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DE10245946C1 - Production of a light source module comprises arranging light emitting diodes in a recess of a casting frame, casting the recesses and removing the casting frame - Google Patents

Production of a light source module comprises arranging light emitting diodes in a recess of a casting frame, casting the recesses and removing the casting frame

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Publication number
DE10245946C1
DE10245946C1 DE10245946A DE10245946A DE10245946C1 DE 10245946 C1 DE10245946 C1 DE 10245946C1 DE 10245946 A DE10245946 A DE 10245946A DE 10245946 A DE10245946 A DE 10245946A DE 10245946 C1 DE10245946 C1 DE 10245946C1
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Germany
Prior art keywords
casting
casting frame
leds
frame
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10245946A
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German (de)
Inventor
Patrick Kromotis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
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Priority to DE10245946A priority Critical patent/DE10245946C1/en
Application granted granted Critical
Publication of DE10245946C1 publication Critical patent/DE10245946C1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

Production of a light source module comprises arranging light emitting diodes (LEDs) in a recess (11) of a casting frame (10), casting the recesses and removing the casting frame.

Description

Die Erfindung betrifft ein Verfahren zur Herstellung eines Lichtquellenmoduls mit mehreren auf einem Trägersubstrat an­ geordneten LEDs.The invention relates to a method for producing a Light source module with several on a carrier substrate ordered LEDs.

Aus der DE 100 51 159 A1 ist ein Lichtquellenmodul mit mehre­ ren auf einer Leiterplatte angeordneten LEDs bekannt.DE 100 51 159 A1 describes a light source module with several ren arranged on a circuit board LEDs known.

Bei LEDs bzw. oberflächenmontierbaren optoelektronischen Bau­ elementen ist z. B. aus dem Artikel "Siemens SMT-Toplet für die Oberflächenmontage" von F, Möllmer und G. Waitl, Siemens Components 29 (1991, Heft 4, Seiten 147 bis 149) bekannt ei­ nen vorgefertigten elektrischen Leiterrahmen (Leadframe) mit Kunststoffmaterial zu umspritzen. Der Kunststoffrahmen ist mit Aussparungen für die LEDs versehen, welche nach der Mon­ tage der LEDs mit Vergußmasse ausgegossen werden.For LEDs or surface mount optoelectronic construction elements is z. B. from the article "Siemens SMT Toplet for the surface assembly "by F, Möllmer and G. Waitl, Siemens Components 29 (1991, volume 4, pages 147 to 149) known a prefabricated electrical lead frame (leadframe) Overmolding plastic material. The plastic frame is with cutouts for the LEDs, which according to Mon days of the LEDs are cast with potting compound.

Um die Wärme der LEDs abzuführen, ist es bei Lichtquellen mit mehreren LEDs notwendig, an der Unterseite der Leiterplatte einen Kühlkörper anzuordnen. Bei starken Temperaturspannungen kommte es jedoch aufgrund der unterschiedlichen Ausdehnungs­ koeffizienten des Kühlkörpers und des Kunststoffes, mit denen die LEDs umspritzt sind, zu Spannungen, welche zur Beein­ trächtigung bzw. zur Zerstörung des Lichtquellenmoduls führen können.To dissipate the heat of the LEDs, it is included with light sources several LEDs required on the underside of the circuit board to arrange a heat sink. With strong temperature tensions it came about because of the different expansion coefficients of the heat sink and the plastic with which the LEDs are overmoulded, to voltages which are legged damage or destroy the light source module can.

Aus der WO 99/41785 A1 ist es an sich bekannt, mechanische unerwünschte Spannungen dadurch auszugleichen, dass die Einzel- LEDs durch Abdünnungen des Trägers voneinander getrennt sind.From WO 99/41785 A1 it is known per se, mechanical to compensate for undesired tensions in that the individual LEDs separated from each other by thinning the carrier are.

Der Erfindung liegt daher die Aufgabe zugrunde, ein Verfahren zur Herstellung eines Lichtquellenmoduls aufzuzeigen, welches auch starken Temperaturschwankungen Stand hält.The invention is therefore based on the object of a method to demonstrate the manufacture of a light source module withstands strong temperature fluctuations.

