DE102016201976B3 - Apparatus and method for processing a substrate - Google Patents

Abstract

The invention relates to a method and a device (1) for processing a substrate (3), the device (1) comprising a carrier device for the substrate (3), the device (1) comprising a first punch (17) the first punch (17) is movable relative to the substrate (3) in such a way that an element (23) can be cut out of the substrate (3) by the first punch (17), the device (1) providing a filling material supply device (12), wherein the device (1) comprises at least one further punch (20), wherein the further punch (20) is movable relative to the filling material (12) such that an element (26 ) is ausschneidbar from the filling material (12), wherein the first punch (17) is movable relative to the substrate (3) that by the first punch (17) the cut-out element (26) of the filler material (12) in one Opening (25) of the substrate (3) can be arranged.

Description

The invention relates to an apparatus and a method for processing a substrate, in particular in the production of value and / or security documents. In the manufacture of value and / or security documents, it is usually necessary to process a substrate. The substrate may be, for example, a card body or a film stack. In particular, it may be necessary to introduce into a substrate an opening or recess which serves, for example, for receiving electronic components, chips or other elements which are different from the substrate.

The DE 10 2014 000 133 A1 discloses a method for processing a flat, at least single-ply substrate in which the substrate formed as a strip, sheet or sheet is passed through at least one processing tool together with a strip, sheet or sheet-shaped filling material at different levels. Furthermore, the substrate is positioned and held in particular in the region of the machining tool, and at least one stamp-like component of the machining tool generates an opening, in particular a window, at a predeterminable point on the substrate. Next, the component is then moved into a region outside the opening and punched out in a further stroke of the filling material through the component of the machining tool an element corresponding to the cross section of the opening. Further, the stamped element is moved by the component in the direction of the opening of the fixed substrate and the element is inserted through the component in the opening of the substrate.

The EP 0 394 926 B1 describes a method for the placement of flat stamping elements on the surface of substrate material, in particular paper signature strips on card cover films, the elements being in multiple use.

The GB 2 267 247 A discloses an apparatus for implanting a segment of material into another material having different properties.

The WO 2015/090956 A1 discloses decorating an insert cut out of a film into an opening of a film with no gaps.

The DE 10 2008 018 491 B3 discloses a method for implanting a chip module in a chip card body, wherein the chip module is supplied on a module belt and punched out of this by means of a punch, inserted into a cavity of the chip card body and permanently fixed there. The module belt is guided between the punch and the chip card body, and the insertion of the chip module in the cavity of the chip card body by means of the punch. In addition, the publication relates to a corresponding device, wherein the punch is set up both for punching out of the chip module from the module belt and for implanting the chip module in the cavity of the chip card body.

In the described method, the element to be inserted is inserted through a corresponding tool in the opening. It is desirable to produce a stable mechanical connection of the element to be used with the substrate in the inserted state.

The technical problem arises of providing a method and a device for processing a substrate, which allow easy and precise insertion of a filling material into an opening in the substrate, wherein the most stable possible mechanical connection between the substrate and the filling material after insertion is made.

The solution of the technical problem arises from the objects with the features of claims 1 and 10. Further advantageous embodiments of the invention will become apparent from the dependent claims.

A device for processing a substrate is proposed. The processing of the substrate is used in particular for producing a value and / or security document. In this case, the processing of the substrate may form one or more steps in the production of the security and / or security document. In particular, the device is used for introducing an opening, in particular a blind hole-like opening, into the substrate and for inserting a filler element into the opening.

The substrate may be formed as a single film or film stack, wherein the film stack comprises a plurality of superimposed films. The films may be plastic films. In particular, the substrate may be a planar substrate, ie a substrate with an un-curved surface. In particular, the substrate may have a rectangular or substantially rectangular cross-section.

The device comprises a carrier device for the substrate. In this case, the carrier device can have or form at least one bearing surface, wherein at least one part of the substrate or the substrate can rest completely on the at least one bearing surface.

In the following reference is made to the following reference coordinate system. A vertical direction may be oriented perpendicular to an upper side of the substrate and away from this upper side. The upper side of the substrate may in this case designate the side from which the opening is introduced into the substrate. A longitudinal and a transverse direction may be oriented perpendicular to each other and perpendicular to the vertical direction. The upper side may in this case be arranged in a plane which is spanned by the longitudinal and transverse directions. Vertical, longitudinal and transverse directions can refer to spatial directions.

Directional information such as "top", "bottom", "above", "below", "top", "bottom" can refer to the vertical direction. It is possible that the vertical direction is oriented parallel and opposite to a gravitational direction, wherein the gravitational direction designates the direction of the gravitational force acting on the substrate.

Furthermore, the device comprises a first stamp. A stamp may in this case designate a tool or component which is suitable for introducing an opening into the substrate. In particular, the first punch can serve for punching the substrate. The first punch is movable relative to the substrate such that an element can be cut out of the substrate by the first punch. In other words, the first punch is movable relative to the substrate such that an opening, in particular a passage opening, can be introduced into the substrate by the first punch. The element can in this case be cut out in a predetermined, desired area of the substrate. Preferably, the substrate can be arranged in a stationary manner, wherein the first punch is movable. The first punch may have a punching surface which is in mechanical contact with the substrate for cutting.

In particular, the element can be cut out of the substrate from the upper side of the substrate by the first stamp. This may mean that the first punch for cutting the element in an area above the top of the substrate is moved towards the top and then penetrates into the substrate.

