DE1046194B - Transistor, Kristallgleichrichter od. dgl. - Google Patents
Transistor, Kristallgleichrichter od. dgl.Info
- Publication number
- DE1046194B DE1046194B DEN14732A DEN0014732A DE1046194B DE 1046194 B DE1046194 B DE 1046194B DE N14732 A DEN14732 A DE N14732A DE N0014732 A DEN0014732 A DE N0014732A DE 1046194 B DE1046194 B DE 1046194B
- Authority
- DE
- Germany
- Prior art keywords
- transistor
- mixture
- crystal rectifier
- filler
- crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 title claims description 7
- 239000000203 mixture Substances 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 239000002966 varnish Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- -1 methylsiloxanes Chemical class 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermistors And Varistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL874801X | 1957-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1046194B true DE1046194B (de) | 1958-12-11 |
Family
ID=19851343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DEN14732A Pending DE1046194B (de) | 1957-03-04 | 1958-02-28 | Transistor, Kristallgleichrichter od. dgl. |
Country Status (5)
| Country | Link |
|---|---|
| BE (1) | BE565347A (pl) |
| DE (1) | DE1046194B (pl) |
| FR (1) | FR1192626A (pl) |
| GB (1) | GB874801A (pl) |
| NL (1) | NL215079A (pl) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3366648D1 (en) * | 1983-01-11 | 1986-11-06 | Ferranti Plc | Thermally conducting filler for enclosing electrical components |
-
0
- NL NL215079D patent/NL215079A/xx unknown
- BE BE565347D patent/BE565347A/xx unknown
-
1958
- 1958-02-28 DE DEN14732A patent/DE1046194B/de active Pending
- 1958-02-28 GB GB6548/58A patent/GB874801A/en not_active Expired
- 1958-03-03 FR FR1192626D patent/FR1192626A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB874801A (en) | 1961-08-10 |
| FR1192626A (fr) | 1959-10-27 |
| BE565347A (pl) | |
| NL215079A (pl) |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE1066666B (pl) | ||
| DE2431236B2 (de) | Ueberspannungsableiter | |
| DE1640021A1 (de) | Kabelabschluss | |
| DE1046194B (de) | Transistor, Kristallgleichrichter od. dgl. | |
| DE1564665A1 (de) | Halbleiteranordnung und Verfahren zum Herstellen einer solchen | |
| DE2059667A1 (de) | Umhuellung fuer Kabel | |
| DE1111739B (de) | Halbleiteranordnung, z. B. Transistor oder Kristalldiode | |
| DE483223C (de) | Durchfuehrungsisolator | |
| DE679226C (de) | Hengeisolator | |
| DE957049C (de) | Elektrisches Hochspannungskabel | |
| DE6909855U (de) | Elektrischer wiederkehrleiter, insbesondere fuer elektrische starkstrom- oder hochspannungskabel | |
| DE1051353B (de) | Aus Giessharz bestehender Endverschluss fuer elektrische Kabel | |
| DE683915C (de) | Anordnung zur Kuehlung frei tragender Spulen fuer elektrische Messinstrumente | |
| DE1569317C2 (de) | Verwendung einer Füllmasse für Transistorgehäuse | |
| DE2028663C (de) | Kabelgarnitur | |
| DE1489091C2 (de) | Eingekapseltes Halbleiterbauelement | |
| DE659743C (de) | Zuendkerze | |
| DE1489916C (de) | Halbleiteranordnung | |
| AT241535B (de) | Elektrisches Bauelement, vorzugsweise Halbleiterbauelement | |
| DE576453C (de) | Verfahren zum Herstellen von Isolatoren, deren Bolzen durch ein Rohr aus keramischem Isolierstoff in der Hoehlung des Isolatorkoerpers gehalten ist | |
| DE2050305A1 (de) | Kabelverbindung | |
| DE1277972B (de) | Elektrisches Bauelement oder Bauelementegruppe, vorzugsweise Halbleiterbauelement | |
| DE634769C (de) | Kabelendverschluss unter Verwendung eines Schutzkonus | |
| DE943539C (de) | Isolierstoff, insbesondere fuer elektrotechnische Zwecke | |
| AT251719B (de) | Element für ein elektrisches Hochspannungs-Heizgerät |