DE102011115658A1 - Electronic device has main soldering surface structure whose section is partially matched with auxiliary soldering surface structure on which electronic component is mounted - Google Patents

Abstract

The device has a carrier (100) with main soldering surface structure (1) that is set with outer edges (101) to form main soldering pad (10). A surface-mountable electronic component (200) is provided with auxiliary soldering surface structure (2) that is set with outer edges (201) to form auxiliary soldering pad (20). The electronic component is mounted on auxiliary soldering surface structure. The auxiliary soldering pad is smaller than main soldering pad, and auxiliary soldering surface structure is partially matched with section of main soldering surface structure.

Description

An electronic device with an electronic component on a carrier is specified.

Surface-mountable electronic components such as, for example, surface-mountable semiconductor components and semiconductor chips usually have contact surfaces, by means of which a component can be soldered to a carrier, for example a printed circuit board. For this purpose, the carrier usually also has contact surfaces whose shape and size correspond to those of the respective component to be mounted. In the event that the contact surface size and shape of the carrier is predetermined, it is therefore necessary to adapt the contact surface size and shape of the component to be mounted accordingly. If the component has a smaller size and thus smaller dimensions of the contact surfaces ("footprint"), an adaptation to the larger contact surfaces of the carrier has hitherto been carried out by an adaptation, ie an enlargement, of the component dimensions and thus of the footprint, which however results in a greater material consumption. means higher material costs and a lower number of pieces per benefit.

At least one object of certain embodiments is to provide an electronic device having a surface mountable electronic device on a carrier.

This object is achieved by an article according to the independent claim. Advantageous embodiments and further developments of the subject matter are characterized in the dependent claims and will become apparent from the following description and the drawings.

In accordance with at least one embodiment, an electronic device has a carrier and a surface-mountable electronic component disposed thereon.

For example, the carrier may include or be a printed circuit board, a metal core board, a package body, a lead frame, a ceramic carrier, or a combination thereof.

The surface-mantable electronic component can be, for example, a surface-mountable semiconductor chip. By way of example, the semiconductor chip may be a light-emitting or light-receiving semiconductor chip, that is to say a light-emitting diode chip or a photodiode chip. Furthermore, it is also possible for the surface-mountable electronic component to be formed, for example, by a power semiconductor component, for example a transistor.

Furthermore, the surface-mountable electronic component can have a semiconductor chip, for example a light-emitting diode chip, a photodiode chip and / or a power semiconductor chip, on a substrate, for example a ceramic or plastic substrate. In this case, the electronic component is arranged on the carrier with the side of the substrate facing away from the chip, which forms a mounting surface of the component.

According to a further embodiment, the carrier has a first pad structure. The device has a second Lötflächenstruktur, by means of which the device is arranged on the first Lötflächenstruktur. The arrangement of the component on the carrier takes place in particular by means of a solder between the first and the second Lötflächenstruktur, whereby a mechanical and electrical connection of the device takes place on the carrier.

The following statements on the pad structure and its elements, unless expressly stated otherwise, refer to the first and second pad structures.

In accordance with a further embodiment, a soldering surface structure has at least one and preferably a plurality of soldering surfaces. The soldering surfaces can be formed by metallizations, ie metal layers, and can be provided for allowing an electrical connection with respectively different polarities and / or a thermal connection of the component to the carrier. In particular, the soldering surfaces of the first soldering surface structure of the carrier can be connected to supply lines, in particular in the form of strip conductors and / or through-connections ("vias"), in order to enable interconnection of the component with further elements of the carrier. According to a preferred embodiment, the leads do not form part of the solder pads of the first pad structure.

The solder surfaces may in particular have edges which bound the solder surfaces. For example, a solder pad may have one or more edges forming outer edges of the pad surface structure. Such edges of a soldering surface are also referred to as outer edges of the soldering surface. Furthermore, a solder pad may have one or more inner edges that are not outer edges of the pad surface structure. An inner edge of a soldering surface of a soldering surface structure can in particular be arranged, for example, with respect to a further inner edge of a further soldering surface of this soldering surface structure.

The outer edges of the pads of a solder pad structure as a whole also form the outer edges of the pad surface structure. The dimensions of the entirety of the outer edges thus also represent the outer dimensions of the Lötflächenstruktur and define a solder pad. A soldering field is formed in particular by a soldering surface structure with all soldering surfaces. Between the pads, a pad structure within the pad has clearance areas that are free of pads and separated by adjacent pads.