Furthermore, the device comprises a supply device for a filling material. The filling material may in this case denote a material which provides an element to be introduced into the opening of the substrate. The filler may be provided, for example, in ribbon or sheet form. Of course, it is also possible to provide the filler as a single use. The filler material may be different from the material of the substrate. The filler material may have the same thickness as the substrate.

By means of the provision device, the filling material can be provided in a region above the upper side of the substrate or in a region below the underside of the substrate, in particular, be arranged.

According to the invention, the device comprises at least one further punch. The further punch is movable relative to the filling material such that an element can be cut out of the filling material by the further punch. This element can also be referred to as filler element. Of course, the further stamp can also be movable relative to the substrate. Preferably, the element can be cut out of the filler material from an underside of the filler material by the further punch. For this purpose, the further punch for cutting can be moved from an area under the underside of the filling material to the underside of the filling material and then penetrate from the bottom into the filling material. The further punch may have a punching surface which comes into mechanical contact with the filler material for cutting.

The further stamp can be identical to the first stamp. This may mean that the elements cut out by the punches have the same geometry when the punches cut out an element of the same material or material of equal thickness. That the first and the further stamp are identical, may also mean that the punching surface and a punching section of the stamp are identical. The punching section may include the punching surface and may refer to the section of the punch that may or may be in mechanical contact with the material when cut.

The filling material may be provided such that an upper and / or lower side of the filling material are oriented perpendicular to the vertical direction. Thus, a punching direction of the first punch may also be oriented parallel to the vertical direction but opposite to the vertical direction. A punching direction of the further punch may be oriented parallel to and in the direction of the vertical direction.

It is possible that a substrate arranged on or on the carrier device can be arranged between the first and the further punch. In this case, the first and the further punch can each be in a starting position, wherein the starting position denotes a position from which the movement for cutting out (punching movement) is carried out. That too Filling material can be arranged in such a way between the first and the further punch in the starting position. The punches can be arranged in a respective starting position such that their punching surfaces face each other along the vertical direction.

Further, the first punch is movable relative to the substrate such that the cut-out member of the filler material can be arranged in an opening of the substrate by the first punch. The opening may in particular be the opening introduced by the first punch.

For example, For example, the first and the further dies may be movable relative to one another such that the filler element can be transported into a range of movement of the first die or to the first die after being cut out. The first stamp can then transport this transported in its range of movement filling material element in the opening of the substrate.

The element cut out of the substrate by the first punch and the element cut out of the filler by the further punch may have the same geometry and dimensions, the elements being arranged in mirror image after being cut, a mirror plane being perpendicular to the vertical direction. In this case, the opening in the substrate has the same geometry and dimension as the cut out of the filler material element, but is arranged mirror-inverted to this element. For example, the cut-out elements may have a partially conical or partially pyramidal geometry. This is due to the interaction between material and stamp during the cutting process.

If the element is cut out of the substrate from the substrate from the upper side, then a width or a diameter in the substrate can change opposite to the vertical direction, in particular increase or decrease.

In particular, a width or a diameter of the opening in the substrate may be at the top or in an area above the smaller than at the bottom. Accordingly, a width or a diameter of the cut filler member at the bottom of the filler member may be larger than at the top thereof. If the filler element is inserted from the upper side of the substrate through the first punch in the opening or arranged in this, the smaller dimension of the underside of the filler element may first in the smaller dimension of the area of the opening in Substrate can be used. This simplifies the insertion. Upon further insertion, the top of the filler element is moved into this smaller dimension portion of the opening in the substrate, the dimension of which is smaller than the corresponding dimension of the top of the filler element. As a result, the filler element is jammed in the opening.

This results in an advantageous manner, a stable mechanical attachment of the filler element in the opening in the substrate.

Next results in an advantageous manner, a spatially accurate arrangement of the filler element, especially if it is passed through the opening in the substrate, as well as centering occurs during insertion. Furthermore, the use of at least two punches makes it possible to carry out an arrangement of the filling material element in the opening of the substrate that is easy to control.

In a further embodiment, the first punch is movable between an initial position and an end position along a movement trajectory. In particular, the movement trajectory can be a straight, but non-curved, movement trajectory. The starting position can be arranged over the top of the substrate. The end position may be located under the underside of the substrate. Thus, upon movement from the home to the end position, the element may be cut out of the substrate.

Furthermore, the further punch is movable between an initial position and an end position along a movement trajectory. This movement trajectory can also be a straight movement trajectory. The starting position of the further punch may be arranged under the underside of the substrate. The end position of the further stamp can be arranged above the upper side of the substrate, in particular also above the upper side of the provided filling material. Thus, upon movement of the further punch from the home position to the end position, the filler element can be cut out of the filler material.

Furthermore, at least a portion of the movement trajectory of the first stamp overlaps at least a portion of the movement trajectory of the further stamp. Preferably, portions of the movement trajectories overlap in a spatial area in which the substrate is disposed. Furthermore, the movement trajectories may also overlap in a spatial area in which the provided filling material is arranged.

If the movement trajectories are just trajectories, then the movement trajectories may at least partially overlap. However, a starting position of the first punch above the end position of the further punch and a starting position of the further punch below the end position of the first punch may be arranged.

This results in an advantageous arrangement of the stamp such that the insertion of the filling material element, which is cut out of the further punch, in the cut-out of the first punch opening in the substrate control technology is easy to carry out. In particular, no movement of the substrate is necessary for this purpose.

If sections of the movement trajectories intersect, then the further stamp can be moved through the opening introduced into the substrate by the first stamp. Also, the first punch may be movable by the opening introduced by the further punch in the filling material opening.