Die Aufgabe wird erfindungsgemäß dadurch gelöst, daß
The object is achieved in that

  • a) ein Vergußrahmen aufgesetzt wird, so daß die LEDs in einer Aussparung des Vergußrahmens angeordnet sind, a) a potting frame is placed so that the LEDs in one Recess of the casting frame are arranged,  
  • b) die Aussparungen, in denen die LEDs angeordnet sind, aus­ gegossen werden undb) the recesses in which the LEDs are arranged be poured and
  • c) der Vergußrahmen wieder entfernt wird.c) the casting frame is removed again.

Durch das nachträgliche Entfernen des Vergußrahmens ist ge­ währleistet, daß auch bei Anordnung eines Kühlkörpers in Form eines Metallträgers unterhalb der Trägersubstrate keine Be­ schädigungen der LEDs durch die Wärmeausdehnungen von dem Kühlkörper verursacht wird, da die LEDs durch Luftzwischen­ räume an den Stellen, wo der Vergußrahmen entfernt wurde, be­ abstandet sind.By the subsequent removal of the casting frame is ge ensures that even when a heat sink is arranged in the form of a metal carrier below the carrier substrates no loading Damage to the LEDs due to the thermal expansion of the Heatsink is caused by the air passing between the LEDs rooms where the potting frame has been removed are spaced.

Der Vergußrahmen weist vorzugsweise an der Unterseite Ab­ dichtwülste auf, so daß beim Aufsetzen des Vergußrahmens z. B. auf zwischen den Trägersubstraten angeordneten Leiterplatten eine hohe Abdichtung zwischen Vergußrahmen und Leiterplatte erzielt wird und es somit nicht zum ungewollten Auslaufen der Vergußmasse beim Vergießen der Aussparungen kommt.The casting frame preferably has on the underside tightly on, so that when placing the casting frame z. B. on printed circuit boards arranged between the carrier substrates a high seal between the potting frame and the printed circuit board is achieved and therefore it does not lead to unwanted leakage the potting compound comes when potting the recesses.

Der Verguß der Aussparungen erfolgt vorzugsweise in zwei Schritten, wobei zuerst mit Reflektormaterial und anschlie­ ßend mit transparentem Material vergossen wird.The recesses are preferably cast in two Steps, starting with reflector material and then is cast with transparent material.

Als Reflektormaterial dient vorzugsweise weißes Silikon oder Titanoxid bzw. mit Titanoxid versetztes Epoxidharz oder Sili­ kon und als transparentes Material entweder transparentes Si­ likon oder transparentes Epoxidharz. Je nach Vergußmaterial ist es vorteilhaft, den Vergußrahmen vor jedem neuen Verguß mit einem Antihaftmittel zu versehen.White silicone or is preferably used as the reflector material Titanium oxide or epoxy resin mixed with titanium oxide or sili kon and as transparent material either transparent Si likon or transparent epoxy resin. Depending on the potting material it is advantageous to use the potting frame before each new potting to be provided with a non-stick agent.

Weitere Vorteile der Erfindung sind in der nachfolgenden Fi­ gurenbeschreibung offenbart.Further advantages of the invention are in the following Fi gurenbeschreibung revealed.

In den Zeichnungen zeigt: In the drawings:  

Fig. 1 ein teilweiser Querschnitt durch ein Lichtquellen­ modul mit aufgesetztem Vergußrahmen, Fig. 1 is a partial cross-sectional view of a light source module with attached Vergußrahmen,

Fig. 2 die Darstellung gemäß Fig. 1 beim Entfernen des Vergußrahmens, Fig. 2 shows the view according to Fig. 1 of the Vergußrahmens during removal,

Fig. 3a und 3b einen Ausschnitt eines Lichtquellenmoduls nach dem ersten Verguß in Seitenansicht und der Ansicht von oben und die FIGS. 3a and 3b a detail of a light source module, after the first potting in side view and the top view and the

Fig. 4a und 4b die Ansichten gemäß den Fig. 3a und 3b nach dem zweiten Verguß. FIGS. 4a and 4b, the views shown in FIGS. 3a and 3b after the second potting.

