DE1037014B - Process for the production of a hermetically sealed rectifier suitable for high currents - Google Patents

Description

GERMAN

The invention relates to a method for producing a hermetically sealed one suitable for high current Rectifier with contact area formed by a heat-sensitive semiconductor with a cup-shaped ceramic member as part of the hermetically sealed housing of the Rectifier is used on which the metal parts carrying the semiconductor and its leads with soldered with a low melting point solder.

In the manufacture of high-voltage rectifiers operated with alternating current of the usual frequency Using a heat-sensitive semiconductor such as germanium as the contact surface poses the problem the protection of the rectifier element against atmospheric influences. While on the one hand a hermetically sealed housing is required for the stated purpose, on the other hand it is at the manufacture of such a housing is essential, an unacceptable rise in the temperature of the element to avoid after making the rectifier connection on its surface. It is also essential secure the rectifier element against overheating during operation by using the The heat generated by the current flowing through the element is diverted from the element. This measure is necessary because the rectifier element is adversely affected by excessive heating. The problem mentioned is not to the same extent present in high frequency rectifiers that are used when the the energy in question is relatively small. It therefore seems essential to have the rectifier and to design its housing in such a way that any soldering points in the housing are sufficiently far away from

Method of manufacture

one suitable for heavy current,

hermetically sealed rectifier

Applicant:

The British Thomson-Houston Company Limited, London

Representative: Dr. M. Herzfeld, patent attorney,
Düsseldorf, Kreuzstr. 32

Claimed priority:
Great Britain 8 August 1952

Robert Guy Hibberd,

Rugby, Warwickshire (Great Britain),

has been named as the inventor

overheating of the element during manufacture of the ceramic bushing enclosing Disguise not on.

It is also known, the semiconductor body with a carrier by means of a solder of low Melting point to be soldered

There are also crystal detectors for voltage measurement or demodulation of electrical waves, especially

the rectifier element should be provided in order to avoid a special in the centimeter area, i.e. in a heating of the latter during the soldering work. with
heat radiating approaches can be provided.

It is already known to use a semiconductor contact 40
rectifier to be provided with a socket or a cup-shaped member made of ceramic material that forms the housing, with an opening in the
Substructure of the socket is provided, which serves to receive the supply line to the contact wire, 45 ringer capacitance can be formed, while the charging switch of the latter is soldered to the line. In the case of capacitance through a construction of this type close to the crystal, the semiconductor-arranged capacitor is represented, body arranged on a hollow metal base, which is made of metal in the other end of the ceramic socket, which is placed on the inner and outer surfaces Outer surfaces that protrudes and is fixed within the same, so that it is applied at the same time as. Dielektrikum serving wall of the ceramic tube with the socket and an outer metal cladding of the detector, the same forms a capacitor that must be in the with such a crystal detector the above rectifier connected circuit. If the conditions are to be met as far as possible, this construction leads to the problem of avoiding extremely small dimensions. "

809 598/434

Sequences is worked, the voltage of which is proportional to the directional voltage generated by the detector is dependent.

With such a crystal detector, it is important to have the high-frequency voltage as direct as possible bring it to the point of contact between the contact pin and the crystal. Uni to achieve this must have the lines as short as possible and as short as possible

3 4

The present method is a very positive element. A suitable one for this purpose pursued a different purpose. Namely, it is said that a soldering metal can contain antimony. The plate 9 is Power rectifiers are created, which at the edge of the body 1 by means of the adhesive normal frequencies 10 common for such amplifiers, while the connection between the is working. The capacitance at the contact point has for 5 the outer surface of the edge of the body 1 and the the function of such a rectifier does not have any flange 4 as well as the one located in the opening 2 Significance, as well as the problem, the high frequency connection between the body 1 and the stake 3 voltage is formed in the immediate vicinity of the tip contact by soldering 11. To the effect bring, does not occur. The task of creating such a for Stark- io surface parts 12 of the cup-shaped ceramic stream will be ensured suitable, hermetically sealed body 1 metallized as indicated, Richter is now achieved according to the invention when assembling the shown in the drawing that in order to avoid harmful heating of the device, the following semiconductor is preferably used When assembling the metal parts assembly procedure follows:

and the cup-shaped ceramic member first 15 After the cup-shaped ceramic body 1 to the a surface part 12 has been metallized through a bottom hole of the cup-shaped member, becomes the introduced, flanged metal plug peg 3 into the opening in the base of the Koran is soldered to the bowl, whereupon the with pers is inserted and soldered into it; a blind hole The lead connected to the semiconductor at a connection 13 in the peg 3 is then deepened with solder of the stopper is soldered, whereupon the Ge 20 lower melting point than that for soldering the housing is closed by filling with the interposition of peg 3 used in the body 1. The zueiner with one in contact with the face of the semi-assembly of the crystal 6 with the one attached to it conductor standing cover plate expediently through associated conductor 7 by means of a Verfassungseine Heat-resistant plastic putty with the edge elements 8 is prepared by using the crystal of the cup and then connected to the plate and 25 of the plate 9 by means of the aforementioned suitable The metal cup encompassing the cup is connected to its all around solder. The soldering of the Kri-1 on ends flange with the outer wall of the bowl stalls with the plate 9 takes place in a suitable manner \ 'is soldered, with the proviso that for the three on- through the same operation as the inward diffusion of the the following soldering of the plug with the impurity element in the crystal for the purpose of being well, the supply line with the stopper and the cup 30 position the rectifier connection using the outer wall of the cup solder with the continuation of a solder with a lower melting point progressively lower melting point is used than that required for diffusion. so that with each subsequent soldering the previous The ceramic body with the attached to it going is not affected. Post 3 is then attached with the crystal ladder set.