In a further embodiment, the carrier device is movable. In this case, the carrier device for positioning the substrate in a processing area, which may also be referred to as a punching area serve. In particular, the substrate can be arranged by the movable carrier device between the punches in their respective starting position. The carrier device may in this case be designed in particular as a carriage. In this case, the carrier device can in particular be movable along a direction of movement which is oriented perpendicular to the vertical direction. For example, the carrier device can be movable in and against the longitudinal or transverse direction.

As a result, the simplest possible feeding of substrates designed as single-use is made possible for further processing.

In a further embodiment, the device comprises at least one fixing device for the substrate. The fixing device allows a spatial fixation of the substrate. In particular, the substrate can be fixed spatially by the fixing device if an element is cut out of the substrate by the first punch and / or if the cut-out element of the filling material is inserted into the opening by the first punch. For example, the substrate can be fixed by the fixing device to the carrier device, so that a relative movement between the carrier device and the substrate is prevented. As a result, an accuracy of the arrangement of the filling material element in the introduced opening is increased in an advantageous manner, since undesired movement of the substrate, in particular slippage, is prevented.

The fixing device can be designed as a clamping device. This can allow the spatial fixation by clamping the substrate.

In a preferred embodiment, the fixing device comprises at least one terminal block. In this case, the fixing device is designed as a clamping device. The first clamping block can in this case be movable relative to the substrate. Further, the first terminal block may be disposed over the top of the substrate. The first terminal block can for example be moved to the top of the substrate and then clamp it, in particular to the support means or to another terminal block. Further, the first punch is movable through the first clamping block. For example, the first clamping block may have or form an opening, a recess or a channel through which the first punch is movable. Thus, the first punch and the first clamping block can be moved independently of each other and thus also relative to each other. This results in an advantageous manner a space-reducing design of the device according to the invention.

In a further embodiment, the fixing device comprises at least one further terminal block. The further clamping block can in this case also be movable relative to the substrate. Further, the further terminal block may be arranged below the underside of the substrate. The further clamping block can be moved, for example, from below to the underside of the substrate and then clamp it to the carrier device or to the first terminal block.

Furthermore, the further punch is movable through the further clamping block. In this case, the further clamping block may have an opening, recess or channel through which the further punch is movable. Thus, the further punch and the further clamping block can be moved independently of one another and thus also relative to one another. This advantageously results in a space-saving design of the device.

In a preferred embodiment, at least a part of the fixing device is movable. For example, the first and / or the further terminal block may be movable. The movement here can serve to clamp the substrate and thus to fix the substrate in a desired spatial position. This results in an advantageous manner a spatial stable arrangement the substrate upon insertion of the opening and the filler element, which in turn increases a positioning accuracy when inserting the filler element.

In a further embodiment, the device comprises at least one pneumatic device for sucking and / or blowing off the element cut out of the substrate. In this case, the pneumatic device can be arranged and / or designed such that the element cut out of the substrate can be removed from the substrate by blowing off or suction after cutting by means of an air flow generated by the pneumatic device.

The air flow may serve to aspirate the substrate to or to blow off the substrate from the pneumatic device. This results in an advantageous manner that, after being cut out of the substrate, the element no longer required can be quickly and reliably removed from the region of the substrate and around the substrate in time for the further processing, in particular the insertion of the filler element not to hinder.

In a further embodiment, at least one of the punches has a guide channel for an air flow generated by the pneumatic device. Preferably, the first punch on such a guide channel. In this case, it is possible that the element is cut out of the substrate by the first punch. Thereafter, the cut-out element can be sucked by an air flow through the first punch either to the first punch and transported away by a movement of the first punch from the substrate. Alternatively, the cut-out element may be blown off or away from the air stream flowing through the first stamp from the substrate. This results in an advantageous manner easy to be produced integration of the pneumatic device for suction and / or blowing off in the proposed device.

Further proposed is a method for processing a substrate. In this case, the method can be carried out by means of a device according to one of the embodiments described in this disclosure. Thus, the device described is also designed such that a method according to one of the embodiments described in this disclosure by means of the device is feasible.

In a first method step, the substrate is arranged between a first punch and a further punch. For this purpose, the punches can be positioned such that the substrate can be arranged between the punches. In particular, the substrate can be arranged on, on or in a carrier device, wherein the carrier device is moved in such a way that the substrate is arranged between the first and the further punch. By means of the carrier device, the substrate can be arranged in the processing region of the device and in the movement region of the two punches.

In a second method step, an element is cut out of the substrate by the first punch.

In a third method step, a filling material is arranged between the first punch and the further punch. For this purpose, the punches can be positioned such that the filling material can be arranged between the punches in addition to the substrate. The filler material may be disposed over an upper surface of the substrate. For example, For example, the filling material can be arranged by a provision device between the first stamp and the further stamp. In this case, the filling material can in particular be arranged between the first and the further stamp such that at least a portion of the filling material is arranged above or below the opening in the substrate. By means of the provision device, the filling material can be arranged in the processing region of the device and in the movement region of the two punches.

In a fourth method step, an element is cut out of the filling material by the second punch. For example, For example, the element may be cut out of the filling material by penetrating the second stamp from an underside into the filling material. In this case, the second punch can be moved by the opening produced by the first punch in the substrate.

In a fifth method step, the element cut out of the filling material is arranged in an opening of the substrate by the first stamp. In this case, the first punch can be moved in such a way that the cut-out filler element is transported by the first punch to and into the opening of the substrate.

During and / or between the method steps, the punches can be moved relative to one another such that no collision of the punches takes place.

This results in an advantageous manner a simple control technology to be performed, which is a highly accurate and allows mechanically stable arrangement of the filler element in a window in the substrate.

