DE10248388B3 - Through contact method for conductor path foil of electronic data carrier e.g. chip card, using contact thread passed between opposite sides of conductor path foil via sewing process using hollow needle - Google Patents

Abstract

The through contact method has a contact thread (3) fed from one side (5) to the opposite side (6) of a conductor path foil (2) via a sewing process using a hollow needle, for providing a through contact (1). The hollow needle is pushed through the conductor path foil and the contact thread is fed through it until it projects from the needle point on the second side of the conductor path foil, at which it is clamped while the needle is retracted, with subsequent separation of the thread in front of the retracted needle point and bending of both thread ends (8) for connection with respective contact surfaces (7). An Independent claim for a device for providing a through contact for a conductor path foil is also included.

Description

The invention relates to a method to create a via through a conductor foil. About that In addition, the invention relates to a method for generating a portable, electronic data carrier, in particular a chip card, the a plurality of one above the other Includes foils and an electronic circuit. The invention also relates to a via device for generating a via a conductor track film and a device for producing portable, electronic data carriers, in particular chip cards.

In the production of chip cards are used to implement an electronic circuit that for example the chip with transponder coils, sensors, displays or similar connects electronic components, often used conductor foils. These are foils that are on one or both Pages are provided with conductor track structures. To generate the Chip card becomes the conductor track film with further film layers laminated or built into the chip card body as an insert.

Depending on the structure of the desired electronic circuit, it may be necessary to build a trace structure, which is on one side of the track foil, with a Conductor structure on the other side of the conductor foil electrically connect to. I.e. there must be one Through-connection between certain points of the conductor track structures be produced on the respective sides of the conductor track foil. The usual through-plating processes known from PCB technology, where the conductor foil is first pierced and then a Contact wire is used, with the contact surfaces on both sides is soldered is for mass production is relatively complex and expensive. Overall are Vias are therefore still a significant cost factor in the production of double-sided conductor foil.

From the ( DE 72 54 65 U DE 24 622 B ) is known for contacting contacts arranged between two thin carrier foils the proposal to apply a suitable copper wire by sewing technology. The document does not provide more precise information on a suitable sewing device.

JP 12 66 788 A discloses to restore an interrupted via the proposal to use an electrically conductive thread which is passed through a hole made in the carrier film and formed over the contact surfaces to be connected.

It is an object of the present invention preferably simple and inexpensive Method for producing a via through a conductor track foil specify.

This task is accomplished through a process and solved a device with the features of the independent claims. In of it dependent claims advantageous developments and refinements of the invention are specified.

According to the invention it is provided that for generation the via a contacting thread by means of a needle in a sewing process passed the conductor foil and that the Contacting thread at least on one of the two sides - in the Rule on both sides - the trace foil formed, for example bent, and with one arranged there Contact surface contacted becomes. In this way, the contact can be made relatively quickly and economical happen because the contact thread like a sewing thread immediately when piercing the hole in the conductor foil by means of the needle through the hole is pulled through. It is then just a second step required by contacting the thread with the contact surfaces.

To carry out the contacting threads the film using the needle any sewing techniques be used. Since it is basically a sewing technique very sophisticated industrial process, there are various Variants available. A variety of layouts can be created using program-controlled system technology are processed, in particular also high processing speeds can be reached.

A can be used as the contacting thread any thinner Thread or sewable wire with sufficient conductivity be used. The terms "thread" and "wire" are used synonymously here. In particular can as sewing threads accordingly suitable copper, aluminum or gold wires are used, whereby especially inexpensive Materials such as copper wire are preferred. When choosing one All you have to do is make sure that metal wire has the right properties, around like a sewing thread within the sewing process to be processed. Therefore, a wire strand can also be used as a contact thread be used. It is also possible to use threads made of conductive plastic, for example conductive Polymers to use.

Also the maximum film thickness is primarily through the sewability given, d. H. it can any thick films sewn as long as a film thickness is used within a via device with the chosen needle still pierce well can be to the sewing process perform. A limitation the film materials are only given by the sewability. For example a common one Inlet film for Chip cards are used, for example made of PVC, PET or ABS.

The method is preferably used within a method for producing portable, electronic data carriers, in particular chip cards, around the conductor tracks of an electronic circuit which relate to the two th of a conductor foil in the chip card, to make contact. In addition, the method according to the invention can also be used in other areas wherever a via connection is to take place through a conductor track film.

