DE102017107394A1 - heat pump system - Google Patents

Abstract

Thus, a heat pump system with a refrigerant circuit (100), a charging circuit (700), a first heat exchanger (170) for transferring heat from the refrigerant circuit (100) to the heat transfer medium of the charging circuit (700) is provided. Further, a hot water tank (300) is provided, wherein the water in the hot water tank (300) by means of the heat transfer medium and a second heat exchanger (330) is heated. Further, a buffer memory (610) is provided as a heating buffer layer memory. The medium in the buffer memory (610) is heated by means of the heat transfer medium of the charging circuit (100). Further, an air heater unit (230) for heating air for space heating based on heat stored in the buffer memory (610) is provided.

Description

The present invention relates to a heat pump system and a buffer for a heat pump system.

Heat pump systems are known in different variations.

It is an object of the present invention to provide a heat pump system which allows flexible use. In particular, it is an object of the present invention to provide a heat pump system for a passive house.

This object is achieved by a heat pump system according to claim 1.

Thus, a heat pump system is provided with a refrigerant circuit, a charging circuit, a first heat exchanger for transferring heat from the refrigerant circuit to the heat transfer medium of the charging circuit. Furthermore, a hot water tank is provided, wherein the water in the hot water tank by means of the heat transfer medium and a second heat exchanger can be heated. Furthermore, a buffer memory is provided as Heizpufferschichtspeicher. The medium in the buffer memory is heated by means of the heat transfer medium of the charging circuit. Further, an air heater unit for heating air for space heating based on heat stored in the buffer memory is provided.

According to one aspect of the present invention, the buffer memory has an inner diameter and a height whose ratio is less than 0.4, in particular less than 0.2.

According to one aspect of the present invention, the hot water storage has a diameter between 400 and 500 mm and a height between 1600 and 1700 mm.

According to one aspect of the present invention, the heat pump has a heating module and a memory module. According to one aspect of the present invention, the memory module may have a width of about 580 mm. The total unit or the heat pump system may have a width of optionally 1430 mm. The height of the heat pump system or the storage module can be 1850 mm. The depth of the storage module and the heat pump system can be for example 812 mm.

Between the air heater and an outer wall of the memory module can be provided with a width of 150 mm.

Further embodiments of the invention are the subject of the dependent claims.

• 1 zeigt eine schematische Darstellung einer Wärmepumpenanlage gemäß der Erfindung,
• 2 zeigen verschiedene Ansichten einer erfindungsgemäßen Wärmebis 5 pumpenanlage, und
• 6A-D zeigt jeweils verschiedene Ansichten eines Lufterhitzers einer Wärmepumpenanlage gemäß der Erfindung.

Advantages and embodiments of the invention are explained below with reference to the drawing.

• 1 shows a schematic representation of a heat pump system according to the invention,
• 2 show different views of a heat of the invention 5 pumping system, and
• 6A-D shows in each case different views of an air heater of a heat pump system according to the invention.

1 shows a schematic representation of a heat pump system according to the invention. 2 shows a further schematic representation of the heat pump. 3 shows a perspective view of the heat pump. 4 shows a view of the heat pump from below and 5 shows a side view of the heat pump according to the invention.

The heat pump system according to the invention represents a combination of a heat generator for heating, for cooling and a ventilation system for temperature control of rooms and / or buildings. The heat pump system 1 has a refrigerant circuit 100 , an air / air heat exchanger 200 , a hot water tank or hot water tank 300 and a buffer memory 610 on. In a charging cycle 700 can be via a three-way valve 710 a hot water (in the hot water tank 310 ) or a heating / cooling of rooms by means of the buffer memory 610 and an air heater 230 respectively.

In particular, a solar system 400 and / or an electric heater 500 can be connected to the heat pump system or integrated.

The heat pump system 1 can be composed of two units: a heating module 2 and a memory module 3 , The two modules 2,3 are assembled in a building / room and form the heat pump system for heating, hot water preparation, ventilation and optionally also for cooling.

The heat pump system 1 has a refrigerant circuit 100 with a compressor 110 , a three-way valve 120 , a gas cooler 130 , a refrigerant subcooler 140 , a throttle 150 and an evaporator 160 on. Furthermore, a gas cooler 170 be provided, which is a heat exchanger 171 for a heat exchange between a refrigerant of the refrigerant circuit 100 and the heat transfer medium of a charging circuit 700 having. Furthermore, the refrigerant circuit lines 180 . 181 . 182 . 183 . 184 and 185 on. The evaporator 160 is an opening 161 assigned over which the evaporator 160 is connected to an outside air AU.

The through the air / air heat exchanger 200 heated outside air AU flows as supply air ZU through a supply air duct 220 to the air heater 230 ,

In the air heater 230 the supply air ZU is raised to a setpoint temperature. A flowing through the air heater heat transfer medium has temperatures of preferably 30-60 ° C, whereby the supply air flow ZU is raised to a temperature of preferably below 60 °, in particular below 50 ° C.