In a further embodiment, the substrate is fixed before the second process step. This can mean that the substrate is fixed in a desired spatial position. This spatial position can also be referred to as a processing spatial position. In the machining attitude, a moving range of the punches and the substrate overlap in a region of the substrate in which the filler is to be inserted. In particular, the substrate can be jammed in this spatial position. The jamming can be done for example by a clamping device. In particular, the substrate can be jammed by a first and optionally a second clamping block. This results in an advantageous manner that the substrate during insertion of the opening and due to the associated force on the substrate performs no unwanted movement that complicates the subsequent placement of the filler element.

In a further embodiment, the fixation of the substrate is canceled after the second method step. For example, the jamming of the substrate in the processing space position can be solved. This results in an advantageous manner that space can be provided for the arrangement of the filling material.

In a further embodiment, the element cut out of the substrate is blown off or sucked off the substrate. This can be done in particular by a corresponding actuation of a pneumatic device for suction and / or for blowing off. This results in an advantageous manner that the subsequently no longer required element which has been cut out of the substrate is removed from the region of the opening in the substrate, whereby the subsequent insertion of the filler material element is not hindered.

In a further embodiment, the element cut out of the filling material is fastened to a stamping surface of the first stamp before the fifth method step. Preferably, the cut-out filling material element can be sucked onto the stamping surface of the first stamp. For this purpose, the first punch, as previously explained, have a guide channel for guiding an air flow. The filler element may be cut out of the second die and transported to the first die after being cut therefrom. Alternatively or cumulatively, the first punch may be moved toward the cut filler element. Before or during the production of the mechanical contact between the punching surface of the first punch and the cut filler element, it can then be sucked by the first punch.

In the attached, in particular sucked, state, the cut-out filler element can then be transported from the first punch to and into the opening in the substrate.

This results in an advantageous manner a simple transport of the cut filler material element, wherein it is ensured that the cut-out filler element does not slip laterally relative to the opening in the substrate.

In a further embodiment, the element cut out of the filling material is sucked onto the stamping surface. This has been explained previously.

In a further embodiment, the further punch is positioned before the fifth method step such that a punching surface of the further punch is arranged below the cut-out opening in the substrate. In particular, a stamping surface or at least a part thereof can be arranged in the same plane as the underside of the substrate. Here, it is advantageously possible for the further punch to form a stop element for the filler element used by the first punch. In particular, it can be ensured that the filling material element is not pressed out of the underside of the substrate by the first stamp.

In a further embodiment, the substrate is fixed before the fifth method step. This can, as previously explained, also be effected by a corresponding clamping device. This results in an advantageous manner that the substrate with the opening during insertion of the filling material element performs no unwanted movements that can reduce the positional accuracy of the element used.

The substrate may in this case be arranged stationarily after the first method step up to the fifth method step.

It is also possible that after the fifth method step in a sixth method step, a further layer, in particular a cover film, is arranged on the upper side of the substrate with the filler element used. For this purpose, the substrate can for example be moved out of the processing area, in particular by a corresponding movement of the carrier device. After that, the cover sheet can be placed on top. After the arrangement the further position, the substrate can be arranged again between the two punches, in particular between the previously described terminal blocks. Furthermore, at least one of the clamping blocks, in particular the first clamping block, or both clamping blocks can be moved in such a way that the substrate is clamped with the applied further layer between the clamping blocks. As a result, the further layer can be connected to the substrate. Thereafter, the substrate can be moved out of the area between the two punches or between the terminal blocks again.

The substrate with the filler element used can be moved out of the processing area. Then, a new substrate can be moved into the processing area and processed according to the described method steps. Before the fourth method step, however, the filling material can be moved in such a way that above or below the window section of the new substrate, the filling introduced into the filling material is no longer arranged, but filling material is arranged.

The invention will be explained in more detail with reference to an embodiment. The figures show:

1 a perspective view of a device according to the invention,

2 a perspective view of a device according to the invention before a first process step,

3 a perspective view of a device according to the invention after the first process step,

4 a perspective view of the device according to the invention before a second process step,

5 a perspective view of the device according to the invention after the second process step,

6 a perspective view of the device according to the invention before the third process step,

7 a perspective view of the device according to the invention after a fourth process step,

8th a perspective view of a device according to the invention before a fifth process step,

9 a perspective view of the device according to the invention after a fifth process step,

10 a perspective view of the device according to the invention before the sixth step,

11 a perspective view of the device according to the invention in the implementation of the sixth method step,

12 a perspective view of the device according to the invention after the sixth method step,

13a a schematic cross section through a device according to the invention before a second process step,

13b a schematic cross section through the device according to the invention after the second process step,

13c a schematic cross section through the device according to the invention after a fourth process step,

13d a schematic cross section through the device according to the invention after a fifth method step and

14 a schematic cross section through the device according to the invention with an upper and a lower terminal block and a first and another stamp.

Hereinafter, like reference numerals designate elements having the same or similar technical features.

In 1 is a perspective view of a device according to the invention 1 shown. The device 1 includes one as a workpiece carrier 2 formed carrier device for a substrate 3 (please refer 2 ). The workpiece carrier 2 can be moved here, in particular along a linear, straight-line trajectory. The device 1 this includes further a linear unit 4 , where the linear unit 4 the entirety of the elements denotes the linear movement of the workpiece carrier 2 enable. The linear unit 4 can in particular guide rails 5 and corresponding guide carriage 6 of the workpiece carrier 2 include. Not shown is a drive device for generating the driving force for the movement of the workpiece carrier 2 ,

The workpiece carrier 2 can be in a gap 7 between an upper terminal block 8th and a lower terminal block 9 to be moved. This gap 7 can also be referred to as a processing area.

