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DE10342201A1 - Method for fabricating curved non-communicating structures e.g. on circuit boards, templates etc, involves generating non-communicating structure directly by erosion or reforming - Google Patents

Method for fabricating curved non-communicating structures e.g. on circuit boards, templates etc, involves generating non-communicating structure directly by erosion or reforming Download PDF

Info

Publication number
DE10342201A1
DE10342201A1 DE2003142201 DE10342201A DE10342201A1 DE 10342201 A1 DE10342201 A1 DE 10342201A1 DE 2003142201 DE2003142201 DE 2003142201 DE 10342201 A DE10342201 A DE 10342201A DE 10342201 A1 DE10342201 A1 DE 10342201A1
Authority
DE
Germany
Prior art keywords
communicating
reforming
erosion
circuit boards
structure directly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE2003142201
Other languages
German (de)
Inventor
Klaus Berger
Wolfgang Hansen
Siegfried Hess
Harald Tober
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mercedes Benz Group AG
Original Assignee
DaimlerChrysler AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DaimlerChrysler AG filed Critical DaimlerChrysler AG
Priority to DE2003142201 priority Critical patent/DE10342201A1/en
Publication of DE10342201A1 publication Critical patent/DE10342201A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A method for fabricating non-communicating structures with curved surfaces in which the non-communicating structure is generated directly by erosion and/or reforming by micro-beam (radiation) technique, and/or micro-chisel technique, micro-embossing technique and/or brush technique.
DE2003142201 2003-09-13 2003-09-13 Method for fabricating curved non-communicating structures e.g. on circuit boards, templates etc, involves generating non-communicating structure directly by erosion or reforming Withdrawn DE10342201A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE2003142201 DE10342201A1 (en) 2003-09-13 2003-09-13 Method for fabricating curved non-communicating structures e.g. on circuit boards, templates etc, involves generating non-communicating structure directly by erosion or reforming

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2003142201 DE10342201A1 (en) 2003-09-13 2003-09-13 Method for fabricating curved non-communicating structures e.g. on circuit boards, templates etc, involves generating non-communicating structure directly by erosion or reforming

Publications (1)

Publication Number Publication Date
DE10342201A1 true DE10342201A1 (en) 2005-04-28

Family

ID=34398717

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2003142201 Withdrawn DE10342201A1 (en) 2003-09-13 2003-09-13 Method for fabricating curved non-communicating structures e.g. on circuit boards, templates etc, involves generating non-communicating structure directly by erosion or reforming

Country Status (1)

Country Link
DE (1) DE10342201A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8025764B2 (en) * 2004-09-01 2011-09-27 Georgia-Pacific Consumer Products Lp Multi-ply paper product with moisture strike through resistance and method of making the same
US8506756B2 (en) 2008-03-06 2013-08-13 Sca Tissue France Embossed sheet comprising a ply of water-soluble material and method for manufacturing such a sheet
US9557158B2 (en) 2013-12-11 2017-01-31 Karsten Hofmann System and method for determining the position of objects in a radiation room for radiation therapy
DE102020000181B3 (en) * 2020-01-27 2021-03-11 Thomas Wimmer Device and method for machining sliding surfaces

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5025547A (en) * 1990-05-07 1991-06-25 Aluminum Company Of America Method of providing textures on material by rolling
DE4326768A1 (en) * 1993-08-10 1995-02-16 Julius Schuele Gmbh Druckguswe Method of producing sliding surfaces
US5885690A (en) * 1995-11-21 1999-03-23 Koyo Seiko Co., Ltd. Machine part
DE19833646C1 (en) * 1998-07-25 1999-10-14 Daimler Chrysler Ag Cylinder running surface for two stroke internal combustion engine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5025547A (en) * 1990-05-07 1991-06-25 Aluminum Company Of America Method of providing textures on material by rolling
DE4326768A1 (en) * 1993-08-10 1995-02-16 Julius Schuele Gmbh Druckguswe Method of producing sliding surfaces
US5885690A (en) * 1995-11-21 1999-03-23 Koyo Seiko Co., Ltd. Machine part
DE19833646C1 (en) * 1998-07-25 1999-10-14 Daimler Chrysler Ag Cylinder running surface for two stroke internal combustion engine

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Informationsdienst Wissenschaft: Pressemitteilung des Laser Zentrums Hannover e.V. vom 17.07.2002 *
Michael Botts: "Der Meißel der Nanostrukturierung: Lichtpulse aus dem Femtosekundenlaser" *
S. Fatikow und U. Rembold: "Microsystem Techno- logy and Microrobotics" Springer Verlag Berlin Heidelberg 1997, S. 69-74, ISBN: 3-540-60658-0 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8025764B2 (en) * 2004-09-01 2011-09-27 Georgia-Pacific Consumer Products Lp Multi-ply paper product with moisture strike through resistance and method of making the same
US8506756B2 (en) 2008-03-06 2013-08-13 Sca Tissue France Embossed sheet comprising a ply of water-soluble material and method for manufacturing such a sheet
US8771466B2 (en) 2008-03-06 2014-07-08 Sca Tissue France Method for manufacturing an embossed sheet comprising a ply of water-soluble material
US9557158B2 (en) 2013-12-11 2017-01-31 Karsten Hofmann System and method for determining the position of objects in a radiation room for radiation therapy
DE102020000181B3 (en) * 2020-01-27 2021-03-11 Thomas Wimmer Device and method for machining sliding surfaces

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OP8 Request for examination as to paragraph 44 patent law
8130 Withdrawal