In addition, 35 can expediently be assembled below the cup.

a absorb the thermal radiation of the rectifier. For this purpose, the ceramic body is placed on a mixed and dissipative plate, possibly under a sufficiently high temperature to soften the solder in the interposition of a thermally conductive metal plate, hole 13, so that the penetration into the z. B. a lead plate can be provided, wherein the hole of the conductor 7 is made possible. The conductor 7 is fastened to the plates by a nut screwed onto a thread extension of the 40 in this way during the subsequent cooling of the cup with the cup assembly in the hole. A suitable adhesive is applied between the edge. To facilitate understanding of the method according to the body 1 and the periphery of the plate 9 in the invention, an execution construction is carried out. This is allowed to soften and thus the connection between the crystal set and the body shown in cross section in the drawing is secured, per 1, in which the cup-shaped body is heated. In the drawing, the reference numeral 1 denotes. The last stage of manufacture consists in making the cup-shaped body made of ceramic material. Crystal set, the cup-shaped body and the He has an opening 2 in its base, to be assembled in flange part 5 and which overlap which the metal peg 3 is placed, whose 50 surfaces of the edge of the body and the outer surface are preferably to be soldered to flange 4 as indicated. By using a screw thread is provided. Solder 11 with a lower melting point than the edge of the cup-shaped body 1 overlaps to form the previous connections due to the upwardly directed flange 4 of a metal-used solder ensures that the previous body 5, which carries the crystal 6 and with the 55 achieved connections are not damaged and are connected to the same. The co-operating conductor 7 is with that the crystal is only heated so high that the stake 3 is connected and establishes the contact with rectifying effect of the contact point between the crystal. Germanium and indium not adversely affected. The crystal 6 preferably consists of Germanium. The sealing achieved by the adhesive nium. 60 completely prevents liquid metal from being formed from the solder A rectifier connection of the PN type connection into the interior of that formed by the body in the body of the crystal by penetrating into the housing and attacking the crystal. Crystal is an impurity element such as B. In order to allow the rectifier to diffuse into an external circuit, which can also be connected as at 8, the part 5 is indicated with a pin, provided as solder to connect the ⁶ 5 14, which is preferably outside with knitted conductor 7 is used with the crystal. The windlass, similar to peg 3, is provided. Around the stall is mounted on a support plate 9, with which the dissipation of heat from the rectifier is connected by means of a solder, whose end of operation can increase a radiation melting point lower than that of the formation of the plate 15 on the rear surface of the part 5 rectifier connection used impurities 7 ° screwed onto the pin by means of a nut 16

Claims (2)

will. A lead disk 17 can be inserted between the radiation plate 15 and the surface of the part 5 facing it for the purpose of better heat conduction. A washer 18 is preferably used between the nut 16 and the radiant panel. P A T Ii N T A N S P R C C H B: 1. Process for the production of a hermetically sealed one suitable for heavy current Rectifier with contact area formed by a heat-sensitive semiconductor, wherein a cup-shaped ceramic member as part of the hermetically sealed housing of the rectifier is used on which the metal parts carrying the semiconductor and its supply line with a solder of low melting point are soldered, characterized in that for the purpose Avoidance of harmful heating of the semiconductor when assembling the metal parts and the ceramic member first a through a bottom hole of the cup-shaped member (1) introduced, Flanged metal plug (3) is soldered to the cup (1), whereupon then the lead connected to the semiconductor is soldered to a recess in the plug (3), whereupon the housing is closed by interposing one with one in contact with the surface of the semiconductor (6) standing cover plate (9) expediently by a heat-resistant Plastic putty connected to the edge of the cup (1) and then a plate (9) and the Cup (1) comprising metal cup on its circumferential flange (4) with the outer wall of the cup (1) is soldered, with the proviso that for the three successive solderings the stopper (3) with the cup (1), the supply line (7) with the stopper (3) and the cup (4) with the outer wall of the cup (1) related to solder with progressively lower melting point so that each subsequent soldering does not affect the previous one. 2. The method according to claim 1, characterized in that additionally below the cup (4) a plate (15) which absorbs and dissipates the thermal radiation from the rectifier, if necessary with the interposition of a thermally conductive metal plate, e.g. lead plate (17) is, the plates (15) and (17) being screwed onto a threaded shoulder (14) of the cup (4) Nut (16) are held together with the bowl. Considered publications:
German Patent Nos. 863 372, 872 602;
U.S. Patent No. 2,595,475;
Belgian patent specification No. 502 229. 1 sheet of drawings © 809 594/434 8.58