Also shown is a longitudinal direction x, a transverse direction y and a vertical direction z. The workpiece carrier 2 is movable in and against the longitudinal direction x. In 1 is the vertical direction z perpendicular to a top 15 one on the workpiece carrier 2 arranged substrate 3 oriented, with the top 15 is oriented parallel to a plane spanned by the longitudinal and transverse directions x, y plane.

The terminal blocks 8th . 9 are here in and against the vertical direction 7 movable. For this purpose, the device 1 comprise at least one drive means and optionally at least one guide means which controls the movement of the clamping blocks 8th . 9 allow z in and against the vertical direction. The clamping blocks can be moved towards and away from each other.

Further illustrated are a take-off roll 10 and a take-up roll 11 for a band-shaped filler 12 (see eg 7 ). At least one of the roles 10 . 11 , in particular the take-up roll 11 , can be driven by a drive device, not shown, to a feed of the filling material 12 to effect. Thus, the device 1 also a drive device for rotating at least one of the rollers 10 . 11 , in particular the take-up roll 11 include. The rolls movable along the longitudinal direction x 10 . 11 form a supply device for the filling material 12 , wherein the filler material 12 in the gap 7 over the top 15 of the substrate 3 can be provided. Next, the filler material 12 be promoted in or against the transverse direction y.

The roles 10 . 11 are synchronously movable in and against the longitudinal direction x. In particular, by this movement filling material 12 in the gap 7 inserted or from the gap 7 be moved out.

Further illustrated is a base plate 13 at which the terminal blocks 8th . 9 are movably attached. Next, the base plate 13 Through holes through, through the rods 14 are movable, at the free end of each of the rollers 10 . 11 are arranged.

Also shown is a drive device 16 for a first stamp 17 , where the first stamp 17 can also be referred to as Oberlochstempel. By means of the drive device 16 is the first stamp 17 in and against the vertical direction z movable. Here, the first stamp 17 through the upper terminal block 8th be moved, in particular by a in the upper terminal block 8th provided opening 18 , Also shown is a drive device 19 for another stamp 20 (please refer 2 ), which can also be referred to as Unterlochstempel. By means of the drive device 19 is the other stamp 20 in and against the vertical direction z movable. In 2 is shown that the further stamp 20 through the lower terminal block 9 can be moved through. For this purpose, the lower terminal block 9 a corresponding opening 21 on.

In an initial position is the first stamp 17 above one on the workpiece carrier 2 arranged substrate 3 arranged. Next is in a starting position of the other stamp 20 under a bottom of the substrate 3 arranged.

The stamps 17 . 20 can be moved along a rectilinear motion trajectory, the motion trajectories being concentric with each other and partially overlapping. In particular, the first stamp 17 are moved against the vertical direction z from the starting position to an end position, wherein the end position under the underside of the substrate 3 is arranged. Next, the more stamp 20 in the vertical direction z are moved to an end position, wherein the end position over the top 15 of the substrate 3 is arranged. In this case, however, the end position of the second punch 20 under the starting position of the first punch 17 and the end position of the first punch 17 above the starting position of the further punch 20 be arranged.

Next are the stamps 17 . 20 relative to the substrate 3 movable.

2 shows a perspective view of the device according to the invention 1 before a first process step. Here is a substrate 3 on a workpiece carrier 2 arranged. The workpiece carrier 2 is in this case formed as a U-profile element, wherein bearing surfaces (not shown) for edge regions of a bottom of the substrate 3 protrude from the side legs and the connecting leg of the U-profile element in the volume encompassed by the U-profile element. Also shown is a window section 22 of the substrate, being below the window portion 22 no support surface of the U-profile element is arranged.

It is further shown that the lower terminal block 9 at one the gap 7 between the terminal blocks 8th . 9 facing surface a cuboid elevation 31 having. Margins of this survey 31 can the motion control of the workpiece carrier 2 serve. Next can be an area of the bottom of the substrate 3 that does not rest on bearing surfaces of the workpiece carrier 2 rests on or immediately above the surface of the survey 31 be arranged when the substrate 3 is transported in a processing space situation.

Is the workpiece carrier 2 completely in the gap 7 retracted, so can a stop surface on the connecting leg of the U-profile to a longitudinal front end x front of the survey 31 strike, with the substrate 3 then positioned in the machining space position. This will produce a repeatable spatial arrangement of the substrate 3 in the editing space situation allows.

Also the upper terminal block 8th indicates at one the gap 7 facing surface a cuboid elevation 32 on. A dimension of the surveys 31 . 32 can be the same. Further, the dimension may be equal to or greater than the dimension of the top 15 of the substrate 3 be.

In 2 is shown that both the first stamp 17 as well as the further stamp 20 are in their starting position. Here is the additional stamp 20 under a bottom of the lower terminal block 9 arranged, wherein a punching surface of the further punch 20 is arranged spaced from the bottom of the lower terminal block with a predetermined distance greater than zero. The first stamp 17 however, is in the starting position in the opening 18 in the upper terminal block 8th arranged, wherein a punching surface of the first punch 17 flush with an underside of the upper terminal block 8th is arranged.