According to a further embodiment, the carrier has the first pad structure with outer edges defining a first pad. The surface mount electronic device includes the second pad structure having outer edges defining a second pad.

According to a further embodiment, the second solder pad is smaller than the first solder pad. This may in particular mean that the second solder pad has outer edges with a smaller dimension compared to outer edges of the first solder pad. In particular, the surface mount electronic device may have a mounting surface on which the second pad structure is disposed and which is smaller in dimension than the first pad structure. The component can thus have such small dimensions that the first soldering surface structure is not completely covered by the component mounted on the carrier.

According to a further embodiment, the second solder surface structure at least partially corresponds to a section of the first solder pad structure. This may mean, in particular, that the shape of the second solder surface structure, that is to say the shapes of the solder surfaces of the second solder surface structure, are at least partially cutouts of the shapes of the first solder surface structure or of the solder surfaces of the first solder surface structure. With an arrangement of the component on the carrier, the soldering surfaces of the second soldering surface structure can thus be arranged at least partially congruently on soldering surfaces of the first soldering surface structure, which also means that the edges of the soldering surfaces of the second soldering surface structure are at least partially congruent with the edges of the soldering surfaces of the first soldering surface structure can be arranged.

"Coincident" means here and below that two congruent elements, so for example, solder pads, edges of solder pads or at least parts of these are arranged directly above one another in an arrangement of the device on the support and a mounting of the device by means of a solder on the support have no lateral offset. The terms "directly above one another" and "no lateral offset" are to be understood within the precision that can be achieved in a mounting of surface mount electronic components on carriers.

According to a further embodiment, the first and the second soldering field have the same but differently sized shape. Particularly preferably, the first and the second solder field are each square or rectangular.

According to a further embodiment, the first and the second solder field each have a center point. In the arrangement of the component on the carrier, the component is aligned in particular on the carrier, that the centers of the first and second solder field are congruent, so one above the other, so that the first and the second solder pad are centered to each other.

In comparison to the usual procedure, in which the component dimensions are adapted to the soldering surface structure of the carrier when a surface mountable electronic component is to be arranged on a support having a deviating from the component geometry Lötflächenstruktur or a different solder pad, which has the consequence that change the component dimensions, in the electronic arrangement described here, the second Lötflächenstruktur of the device is adapted to the first Lötflächenstruktur the carrier, in particular while maintaining the dimensions of the device. This may result in the possibility to use an existing device with only minor changes, which may for example even be outside the main process path and thus for example at a supplier, in applications with existing carrier and thus an existing first Lötflächenstruktur. This offers, for example, the possibility of adapting an already existing component to a deviating quasi-standard. In addition, such a device can also be used as a second source in an existing application ("second source ability").

According to a further embodiment, the first and the second soldering surface structure each have at least two soldering surfaces. Each of the at least two soldering surfaces of the second soldering surface structure may each be at least partially a section of at least one of the two soldering surfaces of the first soldering surface structure.

According to a further embodiment, at least one soldering surface of the second soldering surface structure has an edge which coincides with an edge of a soldering surface of the first soldering surface structure. Particularly preferably, the second Lötflächenstruktur on a plurality of edges, which are congruent with edges of the first Lötflächenstruktur.

According to a further embodiment, the edge of a soldering surface of the second soldering surface structure which is congruent with an edge of a soldering surface of the first soldering surface structure is an inner edge. In the event that at least two soldering surfaces per soldering surface structure are present, each of the soldering surfaces of the second soldering surface structure preferably has at least one inner edge, which is congruent with an inner edge of a soldering surface of the first soldering surface structure.

According to a further embodiment, the second solder surface structure corresponds to a section of the first solder pad structure. In other words, this means that the second Lötflächenstruktur after the arrangement of the device on the support is completely congruent with the cutout of the first Lötflächenstruktur, which is covered by the second Lötflächenstruktur. In particular, the inner edges of the soldering surfaces of the first and second soldering surface structures can be congruent. In particular, the solder pad structure of the component can be adjusted while maintaining the dimensions of the component to the first solder pad structure of the carrier. In this case, the individual soldering surfaces can be designed such that they correspond to a section of the first soldering surface structure or to a section of the soldering surface structure of a matching component with a soldering surface structure corresponding to the first soldering surface structure of the carrier. During soldering, it may be possible for the symmetry and the congruent edges of the soldering surfaces, which run along one direction, for example, to be perpendicular to these inner edges, as in the case of the original component due to the surface tension of the liquid solder for self-centering.