The heat pump system 1 also has a water tank 300 as a hot water storage tank (eg with a volume of 200 l). The water in the store 300 is preferably via a hot water heat exchanger 330 heated. By means of a circulating pump 320 The water in the hot water tank is through the hot water heat exchanger 330 pumped. The drinking water preferably flows through the water pipes 341 and 342 to the hot water heat exchanger 330 who is in a corpus 310 is arranged. Furthermore, to the hot water heat exchanger 330 a hot water supply line 350 and a hot water return line 360 connected.

Further, a buffer memory 610 provided to the a heat transfer circuit 600 connected. A fluid line 612 leads to the air / air heat exchanger 230 , In the cache 610 is a first buffer tube 6110 intended. The cache 610 has a first entry 6111 and a first exit 6112 on.

The cache 610 is designed very slim, ie the ratio of the buffer diameter D to the height H of the buffer memory is low. The cache 610 has a diameter of advantageously about 15-25 cm, the height is advantageously between about 80 cm and 200 cm, wherein the container of diameter and height D / H is preferably less than 0.2.

The diameter D may also be smaller than 15 cm in other embodiments and the height may be even higher than 200 cm. Depending on how high the height H fails, the diameter D can also be larger. As far as the height over 200 cm fails, the diameter D may be over 25 cm, wherein the ratio of diameter and height preferably remains smaller than 0.3.

According to one aspect of the invention, the diameter D of the buffer is about 18 cm and the height about 150 cm. Thus, the ratio of the buffer memory diameter D to the height H of the buffer memory is about 0.12. Such ratios of diameter to height will advantageously be below 0.4, in particular ratios between 0.2 and 0.08, or about 0.1-0.14.

The first buffer tube 6110 is with a first pipe opening 6113 fitted. The first pipe opening 6113 is up to an upper dished bottom 6130 directed. The first buffer tube 6110 itself is opposite the first pipe opening 6113 through, so one through the first buffer tube 6110 flowing heat transfer medium with that in the buffer tank 610 located heat transfer medium on the upper dished bottom 6130 located first pipe opening 6113 communicates.

The buffer memory optionally has a second buffer tube 6120 on. The cache 610 is with a second entry 6121 and a second exit 6122 fitted. The second buffer tube 6120 has a second pipe opening 6123 on, leading to a lower dished bottom 6150 is directed and thus the second buffer tube 6120 to the lower dished bottom 6150 is open. Opposite the second pipe opening 6123 is the second buffer tube 6120 continuously.

The first buffer tube 6110 is in an upper zone ZO of the buffer memory 610 arranged. The second buffer tube 6120 is in a lower zone to the buffer tank 610 arranged.

The first buffer tube 6110 is located in the upper zone ZO. The upper zone ZO advantageously makes a volume of less than 25% of the buffer memory 610 out.

The first entry 6111 , the first exit 6112 , the second entry 6121 and the second exit 6122 but also at any point of the buffer memory 610 be appropriate, for example, in the upper dished bottom 6130 , or in the lower dished bottom 6150 and / or somewhere in the container wall 6140 ,

Are then advantageous in the interior of the buffer memory 610 Pipes attached, with which the entrances and exits 6111 . 6112 . 6121 . 6122 are extended, the pipes then being in a designated area of the buffer tank 610 end up. So the first entry 6111 be arranged in the lower dished bottom and a tube in the buffer memory 610 up to the top of the upper dished bottom 6130 be guided, where then the heat transfer medium in the inner space of the buffer tank 610 can occur. Physically, this corresponds to the arrangement, as when the first entry 6111 at a corresponding point in the upper dished bottom 6130 is appropriate.

The buffer tube distance R is advantageously as large as possible. For manufacturing reasons, it has proved to be advantageous that the first buffer tube 6110 and the second buffer tube 6120 in the container wall 6140 are arranged and thereby have the largest possible R buffer pipe distance. Advantageously, as shown in the embodiment, the first buffer tube 6110 near the upper dished bottom 6130 but still in the container wall 6140 arranged and also the second buffer tube 6120 is near the lower dished bottom 6150 but still in the container wall 6140 arranged.

Also an arrangement of the first buffer tube 6110 and the second buffer tube 6120 in a dished bottom 6130 . 6150 may be advantageous, especially from production engineering thought out. Thus, in an advantageous embodiment, only the same dished ends are needed 6130 . 6150 with a buffer tube ( 6110 . 6120 ) are made, then the bottom and top of each on the container wall 6140 be set.