3 shows a device according to the invention 1 in a perspective view after the implementation of the first method step. Here is the substrate 3 in a gap 7 between the first stamp 17 in its starting position and the other stamp 20 arranged in its starting position. This spatial position of the substrate 3 can also be referred to as a processing spatial position. In this machining space position, a bottom of the substrate may be on a surface of the elevation 31 (please refer 2 ) rest. Next, the window section 22 of the substrate over the opening 21 be arranged in the lower terminal block. Next is the window section 22 also under the opening 18 (please refer 1 ) in the upper terminal block 8th arranged. Thus, a lower end of the first punch 17 , which is the punching surface of the first punch 17 has, in the region of the window portion 22 through the substrate 3 to be moved. Accordingly, an upper end of the further punch 20 , which the punching surface of the other punch 20 has, in the region of the window portion 22 from below through the substrate 3 to be moved.

4 shows a perspective view of the device 1 before a second process step. After the first process step, the upper terminal block 8th opposite to the vertical direction z on the top 15 of the substrate 3 be moved in the processing space position. Further, a mechanical contact between a bottom of the upper terminal block 8th and the top 15 of the substrate 3 prepared and the substrate 3 in the machining space between the lower terminal block 9 and the upper terminal block 8th , especially between the surveys 31 . 32 to be pinched. By this clamping is the substrate 3 spatially fixed in the machining spatial position.

Before, between and during the first and the second process step, no relative movement between the upper terminal block 8th and the first stamp 17 , as well as between the lower terminal block 9 and the other stamp 20 carried out.

5 shows a perspective view of the device 1 after a third process step. In the third process step, the first stamp 17 moved counter to the vertical direction z, wherein an element 23 from the substrate 3 is cut out. The cut-out element 23 from the substrate 3 this corresponds to that in the window section 22 of the substrate 3 (see eg 3 ) arranged material of the substrate 3 , During the third process step, a relative movement between the upper terminal block 8th and the first stamp 17 carried out.

It is shown that the element 23 from the top 15 of the substrate 3 is cut out of this. After cutting is the cut-out element 23 of the substrate 3 under the bottom of the substrate 3 arranged, in particular in the opening 21 of the lower terminal block 9 through which the further stamp 20 is movable.

As the other stamp 20 in its initial position under a bottom of the lower terminal block 9 can, the cut-out element 23 through this opening 21 from the substrate 3 be transported away.

In particular, the cut-out element 23 from the first stamp 17 , in particular of its punching surface, blown away and through the opening 21 formed channel in the lower terminal block 9 be blown out.

For this purpose, the first stamp 17 guide channels 24 for an air flow, wherein the guide channels terminate in outlet openings in the region of the punching surface. Not shown is a pneumatic device for generating the air flow to blow off. Blowing off is schematically indicated by an arrow 30 shown.

6 shows a perspective view of the device 1 before a third process step. It can be seen that a window opening 25 in the substrate 3 was introduced. Next is the further stamp 20 moved in the vertical direction z. The first stamp 17 as well as the upper terminal block 8th are also moved in the vertical direction z, wherein also a relative movement between the first punch 17 and the upper terminal block 8th is carried out. This is the first stamp 17 so in the opening 18 in the upper terminal block 8th that moves the punching surface of the first punch 17 over the underside of the upper terminal block 8th is arranged. The first stamp 17 is thus above its starting position.

By the movement of the upper terminal block 8th in the vertical direction z, the fixation of the substrate 3 saved in the machining space situation.

In 7 is a perspective view of the device 1 shown after the third and fourth process steps. In the third process step, a band-shaped filler material is formed 12 between the stamps 17 . 20 arranged. In particular, the filling material 12 by a movement of the rollers 10 . 11 (please refer 1 ) take place in the longitudinal direction x. This is the band-shaped filler 12 or at least a portion thereof above the window opening 25 in the substrate 3 arranged.

In the fourth method step, the second stamp 20 moves in the vertical direction z and cuts an element 26 from the filler 12 out. This element 26 may also be referred to as filler element. Here it is shown that an upper end of the further punch 20 through the window opening 25 , through the filling material 12 and in the opening 18 in the upper terminal block 8th is moved. Thus, the filler element 26 in the opening 18 and under the punching surface of the first punch 17 arranged.

8th shows a perspective view of the device according to the invention 1 after the fourth and before a fifth process step.

Here it is shown that the filling material 12 has been moved out of the processing area, in particular by a movement of the rollers 10 . 11 opposite to the longitudinal direction x (see 1 ). This can be done if the additional stamp 20 from the opening in the filler 12 was moved out. This is the additional stamp 20 moves counter to the vertical direction z after the fourth method step, so that a punching surface of the further punch 20 below the window opening 25 is arranged. In particular, the punching surface of the further punch 20 in a plane of the underside of the substrate 3 to be ordered.

The filler element 26 may be from the first stamp 17 be sucked on the punching surface. For this purpose, the previously explained guide channels 24 be used for the air flow. The pneumatic device can in this case generate a corresponding air flow for suction. For example, the first stamp 17 and the other stamp 20 before the movement of the further stamp 20 from the opening in the filler 12 are moved relative to each other so that the cut-out filling material element 26 to the punching surface of the first punch 17 is created.

9 shows a perspective view of the device according to the invention 1 after the fifth process step. In the fifth method step, the upper terminal block 8th opposite to the vertical direction z on the top 15 of the substrate 3 moved to, in particular to a bottom of the terminal block 8th the top 15 of the substrate 3 contacted and the substrate 3 in the machining space between the lower terminal block 9 and the upper terminal block 8th is stuck. After that, the first stamp 17 against the vertical direction z moves such that the to the punching surface of the first punch 17 sucked filler element 26 in the window opening 25 is used. Here, the punching surface of the further punch forms a stop surface for the filler element 26 ,

10 shows a perspective view of the device according to the invention 1 after the fifth method step and before a sixth method step. After the fifth process step, the upper terminal block 8th moved in the vertical direction z, wherein the fixation of the substrate 3 is canceled in the machining space situation. Next, the workpiece carrier in the longitudinal direction x from the gap 7 between the upper terminal block 8th and the lower terminal block 9 moved out.