According to a further embodiment, the second soldering field is twisted to the first soldering field. This may mean, in particular, that the first and the second soldering field have the same shape, ie according to a preferred embodiment a square or rectangular shape, but which are rotated relative to each other about a respective center, wherein the centers are arranged congruently one above the other.

According to a further embodiment, the first solder pad is square with a side length a and the second solder pad is square with a side length b. The side lengths a and b of the first and second solder fields are determined by the dimensions of the outer edges of the respective Lötflächenstruktur. The first and second solder fields can preferably be rotated by an angle α for which α = arccos (b / a).

Particularly preferably, the inner edges of the soldering surfaces of the first soldering surface structure can be arranged congruently with the inner edges of the soldering surfaces of the second soldering surface structure. Furthermore, the soldering surfaces of the first and second soldering surface structures with the congruent inner edges may have soldering edge corners at the respective meeting point of one of the congruent inner edges with an adjacent outer edge, wherein the soldering corners of the first and second soldering surface structures are likewise congruent. In other words, the congruent inner edges can reach congruent to a respective adjacent outer edge, so that by the rotation of the first and second solder pad to each other in addition to the congruent inner edges even boundaries of the solder pads of the first and second Lötflächenstruktur in one direction along the congruent inner edges come to rest on each other.

Such a twisted arrangement or embodiment of the second Lötflächenstruktur compared to the first Lötflächenstruktur may result in soldering in the entire soldering plane for self-centering of the device on the Lötflächenstruktur or the solder pad of the carrier. In particular, as described above, the inner edges of the soldering surfaces of the second soldering surface structure may be congruent with inner edges of the soldering surfaces of the first soldering surface structure, whereby the self-centering described above can be achieved.

According to a further embodiment, at least one soldering surface of the second soldering surface structure has at least one projection which projects beyond an at least partially congruent soldering surface of the first soldering surface structure. Particularly preferably, the projection can be arranged on an inner edge of a soldering surface of the second soldering surface structure, which is congruent with an inner edge of a soldering surface of the first soldering surface structure. The projection can protrude beyond the congruent inner edge of the soldering surface of the first Lötflächenstruktur.

According to a further embodiment, at least one soldering surface of the second soldering surface structure has a projection on at least two end regions. This may in particular mean that the projection can adjoin both an inner edge and an outer edge of the soldering surface. In this case, the projection, for example, on the congruent inner edge protrude a soldering surface of the first Lötflächenstruktur.

Particularly preferably, the second solder surface structure corresponds to a section of the first solder pad structure, except for the protrusion or protrusions. This means that the soldering surfaces of the second soldering surface structure, except for the projections, correspond to cutouts of soldering surfaces of the first soldering surface structure. The projections, which can also be referred to as cams, for example, lead to soldering of the component on the carrier to wetting with solder outside the soldering surfaces of the carrier, ie outside of the actual soldering pad formed by the first soldering surface structure, whereby solder masks at the edges of the second soldering surface structure below and outside of the soldering surfaces can form. In particular, a solder meniscus of the solder arranged between the first and second solder surface structure can form on at least one projection between the first and the second solder surface structure. This can result in addition to the self-centering perpendicular to the main edges and to suppress a displacement of the device during the soldering parallel to the main edges or edges of the pads. The projections formed as adjustment cam can also differ in terms of their shape and / or position of each other and of the aforementioned embodiment.

According to a further embodiment, the first soldering surface structure has a first and a second soldering surface, between which a third soldering surface is arranged. The second soldering surface structure may have a fourth and a fifth soldering surface, between which a sixth soldering surface is arranged. The soldering surfaces may in particular all each have a quadrangular shape, for example a rectangular or square shape.

