DE10147376B4 - Electronic component and leadframe and method for producing the same - Google Patents

Abstract

An electronic component having a plastic housing (2) and a metallic carrier (3) partially arranged in the plastic housing (2), wherein a semiconductor chip (4) is arranged on the metallic carrier (3) in flip-chip technology, and wherein the carrier (3) outer contacts (5) in full carrier material thickness (D) and terminal contacts (6) in a reduced thickness of carrier material (d), wherein one side of the terminal contacts (6) on the upper side (11) of the plastic housing (2) is exposed, and wherein the connection contacts (6) with reduced carrier material thickness (d) are directly connected to flip-chip contacts (7) of the active upper side (8) of the semiconductor chip (4) and wherein
- The electronic component (1) has cranked holding webs (21), the terminal contacts (6) on the upper side of the electronic component (1) with external contacts (5) on the underside (9) or on side edges (10) of the electronic component (1 ) connect electrically and mechanically;
- The electronic component (1) on its upper side (11) has a rewiring layer (36), wherein the rewiring layer (36) at the top of ...

Description

The The invention relates to an electronic component and a system carrier and Process for their preparation according to the preamble of the independent claims.

Electronic components that have a plastic housing can accommodate a semiconductor chip, which is connected by means of bonding with a carrier within the plastic housing. Such components, manufactured by bonding technology, as described in the document DE 100 04 410 A1 are fundamentally different from electronic components having a semiconductor chip with a metallic carrier on which a semiconductor chip is arranged in flip-chip technology, as it is known from the document DE 199 21 867 C2 is known.

One Difference between such a flip-chip assembly to a Bond mounting is that of the semiconductor chip in flip-chip mounting is not applied on a chip island, but on a complex Wiring board is arranged on the rewiring lines be led from the microscopic flip-chip bumps to macroscopically large terminal contact surfaces, around macroscopically arranged and correspondingly large external contacts to contact the electronic component. Doing this will ensure that the microscopically fine flip-chip contacts, such as solder bumps, when soldering on corresponding metal surfaces the rewiring cables can not flow out of the way uncontrolled laterally, the rewiring plate with a solder stop Mistake.

From the US Pat. No. 5,770,888 For example, a semiconductor device with a semiconductor chip applied to a substrate is known. The substrate has a multiplicity of conductor tracks, the conductor tracks comprising first and second sections, and the semiconductor chip being applied to the upper sides of the first sections. A plastic housing encloses the semiconductor device such that the bottoms of the first portions and the tops of the second portions are exposed as external contact surfaces. A similar structure for a semiconductor device is also known from US Pat. No. 6,043,430 A known.

The DE 198 45 316 A1 discloses a stackable BGA semiconductor die package having on its top side terminals in the form of solder balls and on its bottom contact pads in the same terminal grid as the solder balls, so that a plurality of these BGA semiconductor chip packages can be easily stacked.

From the DE 197 47 177 A1 For example, a semiconductor device having a redistribution substrate is known, wherein the redistribution substrate comprises a first region and a second region connected to the first region via a flexible portion. The top of the first area is populated with a semiconductor device and the second area is folded over the first so that the device is hammered. The component produced in this way has on its upper side contact pads and on its underside solder balls in the same grid, so that similar components can be easily stacked.

Either the production of a rewiring plate as well as the structuring a solder mask on the rewiring plate require complex and costly Manufacturing steps. Thus, an electronic component with a Semiconductor chip in flip-chip mounting much more expensive than a component in bonding wire assembly. Will the solder mask to cheapen the electronic component in flip-chip mounting omitted, there is not only the risk that the solder of the flip-chip solder bumps dissipates and it comes to no contact, but also that shorts occur because when applying the semiconductor chip to the rewiring plate Lötsöcker into each other go by or because Lot in the gaps between adjacent terminals penetrates and these connections electrically bridged.

task The invention is to provide an electronic component, the in his plastic case a semiconductor chip with flip-chip contacts in flip-chip mounting without a solder mask or to provide a rewiring plate in the plastic housing and additionally mechanical and thermomechanical loads on the flip-chip connection reduce and creepage paths for the penetration of ions and the penetration of moisture from the outside to the Extend the chip.

Is solved this object with the subject of the independent claims. Advantageous developments The invention will become apparent from the dependent claims.

According to the invention an electronic component has a plastic housing and a partially arranged in the plastic housing metallic carrier on, wherein on the metallic support a semiconductor chip in flip-chip technology is arranged, and wherein the carrier external contacts in full substrate thickness and connecting contacts having in reduced carrier material thickness. One side of the terminal contacts is exposed at the top of the plastic housing, and the terminals are with reduced carrier material thickness directly with flip-chip contacts of the active top side of the semiconductor chip connected.

The electronic component has cranked holding webs on, the connection contacts on the top of the electronic component with external contacts on the underside or on side edges of the electronic component connect electrically and mechanically. It also points to his Top of a rewiring layer, wherein the rewiring layer the exposed at the top of the plastic housing side of the Connection contacts with further external contacts on the top side combines. The other generated with the redistribution layer external contacts on the top are to the outside contacts on bottom arranged congruently.

Consequently are the connection contacts on the microscopically small flip-chip contacts by holding webs positioned by reduced carrier material thickness, while the macroscopic external contacts of the electronic component via Holding webs with reduced carrier material thickness with the connection contacts are connected. In this connection is under microscopic an order of magnitude <0.3 mm understood, which is measurable only under a light microscope and under macroscopic an order of magnitude> 0.3 mm, which is measurable with the naked eye.

One Advantage of this electronic component is that the semiconductor chip with its flip-chip contacts directly on corresponding terminal contacts a metallic carrier is arranged so that a complex rewiring plate and the complex application of solder resists account for the rewiring plate. Thus, already by the dimensioning and production of the metallic carrier a Rewiring over realized the holding webs of the metallic carrier. There are none with the solution according to the invention additional Components necessary to from the microscopic spaced flip-chip contacts of a semiconductor chip on the macroscopically arranged connection contacts of the electronic component. Also the thermal and mechanical decoupling between the semiconductor chip with flip-chip contacts and the support structure is conceivable easy way solved by the holding webs with reduced material thickness.

The external contacts are arranged on the underside of the plastic housing. These can be the Retaining webs, the external contacts with the connection contacts and the flip-chip contacts connect, be so half material thickness that they not visible from the bottom of the electronic component are and therefore completely in Plastic housing composition are embedded. This has the advantage that a compound of external contacts with corresponding contact pads of a circuit board or a ceramic substrate reliable carried out can be, as a flow of the Lanyard between the external contacts of the electronic Component and the contact pads of a Circuit board or a ceramic substrate is prevented. Consequently Such an electronic component can be extremely precise on a printed circuit board or a ceramic substrate and connected thereto become.

It can also external contacts on the margins be arranged of the electronic component. Such external contacts on the margins also become outside edge contacts called and have the advantage that on these from the margins of the electronic component can be accessed from. simultaneously leave these outside edge contacts of the electronic component access from the bottom also too. This has the advantage that such an electronic Component extremely flexible can be installed in different electronic circuits and test devices is.

On the top of the plastic housing Connection contacts arranged. In such a component results in an advantageous way the possibility of both from the bottom of the electronic component as well as from the top of the electronic Component on the contacts of the electronic component, with the semiconductor chip with flip-chip contacts be in communication, from the top of the terminal contacts as well as from the bottom over the external contacts To have access. That fulfilled Such an electronic component is an advantageous prerequisite for the stackability such components.

at an embodiment invention, the terminal contacts have contact sockets, the one to the flip-chip contacts of the semiconductor chip have congruent contact pad and with the flip-chip contacts are connected. Through the contact socket attached to the contact socket there is another possibility the dimension of the connection contacts continue to reduce and tune to the size of the flip-chip contacts, so that a congruent contact pad to the flip-chip contacts on the connection contacts is realized. This embodiment of the Invention facilitates the joining of the metallic carrier with the semiconductor chip in flip-chip technology and prevents a broad Bleeding the solder.

In a further embodiment of the invention, the external contacts with the terminal contacts are partially mechanically and / or electrically connected via electrically conductive holding webs. The holding webs have a reduced carrier material thickness. The holding webs therefore have two Functions in this embodiment. On the one hand, they hold the external contacts and the terminal contacts in position for packaging of the electronic component in a plastic housing composition, and on the other hand connect the holding webs the external contacts with the terminal contacts, while these are in turn connected to the flip-chip contacts of the semiconductor chip.

by virtue of the reduced carrier material thickness of Haltstege is advantageously a decoupling of the mechanical and thermo-mechanical loading of the flip-chip connection between terminal contacts and flip-chip contacts realized the burden of sensitive flip-chip contacts to a great extent reduced. Furthermore are the creeper paths for an advance of ions and / or moisture from the outside to Chip through the plastic housing across from the known solutions extended. This has the advantage that the life of such electronic Components is improved.

In a further embodiment According to the invention, it is provided that the carrier has a potential line, which at least partially has a reduced carrier material thickness and surrounded by plastic compound. Such a potential line has the advantage that it is arranged across the plastic housing can be and thus an additional Anchoring for Holding webs and connecting contacts as well as external contacts represents. Furthermore can of such a line a potential, for. B. mass or Supply to different connection contacts and external contacts be distributed.

The Plastic housing indicates in a further embodiment the invention on its underside recesses, partially in holding webs to connection contacts and / or in holding webs to external contacts are arranged and cut them. Such a separation the retaining bars with the help of recesses, from the bottom of the plastic housing being introduced is extremely useful, if this holding webs only the positioning, but not the Serving of electrical connections. Thus, through a simple separation step after packaging a variety of electronic components on the bottom of a mechanical connection between external contacts and connection contacts or external contacts and ground line are cut to isolated, single external contacts to create on the bottom of the electronic component.

such Recesses can in one embodiment of the invention on the underside of the plastic housing Saws are inserted, leaving the bottom of the case Sägenuten comprising a predetermined number of retaining webs electrically interrupt. This interruption of retaining bars is only provided for the Holding webs, which only a mechanical function in packaging provide the electronic component in a plastic housing.

at a further embodiment The invention provides that some external contacts have a reduced carrier material thickness and carry on its top a contact socket having a contact pad, which is congruent to a flip-chip contact. With this embodiment is achieved that at intended positions immediately the flip-chip contacts go into external contacts can, by using the flip-chip contacts and their microscopic terminal pads the correspondingly reduced and congruent contact pad of a on half material thickness reduced or reduced external contact can be applied. This can especially in the center of the electronic component for reasons of space Be an advantage. Only in the area of congruent contact pads exhibit these external contacts the full material thickness of the carrier on.

The electronic component has cranked holding webs on. These holding webs are between terminal contacts on the top of the electronic component and external contacts on the underside arranged the electronic component and connect them electrically and mechanical. Thus be over the cranked ones Retaining webs the connection contacts mechanically fixed on the top of the electronic component and electrically connected, which has the advantage that the electronic Component access both from the top and from the Bottom to the flip-chip contacts of the semiconductor chip allows. About that In addition, the semiconductor chip with its flip-chip contacts hanging on the connecting contacts arranged. At the same time, the cranked retaining bars offer limited protection the flip-chip connections in the packaging of the carrier in a plastic housing compound, there in this process the cranked Stege the edges of the semicon terchips from mechanical damage by molds protect.

On the upper side of the electronic component, a rewiring layer is arranged. In this case, the redistribution layer connects the connection contacts on the top side of the electronic component via rewiring lines to further external contacts on the upper side of the component. This has the advantage that over very short lines another electronic component can be built directly on the first, z. B. a memory device on a logic device. It is not a separate rewiring plate in the form of a printed circuit board made of organic material Shem or ceramic substrate with double-sided structured metallization and vias required, but the component surface itself is also a carrier for rewiring. This allows multiple electronic components z. B. a chipset are very compact and vertically integrated with fewer joints, with many advantages over a flat module integration, z. As less space, short lines, easy testability of the individual components, repair option by replacing components of a stack, because he is not molded or cast as a whole.

By the cranked ones Haltstege are the connection contacts on the upper side without corresponding rewiring not congruent with the external contacts arranged on the bottom. The with the redistribution layer generated external contacts are on the top to the outside contacts on the bottom arranged congruently. Such an electronic component now has identical contacts on the top and bottom external contacts on for each egg nen flip-chip contact inside the electronic component. This has the advantage that with the same test equipment and with the same Test procedure both the bottom and the top of the electronic Component can be tested.

Furthermore there is the possibility of a another embodiment specify an electronic component, wherein a plurality of electronic components stacked on top of each other. The congruently arranged external contacts on the top and bottom of the electronic component can in the vertical stack by simple measures electrically get connected. Such measures can consist in a Leitklebstofftechnik or in a soldering, so that a compact, electronic component of several stacked electronic components is created. Characteristic of this stack is it is that on the one hand semiconductor chips with flip-chip contacts in the Stacks are arranged and on the other hand cranked holding webs electrically the external contacts on the bottom with connection contacts connect on the top, which in turn via rewiring lines with external contacts are electrically connected on the top.

at Another aspect of the invention provides that a system support for multiple electronic Components is designed. This system carrier has structured component positions for each the electronic components, each component position of a system tray frame is surrounded. At the same time, the system carrier has perforations in its edge area on, with which the position of the individual component positions for a corresponding pick and place machines To be defined. In each of the component positions, the system carrier frame Retaining webs to external contacts and Hal testege to terminal contacts toward a central area in the component position. All external contacts and all connection contacts are thus fixed in their position, so that a correct placement of a Semiconductor chips with flip-chip contacts on the connection contacts can be done. This is done in a placement machine. there is neither a chip island for the mounting of the semiconductor chip is required, nor are rewiring plates with solder stop patterns provided. Such a system carrier thus reduces the cost of production electronic components.

The external contacts are arranged in a matrix and electrically connected via holding webs Connection contacts connected, which have an arrangement that the arrangement of flip-chip contacts a to be arranged in flip-chip technology in the component positions Semiconductor chips corresponds.

The external contacts have a full system substrate thickness. This shows the external contacts a profile in cross section over this system carrier material strength, the projections in the middle area of the material thickness shows. These projections in the middle area of the material thickness Improve the anchoring of the external contacts in the plastic housing compound in the packaging of electronic components.

The connecting contacts have a reduced system carrier material thickness. Thus, the External contacts extremely delicate accomplished and to the flip-chip contacts of the semiconductor chip, which are in are arranged at a microscopic distance from each other, guided be without causing short circuits comes between the holding webs and in particular between the terminal contacts. Furthermore they will be there later Completely from the plastic housing compound wrapped and protected.

The external contacts can in another embodiment the invention in at least one component position in an outer ring be arranged. These external contacts in the outer ring at the same time have external contact surfaces the bottom and on the edge sides of the electronic component and allow thus accessing these external contacts from multiple pages out. Furthermore, between holding webs) for external contacts of an outer ring Retaining webs of another inner ring to be arranged from external contacts.

In a further embodiment of the system carrier, the holding webs have a reduced carrier material thickness. This will be the Holding webs flexible and thus also the external contacts or the terminal contacts, which are connected to these retaining webs. This has the advantage that the connection to the flip-chip contacts of the semiconductor chip is loaded less.

In a further embodiment The invention provides that the system carrier a potential line which extends from one side of the leadframe to the opposite side of the system tray frame extends. This potential line can be used electrically on the one hand, to provided external contacts or to appropriately provided terminal contacts On the other hand, it can also be a potential the mechanical stability of the increase filigree structure in every component position. This will ensure safety the positioning of the flip-chip contacts of the semiconductor chip the system carrier improved in each component position.

The Potential line has in a further embodiment of the invention at least partially a reduced system carrier material thickness and is there in the plastic housing compound embeddable. This has the advantage that anchored the potential line is and even at least in critical areas from the bottom of the electronic component are not contacted directly can. Rather, corresponding external contacts are provided, which via retaining webs transverse to the ground line with this in connection. Furthermore, can the potential line on the two sides of the housing component from the outside be contacted, which facilitates a functional test. Moreover hinders a potential line with reduced material thickness that Envelop with Kunsstoffgehäusemasse fewer. In a further embodiment the invention it is provided that the system carrier has cranked holding webs, the one bulge across from the system tray form. Thus arises in each component position such a bulge cranked Haltestegen, with which connection contacts on the top and the external contacts on the bottom when potting of the system carrier be arranged in each component position to an electronic component.

The external contacts in a further embodiment the invention, a reduced system carrier material thickness and a contact socket having a contact pad that is congruent to a contact surface one in flip-chip technology is to be arranged semiconductor chip. Thus can be for a defined number of External contacts, which are directly opposite to a flip-chip contact, in each case an external contact attach directly by the congruent, microscopic contact pad of the Contact socket of the external contact with the terminal contact surface of a be connected in flip-chip technology to be arranged semiconductor chips can. This can be advantageous especially in the center of the component for reasons of space be.

A another embodiment The invention provides that the terminal contacts of a system carrier a embossing having a base, the one to a terminal contact surface of a Having in a flip-chip technology to be arranged semiconductor chip congruent contact pad. By such an embossing on the one hand, the material thickness the connection contacts further diminished and partly the material partially in one to the terminal pads of a in flip chip technology to be arranged semiconductor chips adapted contact socket reshaped. This embossing technique can still be used at the level of the system carrier to to achieve such a configuration of terminal contacts. Next will prevents a wide flow of solder through the contact socket.

Consequently stands for the further processing a system carrier available, the on the one hand exactly positioned and mechanically held terminal contacts a special imprint provides that are precisely aligned to the arrangement of microscopic flip-chip contacts and adapted are. On the other hand, the system carrier sees macroscopically arranged external contacts before, immediately after the casting of the system carrier in a plastic housing compound for functional tests from the bottom of the packaged in plastic housing material system carrier to disposal stand.

• – Maskieren der Oberseite und der Unterseite des Systemträgerrohlings mit unterschiedlichen, zueinander unsymmetrisch strukturierten Ätzmasken,
• – doppelseitiges Ätzen des maskierten Systemträgerrohlings unter einseitigem Dünnätzen von Haltestegen und Anschlußkontakten, sowie einem vorbestimmten Anteil der weiteren Außenkontakte und/oder der Potentialleitungen,
• – Entfernen der unsymmetrischen Ätzmasken,
• – Strukturieren der Anschlußkontakte zu Anschlußkontakten verminderter Materialstärke mit Kontaktsockel, der eine Kontaktanschlußfläche aufweist, die kongruent zu einem Flip-Chip-Kontakt eines Halbleiterchips ist,
• – Strukturieren einer vorbestimmten Anzahl von weiteren Außenkontakten verminderter Materialstärke zu weiteren Außenkontakten mit Kontaktsockeln, die eine Kontaktanschlußfläche aufweisen, die kongruent zu einem Flip-Chip-Kontakt eines Halbleiterchips ist.
• – teilweises Kröpfen der Haltestege, so dass Anschlußkontakte gegenüber dem Systemträgerrahmen angehoben werden und Auswölbungen in jeder Bauteilposition gebildet werden, welche die Halbleiterchips in Flipchiptechnik hängend aufnehmen können.

A method for producing such. System carrier made of a metal plate or a metal strip as Systemträgerroh ling for several of the electronic components described has the following method steps:

• Masking the upper side and the underside of the system carrier blank with different etching masks which are asymmetrically structured relative to one another,
• Double-sided etching of the masked system carrier blank with one-sided thin etching of holding webs and connecting contacts, as well as a predetermined portion of the further external contacts and / or the potential lines,
• Removing the asymmetrical etching masks,
• Patterning the connection contacts to terminal contacts of reduced material thickness with contact socket, which has a contact pad which is congruent with a flip-chip contact of a semiconductor chip,
• - Patterning a predetermined number of other external contacts of reduced material thickness to further external contacts with contact sockets, which have a contact pad, which is congruent to a flip-chip contact a semiconductor chip.
• - Partial crimping of the holding webs, so that terminal contacts are raised relative to the system support frame and bulges are formed in each component position, which can hold the semiconductor chips in flip-chip technology hanging.

One Such method has the advantage of being relatively inexpensive Means a complex system carrier it can be produced for each component position a filigree pattern of retaining webs, connecting contacts and external contacts having. By networking the retaining webs is doing mechanically the position of the individual external contacts and connecting contacts secured and thus enables that reliable a semiconductor chip in flip-chip technology in each component position can be arranged can. Only after the attachment of the semiconductor chip and after a Shed in a plastic housing compound this network is severed from holding webs, so that at defined Make external contacts are accessible on the underside of the electronic component and within the plastic mass, a connection between terminal contacts of the carrier and flip-chip contacts.

The Haltstege be partially cranked, so that connecting contacts across from the system tray be raised and bulges are formed in each component position, which the semiconductor chips record hanging in flip-chip technology can. Such bulges Simultaneously facilitate the adjustment of the component positions in an assembly machine and thus protect the sensitive semiconductor chips used in the placement machine hanging be introduced into the component positions. These are the connection contacts arranged such that they the arrangement of flip-chip contacts, the in flip-chip technology to mount semiconductor chips.

In a further embodiment the invention, the structuring of the terminal contacts and / or the predetermined number of external contacts by embossing technique. This technique has the advantage of being used simultaneously for several connecting contacts and external contacts a pedestal impressed can be while the connection contacts when embossing at the same time thin be formed.

A another embodiment The invention provides that the structuring of the predetermined number from external contacts by double-sided etching technique he follows. In this double-sided etching technique can in an advantageous Way on the one side of the external contact a socket arise which has a diminished, microscopically small contact pad, the congruent to the terminal contact surfaces of Flip-chip contacts is while on the underside of the electronic component an external contact surface for disposal which assumes macroscopic proportions.

While the Flip-chip contacts of the semiconductor chip in a microscopic fine Arrangement are present, the external contacts are in a matrix form arranged at macroscopic distances and are about holding webs mechanically and electrically with the connection contacts, which are congruent to the Flip-chip contacts are arranged connected. The transition from the matrix shape of the external contacts of the system carrier to the microscopic arrangement of the flip-chip contacts is over the thin-etched or thinly shaped Holding webs realized, so that rewiring plates and other more Components are not required to an inventive electronic To realize component.

• – Herstellen eines Systemträgers mit mehreren Bauteilpositionen, die von einem Systemträgerrahmen umgeben sind und eine Struktur mit Außenkontakten, Anschlußkontakten und dazwischen angeordneten Haltestegen verminderter Systemträgermaterialstärke aufweisen, wobei die Anschlußkontakte und eine vorbestimmte Anzahl von weiteren Außenkontakten mit Sockelansätzen strukturiert werden, die zu Flip-Chip-Kontakten des Halbleiterchips kongruente Kontaktanschlußflächen aufweisen,
• – elektrisches Verbinden eines Halbleiterchips mit seinen Flip-Chip-Kontakten in Flip-Chip-Technik mit den Kontaktanschlußflächen der Anschlußkontakte und/oder der vorbestimmten Anzahl von Außenkontakten in jeder Bauteilposition,
• – Verpacken der Bauteilpositionen in einer Kunststoffgehäusemasse,
• – Einbringen von Aussparungen auf der Unterseite des Systemträgers in jeder Bauteilposition zum Auftrennen von Haltestegen, die nicht für eine elektrische Verbindung vorgesehen sind, an entsprechend vorbestimmten Stellen,
• – Auftrennen des Systemträgers zu einzelnen elektronischen Bauteilen.

A method for producing a described electronic component with a plastic housing made of a plastic housing composition and a semiconductor chip arranged in the plastic housing in flip-chip technology has the following method steps:

• Producing a system carrier having a plurality of component positions, which are surrounded by a system carrier frame and have a structure with external contacts, terminal contacts and holding webs of reduced system carrier material thickness arranged therebetween, wherein the terminal contacts and a predetermined number of further external contacts are patterned with socket attachments which are turned into flip chip Have contacts of the semiconductor chip congruent contact pads,
• Electrically connecting a semiconductor chip with its flip-chip contacts in flip-chip technology with the contact pads of the terminal contacts and / or the predetermined number of external contacts in each component position,
• Packaging the component positions in a plastic housing composition,
• - Inserting recesses on the underside of the system carrier in each component position for separating holding webs, which are not intended for an electrical connection, at corresponding predetermined locations,
• - Separation of the system carrier to individual electronic components.

This method has the advantage that a plurality of method steps can be performed simultaneously for a plurality of electronic components. While the loading of the system carrier can be performed with semiconductor chips in a placement machine, wherein individual semiconductor chips in flip-chip technology on or in the component be installed positions, the plastic housing composition can be applied as an entire layer on the system carrier, so that a plastic plate with built-in system carrier for multiple component positions and ready-connected semiconductor chips in flip-chip technology is created. This plastic plate can be structured for several components on the underside by recesses by sawing or laser technology are introduced to separate the external contacts on the bottom of the electronic component and to cut through all holding webs, which serve only mechanical positioning of external contacts. Savings are associated with such a technology because the process steps for multiple electronic components can be performed simultaneously.

One further implementation example of the method provides that the separation of holding webs by Introduction of saw grooves on the underside of the system carrier and / or performed on the underside of the electronic component. These sawing grooves have the advantage that they are very accurately adjusted in their depth of cut can be and that the legends can be introduced with a relatively simple technique are.

It is provided that the separation of holding webs by introducing of recesses on the bottom of the electronic component for separating the holding webs at predetermined locations by means of laser ablation carried out becomes. This laser ablation technique has the advantage that the components not by sawing grooves weakened on the bottom be, but only occasionally recesses by laser ablation be attached where holding bars, for mechanical purposes only serve, should be separated.

In a further embodiment of the method is provided that in the system carrier in each Component position a bulge by cranking the holding webs is introduced, in which the semiconductor chip in Flip-chip technique is arranged. Such bulges by cranking the retaining bars have it in addition, the advantage that they within limits the semiconductor chip from damage protect the insertion of the plastic housing composition.

In a further embodiment of the Method is used in packaging the assembly of semiconductor chip and component position with bulges in a plastic housing compound a mold used, wherein the mold has a mold cavity, in which the external contacts in a lower sealing foil and the terminal contacts in an upper sealing foil memorize, so that after the injection molding process the connection contacts protrude from the top of the plastic housing by a few microns and the external contacts on the bottom of the plastic housing protrude by a few microns. In this Doppelfolienvergußtechnik it is possible, that exposing the external contacts on the bottom and the connection contacts on the top by the impressions the contacts in the sealing film is ensured. Thus, can the function of the individual electronic components still on the system support and immediately after introducing the recesses described above be tested.

In a further embodiment of the Procedure are additional Procedural steps provided on top of the plastic housing composition external contacts to create at least one additional electronic component Component. These are the tops of the electronic components after packaging the electronic components on the system carrier with a redistribution structure coated. This rewiring structure has redistribution lines that are different from those on the top arranged connection contacts to contact pads on extend the top. These contact pads on the top of the electronic component are end surfaces of the rewiring lines.

The Contact pads be with external contacts by selectively applying these external contacts on the top of the electronic component in positions fitted to the positions of the external contacts on the bottom of a second electronic component correspond. Through this additional Process steps is advantageously achieved that on such electronic components with bent support webs, flip-chip mounted semiconductor chips and with rewired connection contacts to external contacts other electronic components can be built directly with short connections and no additional Umverdrahtungsplatten. By rewiring so stackable electronic Components are formed. It can thus several components vertically one above the other to a new, complex electronic component or module stacked become.

One further implementation example provides that the external contacts be selectively applied on the top in positions that the positions of the external contacts on the bottom of the electronic components correspond.

As a result of this process, components each have identically positioned outer contacts on the upper side and on the lower side, which are electrically connected to the same flip-chip contact. This has the advantage that the component of both can be tested above as well as from below with the same test equipment and also that very easily several similar components can be stacked vertically one above the other, for example, memory components. This makes it very flexible to realize different storage capacities at the same slot on a printed circuit board.

A further implementation examples of the method provides that the application of rewiring and external contacts on the top of the electronic components simultaneously for several Components of a system carrier he follows. By having the redistribution lines at the same time for many Components on a system carrier can be applied Saves considerable costs, otherwise in a post-processing incurred by individual components.

In summary is with the component according to the invention and the method of the invention enables flip-chip mounting in "leadless" QFN packages. About that can out housing forms be created, which has a high density of external contacts on the bottom an electronic component in matrix form, as it is in BGA packages (ball grid arrey enclosures) is possible. However, this technology does not use a rewiring board and no solder mask needed. Also on elongated Lotsäulen and elastic connections between external contacts and flip-chip contacts can with the technology according to the invention be waived, since retaining bars provided with reduced material thickness can be the one elastic connection between external contacts and flip-chip contacts of the Realize semiconductor chips.

The Shape of the connection contacts with a contact socket can by embossing technique or by etching respectively. A targeted local passivation against solder wetting, for example, by oxidation of a laser-heated zone can be done easily. A surface passivation can be carried out to prevent solder wetting of the system carrier, by subsequent opening of Contact pads on the connection contacts or contact sockets z. B. with the help of a laser Connect to the flip-chip contacts of the semiconductor chip to limited surfaces the connection contacts can be concentrated.

Where always possible and makes sense, is used as protection against mechanical stress and moisture an external contact of the housing not arranged directly under a flip-chip contact, but each offset to one not possible rectilinear holding web, whereby the thickness of the retaining web is reduced to a smaller material thickness of the system carrier and wherein at least the embossed Part of the ridge with the contact base in the soldering zone for the flip-chip contact is thinner than the rest of the ridge thickness. Such a connecting web, the electrically the external contacts with the connection contacts connects, runs if possible inside the plastic molding compound to protect it from damage to protect and to prevent inadvertently introducing shorts from the outside can be.

By the introduction or imprinting Contact bases are reduced in conjunction with the retaining bars material thickness created a flexible connection, the mechanical and thermo-mechanical Reduced loads on the flip-chip contacts. According to the invention is a Technology created, the creation of a defined solder wetting surface for a flip-chip assembly enabled on metal structures. This technology is especially fine for structured and not necessarily in a plane lying metal structures suitable. Furthermore is the technology for the production of "leadless" housings of the QFN type. The technical possibilities of the new technology, like both-sided and half-sided etching from the system carrier blanks, Shape and weeding of connection contacts or manufacturing feeder webs are used such that both an encapsulated flip chip and underfill materials CSP (chip-sized-package), as well as substrate-free fan-out or fan-in solutions for Rewiring.

The The invention will now be described by way of embodiments with reference to FIG the enclosed drawings closer explained.

1 shows a schematic cross-sectional view of an electronic component of a first embodiment,

2 shows a schematic cross section through a system carrier with etch profiles for electronic components 1 .

3 shows a schematic view of a bottom side of an electronic component of a second embodiment,

4 shows a schematic cross-sectional view of the electronic component of the second embodiment along the section line AA in 3 .

5 shows a detail of a schematic plan view of a component position of a system carrier with a positioned semiconductor chip in flip-chip technology before packaging the component position for an electronic component of a third embodiment,

6 shows a schematic cross section through an electronic component of the third embodiment along the section line BB in 5 .

7 shows a schematic cross section through an electronic component of an embodiment of the invention,

8th shows a schematic cross section through an electronic component having a stack of electronic components of the embodiment of the invention.

1 shows a schematic cross-sectional view of an electronic component 1 a first embodiment.

The reference number 2 indicates a plastic housing. The reference number 3 indicates a metallic carrier on which a semiconductor chip 4 is positioned. The reference number 5 indicates external contacts on the underside of the electronic component 1 , which measures a few microns out of the plastic housing compound 16 of the plastic housing 2 protrude. The reference number 6 indicates a terminal contact and the reference numeral 7 Flip-chip contacts of the semiconductor chip 4 that with the connection contacts 6 of the metallic carrier 3 via contact pads 13 the connection contacts 6 are connected.

The reference number 8th indicates an active top side of the semiconductor chip on which the flip-chip contacts 7 are arranged, the order and spacing of the flip-chip contacts 7 are microscopically small, which in this context relates to an order of magnitude which becomes measurable only with the aid of a light microscope. In contrast, the external contacts 5 on the bottom 9 arranged at intervals that come in a macroscopic order, that is, these distances are measurable and recognizable with the naked eye.

The reference number 9 indicates the underside of the plastic housing and thus also the underside of the electronic component 1 , The reference number 10 indicates the side edges of the electronic component and thus also the side edges of the plastic housing. The reference number 11 indicates the top of the plastic housing and thus also the top of the electronic component 1 ,

The reference number 14 identifies holding webs, which the external contacts 5 and the connection contacts 6 hold in place until the packaging of the electronic component 1 in a plastic housing compound 16 is completed. The retaining bars 14 in this first embodiment, half the material thickness D of the carrier 3 on. This material thickness, reduced to half the material thickness, is marked with the letter d. The height of the electronic component is thus composed of the material thickness D of the system carrier in the range between 0.05 and 1.2 mm and the semiconductor chip mounted in flip-chip technology 4 on the connection contacts 6 of the electronic component. This contributes to the height of the electronic component in the range between 0.05 and 1.2 mm, so that there is an overall height H of the electronic component in the range of about 0.1 to 2.4 mm. Due to the low material thickness of the holding webs 14 These can be made extremely filigree and elastic, so that the stresses due to expansion differences on the connection between the microscopic flip-chip contacts 7 and the connection contacts 6 act to be reduced.

With 1 become four differently arranged external contacts 42 . 43 . 44 and 45 shown in cross-section, each representing a particularly advantageous embodiment of external contacts. The external contact 42 is arranged on the underside of the electronic component and at the same time has an external contact surface on the side edge 10 of the electronic component. All external contacts 42 , which also have edge side contacts, form an outer ring of external contacts on the underside 9 of the electronic component 1 and are over Haltstege 14 with individual, microscopically small flip-chip contacts 7 via the connection contacts 6 connected.

The external contact 43 is an example of an external contact of a second ring of external contacts on the underside of the electronic component and has a special profile of the external contact. This profile is characterized by protrusions in the middle of the cross section. These projections arise in the manufacture of the carrier 3 for the electronic component 1 , The external contact 43 from the second ring of external contacts is over a relatively long elastic holding web 14 of reduced substrate thickness d with a terminal contact 6 connected.

The connection contact 6 This embodiment is made of the material of the holding web 14 formed by embossing, wherein an embossing die the terminal contact 6 opposite the material thickness of the retaining web 14 further reduced and at the same time a contact socket 12 on the connection contact 6 formed. The contact socket has a contact pad on its outer end 13 which is congruent with the pad of the flip-chip contact 7 is. Thus, an electrical connection of macroscopic external contacts 42 or 43 to microscopic circuit contacts 6 with the help of the contact socket 12 be created.

While the external contacts 42 and 43 in one area of the plastic housing compound 16 are arranged, which is free of the semiconductor chip 4 is held, is the terminal contact 44 below the semiconductor chip 4 and has a retaining bar 14 from the predetermined position within an external contact matrix to the position of a flip-chip contact 7 of the semiconductor chip 4 leads. At the end of the jetty 14 this in turn is a connection contact 6 with contact socket 12 shaped.

Another version of an external contact on the bottom 9 of the electronic component 1 shows the reference numeral 45 , In this external contact 45 are the positions of the external contact 45 and the flip-chip contact 7 congruent, so that here is a specially shaped external contact 45 is formed on the bottom of the electronic component 1 has a macroscopic surface and in the upper region of the outer contact 45 on the microscopic surface of the flip-chip contact 7 is reduced. Such an external contact directly with a flip-chip contact 7 is connected, can only be used in places where the flip-chip contacts have macroscopic distances between them.

In addition to the different versions of the external contacts 42 . 43 . 44 and 45 show the 1 a buried potential line 15 passing through the electronic component 1 is arranged below the semiconductor chip. This potential line 15 on the one hand contacts of the same potential with each other and with the semiconductor chip 4 connect and on the other hand, it serves the mechanical stabilization and support of external contacts and terminal contacts via corresponding retaining webs, which after packing the system carrier 23 with applied semiconductor chip 4 be separated again.

These are recesses 17 from the bottom of the electronic component 1 out in the plastic housing material 16 placed in the places where holding webs 14 who had only mechanical tasks to be separated. Holding webs, which also produce an electrical connection, are not separated, as for example in 1 between the external contact 43 and the terminal contact 6 will be shown. The metallic carrier 3 who has both external contacts 5 as well as holding webs 14 and to connection contacts 6 embossed ends of retaining bars 14 has, is from a system carrier 23 formed, which has a plurality of component positions and within each component position 50 of the system carrier 23 such a metallic carrier 3 for a single electronic component 1 forms.

2 shows a schematic cross section through a system carrier 23 with etching profiles for components 5 . 6 . 14 and 15 an electronic component 1 to 1 , Components with the same functions as in 1 are denoted by like reference numerals and will not be discussed separately.

In addition shows 2 a schematic cross section through a section of a system carrier 23 etched system carrier blank 22 in which half-sided retaining webs 14 with full-sided external contacts 5 alternate. Here are the half-sided webs 14 achieved by non-symmetrical Ätzmaskentechnik. The grid dimension s for the half-sided holding webs 14 alternating with unilaterally widened, partly full-sided external contacts 14 with the narrower width w is: s = p + w, wherein the etch gap p p = m + D is. The retaining bars 14 are in this schematic representation in alternation with full-sided external contacts 5 arranged on the top 31 of the system carrier 23 a reduced width w for holding webs 14 or for contact pads 13 . 20 a connection contact 6 or an external contact 5 on the leadframe top, with the width of flip-chip contacts 7 of the semiconductor chip 4 is compatible. On the bottom 32 of the system carrier 23 intended in this embodiment, a greater width W for the external contacts 5 will be realized. If between the full-page external contacts 5 in each case a half-sided holding bridge 14 at the top 31 of the system carrier 23 is provided, so can a grid for the external contacts 5 on the bottom 32 of the system carrier 23 achieved in the embodiment, according to 1 and 2 has the following order of magnitude: S = W + w + 2m + D, where W is the width of the external contact 5 on the bottom 32 of the system carrier 23 , w is the width of the half-sided support bar 14 on the top 31 of the system carrier 23 , m the width of the etch opening and D the material thickness of the system carrier blank 22 is.

Thus, with suitable structuring of non-symmetrical etching masks 33 and 34 sufficiently large external contacts 5 be created, while minimizing the space requirement for the holding webs 14 and minimum width w for contact circuit surfaces 13 . 20 to flip-chip contacts 7 of the semiconductor chip 4 as they are in 1 to be shown.

By asymmetric etching masks 33 and 34 At the top and bottom, with half the material thickness D / 2, an electrical line, such as a potential line, can be created on the top or the bottom in certain areas 15 or in the form of retaining bars 14 , widened at the expense of neighboring bridges. For example, in the field of external contacts 5 on the bottom 32 the system carrier, this broadening can take place, so that the contact with a circuit board, not shown, is facilitated with the widened areas. On the top 31 of the system carrier 23 the grid size remains unchanged at minimum size, leaving on the bottom 32 for example, the triple width for external contacts 5 With W = 3w can be realized. In addition, the asymmetric etching provides two etching masks 33 and 34 a profile of the external contacts 5 in cross section and the holding webs 14 in cross-section, in the center area of the carrier 3 or the system carrier 23 Having projections that anchor the components 5 . 14 and 15 effect in the plastic housing composition. With such etching technology can thus external contact 5 be generated, in its upper material area a contact socket 19 having a reduced contact pad 20 which corresponds in width w to the width of the flip-chip contacts of a semiconductor chip.

3 shows a schematic view of a bottom 9 an electronic component 1 a second embodiment.

components with the same functions as in the previous figures denoted by the same reference numerals and not discussed separately.

On the bottom 9 of the electronic component 1 are in this second embodiment, a plurality of external contacts 5 in rings 25 . 26 . 27 and 28 arranged, with the ring 25 not just on the bottom 9 has an external contact surface, but as an outer ring 24 also external contact surfaces on the side edges 10 of the electronic component 1 having. All outer contact rings 25 . 26 . 27 and 28 below the semiconductor chip 4 arranged. The terminal contacts are in this embodiment in the plastic housing composition 16 buried and thus not visible in this representation.

The location of two connection contacts 46 and 47 is marked in this example and shows that these terminal contacts, which are arranged congruently with the flip-chip contacts, not the positions of the external contacts 5 appropriate. Rather, are holding webs 14 required to connect the external contact surfaces with the terminal contacts. The retaining bars 14 serve in this embodiment, the positioning of the external contacts 5 and connecting the external contacts 5 with the buried connection contacts. As far as the retaining bars 14 do not serve as an electrical connection, they are after packaging the electronic component 1 from the bottom 9 of the electronic component 1 separated from. In this embodiment according to 3 the bottom has recesses 17 in the form of sawing grooves 18 on, extending across the bottom of the new electronic component 1 extend and all retaining bars 14 cut as far as they represent a mechanical support and make no electrical connection.

4 shows a schematic cross-sectional view of the electronic component 1 of the second embodiment along the section line AA in 3 , Components having the same functions as in the previous figures are identified by the same reference numerals and will not be discussed separately.

In this embodiment, a part of the external contacts 5 directly in positions of flip-chip contacts 7 arranged. The matrix of flip-chip contacts 7 is marked, so far as they are not in the section line AA, by dashed lines. The retaining bars 14 lie in this embodiment on the underside of the electronic component 1 and are from the sawing people 18 severed, as far as they are only of mechanical importance. The cross section of the 4 also shows a potential lead 15 from which, as in 3 you can see several stops 29 are arranged transversely, the holder or the potential connection of external contacts 5 serve. This potential line 15 here is completely in plastic housing compound 16 embedded and has the advantage that it forms an additional stabilizing web in each component position, at the holding webs 14 for external contacts 5 and can support terminal contacts.

5 shows a section of a schematic plan view of a component position of a system carrier 23 with positioned semiconductor chip 4 in flip-chip technology before packaging the component position 50 to an electronic component 1 a third embodiment. Components having the same functions as in the previous figures are identified by the same reference numerals and will not be discussed separately.

In this system carrier 23 is between the edge 49 of the semiconductor chip and the first two rows 51 and 52 from external contacts 5 a bend area 53 provided in which the holding webs 21 are cranked so that they are the terminal contacts 6 on the top 11 a packaging electronic component 1 position. This crimping of the retaining bars 21 can in the production of the system carrier 23 be performed and causes the electronic component 1 this third embodiment both on the bottom 9 an access to the flip-chip contacts 7 through the external contacts 5 allows, as well as from the top 11 through the connection contacts arranged there 6 ,

6 shows a schematic cross section through an electronic component 1 of the third embodiment along the section line BB in 5 , Components with the same functions as in the preceding figures are identified by the same reference numerals and are not explained separately.

In contrast to the preceding embodiments, in the third embodiment, the semiconductor chip 4 hanging on the connection contacts 6 arranged. In the bend area 50 goes the semiconductor bridge 21 from the outside contact 5 on the bottom 9 of the electronic component 1 out to the top 11 of the electronic component 1 and the associated pads 6 , Here is the Kröpfungsbereich 53 the etched on reduced material thickness d holding web 21 completely in plastic housing compound 16 after completion of the electronic component 1 embedded. Such a component has the advantage that electrically both from the top 11 as well as from the bottom 9 out on the flip-chip contacts 7 of the semiconductor chip 4 can be accessed.

7 shows a schematic cross section through an electronic component 1 an embodiment of the invention. Components having the same functions as in the previous figures are identified by the same reference numerals and will not be discussed separately.

The electronic component 1 The embodiment of the invention is based on the principles of the third embodiment, that is, on the external contacts 5 is over bent holding webs 21 the external contact 5 on the underside of the electronic component with connection contacts 6 connected to the top of the electronic component, leaving in the plastic housing compound 16 an upper contact option in a microscopic arrangement for accessing the flip-chip contacts 7 consists. On the plastic housing compound 16 Now, a rewiring structure by applying a patterned redistribution layer 36 to be ordered. This redistribution layer 36 has redistribution lines 40 on which the connection contacts 6 on top of the electronic component with external contact surfaces 41 connect the rewiring lines.

On the external contact surfaces 41 are on the top of the electronic component further external contacts 37 arranged, the congruent with external contacts 5 on the bottom of the electronic component on the top 11 of the electronic component 1 are distributed. Such an electronic component 1 with congruent other external contacts 37 on the top 11 of the electronic component 1 and external contacts 5 on the bottom new of the electronic component is able to be stacked to larger units.

8th shows a schematic cross section through an electronic component 1 comprising a stack of electronic components of the embodiment of the invention. Components having the same functions as in the previous figures are identified by the same reference numerals and will not be discussed separately.

For vertical stacking of the electronic components 1 the embodiment of the invention, only the other external contacts 37 on the top of each electronic component with external contacts 5 connected to the bottom of the overlying component, leaving a stack of any number of electronic components 1 the embodiment of the invention may arise. This complex, highly integrated electronic component has the advantage of saving space through vertical stacking.

1

electronic component

2

Plastic housing

3

metallic carrier

4

Semiconductor chip

5

external contacts

6

connecting contacts

7

Flip-chip contacts

8th

active Top of the semiconductor chip

9

bottom of the plastic housing

10

Margins of the electronic component

11

top of the plastic housing

12

Contact socket the connection contacts

13

congruent Contact pads

14

retaining webs

15

potential line

16

Plastic housing composition

17

recesses

18

Sägenuten

19

Contact socket the external contacts

20

Contact pads of the external contacts

21

cranked holding webs

22

System support frame

23

system support

24

outer ring

25 26, 27, 28

rings from external contacts

29

retaining webs at the potential line

30

bulge

31

top of the system carrier

32

bottom of the system carrier

33

upper etching mask

34

lower etching mask

35

System insert blank

36

rewiring

37

external contacts on the top of the electronic component

38

stacked electronic components

39

rewiring

40

rewiring

41

External contact surfaces of rewiring

42 43, 44, 45

external contacts on the bottom of the electronic component

46 47

connecting contacts

48

Kröpfungsbereich

49

edge of the semiconductor chip

50

component position

51 52

string from external contacts the bottom of the electronic component

53

Kröpfungsbereich

H

component height

d

reduced material thickness of the carrier or system carrier

D

Material thickness of the carrier or the system carrier

Claims (31)

Electronic component with a plastic housing ( 2 ) and a partially in the plastic housing ( 2 ) arranged metallic carrier ( 3 ), wherein on the metallic support ( 3 ) a semiconductor chip ( 4 ) is arranged in flip-chip technology, and wherein the carrier ( 3 ) External contacts ( 5 ) in full carrier material thickness (D) and terminal contacts ( 6 ) in reduced carrier material thickness (d), wherein one side of the connection contacts ( 6 ) at the top ( 11 ) of the plastic housing ( 2 ), and wherein the connection contacts ( 6 ) with reduced carrier material thickness (d) directly with flip-chip contacts ( 7 ) of the active top side ( 8th ) of the semiconductor chip ( 4 ) and wherein - the electronic component ( 1 ) cranked holding webs ( 21 ), the terminal contacts ( 6 ) on the top of the electronic component ( 1 ) with external contacts ( 5 ) on the bottom ( 9 ) or on margins ( 10 ) of the electronic component ( 1 ) connect electrically and mechanically; - the electronic component ( 1 ) on its top ( 11 ) a redistribution layer ( 36 ), wherein the rewiring layer ( 36 ) at the top ( 11 ) of the plastic housing ( 2 ) exposed side of the terminals ( 6 ) with further external contacts ( 37 ) on the top ( 11 ) and - which with the redistribution layer ( 36 ) generated further external contacts ( 37 ) on the top ( 11 ) to external contacts ( 5 ) on underside ( 9 ) are arranged congruently. Electronic component according to claim 1, characterized in that the connection contacts ( 6 ) Contact socket ( 12 ), one of the flip-chip contacts ( 7 ) of the semiconductor chip ( 4 ) congruent contact pad ( 13 ) and with the flip-chip contacts ( 7 ) are connected. Electronic component according to one of the preceding claims, characterized in that the external contacts ( 5 ) with the connection contacts ( 6 ) partially via electrically conductive retaining webs ( 14 ) are mechanically and / or electrically connected, wherein the retaining webs ( 14 ) have a reduced carrier material thickness (d). Electronic component according to one of the preceding claims, characterized in that the carrier ( 3 ) a contact of the same potential with each other and with the semiconductor chip ( 4 ) connecting potential line ( 15 ), which at least partially has a reduced carrier material thickness (d) and of plastic housing composition ( 16 ) of the plastic housing ( 2 ) is surrounded. Electronic component according to one of the preceding claims, characterized in that the plastic housing ( 2 ) on its underside ( 9 ) Recesses ( 17 ), which are partially in holding webs ( 14 ) to the connection contacts ( 6 ) and / or in retaining bars ( 14 ) on the further external contacts ( 5 ) are arranged and cut them. Electronic component according to one of the preceding claims, characterized in that the underside ( 9 ) of the plastic housing ( 2 ) Sawing grooves ( 18 ) as recesses ( 17 ) having a predetermined number of retaining webs ( 14 ) interrupt electrically. Electronic component according to one of the preceding claims, characterized in that a number of further external contacts ( 5 ) a reduced carrier material thickness (d) and a Contact socket ( 19 ) having a contact pad ( 20 ) which is congruent with flip-chip contacts ( 7 ) of the semiconductor chip ( 4 ) and with the flip-chip contact ( 7 ) is directly connected. Electronic component according to one of the preceding claims, characterized in that a plurality of electronic components ( 1 ) are arranged vertically one above the other to a stacked electronic component, wherein the further external contacts ( 37 ) of the top side ( 11 ) with the other external contacts ( 5 ) of the underside ( 9 ) of the electronic component ( 1 ) are electrically connected. System carrier for a plurality of electronic components, which are formed according to one or more of claims 1 to 8, the structured component positions ( 50 ) for each electronic component ( 1 ), each component position ( 50 ) from a system tray ( 22 ) and the system carrier ( 23 ) has a perforation in its edge regions, wherein the system carrier frame ( 22 ) in each component position ( 50 ) Retaining bars ( 14 ) to further external contacts ( 5 ) and retaining bars ( 14 ) to connection contacts ( 6 ) towards a central area in the component position ( 50 ), whereby the further external contacts ( 5 ) are arranged in a matrix and via holding webs ( 14 ) electrically with connection contacts ( 6 ) having an arrangement which corresponds to the arrangement of flip-chip contacts ( 7 ) one in flip-chip technology in the component positions ( 50 ) semiconductor chips ( 4 ) corresponds. System carrier according to claim 9, characterized in that the further external contacts ( 5 ) in at least one component position ( 50 ) in an outer ring ( 24 ) are arranged, wherein the further external contacts ( 5 ) Have contact surfaces on the edge sides. System carrier according to claim 9 or 10, characterized in that between holding webs ( 14 ) for the further external contacts ( 5 ) of an outer ring ( 24 ) Retaining bars ( 14 ) of another inner ring ( 26 . 27 . 28 ) from external contacts ( 5 ) are arranged. System support according to one of claims 9 to 11, characterized in that the retaining webs ( 14 ) have a reduced carrier material thickness (d). System carrier according to one of claims 9 to 12, characterized in that the system carrier ( 23 ) a contact of the same potential with each other and with the semiconductor chip ( 4 ) connecting potential line ( 15 ), which extend from one side of the system carrier frame ( 22 ) to the opposite side of the leadframe ( 22 ) and holding webs ( 14 ) extending from the potential line ( 15 ) from transversely to the longitudinal direction of the potential line ( 15 ) and the other external contacts ( 5 ) and / or the connection contacts ( 6 ) mechanically and / or electrically with the potential line ( 15 ) connect. System carrier according to claim 13, characterized in that the potential line ( 15 ) at least partially a reduced system carrier ( 23 ) Has material thickness and in plastic housing composition ( 16 ) is embeddable. System carrier according to one of claims 9 to 14, characterized in that the system carrier ( 23 ) in each component position ( 50 ) one of a matrix of retaining webs ( 14 ), Connection contacts ( 6 ) and / or other external contacts ( 5 ) and / or potential lines ( 15 ) shaped bulge ( 30 ) compared to the system carrier frame ( 22 ) having. System carrier according to one of claims 9 to 15, characterized in that a number of further external contacts ( 5 ) a reduced system carrier material thickness (d) and a contact base ( 19 ) having a contact pad ( 20 ) which is congruent with a flip-chip contact ( 7 ) of a semiconductor chip to be arranged in flip-chip technology ( 4 ) having. System carrier according to one of claims 9 to 16, characterized in that the cranked holding webs ( 21 ) a bulge ( 30 ) compared to the system carrier frame ( 22 ) form. System support according to one of claims 9 to 17, characterized in that the connection contacts ( 6 ) have an embossment which has a contact base ( 12 ), which leads to a flip-chip contact ( 7 ) of the semiconductor chip ( 4 ) congruent contact pad ( 13 ) having. Method for producing a system carrier ( 23 ) for several electronic components ( 1 ), which are designed according to one of claims 1 to 8, wherein the system carrier ( 23 ) comprises a metal plate or a metal strip as a system carrier blank, wherein the system carrier ( 23 ) structured component positions ( 50 ) for each electronic component ( 1 ), each component position ( 50 ) from a system tray ( 22 ) and the system carrier ( 23 ) has a perforation in its edge regions, wherein the system carrier frame ( 22 ) in each component position ( 50 ) Retaining bars ( 14 ) to further external contacts ( 5 ) and retaining bars ( 14 ) to connection contacts ( 6 ) towards a central area in the component position ( 50 ), the external contacts ( 5 ) arranged in a matrix are and over holding webs ( 14 ) electrically with connection contacts ( 6 ) having an arrangement which corresponds to the arrangement of flip-chip contacts ( 7 ) one in flip-chip technology in the component positions ( 50 ) semiconductor chips ( 4 ), the method comprising the following steps: masking the upper side ( 31 ) and the underside ( 32 ) of the system carrier blank ( 22 ) with different asymmetrically structured etching masks ( 33 . 34 ), - double-sided etching of the masked system carrier blank ( 22 ) under one-sided thin etching of retaining webs ( 14 ) and connection contacts ( 6 ), as well as a predetermined proportion of the further external contacts ( 5 ), Ï - removing the asymmetrical etching masks ( 33 . 34 ), - structuring the connection contacts ( 6 ) reduced material thickness (d) with a contact socket ( 12 ), which has a contact pad ( 13 ) which is congruent with flip-chip contacts ( 7 ) of a semiconductor chip to be arranged in flip-chip technology ( 4 ). Structuring the predetermined number of further external contacts ( 5 ) reduced material thickness (d) to further external contacts ( 5 ) with a contact base ( 19 ), which has a contact pad ( 20 ) that are congruent high to flip-chip contacts ( 7 ) of a semiconductor chip to be arranged in flip-chip technology ( 4 ), - partial crimping of the retaining webs ( 11 ), so that connection contacts ( 6 ) compared to the system carrier frame ( 22 ) and bulges ( 30 ) in each component position ( 50 ) forming the semiconductor chips ( 4 ) can be suspended in flip-chip technology. Method according to claim 19, characterized in that the structuring of the connection contacts ( 6 ) and / or the predetermined number of further external contacts ( 5 ) by embossing technique. Method according to claim 19, characterized in that the structuring of the predetermined number of external contacts ( 5 ) by means of double-sided etching. Method according to one of claims 19 to 21, characterized in that the connection contacts ( 6 ) are arranged such that they correspond to the arrangement of flip-chip contacts ( 7 ) of the semiconductor chips to be mounted in flip-chip technology ( 4 ) correspond. Method according to one of claims 19 to 22, characterized in that the further external contacts ( 5 ) are arranged in a matrix form and via holding webs ( 14 ) mechanically and electrically with terminal contacts ( 6 ) get connected. Method for producing an electronic component ( 1 ) with a plastic housing ( 2 ) of a plastic housing composition ( 16 ) and one in the plastic housing ( 2 ) in Flipchiptechnik arranged semiconductor chip ( 4 ), wherein the plastic housing ( 2 ) External contacts ( 5 ) in full carrier material thickness (D) and terminal contacts ( 6 ) in reduced material thickness (d) of a system carrier ( 23 ), wherein one side of the terminal contacts ( 6 ) at the top ( 11 ) of the plastic housing ( 2 ), and wherein the connection contacts ( 6 ) directly with flip-chip contacts ( 7 ) of the active top side ( 8th ) of the semiconductor chip ( 4 ), the method comprising the following steps: - producing a system carrier ( 23 ) with several component positions ( 50 ) from a system tray ( 22 ) and a structure with external contacts ( 5 ), Connection contacts ( 6 ) and retaining webs ( 14 ) reduced system carrier material thickness (d), wherein the connection contacts ( 6 ) and a predetermined number of further external contacts ( 5 ) with base contacts ( 12 . 19 ), wherein the socket contacts ( 12 . 19 ) to flip chip contacts ( 7 ) of the applied semiconductor chip ( 4 ) congruent contact pads ( 13 ), - electrically connecting a semiconductor chip ( 4 ) with its flip-chip contacts ( 7 ) in flip-chip technology with the contact pads ( 13 ) of the connection contacts ( 6 ) and / or the predetermined number of further external contacts ( 5 ) in each component position ( 50 ), - packaging of component positions ( 50 ) in a plastic housing composition ( 16 ) - introducing recesses ( 17 ) on the bottom ( 9 ) of the system carrier ( 23 ) in each component position ( 50 ) for separating retaining webs ( 14 ), which are not intended for an electrical connection, at correspondingly predetermined locations, - separating the system carrier ( 23 ) to individual electronic components ( 1 ). A method according to claim 24, characterized in that the separation of holding webs ( 14 ) by introducing saw grooves ( 18 ) on the bottom ( 9 ) of the system carrier ( 23 ) and / or on the underside ( 9 ) of the electronic component ( 1 ) is carried out. A method according to claim 24, characterized in that the separation of holding webs ( 14 ) by introducing recesses ( 17 ) on the bottom ( 9 ) of the electronic component ( 1 ) for separating the retaining webs ( 14 ) is performed at predetermined locations by laser ablation. Method according to one of claims 24 to 26, characterized in that in the Sys central support ( 23 ) at each component position ( 50 ) a bulge ( 30 ) by cranking the holding webs ( 21 ) is inserted, in which the semiconductor chip ( 4 ) is arranged in flip chip technology. Method according to one of claims 24 to 27, characterized in that when packaging the arrangement of semiconductor chip ( 4 ) and component position with bulges ( 30 ) in a plastic housing composition ( 16 ) a molding tool is used, which has a mold cavity, in which the external contacts ( 5 ) in a lower sealing foil and the connection contacts ( 6 ) in an upper sealing film, so that after the injection molding process, the terminal contacts ( 6 ) from the top ( 11 ) of the plastic housing ( 2 ) protrude by a few microns and the other external contacts ( 5 ) on the bottom ( 9 ) of the plastic housing ( 2 ) protrude by a few microns. Method according to one of claims 24 to 28, characterized in that after the packaging of the electronic components ( 1 ) on the system carrier ( 23 ) the topsides ( 11 ) of the electronic components ( 1 ) with a rewiring structure ( 39 ), wherein the rewiring structure ( 39 ) Rewiring cables ( 40 ), which differ from those on the surface ( 11 ) arranged connection contacts ( 6 ) to contact pads ( 41 ) on the top ( 11 ) and other external contacts ( 37 ) on the top ( 11 ) of the electronic components ( 1 ) exhibit. A method according to claim 29, characterized in that, the further external contacts ( 37 ) on the top ( 11 ) are applied selectively in positions which correspond to the positions of the further external contacts ( 5 ) on the underside of the electronic components ( 1 ) correspond. Method according to one of claims 29 or 30, characterized in that the application of rewiring lines ( 40 ) and other external contacts ( 37 ) on the top ( 11 ) of the electronic components ( 1 ) simultaneously for several components ( 1 ) of a system carrier ( 23 ) he follows.