In the heat transfer circuit 600 is a buffer pump 620 provided, the heat transfer medium first to the air heater 230 and then to a Heizkreiswärmeübertrager 632 haunts. The heating circuit heat exchanger 632 is part of a heating circuit 630 , The heating circuit 630 is traversed by a liquid heat transfer medium, driven by a heating circuit pump 631 , This can be a floor heating and / or radiators are supplied with heat / cold.

In the area of water hydraulics of the buffer tank 610 is a buffer bypass 703 provided by the primary flow line 701 by means of a bypass three-way valve 702 is branched off.

The cache 610 points between the upper dished bottom 6130 and the lower dished bottom 6150 a container wall 6140 on. The cache 610 it has an inner diameter D and a height H. Furthermore, the cylinder wall by a height HZ of the cylinder wall 6140 Are defined. The distance of the first buffer tube 6110 to the second buffer tube 6120 is defined by a buffer pipe distance R

Advantageously, the buffer memory 610 at the upper dished bottom 6130 a vent port 6131 or a vent valve on.

According to one aspect of the invention, the setpoint temperature of the supply air flow ZU is controlled as a function of an outside temperature and / or a room temperature. Accordingly, either the mass flow of the heat transfer medium through the air heater 230 and / or the temperature of the heat transfer medium through the air / air heat exchanger 200 controlled to reach the setpoint temperature of the supply air ZU. Preferably, a supply air temperature sensor is in a supply air connection 240 provided that detects the supply air temperature. Depending on a temperature signal of the supply air and / or the room temperature and / or the outside temperature, the temperature of the heat transfer fluid medium and / or the mass flow of the heat transfer medium is controlled.

With outside air temperatures in the range of -20 °, the supply air is heated to approx. 50 °. At temperatures of around 0 °, the supply air warms up to around 35 ° C.

In a cooling case, when the building is to be cooled, the supply air ZU is lowered in temperature, to a value that is below the set room temperature. This takes place until the setpoint of the room temperature is reached. In many cases, it is necessary that the supply air temperature for cooling longer times, especially over several hours, in which the outside temperature is above 25 ° C or a strong heat input by solar radiation, kept below the set temperature of the room and the heat transfer medium cooled. This is also the refrigerant circuit 100 operated in such a way that the gas cooler serves as a gas heater or evaporator, where the refrigerant absorbs heat from the heat transfer medium and thus cools the heat transfer medium.

The exhaust air flow AB, through the exhaust air duct 210 to the air / air heat exchanger 200 flows in the heating case by the cool outside air flow, preferably with -3 ° to the air / air heat exchanger 200 flows, cooled to temperatures below room temperature. Depending on the outside temperature, cooling takes place to a temperature value which is approx. 2 K to 7 K above the outside air temperature or the temperature of the air which is the air / air heat exchanger 200 is supplied, is. The exhaust air thus flows cooled as exhaust air from the air / air heat exchanger 200 and in the exemplary embodiment is preferably conveyed by the exhaust fan.

The thus extracted exhaust air FO is via an exhaust air duct 250 an evaporator 160 of the refrigerant circuit 100 fed. Since the exhaust air is about 2 K to 7 K warmer than the outside air, the evaporator 160 supplied by the exhaust air relatively high-energy air, which preferably has a temperature above freezing.

In one embodiment, a solar system 400 be connected to the heat pump system. The solar system 400 consists of a solar collector 410 , a solar pump 420 . a solar heat exchanger 430 as well as a solar heat transfer medium cooler 431 , The solar heat transfer medium cooler 431 is preferably in a return line 730 a charging circuit 700 involved.

An electric heater 500 with an electric radiator 510 and an electrical connection 520 may optionally be provided to convert direct electrical current into heat and transfer this heat to the charging circuit 700 to be able to deliver.

In 1 is still an air / air heat exchanger 200 in the heat pump system 1 involved. The air / air heat exchanger 200 is to an exhaust duct 210 , a supply air duct 220 , an exhaust duct 250 and an outside air duct 280 connected. In the supply air duct 220 can optionally have a supply air fan 221 be arranged. An exhaust fan 251 can optionally in the exhaust air duct 250 be arranged.

Outside air is the air / air heat exchanger 200 via a preheater 270 fed. In the preheater 270 the outside air AU is preferably heated to a minimum temperature value of about -3 °, but at least to about -5 ° C or to a value between -5 ° C and +1 ° C, when the supply air to colder than in particular about -3 ° or about 0 ° C is. The minimum temperature should preferably be in a temperature range between -5 ° C and 0 ° C and may be dependent on the temperature of the outside air. At very low temperatures and with very low humidity, the minimum temperature may be lowered, while at high humidity levels, it tends to be somewhat higher. About the outside air duct 280 the air then flows further from the preheater 270 to the air / air heat exchanger 200 ,

In the air / air heat exchanger 200 the outside air AU is further from the heat from passing through the air / air heat exchanger 200 flowing exhaust air AB of a room heated. The exhaust air AB of the room is about 15-25 °, in particular about 20 ° and heated with preferably at least the minimum temperature of about -5 ° C to 0 ° C, in particular -3 Celsius, in the air / air heat exchanger 200 incoming outside air AU to temperatures between at least 12 to about 20 degrees Celsius. The outside air AU is preferably raised countercurrently to a temperature which is approximately 2 K to 5 K below the temperature of the exhaust air AB.