In accordance with a further embodiment, the first and the second soldering surfaces have first outer edges arranged facing away from one another, which have a first distance from one another. In particular, the first distance may define a first outer dimension of the first pad structure. Furthermore, the first outer edges may have a first length perpendicular to the first distance defining a second outer dimension of the first pad surface structure. Accordingly, the fourth and fifth pads may have second outer edges spaced apart from one another at a second distance defining a first outer dimension of the second pad structure while the second outer edges have a second length perpendicular to the second pad defining a second outer dimension of the second pad structure. The first outer dimension of the first soldering surface structure is preferably larger than the first outer dimension of the second soldering surface structure, while the second outer dimension of the first soldering surface structure is larger than the second outer dimension of the second soldering surface structure.

According to a further embodiment, the third soldering surface has a first width along the first distance, while the sixth soldering surface has a second width along the second distance. The first and second widths may be the same in particular. Accordingly, the third and the sixth soldering surface may each have inner edges which are congruent.

According to a further embodiment, the first pad structure has only the first and second pads without any intermediate third pad, while the second pads has only the fourth and fifth pad without any sixth pads. The above-described ratio of the outer dimensions applies equally to this embodiment. Furthermore, first and second Lötflächenstruktur may also have more than the described two or three solder pads, which are arranged, for example, a matrix, each oppositely disposed outer edges of solder pads define the described outer dimensions of the Lötflächenstrukturen.

In the electronic arrangement described herein, the above-described embodiments and features make it possible to adapt surface mount electronic components of various sizes to be soldered to a uniform first pad structure of a substrate. The embodiments described here is common that the geometry of the components does not have to be changed, so the outer dimensions of the device can remain the same.

In particular, in the arrangement described here, a number of advantages, such as maintaining the component dimensions, associated material savings, cost savings or a cost neutral implementation, the ability to adapt an existing component to a different quasi standard and the previously mentioned so-called "second source ability ", ie to insert a component as a second source in an existing application, in which the component with a conventional Lötpadgestaltung has no access.

Further advantages, advantageous embodiments and developments emerge from the embodiments described below in conjunction with the figures.

Show it:

1 a detail of a carrier of an electronic device according to an embodiment,

2 a surface-mountable electronic component for an electronic device according to a further exemplary embodiment,

3 an electronic arrangement according to a further embodiment,

4A to 6 electronic arrangements according to further embodiments.

In the exemplary embodiments and figures, identical, identical or identically acting elements can each be provided with the same reference numerals. The illustrated elements and their proportions with each other are not to be regarded as true to scale, but individual elements, such as layers, components, components and areas, for better presentation and / or better understanding may be exaggerated.

The embodiments of electronic arrangements shown in the following figures, and in particular their Lflächenflächenstrukturen and solder pads are preferred embodiments. However, the features of the embodiments are not limiting to the invention and also apply to other Lötflächenstrukturen with other Lötflächenformen and other Lötflächenanzahlen.

In the 1 and 2 are exemplary embodiments of a carrier 100 and a surface mount electronic device 200 shown for an electronic device.

The carrier 100 is formed purely by way of example by a printed circuit board or a metal core board on which the surface mountable electronic component 200 is soldered. The component 200 is purely by way of example designed as a light-emitting surface-mountable electronic component which has a light-emitting diode chip or a plurality of light-emitting diode chips on a substrate in the form of a plastic or ceramic carrier. In 2 as well as in the following figures is in each case the underside of the device 200 shown the mounting surface of the device 200 forms and with which the component 200 on the carrier 100 mounted and mounted by a solder.

The carrier 100 points as in 1 is shown, a first pad structure 1 with outer edges 101 . 102 . 103 . 104 . 105 . 106 . 107 . 108 on, which is a first soldering field 10 define. In particular, the outer edges 101 to 108 Outside edges of soldering surfaces 11 . 12 . 13 , wherein between the first soldering surface 11 and the second soldering surface 12 the third soldering surface 13 is arranged. The soldering surfaces 11 . 12 . 13 have mutually facing inner edges 111 . 112 . 113 and 114 on. Furthermore, for the electrical connection of the first and the second soldering surface 11 . 12 electrical leads in the form of printed conductors 4 on the carrier 100 arranged. The tracks 4 However, they do not belong to the soldering surface structure 1 and the defined by this first solder pad 10 , The third soldering surface 13 serves the thermal connection of the component 200 and thus to the dissipation of heat during operation of the device 200 can arise.

The soldering surfaces 11 . 12 . 13 are on the support by metallization, ie by metallic layers 100 educated.