A suitable via device to carry out of the method has a needle and adjusting means for piercing the Track foil with the needle on. Means will continue to be used Carry out the contacting thread through the conductor foil with the help of Needle needed. Also points the establishment of funds on the contacting thread at least to form on one side of the conductor foil and with one there arranged contact surface to contact.

The needle used is a hollow needle educated. By using a hollow needle, for example first in a first step the hollow needle from a starting position pierced with a needle tip through the conductor foil be, the contacting thread preferably within the Hollow needle with a thread end in the hollow needle in one certain position is fixed. Then in a second step if the hollow needle is pierced, the contact thread inside the hollow needle continued, so that a Thread end protrudes from the needle tip. If necessary, the The hollow needle moves back become. This thread end is then preferably in a third process step outside the hollow needle held in front of the needle tip. Then in one fourth process step the hollow needle with the thread end held returned to the starting position, so that only the held thread remains in the hole created by the needle. Subsequently is in a fifth Process step of the contacting thread again within the hollow needle fixed and severed at the needle tip. Finally be the contacting thread ends located on both sides of the conductor foil are formed and with the contact areas contacted.

To perform the via process can different sewing methods be used. In a first variant, the contact thread can be used from a first side to a second side of the conductor foil be passed through a hole made by the needle and forming a loop on the second side of the conductive foil again through the same Hole through the conductor foil from the second side back to the first Side led become. The loop is then on the second side of the trace foil with a contact surface contacted.

According to a second variant the contact thread from a first side to a second Side of the conductor foil by a first one generated by the needle Hole passed through and then through an adjacent second hole from the second Page back led to the first page.

To make the contact as safe as possible the contact thread can also be achieved in the manner of a stitching several times from a first page to a second page and back through the track foil led and two arranged on the two sides of the conductor foil contact surfaces contact each other several times.

When using such a stitching process is it also possible the contact wire several times from a first side to one second page and back through the conductor foil that the contact wire at least on one of the two sides, two on the same side, from each other bridged spaced contact areas, d. H. there will be these two contact areas on one side of the conductor foil contacted each other. The contact thread forms in this case an optional trace on the relevant side of the trace.

For contacting the contact thread with the contact areas on the surfaces the relevant sides of the conductor foil are also different Variants.

In a first variant, the contact area directly on the surface the relevant side of the conductor foil, and the contacting thread becomes outside to the contact surface created. With this variant there are different possibilities the contacting thread on the outside at the contact surface to keep.

Here, for example, rivet-fitting processes are available or compression welding process on. An alternative is to contact the contact surface Contact wire with a conductive material, for example with a solder or a conductive paste, to cover or encapsulate it.

Especially when installing the conductor foil in an electronic data carrier consisting of several foils, for example a chip card, it makes sense to use it to connect the thread with the contact surface to connect that on the another layer is laminated onto the relevant side of the conductor foil becomes. I.e. it becomes contact at the same time when laminating on manufactured and thus saved one operation.

In a second variant, the Contacting thread directly to the surface of the page in question of the conductor foil and then one on the conductor foil contact area so upset that she covers the bent contact thread. This is possible by for example, the location of the surface of the page in question the conductor track foil is imprinted with contactable material. This procedure is particularly useful if it is a through-contacting of an external contact surface of a Chip card, for example the usual one Terminal interface, to one located inside the chip card Conductor structure is involved.

As material for the conductor tracks or the contact areas (contact pads) can be any conductive Material can be used. Preferably an inexpensive one Material such as copper or aluminum is used. The material can can also be applied to the film in the form of a silver conductive paste print. It is also possible, a lead frame on the surface to apply the film.

The procedure is also for multi-layer Conductor foils can be used which have a plurality of superimposed ones Foil layers with arranged on different levels between the foil layers Have conductor track structures. Here you can contact at different levels within and / or on the conductor foil located conductor track structures of the contacting thread in one Position at the respective contact surfaces of the to be contacted Conductor structures on top of each other are arranged through all layers of film. be passed through simultaneously.

A particularly suitable variant, a contacting thread in one direction through a conductor foil pass therethrough, consists in using a hollow needle in which the contacting thread guided becomes.

