the solder alloys does not exceed the respective cobalt content. should not be exceeded. From the graph it can be seen that the solder alloys according to the invention are, as mentioned, a significantly better heat resistance is achieved by the addition of palladium than the known ones for soldering alloyed and non-soldering alloy steels of all kinds, of heat-resistant works. In this graphic representation are on the io materials, high speed steel alloys and hard metals. The abscissa axis is the temperatures and on the ordi- Particularly advantageous is its use in the hardnaten axis the tensile strength of the soldered connections to metal-tipped tools, which are applied in kg / mm2 for machining. The new solder α has the following to be used by rocks and in mining. Composition: e.g. broaching tools and steel drills, in which the solder joint is exposed to particularly high mechanical and \ la η 10% thermal loads. Cobalt 4% Claims: Palladium 2%. 1. Use of a copper, manganese and co- For comparison purposes, the following hard solders with an alloy containing 20 bait are used as hard solder, in particular been added, the soldering of steels special for sclnver solderable materials such. B. and hard metals are widely used, including chromium-nickel steels, heat-resistant materials, stellite den: LAg 45 and LAg 49 according to DIN 1734 as well as one and other hard metals, characterized Solder with 85% Ag, 15% Mn and a solder with 4% Co that an alloy is used with a 86% Cu and 10% Mn. 25 Cobalt content from 1 to 10%, manganese from The tensile strength of the alloys LAg 45 and 4 to 35% ·, of palladium from 1 to less L Ag 49 drop sharply at 200 ° C and amount to 5%, the remainder at least 55% copper, with the at 500 ⁰ C only 3.5 or 12% of the initial palladium content does not exceed the cobalt content, worth. At 300 ° C the tensile strength is the 2. Use of alloys other than Ag-Mn solders decreased to 73%, while the 30 ingredients specified in claim 1 are still of the Cu-Mn-Co solder and that of the solder α still: to one or more of the elements chromium, nickel, around 85% have been preserved. At 500 ° C iron, silicon, silver, gold, titanium and vanadium contain both the Ag-Mn solder and the Cu-Mn-Co solder, with the proviso that the amount of these already reached 41%. In contrast, in the case of the he additions together with the palladium 1 to less According to the invention, the solder α at 500 ° C is still 52% of the value than 5% and the cobalt content is not initial value has been retained. exceeds, for the purpose mentioned in spoke 1. The pal- Alloys containing carbon can be used for certain publications under consideration: Applications nor additions to a or French patent specification No. 862 261. 1 sheet of drawings © 909 507/322 4.59