The first and the second soldering surface 11 . 12 have facing away from each other outer edges 101 . 105 on that a first distance 18 as the first outer dimension of the first pad structure 1 or the first solder pad 10 define. Perpendicular to the first distance 18 have the outer edges 101 . 105 the first and second soldering surfaces 11 . 12 a first length 19 indicative of a second dimension of the first pad structure 1 or the first solder pad 10 Are defined.

In the exemplary embodiment shown, the first solder surface structure 1 and thus the first soldering field 10 a first distance 18 and a first length 19 each about 3.3 mm. The width of the third soldering surface 13 along the first distance 18 is purely exemplary, about 1.3 mm and the distance between each facing each other directly adjacent inner edges 111 . 112 respectively 113 . 114 is about 0.5 mm. The distance between the inner edges 111 . 114 is about 2.3 mm in the embodiment shown.

On such a solder pad usually a component can be soldered, which is one of the first Lötflächenstruktur 1 corresponding Lötflächenstruktur having the same dimensions. A common one on the vehicle 100 mountable component would, for example, have an area of 3.45 × 3.45 mm ² .

This in 2 shown surface mount electronic component 200 has a second pad structure 2 with outer edges 201 . 202 . 203 . 204 . 205 . 206 . 207 . 208 on, which is a second solder field 20 define. In particular, the second solder surface structure 2 a fourth and a fifth soldering surface 24 . 25 on, between which a sixth soldering surface 26 is arranged. The soldering surfaces 24 . 25 . 26 point in addition to the outer edges 201 . 202 . 203 . 204 . 205 . 206 . 207 . 208 also inside edges 211 . 212 . 213 and 214 on, which are arranged in pairs facing each other.

The fourth and fifth solder surfaces 24 . 25 have facing away from each other outer edges 201 . 205 on that a second distance 28 and thus a first outer dimension of the second pad structure 2 define. Perpendicular to the second distance 28 have the fourth and fifth solder surfaces 24 . 25 on the outer edges 201 . 205 a second length 29 indicative of a second outer dimension of the second pad structure 2 Are defined.

The second distance 28 and the second length 29 are purely exemplary in the illustrated embodiment, each 2.7 mm, so that the first outer dimension of the first Lötflächenstruktur 1 of in 1 shown carrier 100 larger than the first outer dimension of the second pad structure 2 of the component 200 is and the second outer dimension of the first Lötflächenstruktur 1 larger than the second outer dimension of the second pad structure 2 is.

The fourth soldering surface 24 may be formed, for example, as a cathode, while the fifth soldering surface 25 is designed as an anode. The sixth soldering surface 26 serves as a thermal connection pad of the device 200 to the carrier 100 and is electrically neutral. The soldering surfaces 24 . 25 . 26 can be formed by metallization on the component bottom shown.

To identify the anode or cathode, the sixth soldering surface 26 a recess, which may for example be designed semicircular with a radius of 0.2 mm. Such markings are common and known to those skilled in the art and may include other farms. In particular, in the following inner edges and solder surfaces are also referred to as congruent, if a soldering surface on an inner edge of such an identification of the polarity of the device 200 having.

In a conventional device with the outer dimensions of the second pad structure shown 2 would be the fourth and the fifth soldering surface 24 . 25 each a width of 0.5 mm along the second distance 28 while the sixth soldering surface 26 a width along the second distance 28 of about 1 mm. The distance between the inner edges 211 . 214 to each other would thus be about 1.7 mm in a conventional device.

This in 2 shown component 200 has purely by way of example a footprint of 3 × 3 mm ² . With the usual arrangement and size of the solder pads for such a component size 24 . 25 . 26 So it would not be possible, the device 200 on the carrier 100 according to 1 because of the dimensions and distances of the soldering surfaces 11 . 12 . 13 of the carrier 100 would not match those of a conventional device.

In 3 is the component 200 according to 2 for an embodiment of an electronic device shown, wherein to illustrate the arrangement of the first Lötflächenstruktur 1 compared to the second pad structure 2 the first pad structure 1 is arranged by means of dotted lines. The surface-mountable electronic component 200 as in connection with 2 described a mounting surface on which the second pad structure 2 is arranged and the smaller dimensions than the first Lötflächenstruktur 1 having. The component 200 Thus, in the embodiment shown has such small dimensions that the first Lötflächenstruktur 1 through that on the carrier 10 assembled component 200 is not completely covered.