When using such a hollow needle can for example first in a first step the hollow needle from a starting position pierced with a needle tip through the conductor foil be, the contacting thread preferably within the Hollow needle with a thread end in the hollow needle in one certain position is fixed. Then in a second step if the hollow needle is pierced, the contact thread inside the hollow needle continued, so that a Thread end protrudes from the needle tip. If necessary, the The hollow needle moves back become. This thread end is then preferably in a third process step outside the hollow needle held in front of the needle tip. Then in one fourth process step the hollow needle with the thread end held returned to the starting position, so that only the held thread remains in the hole created by the needle. Subsequently is in a fifth Process step of the contacting thread again within the hollow needle fixed and severed at the needle tip. Finally be the contacting thread ends located on both sides of the conductor foil are formed and with the contact areas contacted.

In order to work particularly quickly and inexpensively, can in a correspondingly configured through-contacting device with a plurality of arranged side by side and / or one behind the other Needles in parallel several vias in one Track foil are generated. Thus, it is e.g. B. possible on a wide conductor track film has several uses for ticketing inlay films generate in parallel.

The invention is described below Reference to the attached Figures based on exemplary embodiments explained in more detail. It represent:

1 2 shows a schematic sectional drawing through a through-contacting according to the invention in accordance with a first exemplary embodiment,

2a to 2d schematic representations of the different method steps in a very simple via method for producing a via similar 1 .

3 2 shows a schematic section through a through-contact according to a second exemplary embodiment,

4 2 shows a schematic section through a multiple plated-through hole between two contact surfaces,

5 2 shows a schematic section through a multiple through-contact combined with a surface contact,

6 2 shows a schematic section through a through-connection according to the invention through a multilayer conductor track film,

7 2 shows a schematic section through a simple through-contacting according to the invention when the contacting thread ends are fastened in accordance with a first exemplary embodiment,

8th 2 shows a schematic section through a simple through-contacting according to the invention when the contacting thread ends are fastened in accordance with a second exemplary embodiment,

9 3 shows a schematic section through a simple through-contacting according to the invention when the contacting thread ends are fastened in accordance with a third exemplary embodiment,

10 1 shows a schematic section through a simple through-contacting according to the invention when the contacting thread ends are fastened in accordance with a fourth exemplary embodiment,

11 2 shows a schematic section through a chip card produced according to the invention when the outer contact surfaces are embossed,

12 a roughly schematic overview of a through-plating device according to the invention.

1 shows a simple embodiment of a plated-through hole set within a sewing process according to the invention 1 between two on the two sides 5, 6 of a conductor track film 2 arranged contact surfaces 7 which consists of a simple contact thread 3 consists of a hole 4 is drawn. The hole 4 through the conductor foil 2 through which the contact thread 3 is disproportionately shown here for clarification. The ends 8th of the contact thread 3 are each bent over and thus contact the two contact surfaces 7 , Such a simple via 1 is sufficient in most cases. It is because it is only a single puncture at a suitable point on the trace foil 2 is particularly easy and quick to generate.

A method for producing such a simple via 1 is subsequently based on the 2a to 2d described:
A through-contacting device with a hollow needle is used 10 used in which the contacting thread 3 to be led. The contact thread 3 is made from a contact thread reservoir 9 , for example from a coil 9 , withdrawn and from behind through the hollow needle 3 guided. Inside the hollow needle 10 becomes the contact thread 3 in a clamping device 11 held in a certain position so that the end of the contact thread 3 inside the hollow needle 10 located. The hollow needle 10 is in a starting position ( 2a ).

The hollow needle 10 is then in a stitch direction R _s ( 2 B ) moved down, passing through the contact surfaces 7 and the carrier material of the conductor track foil 2 pierces. Once the needle 10 the trace foil 2 has pierced, the clamping device 11 solved and the contact thread 3 advanced until one end 8th of the contact thread 3 from the needle tip 12 protrudes. This contact thread end 8th is then through a thread clamping device 13 clamped, which has two jaws, which are compressed in a clamping direction R _K and the end 8th of the contact thread 3 hold tight.