Fig. 1 zeigt einen teilweisen Querschnitt durch ein Licht­ quellenmodul mit zwei LEDs. Die LEDs umfassen jeweils opto­ elektronische Bauelemente 1, die über ein Trägersubstrat 2 aus Metall oder einem gut wärmeleitendem Material mit einem Metallträger 3 verbunden. Fig. 1 shows a partial cross section through a light source module with two LEDs. The LEDs each include optoelectronic components 1, which is connected via a supporting substrate 2 formed of metal or highly thermally conductive material having a metal support. 3

Die Trägersubstrate 2 sind, wie im linken Trägersubstrat 2 von Fig. 1 dargestellt, aus einer siliziumhaltigen Träger­ schicht 4 und einer darüber angeordneten Siliziumoxidschicht 5 sowie einer über dieser angeordneten Siliziumnitridschicht 6 aufgebaut, wobei die Schichten 5 und 6 als Isolierschicht fungieren.The carrier substrates 2 are, as shown in the left carrier substrate 2 of FIG. 1, composed of a silicon-containing carrier layer 4 and a silicon oxide layer 5 arranged thereon and a silicon nitride layer 6 arranged above this, the layers 5 and 6 functioning as an insulating layer.

Zwischen den optoelektronischen Bauelemente 1 sind Leiter­ platten 7 angeordnet, wobei die optoelektronischen Bauelemen­ te über diese Leiterplatten 7 sowie über Verdrahtungen 8 elektrisch angesteuert sind. An der Oberfläche der Trägersub­ strate 2 sind hierzu Metallpads 9 vorgesehen.Between the opto-electronic components 1 are printed circuit boards 7, wherein the optoelectronic Bauelemen te on these printed circuit boards 7, and are electrically actuated via wirings. 8 Metal pads 9 are provided on the surface of the carrier substrate 2 for this purpose.

Die optoelektronischen Bauelemente 1, die Trägersubstrate 2, die Leiterplatten 7 einschließlich der Verdrahtung 8 sind in der Regel in einer flexiblen Leiterplatte aufgenommen. The optoelectronic components 1 , the carrier substrates 2 , the printed circuit boards 7 including the wiring 8 are generally accommodated in a flexible printed circuit board.

Zum Schutz der LEDs vor mechanischer Einwirkung sowie zur Er­ zielung eines Reflektors für bessere Lichtabstrahlung müssen die LEDs vergossen werden.To protect the LEDs from mechanical influences and to protect them aiming for a reflector for better light emission the LEDs are shed.

Hierzu ist, wie in Fig. 1 dargestellt, ein Vergußrahmen 10 auf die Leiterplatte aufgesetzt, wobei der Vergußrahmen 10 jeweils Aussparungen 11 an den Stellen aufweist, an welchen die LEDs angeordnet sind.For this purpose, as shown in FIG. 1, a casting frame 10 is placed on the circuit board, the casting frame 10 in each case having cutouts 11 at the locations at which the LEDs are arranged.

Der Vergußrahmen 10 weist an seiner Unterseite elastisch ver­ formbare Dichtwülste 12 auf, so daß eine ideale Abdichtung zur Leiterplatte 7 hin erfolgt.The potting frame 10 has on its underside elastically deformable sealing beads 12 , so that an ideal seal to the circuit board 7 takes place.

Ist der Vergußrahmen 10, wie in Fig. 1 dargestellt, aufge­ setzt, erfolgt in einem ersten Verfahrensschritt der Verguß von reflektierender Vergußmasse 13 und in einem zweiten Schritt der Verguß mit klarer Vergußmasse 14.If the casting frame 10 , as shown in FIG. 1, is set up, the casting of reflective casting compound 13 takes place in a first method step and the casting with clear casting compound 14 takes place in a second step.

Die reflektierende Vergußmasse 13 kann entweder weißes Sili­ kon oder auch Titanoxid oder mit Titanoxidpartikeln versetz­ tes Epoxidharz oder Silikon sein. Als klare Vergußmasse fin­ det in der Regel transparentes Silikon bzw. transparentes Epoxidharz Verwendung.The reflective casting compound 13 can be either white silicone or titanium oxide or epoxy resin or silicone mixed with titanium oxide particles. Transparent silicone or transparent epoxy resin is generally used as the clear sealing compound.