As in 3 can be seen, are the solder pads 24 . 25 . 26 the second solder surface structure 2 to the soldering surfaces 11 . 12 . 13 the first pad structure 1 adjusted while the outside dimensions 28 . 29 the second solder surface structure 2 unchanged in relation to the comments on 2 are.

In particular, the pad structures are 1 and 2 centered with respect to a respective center are arranged to each other, so that the centers are congruent. The centers of the first and second solder fields 10 . 20 are indicated by the dashed cross and the reference M.

The fourth soldering surface 24 and the fifth soldering surface 25 the second solder surface structure 2 have inner edges 211 . 214 on, the congruent with the inner edges 111 . 114 the first soldering surface 11 or the second soldering surface 12 the first pad structure 1 are. Accordingly, the second pad structure 2 in comparison to the previously described usual design for solder pads fourth and fifth pads 24 . 25 with a reduced width.

The sixth soldering surface 26 has a width equal to the width of the third soldering surface 13 the first pad structure 1 is so the inner edges 212 . 213 the sixth soldering surface 26 the second solder surface structure 2 congruent with the inner edges 112 . 113 the third soldering surface 13 the first pad structure 1 are. The sixth soldering surface 26 the second solder surface structure 2 was thus compared to the corresponding soldering surface of Broadened solder pad structure of a known device. Thus, it is possible the outer dimensions of the device 200 , so the exemplary 3 × 3 mm ² mentioned above, and only the second pad structure 2 to the first pad structure 1 adapt. The individual solder surfaces 24 . 25 . 26 are designed so that the second Lötflächenstruktur 2 a section of the first solder pad structure 1 equivalent. During soldering, such symmetry results in the first and second solder pad patterns 1 . 2 and in particular the congruent inner edges 111 to 114 and 211 to 214 along the direction of the distances 18 . 28 and perpendicular to these inner edges 111 to 114 . 211 to 214 due to the surface tension of the liquid solder during soldering for self-centering, as well as in a device having a Lötflächenstruktur, the Lötflächenstruktur 1 of the carrier 100 corresponds, that is the case.

Thus, it is possible from the dimensions of much smaller components 200 reproducible on the carrier 100 or on the first solder pad 10 of the carrier 100 to mount by soldering.

In the 4A and 4B another embodiment of an electronic device is shown, which represents a modification of the previous embodiment. 4B shows a section of the arrangement 4A ,

In particular, the component has 200 according to the 4A and 4B in comparison to the previous embodiment according to 3 in addition to the inner edges 111 . 112 . 113 . 114 the soldering surfaces 24 . 25 . 26 projections 27 on, over the at least partially congruent solder surfaces 11 . 12 . 13 . 14 the first pad structure 1 of the carrier 100 protrude. In particular, protrude the projections 27 over to the respective inner edges 211 to 214 congruent inner edges 111 to 114 the first pad structure 1 out. The projections 27 are in each case in end areas of the soldering surfaces 24 . 25 . 26 arranged and bordering the inner edges 111 to 114 and the outer edges 202 . 203 . 204 . 206 . 207 . 208 at. In the embodiment shown, the projections 27 along the course of the inner edges 211 to 214 a width of about 0.2 mm and perpendicular to a length of about 0.13 mm.

The projections 27 serve as adjustment socks, which during soldering to a wetting with solder 300 outside of through the Lötflächenstrukturen 1 . 2 formed respective solder pads and thus lead to the formation of Lotmenisken 3 at the edges of the soldering surfaces 24 . 25 . 26 the second solder surface structure 2 and at the edges of the pads 11 . 12 . 13 the first pad structure 1 , as in 4B is shown.

This leads during the soldering process in addition to the self-centering perpendicular to the inner edges 211 to 214 as already in the embodiment according to 3 to suppress the displaceability of the device 200 parallel to the inner edges 211 to 214 ,

The projections 27 can be designed differently in shape and location and in particular also differ from the projections shown in the embodiment shown.

In 5 is another embodiment of an electronic device with an electronic component 200 on a carrier 100 shown at the first and the second solder field 10 . 20 are twisted to each other. In particular, the component 200 compared to the components of the preceding embodiments arranged rotated by the indicated center M.