Then the contact thread is clamped 3 the hollow needle 10 moved back in a reset direction R _R to the starting position, automatically by clamping the contacting thread end 8th inside the clamping device 13 the contacting thread 3 from the hollow needle 10 is pulled out. As soon as the hollow needle 10 is back in the starting position, the contact thread 3 by means of a cutting device 14 directly at the tip of the needle 12 severed ( 2c ). The contact thread 3 is again inside the hollow needle 10 with the fixation device 11 fixed and if necessary even something in the hollow needle 10 withdrawn.

In a further process step, they are made from the conductor foil 2 protruding ends on both sides 8th of the contact thread 3 reshaped by applying a force on the thread ends in corresponding reshaping directions R _F 8th is exercised and so the thread ends 8th are bent against the contact surfaces 7. This can be done, for example, with a pressing device in a subsequent station. 2d shows a variant in which the two thread ends 8th are each bent to the same side. In the embodiment according to 1 are the two thread ends 8th instead, bent in opposite directions. This makes no difference to how it works.

In addition to this simple version, a wide variety of sewing variants are also possible, based on the 3 to 6 being represented.

In the variant according to 3 it is a double contact, in which the contact thread 3 through the same hole again 4 is withdrawn so that the two contacting thread ends 8th on the same side 5 of the conductor foil 2 are located and form a loop S on the other side 6. Both the contact thread ends 8th as well as the loop S can be reshaped with the usual methods and against the contacting surfaces 7 be pressed to ensure the necessary contacting.

4 shows a variant in which a multiple contact between two contact surfaces 7 on the top 5 and the bottom 6 is generated by the contacting thread 3 several times like a tack between the two sides 5, 6 through adjacent holes 4 . 4 ' . 4 '' is pulled back and forth.

A similar variant is in 5 shown, but here only one double via between two contacting areas 7 on the two opposite sides 5, 6 of the conductor foil 2 takes place and the basting stitches are pulled so far that the contact thread 3 a conductive bridge between two adjacent contact areas 7 . 7 ' . 7 '' on the same side 5 of the conductor foil 2 forms. This means that it is a combined method from a plated-through hole according to the invention 1 with a surface contact.

The individual holes through the conductor foil 2 through which the contact thread 3 runs are in 5 as well as in the following 6 not shown.

6 shows a through-plating according to the invention 1 through a multilayer conductor foil 2 which consist of several layers of film 15 . 16 . 17 . 18 . 19 consists of a medium film 17 trace structures on both sides with contact areas 20 . 21 having. In addition, the outer foils 15 . 19 in each case on the outside of conductor track structures with contact areas 7 on. Around all conductor structures or contact areas 7 . 20 . 21 To connect with each other at different levels is the thread of contact 3 by means of the sewing process according to the invention passed through all layers with a needle, wherein multiple contacting or — as shown here — double contacting is also possible, that is to say that the thread comes from the top once 5 to the bottom 6 the multilayer conductor foil 2 and is returned.

The 7 to 10 each show different variants, such as the contact thread ends 8th on the outside 5 . 6 the conductor foil 2 with the contact areas there 7 can be connected.

7 shows a variant in which by means of a rivet fit by simply pressing a groove 22 a connection of the thread ends 8th with the contact areas 7 is produced. This is in one operation at the same time as the contact thread ends are bent 8th possible. As an alternative to such a rivet form fit, a compression welding process, for example an ultrasonic or thermal welding process, can also be used.

8th shows a variant in which the bent contact thread ends 8th using an electrically conductive paste 23 are encapsulated.

In the variant according to 9 is on the two sides 5, 6 of the conductor foil 2 after bending the contact thread ends 8th one more slide each 24 . 25 laminated with the ends 8th firmly against the contact surfaces 7 the conductor foil 2 pressed. This method is particularly useful when the conductor track film 2 as ticking between other foils 24 . 25 z. B. is laminated to produce a disk card.

10 shows a variant in which first the two ends 8th of the contact thread 3 directly on the surfaces 5 . 6 the conductor foil 2 be bent and then with a contact surface 26 be stamped. This variant is particularly useful when a through-connection to a contact surface located on a surface of the chip card 26 should be done.

Of course, it is also possible to combine different contacting methods with one another and, for example, the contacting on the underside by laminating on another film 25 and on the top by embossing with a contact surface 26 to realize. Such a variant is in 11 shown. Here it is shown how, with the aid of the method according to the invention, a plated-through hole from a component which is located inside a chip card to the contact areas 26 is produced on the outside of the chip card.