Zur Reflektorwirkung wird die reflektierende Vergußmasse 13 so ausgegossen, daß sich die Oberfläche der reflektierenden Vergußmasse 13 seitlich schräg bzw. konvex von dem Trägersub­ strat 2 nach oben erstreckt.For the reflector effect, the reflective potting compound 13 is poured out such that the surface of the reflective potting compound 13 extends laterally obliquely or convexly from the carrier substrate 2 upwards.

Fig. 2 zeigt die Ansicht gemäß Fig. 1, wobei in diesem Ver­ fahrensschritt der Vergußrahmen 10 vom Lichtquellenmodul ab­ gehoben wird, so daß die mit Vergußmasse 13, 14 vergossenen LEDs über Luftzwischenräume voneinander beabstandet sind. Fig. 2 shows the view of FIG. 1, in this Ver process step, the potting frame 10 is lifted from the light source module, so that the potted with potting compound 13 , 14 LEDs are spaced apart from each other via air gaps.

Erfolgt der Verguß mit Silikon, ist es zweckmäßig, hier einen weiteren meschanischen Schutz aufzubringen, welcher jedoch nicht formschlüssig mit der Vergußmasse abschließen sollte. If the potting is done with silicone, it is advisable to use one here to provide further mechanical protection, which however should not form fit with the sealing compound.  

Als Schutz kann ein Reflektor oder ein anderes optisches Ele­ ment verwendet werden. Wird ein Reflektor verwendet, kann der Verguß auch nur mit klarer Vergußmasse erfolgen.As a protection, a reflector or another optical ele ment can be used. If a reflector is used, the Potting should also be done with a clear potting compound.

Fig. 3a und 3b zeigen in einer Seitenansicht sowie in einer Ansicht von oben nochmals den Schritt des Einbringens der re­ flektierenden Vergußmasse 13, wobei der Vergußrahmen 10 nicht dargestellt ist. Fig. 3a and 3b show a side view and in a view from above, again the step of introducing the re inflecting potting compound 13, wherein the Vergußrahmen 10 is not shown.

In Fig. 3b, welcher die Ansicht von oben zeigt, ist zu er­ kennen, daß pro LED vier optoelektronischen Bauelemente 1 an der Oberseite des Trägersubstrates 2 angeordnet sind und die optoelektronischen Bauelemente 1 jeweils separat durch Ver­ drahtungen 8 angesteuert sind.In Fig. 3b, which shows the view from above, he is to know that four optoelectronic components 1 are arranged per LED on the top of the carrier substrate 2 and the optoelectronic components 1 are each separately controlled by wiring 8 per LED.

Fig. 4a und 4b zeigen die Ansicht gemäß Fig. 3a und 3b nach eingebrachter transparenter bzw. klarer Vergußmasse 14. FIGS. 4a and 4b show the view of FIG. 3a and 3b to be applied transparent or clear encapsulant fourteenth

Insbesondere bei Lichtquellenmodulen für HUD-Systeme (HUD = Head-Up Display) müssen die LEDs in einem Raster angeordnet werden, so daß der Rahmen zwischen den LEDs zu eng und zu steil wäre, als daß durch ihn eine Reflektorwirkung erzielt werden könnte. Somit ist es ohnehin nötig, die LEDs zweistu­ fig, d. h. mit einer reflektierenden Vergußmasse und anschlie­ ßend mit einer klaren Vergußmasse zu vergießen, um eine Re­ flektorwirkung zu erzielen.Especially with light source modules for HUD systems (HUD = Head-Up Display) the LEDs must be arranged in a grid be so that the frame between the LEDs is too tight and too would be steep to achieve a reflector effect could be. So it is necessary to double the LEDs anyway fig, d. H. with a reflective potting compound and then shedding with a clear potting compound to make a re to achieve a reflector effect.

Der herkömmlich verwendete Rahmen ist somit nur herstellungs­ technisch notwendig und bringt insbesondere bei mobilem Ein­ satz des Lichtquellenmoduls die Probleme mit sich, daß auf­ grund der unterschiedlichen Temperaturen Wärmespannungen ent­ stehen und es somit zur Beschädigung des Lichtquellenmodules kommen kann.The conventionally used frame is therefore only manufacturing technically necessary and brings in particular with mobile Ein set of the light source module the problems with that on due to the different temperatures ent stand and thus damage the light source module can come.

