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DE102011051335A8 - Substrathalteeinrichtung - Google Patents

Substrathalteeinrichtung Download PDF

Info

Publication number
DE102011051335A8
DE102011051335A8 DE102011051335A DE102011051335A DE102011051335A8 DE 102011051335 A8 DE102011051335 A8 DE 102011051335A8 DE 102011051335 A DE102011051335 A DE 102011051335A DE 102011051335 A DE102011051335 A DE 102011051335A DE 102011051335 A8 DE102011051335 A8 DE 102011051335A8
Authority
DE
Germany
Prior art keywords
substrate holder
holder
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102011051335A
Other languages
English (en)
Other versions
DE102011051335A1 (de
Inventor
Andreas Heinze
Carsten Rauh
Herbert Prskawetz
Andreas Müller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meyer Burger Germany GmbH
Original Assignee
Roth and Rau AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roth and Rau AG filed Critical Roth and Rau AG
Priority to DE102011051335A priority Critical patent/DE102011051335A1/de
Publication of DE102011051335A1 publication Critical patent/DE102011051335A1/de
Publication of DE102011051335A8 publication Critical patent/DE102011051335A8/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE102011051335A 2011-06-26 2011-06-26 Substrathalteeinrichtung Withdrawn DE102011051335A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102011051335A DE102011051335A1 (de) 2011-06-26 2011-06-26 Substrathalteeinrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102011051335A DE102011051335A1 (de) 2011-06-26 2011-06-26 Substrathalteeinrichtung

Publications (2)

Publication Number Publication Date
DE102011051335A1 DE102011051335A1 (de) 2013-01-10
DE102011051335A8 true DE102011051335A8 (de) 2013-03-21

Family

ID=47426325

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011051335A Withdrawn DE102011051335A1 (de) 2011-06-26 2011-06-26 Substrathalteeinrichtung

Country Status (1)

Country Link
DE (1) DE102011051335A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103280420B (zh) * 2013-06-04 2015-11-25 上海华力微电子有限公司 晶圆承载装置及晶圆倒片的方法
CN113066744B (zh) * 2021-03-19 2021-11-16 江苏新智达新能源设备有限公司 真空烧结炉的料盘转运机构
CN114551314A (zh) * 2022-03-03 2022-05-27 江西汉可泛半导体技术有限公司 一种水平式多硅片中转机构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3625038A1 (de) * 1986-07-24 1988-01-28 Siemens Ag Vorrichtung zur halterung von flachbaugruppen
DE3738165A1 (de) * 1987-11-10 1989-05-24 Siemens Ag Verfahren und anordnung zum umsetzen von plattenfoermigen werkstuecken
US5435075A (en) * 1992-04-07 1995-07-25 Tokyo Electron Limited Spindrier
US5971156A (en) * 1997-09-05 1999-10-26 Kinetrix, Inc. Semiconductor chip tray with rolling contact retention mechanism
DE10304174A1 (de) * 2002-02-25 2003-09-11 Samsung Electronics Co Ltd Vorrichtung und Verfahren zur Waferrückseiteninspektion

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008060874A1 (en) 2006-11-10 2008-05-22 Evergreen Solar, Inc. Substrate with two sided doping and method of producing the same
DE102007057891A1 (de) 2006-12-01 2008-07-03 Ingenia Gmbh Wafergreifer und Verfahren zu seiner Ansteuerung

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3625038A1 (de) * 1986-07-24 1988-01-28 Siemens Ag Vorrichtung zur halterung von flachbaugruppen
DE3738165A1 (de) * 1987-11-10 1989-05-24 Siemens Ag Verfahren und anordnung zum umsetzen von plattenfoermigen werkstuecken
US5435075A (en) * 1992-04-07 1995-07-25 Tokyo Electron Limited Spindrier
US5971156A (en) * 1997-09-05 1999-10-26 Kinetrix, Inc. Semiconductor chip tray with rolling contact retention mechanism
DE10304174A1 (de) * 2002-02-25 2003-09-11 Samsung Electronics Co Ltd Vorrichtung und Verfahren zur Waferrückseiteninspektion

Also Published As

Publication number Publication date
DE102011051335A1 (de) 2013-01-10

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Legal Events

Date Code Title Description
R163 Identified publications notified
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20140101