The chip card here consists of two foils 2 and 25 , with the top slide 2 forms the conductor track film through which the through-plating by means of the contacting threads 3 is produced. A component 34 , for example a chip, is here with a conductor track structure 35 , which is on the underside of the conductor foil 2 is connected. Through-contacting with the contacting threads then takes place 3 , wherein the contacting of the lower contact thread end 8th in each case by laminating on the lower film 25 over the thread ends, the conductor track structure 35 and the component 34 takes place so that these parts between the foils 2 and 25 are located. The contact on the top 5 the conductor track film is done by first the contacting thread ends 8th bent over and then with contact surfaces 26 be stamped. These contact areas 26 form z. B. the usual contact pads of a chip card, which serve as an interface to a terminal.

12 shows roughly schematically the process flow for the industrial production of ticking foils for the production of chip cards, these ticking foils each with a component 33 are equipped and also have conductor track structures on an upper and a lower side, which on corresponding contact surfaces 7 are plated through in the manner according to the invention.

Several panels can be used simultaneously on a conductor foil 2 are manufactured. The foil 2 moves cyclically in the feed direction R _V and first arrives at a via station 27 which from a sewing station 28 and a downstream forming station 29 consists. The sewing station 28 points according to the number of side by side on the conductor track foil 2 benefit multiple needles 10 with associated contact thread retention devices, e.g. B. coils 9 , on. Below the slide 2 there are clamping devices at the appropriate points 13 , Punching and passing through threads 3 as well as reshaping the ends 8th the via threads 3 takes place at the sewing station 28 and the forming station 29 each as in the 2a to 2d described in more detail.

In a downstream milling station 30 can then have cavities in the appropriate places 32 in the conductor foil 2 be milled. In another assembly station 31 then the components 33 into the cavities 32 used. This can be followed by further process stations, in which, for example, further connections of the already existing conductor track structure to the component are initially provided on the surface 33 are produced and then the finished conductor foil 2 is laminated with other foils above or below and finally the finished cards are punched out.

The method according to the invention is extremely inexpensive. A particular advantage lies in the fact that any layouts can be processed in the through connection. Unless the individual needles 10 the sewing station 28 are arranged so that they can be set up in various directions above the surface, it is possible to switch the entire system from one to the next clock cycle to a different layout, and thus in particular to process a wide variety of different layouts.

1

via

2

Printed circuit film

3

Kontaktierungsfaden

4

hole

4 '

hole

4 ''

hole

5

top

6

bottom

7

contact area

7 '

contact area

7 ''

contact area

8th

Kontaktierungsfadenende

9

Kitchen sink

10

cannula

11

clamper

12

pinpoint

13

Thread clamp

14

cutter

15

film layer

16

film layer

17

film layer

18

film layer

19

film layer

20

contact area

21

contact area

22

groove

23

conductive paste

24

foil

25

foil

26

contact area

27

Durchkontaktierungsstation

28

sewing station

29

forming station

30

milling

31

loading station

32

cavity

33

module

34

component

35

Conductor structure

R _F

Umformrichtungen

R _K

clamping direction

R _R

Return direction

R _S

DStichrichtung

R _V

 feed direction

S

loop

Claims (18)