Next is also the first stamp 17 relative to the upper terminal block 8th moved in the vertical direction z, in particular until a punching surface of the first punch 17 flush with a bottom of the upper terminal block 8th is. This will be the first stamp 17 moved to its original position.

On a top 15 the substrate with the filling material element used 26 then becomes a cover sheet 27 arranged. This cover sheet 27 In particular, it can form a closed surface and as a protective layer for the filling material element 26 serve.

Arranging the cover sheet 27 on the top 15 is by an arrow 28 indicated. After arranging the workpiece carrier 2 again against the longitudinal direction x in the space 7 between the upper and lower terminal block 8th . 9 moves, especially until the workpiece carrier 2 is in a stop position. This movement is by an arrow 29 symbolizes.

11 shows a perspective view of the device 1 when performing a sixth method step. In the sixth method step, the upper terminal block 8th against the vertical direction on the lower terminal block 9 moved to the substrate 3 with the on the top 15 of the substrate 3 arranged cover sheet between the terminal block 8th . 9 is clamped. This will make the cover sheet 27 to the substrate 3 pressed and connected to this.

During this processing step are the first and the other stamp 17 . 20 each arranged such that they are not from the corresponding terminal blocks 8th . 9 in the direction of the other terminal block 9 . 8th protrude.

12 shows a perspective view of the device 1 after the sixth process step. Here, the upper terminal block 8th moved back in the vertical direction z, causing the fixation of the substrate 3 with the cover sheet arranged thereon 27 will be annulled. After this, the workpiece carrier can 2 with the substrate attached to it from the gap 7 between the terminal blocks 8th . 9 to be moved out.

13a shows a schematic cross section through a device according to the invention 1 before the second process step. Shown is a first stamp 17 , a second stamp 20 , an upper terminal block 8th , a lower terminal block 9 and a substrate 3 which is in a gap 7 between the upper and lower terminal block 8th . 9 is arranged. Also shown is an opening 21 in the lower terminal block 9 through which the lower punch 20 can be moved in and against a vertical direction z. Before the second process step is the additional stamp 20 below and spaced from a bottom of the lower terminal block 9 arranged.

13b shows a device according to the invention 1 after the second process step. Before the second process step, the upper terminal block 8th against the vertical direction z on the lower terminal block 9 be moved, causing the substrate 3 between the terminal blocks 8th . 9 clamped and fixed in a machining space position. After that, the first stamp 17 against the vertical direction through an opening 18 (see eg 1 ) in the upper terminal block 8th on the substrate 3 to and through the substrate 3 through the opening 21 in the lower terminal block 9 to be moved. This movement (which can also be called a punching movement or stroke) becomes an element 23 of the substrate 3 cut out.

In 13c is a schematic cross section through the device according to the invention 1 shown after a fourth process step. Before the fourth process step, this will be out of the substrate 3 cut element 23 through the opening 21 through to and from the underside of the lower terminal block 9 transported away. After that, the upper terminal block 8th moved in the vertical direction z. Next is the first stamp 17 relative to the upper terminal block 8th also moved in the vertical direction z. Thus, the first stamp 17 out of the opening 21 and from below through the substrate 3 through the opening 18 in the upper terminal block 8th emotional.

Next is in the space 7 over the opening 25 in the substrate 3 a filler 12 arranged. After this, the upper terminal block 8th be moved against the vertical direction z to fill material 12 and substrate 3 to the lower terminal block 9 to squeeze.

Next is shown that the first stamp 17 so in the opening 18 is moved, that a punching surface of the first punch 17 , which may be arranged on its underside, in the vertical direction z over the underside of the upper terminal block 8th is arranged. In the fourth method step, the further punch in the vertical direction z is through the opening 21 in the lower terminal block 9 through the opening 25 in the substrate 3 and through the filler material 12 emotional. This is a filler element 26 from the filler 12 cut out and into the opening 18 in the upper terminal block 8th transported, in particular to the punching surface of the first punch 17 , Here or after contacting the stamping surface, the filler element 26 to the punching surface of the first punch 17 be sucked.

13d shows a schematic cross section through the device according to the invention after a fifth method step. Before the fifth process step, the filling material 12 (please refer 13c ) from the gap 7 be transported out. For this purpose, the upper terminal block 8th with the first stamp 17 be moved in the vertical direction z, whereby the spatial fixation of the filling material 12 will be annulled. Further, as previously explained, the filler element 26 to the punching surface of the first punch 17 be sucked. After removal of the filling material 12 from the gap 7 can the upper terminal block 8th with the first stamp 17 again against the vertical direction z on the substrate 3 be moved, causing the substrate 3 again between the lower and the upper terminal block 9 . 8th pressed and thus fixed in the machining position. After that, the first stamp 17 be moved against the vertical direction z, so that the filling material element 26 in the opening 25 in the substrate 3 is pressed. Before that, the further stamp 20 be moved against the vertical direction z until a punching surface of the other punch 20 which may be disposed at an upper end of the further punch, is flush with a lower surface of the substrate.

14 shows a schematic cross section through a device according to the invention 1 with an upper terminal block 8th , a lower terminal block 9 , a first stamp 17 passing through an opening 18 in the upper terminal block 8th in and against a vertical direction z is movable and another stamp 20 passing through an opening 21 in the lower terminal block 9 in and against the vertical direction z is movable. Also shown is a substrate 3 and an already-cut filler element 26 ,

Also shown is an opening 25 in the substrate 3 that by the first stamp 17 in the substrate 3 was introduced.