3 shows a perspective view of the heat pump system according to the invention. It can be seen in particular that the heat pump system 1 from a memory module 3 and a heating module 2 is composed. In the memory module 3 is the hot water tank 300 , the cache 610 as well as the air heater unit 230 intended. The air heater unit 230 has a height that is greater than the width of the air heater unit 230 , The air heater unit 230 is on one side of the memory module 300 intended. The air heater unit 230 has a width 230a and a height 230b on. Here's the height 230b larger than the width 230a , The air heater unit 230 is substantially parallel to an outer end or an outer wall of the memory module 300 intended. Through the air heater unit 230 the medium flows out of the buffer memory 610 and heats the air flowing past it.

4 shows a view in particular of the memory module 3 from underneath. Here, in particular, the hot water tank 300 and the cache 610 shown.

In 5 is a side view of the heat pump system shown. In this case, in particular, the air heater unit 230 to see which ones in the memory module 3 is provided.

6A-D each shows a view of a thermal heater according to the invention. In 6A is a perspective view shown in FIG 6B is a side view shown in 6C is a section shown along AA and in 6D is shown a section BB. The air heater 230 is as a heat exchanger with a brine inlet 231 and a brine spout 232 designed. Furthermore, the air heater 230 a plurality of pipes 233 on, through which the brine can flow. Furthermore, a first sheet 234 at a first end and a second sheet 235 provided at a second end of the heat exchanger.

The brine flows through the pipes 233 and heats the air flowing past the air heater. Optionally, the flow velocity of the passing air may be opposite to the flow direction of the brine in the tubes 233 be.

According to one aspect of the present invention, air flows of 60 to 350 m ³ / h, temperatures of one = 15 to 25 ° C, temperatures of 30 to 55 ° C and pressure losses of 10 to 100 Pa can be realized.

According to one aspect of the present invention, volume flows of 0.5 to 5 liters per minute, temperatures of 35 to 65 ° C, temperatures of 25 to 55 ° C and pressure losses of 10 to 500 m could be realized on the liquid side. The pipe diameter can be 9.52 mm, for example. The ratio of the geometry of the disk pack (thus two single WAT) = can be 260 mm x 150 mm x 899 mm. These proportions are chosen so that a maximum power of 4 kW at maximum pressure losses can be transmitted with standard circulation pumps and fans for this power size.

Optionally, optimum operation can be ensured under nominal conditions (1.5 kW heating capacity of the air exchanger and 160 m ³ / h ventilation volume). Here, 2% auxiliary power for the environmental pump and about 3% auxiliary power for home fans can be provided. Thus, the required usability values can be achieved with reasonable costs optimal SCOP values according to the European Energy Labeling Directive.

According to one aspect of the present invention, fins 236 in the area of the second sheet 235 be provided. The distance between the slats can be, for example, 2.5 mm. The thickness of the slats can be 0.15 mm. The number of lamellae may be 358, for example.

According to one aspect of the present invention, the height of the pipe bends may be about 80 mm.

Claims (4)

Heat pump system, with a refrigerant circuit (100) with a refrigerant, a charging circuit (700) having a heat transfer medium and a primary supply line (701), a first heat exchanger (170) for transferring heat from the refrigerant circuit (100) to the heat transfer medium of the charging circuit (700), a hot water storage tank (300), wherein the water in the hot water storage tank (300) can be heated by means of the heat transfer medium and a second heat exchanger (330), a buffer memory (610) as a heating buffer layer memory, wherein the medium in the buffer memory (610) by means of the heat transfer medium of the charging circuit (100) is heated, and an air heater unit (230) for heating air for space heating based on heat stored in the buffer memory (610). Heat pump system after Claim 1 wherein the buffer memory (610) has an inner diameter (D) and a height (H) whose ratio is less than 0.4, in particular less than 0.2. Heat pump system (1) after Claim 1 or 2 , further comprising a heating module (2) having a housing having the refrigeration circuit (100) and the heat exchanger (170), and a storage module (3) having a housing housing the hot water storage tank (300), the buffer storage tank (610) and the storage tank Air heater unit (230), wherein the heating module (2) and the memory module (3) together form the heat pump system, wherein the charging circuit (700) through the heating module (2) and through the memory module (3). Buffer layer memory (610) for a heat pump system, with an inner diameter (D) and a height (H), wherein the ratio between the inner diameter (D) and the height (H) is less than 0.4, in particular less than 0.2.

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