Method of creating a via ( 1 ) with a conductor foil ( 2 ) with a first side (5) and a second side ( 6 ), where a contact thread ( 3 ) in a sewing process through the conductor foil ( 2 ) is passed through, characterized in that - the contact thread ( 3 ) using a hollow needle ( 10 ), in which he ( 3 ) is guided through the conductor foil ( 2 ) is pulled through - the hollow needle ( 10 ) while the contact thread ( 3 ) inside the hollow needle ( 10 ), initially from a starting position with a needle tip ( 12 ) through the conductor foil ( 2 ) is pierced, - the contact thread ( 3 ) then inside the hollow needle ( 10 ) is continued so that a thread end ( 8th ) protrudes from the needle tip, - the hollow needle ( 10 ) is returned to the starting position, - the contact thread ( 3 ) in front of the needle tip ( 12 ) is severed and finally the contact thread ends on both sides of the conductor foil ( 8th ) at least on the first or the second side (5, 6) of the conductor foil ( 2 ) formed and contacted with at least one contact surface. A method according to claim 1, characterized in that the contact thread ( 3 ) from the first side (5) to the second side (6) through a through the hollow needle ( 10 ) created hole and forming a loop (S) on the second side (6) of the conductor foil ( 2 ) through the same hole ( 4 ) from the second side (6) back to the first side (5), and that the loop (S) on the second side (6) of the conductor foil ( 2 ) with at least one contact surface ( 7 . 26 ) is contacted. A method according to claim 1, characterized in that the contact thread ( 3 ) from the first side (5) to the second side (6) through a first through the needle ( 10 ) created hole ( 4 ) and through a second hole next to it ( 4 ' . 4 '' ) from the second side (6) back to the first side (5). A method according to claim 3, characterized in that the contact thread ( 3 ) several times through the conductor foil in the manner of a tack seam ( 2 ) is passed through from the first side (5) to the second side (6) and back, with two on the two sides (5, 6) of the conductor foil ( 2 ) arranged contact surfaces ( 7 ) contacted each other several times. Method according to one of claims 1 to 4, characterized in that the contact thread ( 3 ) several times through the conductor foil in the manner of a tack seam ( 2 ) is passed through from the first side (5) to the second side (6) and back, so that the contact thread ( 3 ) at least on one of the two sides (5) two contact surfaces arranged there ( 7 . 7 ' . 7 '' ) bridges. Method according to one of claims 1 to 5, characterized in that the contact surface ( 7 ) directly on the surface of the conductor foil ( 2 ) is arranged and the formed contact thread ( 3 ) on the outside to the contact surface ( 7 ) created becomes. A method according to claim 6, characterized in that the contact thread ( 3 ) by a rivet-fitting process and / or a compression welding process with the contact surface ( 7 ) is connected. A method according to claim 6 or 7, characterized in that the on the contact surface ( 7 ) contact thread ( 3 ) with a conductive material ( 23 ) is covered. A method according to claim 6, characterized in that the contact thread ( 3 ) thereby with the contact surface ( 7 ) is connected that on the relevant side (5, 6) of the conductor track film ( 2 ) another layer ( 24 . 25 ) is laminated on. Method according to one of claims 1 to 5, characterized in that the formed contact thread ( 3 ) directly to the surface of the conductor foil ( 2 ) is created and then on the conductor foil ( 2 ) a contact surface ( 26 ) is applied in such a way that the shaped contact thread ( 3 ) covered. Method according to one of claims 1 to 10, characterized in that the conductor track film ( 2 ) a plurality of superimposed film layers ( 15 to 19 ) with between the film layers ( 15 to 19 ) arranged conductor track structures and that for contacting at different levels within and / or on the conductor track film ( 2 ) located conductor track structures of the contacting thread ( 3 ) at a position where contact surfaces ( 7 . 20 . 21 ) the conductor track structures to be contacted are arranged one above the other, through all film layers ( 15 to 19 ) is passed through. A method according to claim 1, characterized in that the thread inside the hollow needle ( 10 ) is fixed while the conductor foil is pierced. A method according to claim 1, characterized in that the from the hollow needle ( 10 ) protruding thread end is clamped while the hollow needle ( 10 ) is returned to the starting position. Method according to one of claims 1 to 13, characterized in that in a via device ( 27 ) several plated-through holes at the same time through a conductor foil ( 2 ) be generated. Use of a method according to one of claims 1 to 14 for producing a through-connection through a conductor track film, which is part of a portable, electronic data carrier. Use according to claim 15, characterized in that the electronic media one Smart card is. Device for producing a via through a conductor track film ( 2 ) with - an adjustable hollow needle ( 10 ), - Means for fixing the contact thread in the hollow needle ( 10 ), - adjusting means for piercing the conductor foil ( 2 ) with the hollow needle ( 10 ), - a device for fixing the pierced contact thread ( 3 ), - and funds ( 29 ) to the contact thread ( 3 ) at least on one side (5, 6) of the conductor foil ( 2 ) and there with at least one contact surface ( 7 ) to contact. Device according to Ansμruch 17, characterized by a plurality of hollow needles arranged side by side and / or one behind the other ( 10 ) to connect several vias ( 1 ) in a conductor foil ( 2 ) to create.