The soldering surfaces 24 . 25 . 26 are in turn as cutouts of the soldering surfaces 11 . 12 . 13 formed, so that too in 5 embodiment shown, the second Lötflächenstruktur 2 through a section of the first soldering surface structure 1 is formed. In particular, in the embodiment of the 5 also the inner edges 211 to 214 congruent with the inner edges 111 to 114 the first pad structure 1 , which results in a self-centering of the device 200 in a direction perpendicular to the congruent inner edges 111 to 114 and 211 to 214 results.

In 6 a further embodiment is shown, which represents a particularly preferred modification of the previous embodiment.

As already in connection with 1 has the first pad structure 1 external dimensions 18 . 19 on, the one side length a of the square formed first solder pad 10 correspond. The outer dimensions 28 . 29 the second solder surface structure 2 correspond to a side length b of the likewise square-shaped second solder pad 20 , Preferably, for the angle α around which the device 200 is rotated about the center M, the relationship c = arccos (b / a) applies.

Furthermore, the second pad structure is 2 to the first pad structure 1 dimensioned such that solder surface corners of the second Lötflächenstruktur 2 passing through the meeting point of the inner margin 211 and the outer edge 201 as well as through the meeting point of the inner margin 214 and the outer edge 205 are formed, each congruent with a Lötflächenecke the first Lötflächenstruktur 1 are passing through the meeting point of the inner margin 111 with the outer edge 102 as well as through the meeting point of the inner margin 114 with the outer edge 106 be formed.

Such an arrangement leads during soldering in the entire soldering plane for self-centering of the device 200 on the carrier 100 parallel and perpendicular to the inner edges 111 to 114 and 211 to 214 , This is done as out 6 recognizable, on the one hand by the congruent inner edges 111 to 114 and 211 to 214 and on the other by the parallel to the main edges of the device 200 completely over the first soldering surface structure 1 extending second solder surface structure 2 because of the twisting of the solder fields 10 . 20 and the dimensions of the pad structures 1 . 2 the above-described land corners form boundaries of the respective soldering surfaces which are in the direction along the inner edges 111 to 114 and 211 to 214 come to rest on each other.

The features and embodiments described in the exemplary embodiments and also in the general part above can, although not explicitly shown in the figures, be combined with one another.

The invention is not limited by the description based on the embodiments of these. Rather, the invention encompasses any novel feature as well as any combination of features, including in particular any combination of features in the claims, even if this feature or combination itself is not explicitly stated in the patent claims or exemplary embodiments.

Claims (15)

