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DE10340705A1 - Verfahren zum Herstellen einer Leiterplatte und Leiterplatte mit einem Metallträger als Leiterplattenkern - Google Patents

Verfahren zum Herstellen einer Leiterplatte und Leiterplatte mit einem Metallträger als Leiterplattenkern Download PDF

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Publication number
DE10340705A1
DE10340705A1 DE2003140705 DE10340705A DE10340705A1 DE 10340705 A1 DE10340705 A1 DE 10340705A1 DE 2003140705 DE2003140705 DE 2003140705 DE 10340705 A DE10340705 A DE 10340705A DE 10340705 A1 DE10340705 A1 DE 10340705A1
Authority
DE
Germany
Prior art keywords
circuit board
adhesion layer
insulating adhesion
conductor layer
metal carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE2003140705
Other languages
English (en)
Other versions
DE10340705B4 (de
Inventor
Helmut Schlenker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FELA GMBH, DE
Original Assignee
Fela Hilzinger Leiterplat GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fela Hilzinger Leiterplat GmbH filed Critical Fela Hilzinger Leiterplat GmbH
Priority to DE2003140705 priority Critical patent/DE10340705B4/de
Publication of DE10340705A1 publication Critical patent/DE10340705A1/de
Application granted granted Critical
Publication of DE10340705B4 publication Critical patent/DE10340705B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0594—Insulating resist or coating with special shaped edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)

Abstract

Die Erfindung bezieht sich auf ein Verfahren zum Herstellen einer Leiterplatte (1), bei dem auf einem Metallträger (2) als Leiterplattenkern eine isolierende Haftschicht (3) aufgebracht wird und auf der isolierenden Haftschicht (3) eine Leiterschicht (7) aufgesetzt wird, wobei die Verbindung unter Einsatz von Wärme (TV, TW) erfolgt. DOLLAR A Das Verfahren wird vorzugsweise derart ausgeführt, dass die Haftschicht (3) vor dem Aufsetzen der Leiterschicht (7) unter Ausbildung mindestens einer Aussparung (4) in der Haftschicht (3) strukturiert oder strukturiert aufgebracht wird und der Verfahrensablauf unter zeitlichen und thermischen Parametern derart erfolgt, dass ein Übergangsbereich (5a, 5b) der isolierenden Haftschicht (3) zu der Aussparung (4) veräuft. Eine derart ausgebildete Leiterplatte ist derart ausgebildet, dass die isolierende Haftschicht (3) vom Bereich des Randes (5a) der Leiterschicht (7) zur Aussparung (4) einerseits und andererseits zum Bereich eines Punktes bzw. Randes (5b) zwischen Haftschicht (3) und dem Metallträger (2) einen Übergangsbereich (5a, 5b) mit einer fließenden Verlaufskontur aufweist.
DE2003140705 2003-09-04 2003-09-04 Metallkernleiterplatte und Verfahren zum Herstellen einer solchen Metallkernleiterplatte Expired - Fee Related DE10340705B4 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE2003140705 DE10340705B4 (de) 2003-09-04 2003-09-04 Metallkernleiterplatte und Verfahren zum Herstellen einer solchen Metallkernleiterplatte

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2003140705 DE10340705B4 (de) 2003-09-04 2003-09-04 Metallkernleiterplatte und Verfahren zum Herstellen einer solchen Metallkernleiterplatte

Publications (2)

Publication Number Publication Date
DE10340705A1 true DE10340705A1 (de) 2005-04-21
DE10340705B4 DE10340705B4 (de) 2008-08-07

Family

ID=34352759

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2003140705 Expired - Fee Related DE10340705B4 (de) 2003-09-04 2003-09-04 Metallkernleiterplatte und Verfahren zum Herstellen einer solchen Metallkernleiterplatte

Country Status (1)

Country Link
DE (1) DE10340705B4 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2408279A1 (de) 2010-07-14 2012-01-18 FELA Hitzinger GmbH Verbiegbare Metallkernleiterplatte
EP2755456A1 (de) * 2013-01-09 2014-07-16 Carl Freudenberg KG Anordnung mit einer flexiblen Leiterplatte und einer Wärmesenke

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3032744A1 (de) * 1979-08-30 1981-03-19 Showa Denko K.K., Tokyo Elektrisch isolierende unterlage mit hoher waermeleitfaehigkeit
DE3640952A1 (de) * 1986-11-29 1988-06-09 Bbc Brown Boveri & Cie Substrat
DE4006063A1 (de) * 1989-05-01 1990-11-08 Ibiden Co Ltd Verfahren zur herstellung einer leiterplatte fuer elektronische bausteine
DE4118397A1 (de) * 1991-06-05 1992-12-10 Ant Nachrichtentech Mit halbleiterbauelementen bestueckte metallkernleiterplatte

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3032744A1 (de) * 1979-08-30 1981-03-19 Showa Denko K.K., Tokyo Elektrisch isolierende unterlage mit hoher waermeleitfaehigkeit
DE3640952A1 (de) * 1986-11-29 1988-06-09 Bbc Brown Boveri & Cie Substrat
DE4006063A1 (de) * 1989-05-01 1990-11-08 Ibiden Co Ltd Verfahren zur herstellung einer leiterplatte fuer elektronische bausteine
DE4118397A1 (de) * 1991-06-05 1992-12-10 Ant Nachrichtentech Mit halbleiterbauelementen bestueckte metallkernleiterplatte

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2408279A1 (de) 2010-07-14 2012-01-18 FELA Hitzinger GmbH Verbiegbare Metallkernleiterplatte
DE102010027149A1 (de) 2010-07-14 2012-01-19 Fela Hilzinger Gmbh Verbiegbare Metallkernleiterplatte
EP2755456A1 (de) * 2013-01-09 2014-07-16 Carl Freudenberg KG Anordnung mit einer flexiblen Leiterplatte und einer Wärmesenke

Also Published As

Publication number Publication date
DE10340705B4 (de) 2008-08-07

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OP8 Request for examination as to paragraph 44 patent law
8364 No opposition during term of opposition
R082 Change of representative

Representative=s name: PATENTANWAELTE WESTPHAL MUSSGNUG & PARTNER, DE

R081 Change of applicant/patentee

Owner name: FELA GMBH, DE

Free format text: FORMER OWNER: FELA HILZINGER GMBH LEITERPLATTENTECHNIK, 78054 VILLINGEN-SCHWENNINGEN, DE

Effective date: 20130506

R082 Change of representative

Representative=s name: PATENTANWAELTE WESTPHAL MUSSGNUG & PARTNER, DE

Effective date: 20130506

Representative=s name: WESTPHAL, MUSSGNUG & PARTNER PATENTANWAELTE MI, DE

Effective date: 20130506

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee