DE102007043001A1 - Tape technology for electronic components, modules and LED applications - Google Patents

Abstract

The present invention relates to a method for the series production of a plurality of ankontaktierten electronic components (7), in particular of modules and / or power modules and / or light emitting diodes and / or general electronic power devices. It is an object to provide a low-cost and simple method for mass production of ankontaktierten electronic components (7) in large quantities. The present invention is characterized in that a second strip comprising components (7) and an exposed metal conductor (15) are superimposed such that in the claimed strip method a mechanical and / or electrical contacting of the respective metal conductors (15) is achieved. to the respective contact surface (9) of the respective electronic component (7) is executable. Both bands can be produced in the form of rolls. The electronic components (7) can be isolated after Ankontaktieren or created as a single role. In this way, a particularly effective manufacturing process can be provided. The method is particularly suitable for electronic power components, which can additionally have heat-dissipating layers (19) in a simple manner.

Description

The The present invention relates to a method according to the Preamble of the main claim and correspondingly produced electronic Components.

For a conventional planar connection according to the WO 03030247 , Siemens is internally referred to as "SiPLIT" (Siemens Planar interconnect technology), the isolation of contact traces by the application of an insulating film on the electronic components on Direct Copper Bond (DCB) substrates achieved Connection technologies, for example by means of bonding or SiPLIT, allow a wide variety of variants for different power electronics applications that are also subject to high thermal loads.

In particular, the conventional bonding technology is the benchmark in manufacturing cost of power devices and modules. In addition, there are a variety of bond-related embodiments, such as ribbon bonding and the like. For the production of power modules, DCB substrates are mainly populated by soldering of electronic components and / or surface mounted devices (SMDs). For the technology for planar connections, internally referred to by Siemens as "SiPLIT", the isolation and patterning of the contact conductor tracks is achieved by applying a laser-structured insulating film WO 03030247 ) generates the electrical connections.

Next the achievement of technical requirements and characteristics the desire for reduction of manufacturing costs in comparison to conventional designs.

It object of the present invention is a cost and simple method for serial production of ankontaktierten electronic components, in particular of modules and / or power modules, and / or light-emitting diodes and / or generally electronic power components, to provide in large numbers.

The Task is by a method according to the main claim solved. It will be advantageous electronic components made according to the independent claim.

It should be the cost-effective conventional process technology used in "roll-to-roll" procedures for conventional Tape Automatic Bonding (TAB) known and in productive use for the production of flexible circuits. These typical basic technologies for The TAB process is based on the traditional assembly and connection technology base for the preparation according to the invention of electronic components.

The inventive method may preferably for Series production of cost-effective components / modules in high volumes and preferred for conventional Power modules are used.

Further advantageous embodiments are located in the subclaims.

According to one Further advantageous embodiment, a generating of the first Volume with a step of producing as a single role a carrier film having at least one on at least one Site generated structured metallization for component assembly and / or as a radiator connection surface. The carrier foil should thermally conduct and / or electrically isolate and an advantageous have small thickness and flexibility. The structured Metallization is designed according to an application layout wor the. So it is advantageous a single role of the carrier film generated, which is easy to transport and handle.

According to one Another advantageous embodiment is followed by generating the first Tape with a step of applying adhesive layers on the unrolled carrier film. Adhesive layers are for example Solder and / or adhesive layers z. B. for the assembly with components. In this way, these adhesive layers can be generated particularly fast and inexpensively.

According to one Further advantageous embodiment, a generating of the first Bands with the step of placement and electrical contacting and / or attaching the carrier film to the electronic Components with unrolled carrier film. The electric Contacting and / or fastening can be done, for example, by means of a Reflow process are executed. The electrical contact and / or fastening can be performed over the entire surface become. The electrical contacting and / or fastening can in particular be carried out by means of soldering or gluing. Subsequently, an optional rolling up of the first volume be executed. In this way is the electric Contacting and / or attaching quickly and inexpensively executable.

According to a further advantageous embodiment, the second strip is produced by a step of producing the electrically insulating contacting foil as a single roll associated with the contact surfaces of the electronic components Kontaktierungsfolienöffnungen and projecting into this exposed metal conductors of the formed on the Kontaktierungsfolie structured metallizations. The Kontaktierungsfolienöffnungen can be produced inexpensively, for example by punching. By generating a corresponding single role of the second band, this is also very easy to transport and handle. Accordingly, high quantities can be processed.

According to one Another advantageous embodiment is a generating the second Bands with a step of mechanical deformation of the exposed Metal conductor in the direction of the respective contact surface of the respective electronic component with unrolled contacting foil. This step can be particularly advantageous just before Ankontaktieren be executed. Basically, though an optional subsequent reeling of the second volume possible before contacting. This is the same way a large number of components transportable, manageable and manufacturable.

According to one Another advantageous embodiment is a generating a Single role after Ankontaktieren, the single role of the successive lying first and second band is formed. Alternatively you can the ankontaktierten electronic components directly after the step of Ankontaktierens be isolated. The generated single role is suitable especially for when the ankontaktierten electronic Components of the single role to be further processed.

According to one Another advantageous embodiment is for the production of electronic Components a conventional construction and connection technology (AVT) used. This allows conventional process steps be carried out in a simple manner.

According to one further advantageous embodiment is a loading with already pre-prepared components on the wafer level. Thus, in the wafer process already steps for the production and Processing of electronic components can be integrated.

According to one Another advantageous embodiment, a manufacture of many functional surfaces of the electronic components in particular by means of galvanic processes and / or by means of soldering and / or by means of printing. Functional surfaces are in particular upper contact surfaces of the electronic components, such as gate and drain connections of an IGBT (Insulated Gate Bipolar Transistors). A galvanic Process may be, for example, a nickel-gold electrolysis bath. In this way, contact surfaces of the electronic components generated contactable.

According to one Further advantageous embodiment, a generating of the first Bandes with a step of creating openings and / or Slits in the carrier film for direct production of electrical connections to the electronic components. In order to There are further possibilities for electrical Ankontaktierung the electronic components. The first band can optionally follow be rolled up.

According to one Further advantageous embodiment, a generating of the first Bandes with a further step of generating a heat-conducting Cover coating and / or film as a mechanical and / or electrical Surface protection and / or improved heat dissipation the structured metallization having carrier film. It may be followed by an optional roll up of the first band.

According to one Another advantageous embodiment is a use of high Heat-conducting and / or highly electrically insulating, structured carrier sheet materials. This way you can a good thermal connection of side surfaces by good conformability and high electrical Dielectric strength provided for high temperature applications become.

According to one Another advantageous embodiment is a use of a on both sides with a thermally conductive silicone film coated polyimide film as a base sheet material.

This is particularly advantageous for high temperature applications.

According to one Another advantageous embodiment is a use of structured Ceramic films as a carrier foil material. This is done in particular in combination with functional surfaces in particular with contact surfaces, the electronic components. On This way, equally high temperature applications can be provided.

According to one further advantageous embodiment is a padding cavities between the contacting film and edge portions of electronic components with an additional electrical Insulation material, in particular a resin and / or an underfill. In this way, short circuits between upper pads and lower pads of the components avoided.

The The present invention will be described by way of example described in conjunction with the figures. Show it:

1 a first embodiment of an electronic component produced according to the inventive method;

2 A second embodiment of an electronic component produced according to the inventive method;

3 an embodiment of the essential steps of the method according to the invention;

4 A third embodiment of an electronic component produced according to the inventive method.

1 shows a first embodiment of an ankontaktierten electronic component 7 , which has been produced according to a first embodiment of a method according to the invention. reference numeral 1 denotes a thermally conductive and / or electrically insulating carrier film 1 which have at least one structured metallization at least on one side 3a having. By means of a solder layer 5 at lower contact surfaces 9a of the electronic component 7 this is with the carrier foil 1 attached and contacted electrically. In this way, a first band of at least one structured metallization 3a having electrically insulating carrier film 1 , on the contact surfaces 9 comprising electronic components 7 attached and / or electrically contacted, can be generated. reference numeral 11 denotes a thermally conductive and / or electrically insulating contacting film 11 as well as the carrier film 1 structured metallizations 3b at least on one side. The contacting foil 11 has Kontaktierungsfolienöffnungen 13 such that in this metal conductor 15 protrude freely carrying. In this case, the position of the Kontaktierungsfolienöffnung 13 and the metal ladder 15 on the corresponding upper contact surface (s) 9b of the electronic component 7 Voted. That is a metal conductor 15 is directly to an upper contact surface 9b an electronic component 7 ankontaktierbar. In this way, a second band is a metallization structured on at least one side 3b having, electrically insulating contacting film 11 with the upper contact surfaces 9b the electronic components 7 associated contacting foil openings 13 and in this, projecting, exposed metal conductors 15 the structured metallization 3b produced. An ankontaktiertes device 7 according to 1 has been produced such that the first and the second band at least in the region of the upper contact surfaces 9b and the associated exposed metal conductor 15 have been superimposed or superimposed. Thereafter, a direct mechanical and electrical Ankontaktieren the at least one protruding exposed metal conductor concluded 15 to the respective upper contact surface 9b of the respective electronic component 7 at. A single electronic component 7 according to 1 is for example by separating the ankontaktierten electronic components 7 produced after the Ankontaktierschritt. Further shows 1 a heat sink 17 pointing to the down arrow. This can heat from the electronic component 7 For example, in the use of the electronic component 7 as a power component, advantageously be dissipated down.

According to the method according to 3 combined with 1 finds a suitable, thin thermally conductive and / or electrically insulating carrier film 1 with, for example, double-sided, structured copper metallization 3a for the assembly of electronic components 7 and as a cooler connection surface use. In this way, a conventional direct copper bond board is replaced. The carrier film produced according to an application layout in a roll-to-roll process 1 becomes after application of adhesive layers 5 or solder or adhesive layers with electronic components 7 equipped and, for example, in the reflow process, on the lower contact surfaces 9a or small copper surfaces soldered over the entire surface. For creating the connection of the upper contact surfaces 9b the electronic components 7 , which are, for example, source contacts or gate contacts, becomes a contact foil 11 with another structured metallization 3b with corresponding contacting foil openings 13 and adapted, free in the Kontaktierungsfolienöffnungen 13 protruding, copper metal conductors 15 produced. The layer thicknesses of the carrier film 1 or contacting film 11 , which are the insulating films, and the structured metallizations 3a and 3b , which are the metal foils, meet the respective requirements of thermal management and the required current densities. The contact sheet thus produced 11 now allows for a mechanical forming of the copper-metal conductor 15 the direct Ankontaktierung the exposed copper-metal conductor 15 on the upper contact surfaces 9b the electronic components 7 For example, by gluing and / or soldering and / or welding and / or terminals. In particular, electronic components already prepared at the wafer level can also be used 7 be fitted. Differently required functional or functional surfaces, for example, the upper contact surfaces 9b an electronic component 7 can be generated in the strip method according to the invention by means of galvanic processes in a dipping bath.

An electronic component 7 according to 1 is thus produced in a very cost-effective manner by the proposed tape method. Such generated electronic components 7 are particularly suitable for power electronics, for LED (light emitting diode) applications and other other applications with to the above base materials further alternative base materials.

2 shows a second embodiment of a generated according to the inventive method ankontaktierten electronic component 7 , Denote, in 2 , same reference numerals 1 same elements. The second embodiment according to 2 shows the introduction of openings 21 and slots in the copper-textured carrier sheet 1 so that direct electrical connections of the involved electronic components 7 are available. reference numeral 21 denotes openings 21 in the carrier film 1 , A heat conductive covercoat / foil 19 causes an additional improved heat dissipation by reducing the thermal resistance on the underside of the electronic component 7 , reference numeral 17 refers to the corresponding heat sink 17 to the corresponding heat energy of the electronic component 7 can be derived. The side of the upper contacting foil 11 according to 2 corresponds largely to the side of the upper contacting film 11 according to 1 , Only the solder layer 5 is in 2 reduced.

3 shows an embodiment of a method according to the invention for producing a plurality of ankontaktierten devices 7 , With a first step S1, a first band of one, at least one struc tured metallization is generated 3a having, electrically insulating carrier film 1 , on the lower contact surfaces 9a Electronic Components 7 attached and electrically contacted. According to a further step S2, a second band of one, at least one structured metallization is generated 3b having, electrically insulating contacting film 11 with the upper contact surfaces 9b the electronic components 7 associated contacting foil openings 13 and in this, projecting, exposed metal conductors 15 the structured metallization 3b , With a step S3, the first and the second band are superimposed at least in one area in an upper contact area 9b and an associated, exposed metal conductor 15 , With a concluding step S4, a direct mechanical and electrical contacting of the at least one protruding, exposed metal conductor takes place 15 to the respective upper contact surface 9b of the respective electronic component 7 , This step is carried out, for example, by means of soldering and / or gluing and / or welding and / or clamping. Subsequently, the ankontaktierten components 7 rolled up or separated directly.

metallization 3a and 3b can on the top and / or on the bottom of the thermally conductive and / or electrically insulating carrier film 1 and / or the thermally conductive and / or electrically insulating contacting film 11 be generated.

The heat conductive cover coating / foil 19 can be beneficial on the device 7 opposite side of the carrier film 1 be upset.

4 shows a third embodiment of an electronic component produced according to the inventive method. It is like 4 of the 1 except for the feature that possible cavities between Kontaktierungsfolie 11 and edge portions of the electronic components 7 with an additional electrical insulation mass 23 , in particular a resin 23a and / or an underfill 23b have been filled. The additional electrical insulation mass 23 is advantageous in terms of thermal and electrical properties of the contacting film 11 customized. The additional electrical insulation mass 23 can be a mold or injection molding. The production of a filling or an underfill may be carried out by dispensing with a needle by means of which the mass is injected into the cavity. Basically, the additional electrical insulation material 23 also before the application of the contacting film 11 on the device 7 be upset. The additional electrical insulation mass 23 prevents electrical short circuits between the upper and lower connection surfaces 9a and 9b that can cause the cavities. Cavities may alternatively be achieved by adjusting the stiffness of the contacting film 11 be avoided. Is this close to the electronic component 7 cavities can be avoided.

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• WO 03030247 [0002, 0003]

Claims (17)

Method for series production of a plurality of ankontaktierten electronic components ( 7 ), in particular of modules and / or power modules and / or light emitting diodes and / or generally electronic power components, characterized by - generating a first band of at least one structured metallization ( 3a ), electrically insulating carrier film ( 1 ) on which electronic components ( 7 ) by means of lower contact surfaces ( 9a ) and / or are electrically contacted; Generating a second band of at least one structured metallization ( 3b ), electrically insulating contacting film ( 11 ) with upper contact surfaces ( 9b ) of the electronic components ( 7 ) associated contacting foil openings ( 13 ) and exposed in this exposed metal conductors ( 15 ) of the structured metallization ( 3b ); Superposition of the first and second bands in the region of at least one upper contact surface ( 9b ) and at least one associated exposed metal conductor ( 15 ); Direct mechanical and / or electrical contacting of the at least one protruding exposed metal conductor ( 15 ) to the respective upper contact surface ( 9b ) of the respective electronic component ( 7 ), for example by means of soldering and / or gluing and / or welding and / or clamping. Method according to claim 1, characterized by producing the first strip with a step of producing as a single roll a thin, thermally conductive and / or electrically insulating carrier foil ( 1 ) with at least one structured metallization produced on at least one side ( 3a ) for the component assembly and / or as a radiator connection surface. Method according to claim 1 or 2, characterized by producing the first strip with a step of applying adhesive layers ( 5 ), in particular solder and / or adhesive layers, on the unrolled carrier film ( 1 ). A method according to claim 1, 2 or 3, characterized by producing the first strip with a step of placement and, for example, by means of a reflow process, in particular full-surface, electrical contacting and / or fastening, in particular by means of soldering and / or gluing, the carrier film ( 1 ) with the electronic components ( 7 ) with unrolled carrier film ( 1 ), and optional subsequent rewinding of the first volume. Method according to one or more of Claims 1 to 4, characterized by producing the second strip with a step of producing the electrically insulating contacting foil as a single roll ( 11 ) with the upper contact surfaces ( 9b ) of the electronic components ( 7 ), in particular punched, contacting film openings ( 13 ) and exposed in this exposed metal conductors ( 15 ) of on the contacting film ( 11 ) structured structured metallizations ( 3b ). Method according to one or more of claims 1 to 5, characterized by producing the second strip with a step of mechanically deforming, in particular bending, the exposed metal conductor ( 15 ) towards the respective upper contact surface ( 9b ) of the respective electronic component ( 7 ) with unrolled contacting film ( 11 ), and optionally subsequent rolling up of the second band. Method according to one or more of claims 1 to 6, characterized by generating a single roll after Ankontaktieren, wherein the single roll is formed from the superimposed first and second band or singulating the ankontaktierten electronic components ( 7 ). Method according to one or more of the claims 1 to 7, characterized in that a conventional Assembly and connection technology is used. Method according to one or more of Claims 1 to 8 in conjunction with Claim 4, characterized by equipping with electronic components already pre-prepared on a wafer plane ( 7 ). Method according to one or more of claims 1 to 9, characterized by producing various functional surfaces, in particular upper contact surfaces ( 9b ), electronic components ( 7 ), in particular by means of galvanic processes, for example in a nickel-gold bath, and / or by means of solder and / or by means of pressure. Method according to one or more of claims 1 to 10, characterized by producing the first strip with a step of creating openings ( 21 ) and / or slots in the carrier film ( 1 ) for directly generating electrical connections to the electronic components ( 7 ), and optional subsequent rewinding of the first volume. Method according to one or more of claims 1 to 11, characterized by generating of the first strip comprising a step of producing a heat conductive cover coating ( 19 ) and / or foil as mechanical and / or electrical surface protection and / or for improved heat dissipation on the structured metallization ( 3a ) having carrier film ( 1 ), and optional subsequent rewinding of the first volume. Method according to one or more of the claims 1 to 12, characterized by using high heat conductive and / or highly electrically insulating, structured Support film materials. Method according to one or more of claims 1 to 13, characterized by using one, in particular on both sides, with a thermally conductive silicone film ( 19 ), coated polyimide film as a carrier film ( 1 ). Method according to one or more of claims 1 to 14, characterized by using structured ceramic films as carrier films ( 1 ), especially in combination with functional surfaces, in particular with upper contact surfaces ( 9b ), electronic components ( 7 ). Method according to one or more of claims 1 to 15, characterized by filling cavities between contacting film ( 11 ) and edge regions of the electronic components ( 7 ) with an additional electrical insulation compound ( 23 ), in particular a resin ( 23a ) and / or an underfill ( 23b ). Variety of electronic components ( 7 ) and / or modules, in particular power modules and / or light emitting diodes and / or in general electronic power components, characterized in that it has been produced by a method according to one or more of claims 1 to 16.