Durch den einfachen Verfahrensschritt, den Rahmen nicht als Bestandteil des Lichtquellenmodules zu verwenden, sondern als Vergußrahmen, wobei dieser sich zur leichteren Entformung auch nach unten konisch verjüngen kann, ist es möglich, ein Lichtquellenmodul herzustellen, welches auch für den mobilen Einsatz mit starken Temperaturschwankungen geeignet ist.By the simple procedural step, the frame is not considered To be used as part of the light source module, but as Casting frame, this is for easier demolding  can also taper conically downwards, it is possible to Manufacture light source module, which also for the mobile Use with strong temperature fluctuations is suitable.

Claims (6)

1. Verfahren zur Herstellung eines Lichtquellenmoduls mit mehreren auf einem Trägersubstrat (2) angeordneten LEDs, dadurch gekennzeichnet, daß
  • a) ein Vergußrahmen (10) aufgesetzt wird, so daß die LEDs in einer Aussparung (11) des Vergußrahmens (10) angeordnet sind,
  • b) die Aussparungen (11), in denen die LEDs angeordnet sind, ausgegossen werden,
  • c) der Vergußrahmen (10) wieder entfernt wird.
1. A method for producing a light source module with a plurality of LEDs arranged on a carrier substrate ( 2 ), characterized in that
  • a) a casting frame ( 10 ) is placed so that the LEDs are arranged in a recess ( 11 ) of the casting frame ( 10 ),
  • b) the recesses ( 11 ) in which the LEDs are arranged are poured out,
  • c) the casting frame ( 10 ) is removed again.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß der Vergußrahmen (10) an der Unterseite Abdichtwülste (12) aufweist und auf zwischen den Trägersubstraten (2) angeordne­ ten Leiterplatten (7) aufgesetzt wird.2. The method according to claim 1, characterized in that the casting frame ( 10 ) has sealing beads ( 12 ) on the underside and is placed on the printed circuit boards ( 7 ) arranged between the carrier substrates ( 2 ). 3. Verfahren nach einem der Ansprüche 1 oder 2, dadurch gekennzeichnet, daß der Verguß in zwei Schritten erfolgt, wobei zuerst reflektie­ rendes Vergußmaterial (13) und danach transparentes Vergußma­ terial (14) vergossen wird.3. The method according to any one of claims 1 or 2, characterized in that the potting takes place in two steps, wherein first reflective potting material ( 13 ) and then transparent Vergußma material ( 14 ) is potted. 4. Verfahren nach Anspruch 3, dadurch gekennzeichnet, daß als reflektierendes Vergußmaterial weißes Silikon oder Ti­ tanoxid oder Titanoxidpartikel versetztes Epoxidharz oder Si­ likon verwendet wird.4. The method according to claim 3, characterized in that white silicone or Ti as a reflective potting material epoxy resin or Si mixed with tan oxide or titanium oxide particles likon is used. 5. Verfahren nach einem der Ansprüche 3 oder 4, dadurch gekennzeichnet, daß als transparentes Material Silikon oder transparentes Epoxid­ harz verwendet wird.5. The method according to any one of claims 3 or 4, characterized in that as a transparent material silicone or transparent epoxy resin is used. 6. Verfahren nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß der Vergußrahmen vor jedem Verguß mit Antihaftmittel versehen wird.6. The method according to any one of claims 1 to 5, characterized in that  the casting frame must be provided with non-stick agent before each casting becomes.
DE10245946A 2002-09-30 2002-09-30 Production of a light source module comprises arranging light emitting diodes in a recess of a casting frame, casting the recesses and removing the casting frame Expired - Fee Related DE10245946C1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10245946A DE10245946C1 (en) 2002-09-30 2002-09-30 Production of a light source module comprises arranging light emitting diodes in a recess of a casting frame, casting the recesses and removing the casting frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10245946A DE10245946C1 (en) 2002-09-30 2002-09-30 Production of a light source module comprises arranging light emitting diodes in a recess of a casting frame, casting the recesses and removing the casting frame

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