Electronic arrangement comprising - a carrier ( 100 ) having a first pad structure ( 1 ) with outer edges ( 101 . 102 . 103 . 104 . 105 . 106 . 107 . 108 ), which has a first soldering field ( 10 ), and - a surface-mountable electronic component ( 200 ) with a second solder surface structure ( 2 ) with outer edges ( 201 . 202 . 203 . 204 . 205 . 206 . 207 . 208 ), which has a second soldering field ( 20 ), where the component ( 200 ) with the second pad structure ( 2 ) on the first pad structure ( 2 ) of the carrier ( 100 ), the second soldering field ( 20 ) smaller than the first solder pad ( 10 ) and - wherein the second solder surface structure ( 2 ) at least partially a section of the first pad structure ( 1 ) corresponds. Arrangement according to claim 1, wherein the first and the second soldering field ( 10 . 20 ) each have a center (M) and the centers (M) are congruent. Arrangement according to one of the preceding claims, wherein the first and the second pad structure ( 1 . 2 ) at least two solder pads ( 11 . 12 . 13 . 24 . 25 . 26 ) and the at least two solder pads ( 24 . 25 . 26 ) of the second pad structure ( 2 ) at least partially cutouts of the at least two solder pads ( 11 . 12 . 13 ) of the first pad structure ( 1 ) are. Arrangement according to claim 3, wherein the at least two soldering surfaces ( 11 . 12 . 13 ) of the first pad structure ( 1 ) each have at least one inner edge ( 111 . 112 . 113 . 114 ), which coincide with a respective inner edge ( 211 . 212 . 213 . 214 ) of the at least two solder pads ( 24 . 25 . 26 ) of the second pad structure ( 2 ). Arrangement according to one of the preceding claims, wherein the second pad structure ( 2 ) a section of the first pad structure ( 1 ) corresponds. Arrangement according to one of the preceding claims, wherein the second soldering field ( 20 ) twisted to the first solder pad ( 10 ). Arrangement according to claim 6, wherein the first soldering field ( 10 ) square with one side length a and the second soldering field ( 20 ) is square with a side length b and the second soldering field ( 20 ) to the first soldering field ( 10 ) is rotated by an angle α = arccos (b / a). Arrangement according to claim 6 or 7, wherein - the second pad structure ( 2 ) Soldering surfaces ( 24 . 26 ), each having an inner edge ( 211 . 214 ), which coincide with an inner edge ( 111 . 114 ) of a soldering surface ( 11 . 13 ) of the first pad structure ( 1 ), - the soldering surfaces ( 24 . 26 ) of the second pad structure ( 2 ) at each of the one with an inner edge ( 111 . 114 ) of the first pad structure ( 1 ) congruent inner edge ( 211 . 214 ) at least one Lötflächenecke at a meeting point with an outer edge ( 201 . 205 ), - the soldering surfaces ( 11 . 13 ) of the first pad structure ( 1 ) at each of the one with an inner edge ( 211 . 214 ) of the second pad structure ( 2 ) congruent inner edge ( 111 . 114 ) at least one Lötflächenecke at a meeting point with an outer edge ( 102 . 106 ), and the soldering surface corners of the second soldering surface structure ( 2 ) congruent with the Lötflächenecken first Lötflächenstruktur ( 1 ) are. Arrangement according to one of the preceding claims, wherein at least one soldering surface ( 24 . 25 . 26 ) of the second pad structure ( 2 ) at least one projection ( 27 ), which has at least one partially congruent soldering surface ( 11 . 12 . 13 ) of the first pad structure ( 1 protrudes). Arrangement according to claim 9, wherein the projection ( 27 ) on an inner edge ( 211 . 212 . 213 . 214 ) of a soldering surface ( 24 . 25 . 26 ) of the second pad structure ( 2 ) is arranged and over a congruent inner edge ( 111 . 112 . 113 . 114 ) of a soldering surface ( 11 . 12 . 13 ) of the first pad structure ( 1 protrudes). Arrangement according to claim 9 or 10, wherein at least one soldering surface ( 24 . 25 . 26 ) of the second pad structure ( 2 ) at least two end regions each have a projection ( 27 ) having. Arrangement according to one of claims 9 to 11, wherein a between the first and second Lötflächenstruktur ( 1 . 2 ) arranged solder ( 300 ) at least one projection ( 27 ) a solder meniscus ( 3 ) having. Arrangement according to one of the preceding claims, wherein - the first pad structure ( 1 ) a first and a second soldering surface ( 11 . 12 ) between which a third soldering surface ( 13 ), and - the second pad structure ( 2 ) a fourth and a fifth soldering surface ( 24 . 25 ), between which a sixth soldering surface ( 26 ) is arranged. Arrangement according to claim 13, wherein - the first and second soldering surfaces ( 11 . 12 ) facing away from each other first outer edges ( 101 . 105 ) with a first distance ( 18 ) having a first outer dimension of the first pad structure ( 1 ), - the first outer edges ( 101 . 105 ) a first length ( 19 ) perpendicular to the first distance ( 18 ) having a second outer dimension of the first pad structure ( 1 ), - the fourth and fifth soldering surfaces ( 24 . 25 ) facing away from each other second outer edges ( 201 . 205 ) with a second distance ( 28 ) having a first outer dimension of the second pad structure ( 2 ), - the second outer edges ( 201 . 205 ) a second length ( 29 ) perpendicular to the second distance ( 28 ) having a second outer dimension of the second pad structure ( 2 ), - the first outer dimension of the first pad structure ( 1 ) greater than the first outer dimension of the second pad structure ( 2 ) and - the second outer dimension of the first pad structure ( 1 ) greater than the second outer dimension of the second pad structure ( 2 ). Arrangement according to claim 13 or 14, wherein - the third soldering surface ( 13 ) along the first distance ( 18 ) has a first width, - the sixth soldering surface ( 26 ) along the second distance ( 28 ) has a second width and - the first width and the second width are the same.

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