In 14 it can be seen that the cut-out filling material element 26 is formed in the form of a partial pyramid or part cone in cross section, wherein a diameter or a width of the cut filler element 26 enlarged in the vertical direction z.

This geometric design is due to the cutting of the filler element 26 through the further stamp 20 that's the filler material 12 from the bottom of the filler 12 cut out of this.

The opening 25 in the substrate 3 that by the first stamp 17 is generated here is also part cone or teilpyramidenförmig, wherein dimensions of the opening 25 the dimensions of the filler element 26 can correspond. However, the opening is 25 with respect to a mirror plane orthogonal to the vertical direction z, mirrored to the filler element 26 educated. This means that there is a width or a diameter of the opening 25 reduced in vertical direction.

Will be the filler element 26 through the first stamp 17 in the opening 25 pressed, it is due to the mirror-inverted arrangement a good mechanical connection, in particular a positive and non-positive connection between the filler element 26 and the substrate 3 ,

LIST OF REFERENCE NUMBERS

1

contraption

2

Workpiece carrier

3

substratum

4

linear unit

5

guide rails

6

carriage

7

gap

8th

upper terminal block

9

lower terminal block

10

role

11

role

12

filling material

13

baseplate

14

pole

15

top

16

driving means

17

first stamp

18

opening

19

driving means

20

another stamp

21

opening

22

window section

23

cut element from the substrate

24

air duct

25

Opening in the substrate

26

Filler element

27

cover sheet

28

arrow

29

arrow

30

arrow

31

survey

32

survey

x

longitudinal direction

y

transversely

z

vertical direction

Claims (17)

Device for processing a substrate ( 3 ), the device ( 1 ) a support means for the substrate ( 3 ), the device ( 1 ) a first stamp ( 17 ), wherein the first stamp ( 17 ) relative to the substrate ( 3 ) is movable by the first punch ( 17 ) an element ( 23 ) from the substrate ( 3 ) is cut out, the device ( 1 ) a supply device for a filling material ( 12 ), characterized in that the device ( 1 ) at least one further stamp ( 20 ), the further stamp ( 20 ) relative to the filler material ( 12 ) is movable, that by the further stamp ( 20 ) an element ( 26 ) from the filler material ( 12 ) is cut out, wherein the first stamp ( 17 ) relative to the substrate ( 3 ) is movable by the first punch ( 17 ) the cut-out element ( 26 ) from the filler material ( 12 ) in an opening ( 25 ) of the substrate ( 3 ) can be arranged. Apparatus according to claim 1, characterized in that the first stamp ( 17 ) between a starting position and an end position along a movement trajectory is movable, wherein the further stamp ( 20 ) is movable between an initial position and an end position along a movement trajectory, wherein at least a portion of a movement trajectory of the first stamp ( 17 ) with at least a portion of a movement trajectory of the further stamp ( 20 ) overlaps. Device according to one of the preceding claims, characterized in that the carrier device is movable. Device according to one of the preceding claims, characterized in that the device ( 1 ) at least one fixing device for the substrate ( 3 ). Apparatus according to claim 4, characterized in that the fixing device at least one first terminal block ( 8th ), wherein the first stamp ( 17 ) through the first terminal block ( 8th ) is movable therethrough. Apparatus according to claim 5, characterized in that the fixing device at least one further terminal block ( 9 ), the further stamp ( 20 ) through the further terminal block ( 9 ) is movable therethrough. Device according to one of claims 4 to 6, characterized in that at least a part of the fixing device is movable. Device according to one of the preceding claims, characterized in that the device ( 1 ) at least one pneumatic device for sucking and / or blowing off of the substrate ( 3 ) cut out element ( 23 ). Apparatus according to claim 8, characterized in that at least one of the stamp ( 17 . 20 ) a guide channel ( 24 ) for an air flow generated by the pneumatic device. Method for processing a substrate ( 3 ), wherein in a first process step the substrate ( 3 ) between a first stamp ( 17 ) and another stamp ( 20 ) is arranged, wherein in a second method step by the first stamp ( 17 ) an element ( 23 ) from the substrate ( 3 ) is cut out, wherein in a third process step, a filler ( 12 ) between the first stamp ( 17 ) and the further stamp ( 20 ) is arranged, wherein in a fourth method step by the second punch ( 20 ) an element ( 26 ) from the filler material ( 12 ) is cut out, wherein in a fifth method step by the first stamp ( 17 ) that from the filling material ( 12 ) cut out element ( 26 ) in an opening ( 25 ) of the substrate ( 3 ) is arranged. Method according to claim 10, characterized in that the substrate ( 3 ) is fixed before the second process step. Method according to claim 11, characterized in that the fixing of the substrate ( 3 ) is canceled after the second step. Method according to one of claims 10 to 12, characterized in that the from the substrate ( 3 ) cut out element ( 23 ) from the substrate ( 3 ) is blown off or sucked off. Method according to one of claims 10 to 13, characterized in that the from the filler material ( 12 ) cut out element ( 26 ) before the fifth process step on a punching surface of the first punch ( 17 ) is attached. A method according to claim 14, characterized in that the from the filler material ( 12 ) cut out element ( 26 ) is sucked to the punching surface. Method according to one of claims 10 to 15, characterized in that the further stamp ( 20 ) is positioned before the fifth method step such that a punching surface of the further punch ( 20 ) below the cut-out opening ( 25 ) in the substrate ( 3 ) is arranged. Method according to one of claims 10 to 16, characterized in that the substrate ( 3 ) is fixed before the fifth process step.

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